TWI618204B - 半導體裝置載體、製造半導體裝置載體的方法及具有該載體的半導體裝置處理器 - Google Patents

半導體裝置載體、製造半導體裝置載體的方法及具有該載體的半導體裝置處理器 Download PDF

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Publication number
TWI618204B
TWI618204B TW106115911A TW106115911A TWI618204B TW I618204 B TWI618204 B TW I618204B TW 106115911 A TW106115911 A TW 106115911A TW 106115911 A TW106115911 A TW 106115911A TW I618204 B TWI618204 B TW I618204B
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TW
Taiwan
Prior art keywords
semiconductor element
base member
opening
carrier
sealing layer
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TW106115911A
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English (en)
Chinese (zh)
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TW201803041A (zh
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柳弘俊
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宰體有限公司
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Publication of TW201803041A publication Critical patent/TW201803041A/zh
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Publication of TWI618204B publication Critical patent/TWI618204B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06527—Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • H01L2225/06537—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106115911A 2016-05-11 2017-05-11 半導體裝置載體、製造半導體裝置載體的方法及具有該載體的半導體裝置處理器 TWI618204B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
??10-2016-0057833 2016-05-11
KR1020160057833A KR20170127324A (ko) 2016-05-11 2016-05-11 반도체소자 캐리어, 이의 제조방법 및 이를 포함하는 소자핸들러

Publications (2)

Publication Number Publication Date
TW201803041A TW201803041A (zh) 2018-01-16
TWI618204B true TWI618204B (zh) 2018-03-11

Family

ID=60266643

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106115911A TWI618204B (zh) 2016-05-11 2017-05-11 半導體裝置載體、製造半導體裝置載體的方法及具有該載體的半導體裝置處理器

Country Status (3)

Country Link
KR (1) KR20170127324A (fr)
TW (1) TWI618204B (fr)
WO (1) WO2017196109A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201901908XA (en) * 2019-03-04 2020-10-29 Rokko Systems Pte Ltd Improved sputtering processing and apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW282566B (fr) * 1994-04-26 1996-08-01 Hitachi Ltd
TW201044278A (en) * 2009-03-23 2010-12-16 Sonavation Inc Improved piezoelectric identification device and applications thereof
CN101969053B (zh) * 2008-05-16 2012-12-26 精材科技股份有限公司 半导体装置及其制造方法
TW201438180A (zh) * 2010-07-15 2014-10-01 Toshiba Kk 半導體裝置及使用其之行動通信機器
TW201523748A (zh) * 2013-12-13 2015-06-16 Toshiba Kk 半導體裝置之製造方法及半導體裝置
TW201523831A (zh) * 2013-12-13 2015-06-16 Toshiba Kk 半導體裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003040389A (ja) * 2001-08-01 2003-02-13 Ricoh Co Ltd 半導体集積回路装置用トレイ
KR100748482B1 (ko) * 2006-01-23 2007-08-10 미래산업 주식회사 반도체 소자 테스트 핸들러
US20120128656A1 (en) * 2008-05-02 2012-05-24 Immunovative Therapies, Ltd. Vaccine compositions and methods
KR101501735B1 (ko) * 2014-09-23 2015-03-12 제너셈(주) 반도체패키지의 ｅｍｉ 쉴드 처리공법
KR101604582B1 (ko) * 2015-08-24 2016-03-17 (주) 에스에스피 반도체 패키지 코팅 장치

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW282566B (fr) * 1994-04-26 1996-08-01 Hitachi Ltd
CN101969053B (zh) * 2008-05-16 2012-12-26 精材科技股份有限公司 半导体装置及其制造方法
TW201044278A (en) * 2009-03-23 2010-12-16 Sonavation Inc Improved piezoelectric identification device and applications thereof
TW201438180A (zh) * 2010-07-15 2014-10-01 Toshiba Kk 半導體裝置及使用其之行動通信機器
TW201523748A (zh) * 2013-12-13 2015-06-16 Toshiba Kk 半導體裝置之製造方法及半導體裝置
TW201523831A (zh) * 2013-12-13 2015-06-16 Toshiba Kk 半導體裝置

Also Published As

Publication number Publication date
WO2017196109A1 (fr) 2017-11-16
TW201803041A (zh) 2018-01-16
KR20170127324A (ko) 2017-11-21

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