TWI617683B - Evaporation source device - Google Patents

Evaporation source device Download PDF

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Publication number
TWI617683B
TWI617683B TW103108654A TW103108654A TWI617683B TW I617683 B TWI617683 B TW I617683B TW 103108654 A TW103108654 A TW 103108654A TW 103108654 A TW103108654 A TW 103108654A TW I617683 B TWI617683 B TW I617683B
Authority
TW
Taiwan
Prior art keywords
crucible
opening
heating
temperature
source device
Prior art date
Application number
TW103108654A
Other languages
English (en)
Chinese (zh)
Other versions
TW201506177A (zh
Inventor
Keita Misawa
Shuji Maki
Yoshimasa Kobayashi
Yoshinari Kondo
Naoto Yamada
Kazuhiro Watanabe
Masahiro Yamazaki
Eiichi Matsumoto
Original Assignee
Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Publication of TW201506177A publication Critical patent/TW201506177A/zh
Application granted granted Critical
Publication of TWI617683B publication Critical patent/TWI617683B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW103108654A 2013-03-12 2014-03-12 Evaporation source device TWI617683B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013049258A JP6250940B2 (ja) 2013-03-12 2013-03-12 蒸発源装置

Publications (2)

Publication Number Publication Date
TW201506177A TW201506177A (zh) 2015-02-16
TWI617683B true TWI617683B (zh) 2018-03-11

Family

ID=51536752

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108654A TWI617683B (zh) 2013-03-12 2014-03-12 Evaporation source device

Country Status (4)

Country Link
JP (1) JP6250940B2 (ja)
KR (1) KR102013013B1 (ja)
TW (1) TWI617683B (ja)
WO (1) WO2014142097A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104278239A (zh) * 2014-10-31 2015-01-14 京东方科技集团股份有限公司 蒸镀坩埚装置
CN104694883A (zh) * 2015-03-27 2015-06-10 京东方科技集团股份有限公司 一种坩埚
CN107217236B (zh) * 2017-05-17 2023-10-20 大连交通大学 一种低温真空蒸发源
CN107779824A (zh) * 2017-12-07 2018-03-09 合肥鑫晟光电科技有限公司 蒸发源、蒸镀装置以及有机电致发光显示器的生产设备
KR102590301B1 (ko) * 2018-04-24 2023-10-18 주식회사 선익시스템 증착 장치용 증발원
CN108359941B (zh) * 2018-05-11 2019-08-23 京东方科技集团股份有限公司 坩埚盖、坩埚盖组件、蒸发源、蒸镀方法
KR102150453B1 (ko) * 2018-06-21 2020-09-01 주식회사 선익시스템 증착 장치용 증발원
JP2020002388A (ja) * 2018-06-25 2020-01-09 株式会社アルバック 真空蒸着装置用の蒸着源
CN110218977B (zh) * 2019-07-03 2021-04-27 Tcl华星光电技术有限公司 蒸镀装置
KR102319130B1 (ko) * 2020-03-11 2021-10-29 티오에스주식회사 가변 온도조절 장치를 구비한 금속-산화물 전자빔 증발원
JP7162639B2 (ja) * 2020-05-20 2022-10-28 キヤノントッキ株式会社 蒸発源装置、蒸着装置、及び蒸発源装置の制御方法
KR102700373B1 (ko) * 2022-10-25 2024-08-30 (주)데포랩 증발원

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169321A (ja) * 1986-01-21 1987-07-25 Hitachi Ltd 真空蒸着用蒸発源
JP2006188763A (ja) * 2005-01-06 2006-07-20 Samsung Sdi Co Ltd 蒸発源の加熱制御方法，蒸発源の冷却制御方法および蒸発源の制御方法
JP2006193761A (ja) * 2005-01-11 2006-07-27 Ideal Star Inc 気化器及び気化器を有するプラズマ処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100732850B1 (ko) * 2005-01-06 2007-06-27 삼성에스디아이 주식회사 증착시스템의 증착원의 제어방법
KR101015277B1 (ko) * 2008-12-10 2011-02-15 삼성모바일디스플레이주식회사 증발원
JP5414587B2 (ja) * 2010-03-23 2014-02-12 日立造船株式会社 蒸着装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169321A (ja) * 1986-01-21 1987-07-25 Hitachi Ltd 真空蒸着用蒸発源
JP2006188763A (ja) * 2005-01-06 2006-07-20 Samsung Sdi Co Ltd 蒸発源の加熱制御方法，蒸発源の冷却制御方法および蒸発源の制御方法
JP2006193761A (ja) * 2005-01-11 2006-07-27 Ideal Star Inc 気化器及び気化器を有するプラズマ処理装置

Also Published As

Publication number Publication date
WO2014142097A1 (ja) 2014-09-18
KR102013013B1 (ko) 2019-08-21
JP6250940B2 (ja) 2017-12-20
TW201506177A (zh) 2015-02-16
JP2014173169A (ja) 2014-09-22
KR20150123809A (ko) 2015-11-04

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