200948993 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種真空沉積裝置，且特別是關於一種 蒸發器與具有此蒸發器的真空沉積裝置，此装置是用來改 善沉積於基材上的薄膜均勻度。 【先前技術】 用來製造有機發光裝置最為普遍的薄膜形成方法，包 括蒸發有機物質，並使所蒸發的有機物質沉積於基材的表 面上。所蒸發之有機物質的沉積，包括在腔體中設置例如 為玻璃之基材，並使蒸鑛源(evaporation source)面對基材的 表面，此蒸鍍源例如為包含有機物質的點(point)蒸鍍源。 然後’包含有機物質的蒸鍍源被加熱以使有機物質蒸發， 且被蒸發的有機物質沉積於基材的表面上以形成有機薄 膜。然而’隨者近來基材面積的增加，線型(linear-|ype)蒸 鍍源被廣泛地使用以確保具有大面積薄膜的均勻度，線型 蒸鍍源取代了習知的點蒸鍍源。此類的線型蒸鍍源包括具 有相同直徑與相同距離的多個蒸鍍排氣口，位於一長方體 容器罐(parallelepiped pot)的上部，以使有機物質均勻地蒸 鍍在大面積的基材上。 然而，由具有相同直徑與相同距離的蒸鍍排氣口所蒸 錢的有機物質集中在基材的中間，以至於基材中間比基材 邊緣厚。此外，由於是使用預定角度來蒸鍍有機物質，因 200948993 此’由蒸鍍排氣口所蒸鍍、且對應於基材邊緣的有機物質， 僅有部份會被沉積在基材上，以至於大量的有機物質流失。 另外，被加熱之蒸鑛源的熱量會經由蒸鑛排氣口輻射 至基材’且被轉移的熱量使基材的溫度增加^在此情況下， 沉積於基材上之薄膜可能被損傷。 【發明内容】 ❹ 本發明提出一種蒸發器以及具有此蒸發器的真空沉 積裝置，此裝置是用來改善沉積於基材上的薄膜均句产， 以及減少有機物質的流失。 又 本發明又提出一種蒸發器以及具有此蒸發器的真空 沉積裝置，此裝置是用來防止蒸鍍源對基材之熱輻射，以 及防止基材的溫度增加。 在一實施例中，蒸發器包括：容器罐(pot)，其中存放 ^ 有機物質；罐蓋，覆蓋於所述容器罐的開口；以及多個蒸 鍍排氣口’多個蒸鍍排氣口彼此間隔開來，以蒸錢由容 © 罐蒸發的有機物質。 & 多個蒸鑛排氣口彼此至少在長度與直徑的其中之一 可為不同。 多個蒸鍵排氣口的每一個可具有垂直穿入容器之形 狀並耦接於罐蓋。多個蒸鍍排氣口可以一種方式轉接於罐 蓋’在此方式中’蒸鍍排氣口朝向容器罐外部與内部的至 少其中之一而突出。向容器罐外部突出的蒸鍍排氣口可彎 200948993 多個蒸鍍排氣口的長度可由容器罐的中心往办。 的邊緣增加。多個蒸鍍排氣口彼此之間的距離可為令，罐 多個蒸鍍排氣口之間的距離可由中心朝向邊緣而減=同。 多個蒸鍍排氣口的直徑可由容器罐的中心朝向办 罐的邊緣而減少。多個蒸鍍排氣口彼此之間的距離可=器 同。多個蒸鍍排氣口之間的距離可由容器罐的中心二= 罐的邊緣而減少。 蒸發器可更包括配置於罐蓋上^防止餘射的撐 板。多個蒸鍍排氣口的每一個都具有垂直穿入容器之形 狀，且每一個蒸鍍排氣口耦接於罐蓋及擋板。 / 蒸發器可更包括配置於罐蓋與擋板之間的加熱件。加 熱件圍繞於多個蒸鑛排氣口中的每一個。 在另一實施例中，真空沉積裝置包括：腔體；基材支 撐單元，配置於腔體中，且基材支撐單元支撐基材；容器 罐，面對腔體中的基材支撐單元，且容器罐存放有機物質 於其中；罐蓋，覆蓋於容器罐的開口；以及多個蒸鍍排氣 口，彼此間隔開來，以蒸鍍由容器罐蒸發的有機物質。 多個蒸鍍排氣口彼此至少在長度與直徑的其中之一 可為不同。 真空沉積裝置更包括配置於罐蓋上且防止熱輻射之 擋板’以及用來加熱各蒸鍍排氣口之加熱件。 【有利的效果】 依照本發明之揭露，用來蒸鍍被蒸發之有機物質的蒸 鍍排氣口具有管路形狀，包括穿入的中心以及不同的長度 200948993 與直徑，從而改善沉積於基板上之薄膜均勻度。 此外，依照本發明所揭露’對應於基材邊緣的蒸鍍排 氣口，其長度被增加，或是蒸鍍排氣口的直徑被減少，以 使由蒸鍍排氣口所蒸鍍的有機物質的損失減為最小。 此外’依照本發明所揭露，擋板配置於蒸鍍源的罐蓋 上’以防止由蒸鍍源至基材的熱輻射，因此可保護基材或 沉積於基材上之薄膜免於受到熱損傷。 eBACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a vacuum deposition apparatus, and more particularly to an evaporator and a vacuum deposition apparatus having the same, which is used to improve deposition on a substrate. Film uniformity. [Prior Art] A film forming method which is most commonly used for fabricating an organic light-emitting device includes evaporating an organic substance and depositing the evaporated organic substance on the surface of the substrate. The deposition of the evaporated organic substance includes disposing a substrate such as glass in the cavity, and causing an evaporation source to face the surface of the substrate, such as a point containing an organic substance (point ) evaporation source. Then, the evaporation source containing the organic substance is heated to evaporate the organic substance, and the