SG10201901908XA - Improved sputtering processing and apparatus - Google Patents

Improved sputtering processing and apparatus

Info

Publication number
SG10201901908XA
SG10201901908XA SG10201901908XA SG10201901908XA SG10201901908XA SG 10201901908X A SG10201901908X A SG 10201901908XA SG 10201901908X A SG10201901908X A SG 10201901908XA SG 10201901908X A SG10201901908X A SG 10201901908XA SG 10201901908X A SG10201901908X A SG 10201901908XA
Authority
SG
Singapore
Prior art keywords
sputtering processing
improved sputtering
improved
processing
sputtering
Prior art date
Application number
SG10201901908XA
Inventor
Jong Jae Jung
Yun Suk Shin
Deok Chun Jang
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Priority to SG10201901908XA priority Critical patent/SG10201901908XA/en
Priority to TW109105347A priority patent/TWI820302B/en
Priority to US16/795,710 priority patent/US11476150B2/en
Priority to CN202010135380.5A priority patent/CN111653503A/en
Publication of SG10201901908XA publication Critical patent/SG10201901908XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Compositions Of Oxide Ceramics (AREA)
SG10201901908XA 2019-03-04 2019-03-04 Improved sputtering processing and apparatus SG10201901908XA (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SG10201901908XA SG10201901908XA (en) 2019-03-04 2019-03-04 Improved sputtering processing and apparatus
TW109105347A TWI820302B (en) 2019-03-04 2020-02-19 Process and placement station for sputtering
US16/795,710 US11476150B2 (en) 2019-03-04 2020-02-20 Sputtering processing and apparatus
CN202010135380.5A CN111653503A (en) 2019-03-04 2020-03-02 Improved sputtering process and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201901908XA SG10201901908XA (en) 2019-03-04 2019-03-04 Improved sputtering processing and apparatus

Publications (1)

Publication Number Publication Date
SG10201901908XA true SG10201901908XA (en) 2020-10-29

Family

ID=72335416

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201901908XA SG10201901908XA (en) 2019-03-04 2019-03-04 Improved sputtering processing and apparatus

Country Status (4)

Country Link
US (1) US11476150B2 (en)
CN (1) CN111653503A (en)
SG (1) SG10201901908XA (en)
TW (1) TWI820302B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201404371VA (en) * 2014-07-24 2016-02-26 Rokko Systems Pte Ltd Improved dry block assembly
SG10201509996UA (en) * 2015-12-04 2017-07-28 Rokko Systems Pte Ltd Improved substrate processing and apparatus
KR20170127324A (en) * 2016-05-11 2017-11-21 (주)제이티 Semiconductor device carrier, manufacturing method thereof and semiconductor device handler having the same

Also Published As

Publication number Publication date
TW202045755A (en) 2020-12-16
US20200286771A1 (en) 2020-09-10
TWI820302B (en) 2023-11-01
CN111653503A (en) 2020-09-11
US11476150B2 (en) 2022-10-18

Similar Documents

Publication Publication Date Title
SG11202006345UA (en) Image processing methods and apparatuses
EP3614259A4 (en) Processing apparatus and processing method
EP3627397A4 (en) Processing method and apparatus
EP3800589A4 (en) Task processing method and apparatus
GB201802533D0 (en) Image processing apparatus and methods
EP3639967A4 (en) Processing apparatus and processing method
EP3944083A4 (en) Card-related processing method and apparatus
SG10202002976XA (en) Inspecting apparatus and processing apparatus including the same
EP3468245A4 (en) Signal processing method and apparatus
EP3817241A4 (en) Signal processing method and apparatus
SG10202009275VA (en) Processing apparatus
SG10201913764UA (en) Processing apparatus
EP3614602A4 (en) Signal processing method and apparatus
EP3663938A4 (en) Signal processing method and apparatus
EP4013098A4 (en) Processing method and device
EP3962192A4 (en) Processing method and device
EP3646985A4 (en) Processing apparatus and processing method
SG10201910303SA (en) Plasma processing apparatus and plasma processing method
EP3592062A4 (en) Signal processing method and apparatus
EP3738712A4 (en) Processing device and processing method
EP3618295A4 (en) Signal processing method and apparatus
EP4027560A4 (en) Processing method and device
EP3609255A4 (en) Signal processing method and apparatus
EP3952181A4 (en) Processing method and device
EP3626390A4 (en) Processing apparatus and processing method