KR20150128743A - 전도성 나노-필러로 도핑된 유전성 폴리머 기반 프랙셔널 오더 커패시터 - Google Patents

전도성 나노-필러로 도핑된 유전성 폴리머 기반 프랙셔널 오더 커패시터 Download PDF

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KR20150128743A
KR20150128743A KR1020157026181A KR20157026181A KR20150128743A KR 20150128743 A KR20150128743 A KR 20150128743A KR 1020157026181 A KR1020157026181 A KR 1020157026181A KR 20157026181 A KR20157026181 A KR 20157026181A KR 20150128743 A KR20150128743 A KR 20150128743A
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South Korea
Prior art keywords
fractional order
capacitors
capacitor
manufacturing
electrode layer
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KR1020157026181A
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Korean (ko)
Inventor
마흐무드 엔. 알마드호운
암로 엘스후라파
칼리드 살라마
후삼 엔. 알사리프
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사우디 베이식 인더스트리즈 코포레이션
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Publication of KR20150128743A publication Critical patent/KR20150128743A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/13—Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals
    • H03K5/14—Arrangements having a single output and transforming input signals into pulses delivered at desired time intervals by the use of delay lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020157026181A 2013-03-14 2014-03-06 전도성 나노-필러로 도핑된 유전성 폴리머 기반 프랙셔널 오더 커패시터 Ceased KR20150128743A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361783373P 2013-03-14 2013-03-14
US61/783,373 2013-03-14
PCT/US2014/021173 WO2014158970A1 (en) 2013-03-14 2014-03-06 Fractional order capacitor based on dielectric polymer doped with conductive nano-fillers

Publications (1)

Publication Number Publication Date
KR20150128743A true KR20150128743A (ko) 2015-11-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157026181A Ceased KR20150128743A (ko) 2013-03-14 2014-03-06 전도성 나노-필러로 도핑된 유전성 폴리머 기반 프랙셔널 오더 커패시터

Country Status (7)

Country Link
US (1) US9305706B2 (https=)
EP (2) EP3511964A1 (https=)
JP (1) JP6298878B2 (https=)
KR (1) KR20150128743A (https=)
CN (1) CN105190805A (https=)
TW (1) TWI620215B (https=)
WO (1) WO2014158970A1 (https=)

Cited By (3)

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KR20190031928A (ko) * 2017-09-19 2019-03-27 유덕첨단소재(주) 그래핀을 이용한 적층 세라믹 커패시터 및 이의 제조 방법
US10403436B2 (en) 2016-12-19 2019-09-03 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
US10699850B2 (en) 2018-04-30 2020-06-30 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor including graphene platelets

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US10091870B2 (en) * 2015-03-31 2018-10-02 International Business Machines Corporation Methods for tuning propagation velocity with functionalized carbon nanomaterial
CN105790724B (zh) * 2016-04-28 2018-04-13 华南理工大学 一种0到1阶功率级分数阶电容元件的制备方法
CN106411291B (zh) * 2016-07-31 2023-04-07 华南理工大学 一种阶数大于1的大功率可调高频分数阶电容及其控制方法
WO2018193405A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Phase angle tunable fractional-order capacitors including poly (vinylidene fluoride)-based polymers and blends and methods of manufacture thereof
WO2018193403A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Method of modeling a fractional order capacitor design
WO2018193404A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Numerical design of fractional order capacitors
WO2018193402A1 (en) * 2017-04-19 2018-10-25 Sabic Global Technologies, B.V. Phase angle tunable fractional-order capacitors including multi-layer ferroelectric polymer dielectric and methods of manufacture thereof
FR3066398B1 (fr) * 2017-05-18 2019-07-05 X'sin Prise d'escalade a detection capacitive, procede de realisation et mur associes
CN111537400B (zh) * 2020-05-19 2023-03-31 北京林业大学 一种在线测定水中颗粒物分形维数的方法
CN118638374B (zh) * 2024-07-16 2025-08-26 深圳大学 一种掺杂含氟铁电聚合物、薄膜及其制备方法和应用

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10403436B2 (en) 2016-12-19 2019-09-03 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
US10763044B2 (en) 2016-12-19 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
US11004611B2 (en) 2016-12-19 2021-05-11 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
KR20190031928A (ko) * 2017-09-19 2019-03-27 유덕첨단소재(주) 그래핀을 이용한 적층 세라믹 커패시터 및 이의 제조 방법
US10699850B2 (en) 2018-04-30 2020-06-30 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor including graphene platelets

Also Published As

Publication number Publication date
CN105190805A (zh) 2015-12-23
TW201505052A (zh) 2015-02-01
WO2014158970A1 (en) 2014-10-02
US20140266374A1 (en) 2014-09-18
US9305706B2 (en) 2016-04-05
JP6298878B2 (ja) 2018-03-20
JP2016511550A (ja) 2016-04-14
EP3511964A1 (en) 2019-07-17
TWI620215B (zh) 2018-04-01
EP2973626A1 (en) 2016-01-20

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