evaporated organic substance is deposited on the surface of the substrate to form an organic film. However, linear-to-yelt evaporation sources have been widely used to ensure uniformity of large-area films, and linear vapor deposition sources have replaced conventional point evaporation sources. Such a linear vapor deposition source includes a plurality of vapor deposition vents having the same diameter and the same distance, located in an upper portion of a parallelepiped pot to uniformly vaporize organic substances on a large-area substrate. . However, the organic matter evaporated by the vapor deposition vent having the same diameter and the same distance is concentrated in the middle of the substrate, so that the intermediate portion of the substrate is thicker than the edge of the substrate. In addition, since the organic material is vapor-deposited using a predetermined angle, only the portion of the organic material evaporated from the vapor deposition vent and corresponding to the edge of the substrate will be deposited on the substrate. As for the loss of a large amount of organic matter. In addition, the heat of the heated source may be radiated to the substrate via the vapor vent and the transferred heat increases the temperature of the substrate. In this case, the film deposited on the substrate may be damaged. SUMMARY OF THE INVENTION The present invention provides an evaporator and a vacuum deposition apparatus having the same, which is used to improve the deposition of a film deposited on a substrate and to reduce the loss of organic matter. Further, the present invention further provides an evaporator and a vacuum deposition apparatus having the same for preventing heat radiation from the evaporation source to the substrate and preventing an increase in temperature of the substrate. In one embodiment, the evaporator includes: a pot in which the organic substance is stored; a can lid covering the opening of the container can; and a plurality of vapor deposition vents 'a plurality of vapor deposition vents Interval with each other to evaporate the organic matter evaporated from the canister. & Multiple steam vents may differ from each other by at least one of length and diameter. Each of the plurality of steaming key vents may have a shape that penetrates vertically into the container and is coupled to the can lid. The plurality of vapor deposition vents may be transferred to the can lid in a manner in which the vapor deposition vents protrude toward at least one of the exterior and the interior of the container can. The vapor deposition vent protruding to the outside of the container can be bent. 200948993 The length of the plurality of vapor deposition vents can be made from the center of the container. The edge of the increase. The distance between the plurality of vapor deposition vents may be such that the distance between the plurality of vapor deposition vents of the can is reduced from the center toward the edge. The diameter of the plurality of vapor deposition vents may be reduced from the center of the canister toward the edge of the can. The distance between the plurality of vapor deposition vents can be the same. The distance between the plurality of vapor deposition vents can be reduced by the center of the canister = the edge of the can. The evaporator may further include a stayer disposed on the can lid to prevent residual shots. Each of the plurality of vapor deposition vents has a shape that penetrates vertically into the container, and each of the vapor deposition vents is coupled to the can lid and the baffle. The evaporator may further include a heating member disposed between the can lid and the baffle. The heating member surrounds each of the plurality of steam vents. In another embodiment, the vacuum deposition apparatus includes: a cavity; a substrate supporting unit disposed in the cavity, and the substrate supporting unit supports the substrate; the container can facing the substrate supporting unit in the cavity, and The canister stores organic matter therein; a can lid covering the opening of the canister; and a plurality of vapor deposition vents spaced apart from each other to evaporate the organic matter evaporated by the canister. The plurality of vapor deposition vents may differ from each other at least in one of the length and the diameter. The vacuum deposition apparatus further includes a baffle plate disposed on the can lid and preventing heat radiation, and a heating member for heating each of the vapor deposition exhaust ports. [Advantageous Effects] According to the disclosure of the present invention, the vapor deposition vent for vaporizing the evaporated organic substance has a pipe shape including a penetrating center and a different length of 200948993 and a diameter, thereby improving deposition on the substrate. Film uniformity. In addition, according to the present invention, the length of the vapor deposition vent corresponding to the edge of the substrate is increased, or the diameter of the vapor deposition vent is reduced, so that the organic vapor deposited by the vapor deposition vent is organic. Substance loss is minimized. In addition, according to the invention, the baffle plate is disposed on the can lid of the evaporation source to prevent heat radiation from the evaporation source to the substrate, thereby protecting the substrate or the film deposited on the substrate from heat. damage. e
此外，依照本發明所揭露，加熱件配置於蒸鍍排氣口 的周圍，以避免因蒸鍍排氣口堵塞而使薄膜均勻度惡化。 【實施方式】 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。然而，本發 ，可以用不_式加以實施’且其理解不應受限於此處所 提出的實_。更物地說，所提供的這些實施例使此處 之說明成為徹底且完全，並絲分縣㈣之目標傳達於 ^領域具通常域者。在全篇朗#巾，類 與類似的構件相關。 十 圖1為一實施例之具有蒸發器300的真空沉積裝置的 橫剖面示意圖1 2為本實施例之蒸發器的爆炸示意 f二圖1為—橫剖面示意圖，其在說明相關領域蒸發器ί 器的面示意® ’其在_本實施例之蒸發 ’在本實施射，Μ崎裝置包括腔體 基材支撐單元2〇〇，以及面對於基材支撐單元2〇〇的 200948993 蒸發器300。基材支撐單元200配置於腔體100内部的上 部’且基材支撐單元200支撐基材S。 腔體100具有圓柱體或長方體的形狀，且腔體1〇〇具 ，預疋之内部表面以對基材s進行處理。腔體1〇〇的形狀 可對應於基材S的形狀，且腔體1〇〇的形狀不限於圓柱體 或長方體的形狀。腔體1〇〇的第一侧壁設置有基材開口 110以裝入與退出基材$，且基材開口 ho亦可設置於腔 =100的第二侧壁上。腔體100的第二侧壁設置有排出部 分120,以將物質由腔體1〇〇排出，且例如為高真空幫浦 ，的排出構件13〇疋與排出部分12〇連接。排出構件 可、腔體^〇〇之下侧壁(lower wall)連接。排出構件可 ”括冋真空幫浦以及低真空幫浦，以便在腔體觸内 空條件，然後再於腔體刚内維持高真空狀態。 种骑、s Γ以疋一體成形，或是可包括具有敞開上部的下 腔體以及覆蓋敞開上部的腔體蓋(lid)。 *授ί材ί撑單元綱配置於腔體議内部的上部，基材 If撐與移動被裝人腔體中的基材S。基材支 撐基材s .、匕.支揮物21G，以在其本身的下表面上支 2^0 部分22G，以移動支摔物21G。支撐物Further, according to the present invention, the heating member is disposed around the vapor deposition exhaust port to prevent the film uniformity from being deteriorated due to clogging of the vapor deposition exhaust port. [Embodiment] The above described features and advantages of the present invention will be more apparent from the following description. However, the present invention may be implemented in a non-form and the understanding thereof should not be limited to the actual _ presented herein. More specifically, the embodiments provided are intended to be thorough and complete, and the objectives of the county (4) are communicated to the domain. In the whole article, the category, the class is related to similar components. FIG. 1 is a schematic cross-sectional view of a vacuum deposition apparatus having an evaporator 300 according to an embodiment. FIG. 1 is an exploded view of the evaporator of the present embodiment. FIG. 1 is a cross-sectional view showing a related art evaporator ί. The surface of the device is shown in the present embodiment. The evaporation device of the present embodiment comprises a cavity substrate supporting unit 2, and a 200948993 evaporator 300 facing the substrate supporting unit 2〇〇. The substrate supporting unit 200 is disposed at the upper portion inside the cavity 100 and the substrate supporting unit 200 supports the substrate S. The cavity 100 has the shape of a cylinder or a rectangular parallelepiped, and the cavity 1 has a pre-twisted inner surface to treat the substrate s. The shape of the cavity 1 可 may correspond to the shape of the substrate S, and the shape of the cavity 1 不 is not limited to the shape of a cylinder or a rectangular parallelepiped. The first side wall of the cavity 1 is provided with a substrate opening 110 for loading and unloading the substrate $, and the substrate opening ho can also be disposed on the second side wall of the cavity =100. The second side wall of the cavity 100 is provided with a discharge portion 120 for discharging the substance from the cavity 1 and, for example, a high vacuum pump, and the discharge member 13 is connected to the discharge portion 12A. The discharge member can be connected to the lower wall of the cavity. The discharge member may include a vacuum pump and a low vacuum pump to contact the inner cavity condition and then maintain a high vacuum state in the cavity. The ride, the s Γ are integrally formed by the raft, or may include a lower cavity having an open upper portion and a cavity cover covering the open upper portion. * The material is arranged in the upper part of the cavity, and the substrate is supported and moved to the base in the cavity. Material S. The substrate supports the substrate s., 匕. The support 21G, to support the 2^0 portion 22G on its lower surface to move the support 21G.
形時4擔基材S之形狀。舉例來說，當基材S為圓 為多邊# # ±1G可對應於基材S而為圓形，而當基材S 支熱21G可對應於基材s而為多邊形。支 製程中 積效率，因此，沉積製程所需 200948993 的溫度可被維持住。驅動部分220連接於支撐物2l〇的上 部’且驅動部分220使支撐基材S的支撐物21〇移動。驅 動部分220設置有例如為馬達230之驅動構件，以提供驅 動部分220 —驅動力。驅動部分22〇可在旋轉支撐物21〇 的同時移動支撐物210。 蒸發器300配置於腔體1〇〇内部較低的部分，並使以 固體或粉末型態存放在蒸發器300中的有機物質蒸發，以 及對基材S的表面提供被蒸發的有機物質。蒸發器包 括容器罐310、覆蓋容器罐310上部的罐蓋32〇，以及耗接 於罐蓋320的多個蒸鍍排氣口 330。蒸鍍排氣口 33〇改善 了沉積於基材S上的薄膜均勻度。蒸發器3〇〇將在後面有 更為詳細的說明。 活動遮板400可設置於基材支撐單元2〇〇與蒸發器 300之間，活動遮板400控制了被蒸發的有機物質的移動 路徑。腔體100的内表面可具有突出物14〇以支撐該活動 遮板400 ’且活動遮板400可配置於突出物14〇上以及固 疋在突出物140上。活動遮板400的結構可以有不同的修 改形式。厚度量測裝置(未緣示)可配置於腔體1〇〇中，以 量測由蒸發器300所蒸發的有機物質總量。 以下將會更詳細地說明蒸發器300。請參照圖1及圖 2’蒸發器300包括容器罐310、覆蓋於容器罐31〇上部的 罐蓋320 ’以及通過罐蓋320的蒸鍍排氣口 33〇。 容器罐310為中空的長方體容器，其具有敞開的頂 部’且有機物質以固態或粉末型態存放於容器罐31〇的内 9 200948993 部空間 形、多 。容器罐310可選擇性地具有長度上延伸的長 面體型以及橢圓形中的其中一種。容器罐 = 如為加熱器(未緣示)之加熱件，以使以粉末型 器罐31〇中的有機物質蒸發。被加熱件所蒸^ ==氣驗蒸鑛至基材s，以在基材s的表面形成均 ❹ ，蓋320覆蓋於設置在容器罐310頂部的開口、或是 覆蓋容器罐310的侧表面以關閉該容器罐31〇，且罐蓋32〇 具有對應於谷器罐310的形狀。請參照圖2，罐蓋32〇設 置有多個通孔322 ’而這些通孔322以預定的距離彼此間 隔開來。可至少在蒸發器3〇〇的長軸方向將通孔322佈置 為一條直線’或是以二維的形式來佈置通孔322。 ◎ 多個蒸鍵排氣口 330，其彼此之間可具有不同的直徑 與長度，分別耦接於罐蓋32〇的通孔322。舉例而言，蒸 鍍排氣口 330可具有圓柱管形，其具有預定的直徑與長 度。當蒸鍍排氣口 330彼此具有不同的直徑與長度時，蒸 鍍排氣口 330的長度可由蒸發器3〇〇的中心往蒸發器300 的邊緣增加’或是，蒸鑛排氣口 330的直徑可由蒸發器300 的中心往蒸發器300的邊緣減少。也就是說，配置於蒸發 器300邊緣的蒸鍍排氣口 330，其長度可大於、或是其直 徑可小於配置在蒸發器3〇〇中心的蒸鍵排氣口 330，以便 改善有機物質蒸氣對於基材S邊緣蒸鍍之直線性。就其本 身而論，當蒸鍍排氣口 330的長度與直徑隨著基材S的相 對位置而有所不同時，有機物質到達基材S的總量會根攄 10 200948993 有機物質所通過的蒸鍍排氣口 330而有所不同。因此，為 了在整個基材S上得到均勻厚度的薄膜，使蒸鍍排氣口 330 的間距不同是有必要的。也就是說，當蒸鍍排氣口 330的 長度由蒸發器300的中心往蒸發器300的邊緣增加，或蒸 鍵排氣口 330的直徑由蒸發器3〇〇的中心朝向蒸發器300 的邊緣減少時，則通過蒸鍍排氣口 330的有機物質總量朝 向容器罐310的邊緣而減少。因此，蒸鍍排氣口 330的間 距由蒸發器300的中心向蒸發器3〇〇的邊緣減少，以增加 蒸鍍排氣口 330朝向蒸發器300邊緣的密度。蒸鍍排氣口 330的直徑範圍可由大約1毫米(mm)到大約2〇毫米，且蒸 鍵排氣口 330的長度範圍可由大約imm到大約i00mm， 以使薄膜的均勻度達到最大。雖然容器罐310與罐蓋32〇 如上所述為分離的零件，但容器罐31〇與罐蓋32〇可為一 體成形。雖然蒸鍍排氣口 330的橫剖面為圓形，此橫剖面 可以是橢圓形，或是多邊形，例如：三角形與四角形。如 圖5所示，蒸鍍排氣口 330可以是分離的零件，耦接於罐 蓋320及擋板340 ’或者，蒸鍵排氣口 330可與罐蓋320 或擋板340 —體成形。 在相關的領域中，請參照圖3，由於有機物質是經由 相同長度及相同直徑的通孔所蒸鍍，因此有機物質具有相 同的蒸鍍角度。如此，有機物質沉積於基材中心的總量， 會大於有機物質沉積於基材邊緣的總量，因此使得薄膜的 均勻度惡化，並增加有機物質的流失。此外，蒸鍍源的熱 篁會直接被輕射至基材，因此使基材或基材上的膜層受到 11 200948993 損傷。 另一方面，依照本實施例，當以固體或粉末形態存放 於容器罐310中的有機物質被加熱且蒸發時，被蒸發的有 機物質會經由蒸鍍排氣口 330均勻地以蒸氣型態蒸鍍於基 材S。也就是說’請參照圖4 ’由於蒸發器3〇〇中心所配 置的蒸鍍排氣口 330，其具有短的長度或是大的直徑，因 此，被蒸發且由蒸發器300發散的有機物質會以大角度被 廣泛地蒸鍍。由於蒸鍍排氣口 330的長度往邊緣增加，或 疋黑·鍍排氣口 330的直徑往邊緣減少，因此由蒸鑛排氣口 330所蒸發的有機物質，其蒸鍍之角度朝向邊緣減少，以 至於有機物質被蒸鑛地較為狹窄’並且增加了有機物質朝 向邊緣的直線性。特別是，由於對應基材邊緣而配置在最 外側的蒸鍍排氣口 330,其具有最長的長度或是最短的直 徑，因此在最外侧被蒸鍍的有機物質會具有最佳的直線 性。由於以蒸氣型態通過蒸鍍排氣口 33〇的有機物質總量 朝向邊緣減少’因此蒸鍍排氣口 330的間距朝向邊緣減 少，以使沉積在基材S上的有機物質厚度均勻，從而控制 ❹ 整個有機物質的蒸鑛總量。因此，根據本實施例所說明之 蒸發器，其配置成使沉積於整個基材S上的薄膜厚度均 勻，並使被蒸發離開基材S的有機物質總量減到最低，從 而減少有機物質的流失。 圖5為另一實施例之具有蒸發器3〇1的真空沉積裝置 橫剖面示意圖。圖6為本實施例之蒸發器的爆炸透視圖。 請參照圖5及圖6 ’在本實施例中，真空沉積裝置包 12 200948993 括腔體100、基#支稽單元200,以及面對於基材支撐單元 200的蒸發器301。基材支撐單元細配置於腔體〗⑻内部 的上部，且基材支撐單元2〇〇支撲基材s。紐器3〇1包 括，器罐310、覆蓋於容器罐31〇上部的罐蓋32〇、配置於 罐盍320上的擋板340，以及耦接於罐蓋32〇與擋板34〇 的蒸鍍排氣口 330。也就是說，蒸發器3〇1與蒸發器3〇〇 不同，蒸發器301更進一步包括罐蓋32〇上的擋板34〇。 ❹ 配置於罐蓋320上的擋板340，使在容器罐31〇中、 或是蒸鍍排氣口 330所產生的熱量免於輻射至基材s。擋 板340的外表面或是内侧可配置包括冷卻水通道(未繪示） 的冷卻構件，以改善熱隔絕效率（thermal insulati〇n efficiency)。此外，擋板340配置有多個通孔342，而這些 通孔342以一預定的距離彼此間隔開來，且這些通孔342 的位置可對應於罐蓋320上配置有通孔322的位置^因此， 蒸鍍排氣口 330耦接於罐蓋320的通孔322,以及擋板340 的通孔342。擋板340可與罐蓋320接觸，或是與罐蓋32〇 瘳 間隔開。擋板340可與罐蓋320具有相同的形狀。 因此，蒸發器301的蒸鍍排氣口 330改善了沉積於基 材S上的薄膜均勻度’且蒸發器3〇1的擋板340避免了由 蒸鍍源至基材S之熱輻射。 圖7為另—實施例之蒸發器302的橫剖面示意圖。 請參照圖7，蒸發器302包括容器罐302、覆蓋於容 器罐310上部的罐蓋320、配置於罐蓋320上的擋板34〇、 通過罐蓋320與擋板340的蒸鍍排氣口 330，以及配置在 13 200948993 蒸鑛排氣口 330周圍的加熱件350。也就是說，蒸發器302 與瘵發器301不同，蒸發器302更包括配置在蒸鍍排氣口 330周圍的加熱件350 〇 加熱件350把蒸鍵排氣口 330加熱。舉例來說，加熱 件350可配置於罐蓋320與擋板340之間，且加熱件350 圍繞於各個蒸鍍排氣口 330。加熱件35〇把蒸鍍排氣口 33〇 加熱’從而使蒸鍍排氣口 330免於堵塞。也就是說，當有 機物質被連續地蒸發而通過蒸鍍排氣口 330至基材，蒸鍍 排氣口 330可能會被連續蒸發的有機物質所堵塞。尤其 〇 是’在蒸發器302的邊緣，長度長或直徑小的蒸鍍排氣口 330可能會較為頻繁地被堵塞。因此，當蒸鍍排氣口 330 的周圍被加熱，以致蒸鍍排氣口 330處於預定或更高的溫 度下，蒸鍍排氣口 330免於被有機物質所堵塞，且附著於 療鑛排氣口 330内部的有機物質被蒸發以防止蒸鍍排氣口 330的堵塞。 請參照圖8 ’在蒸發器303的實例中，蒸鑛排氣口 330 可配置於容器罐310的外侧，且罐蓋320可以一種方式覆 ❹ 蓋於容器罐310，其中蒸鍍排氣口 330朝向基材s。 雖然蒸鍍排氣口 330具有筆直的導管形狀，其包括突 出的上部與下部，但筆直導管形狀的蒸鍍排氣口 330可以 被彎曲。也就是說，當蒸發器3〇〇的蒸鍍排氣口 33〇具有 筆直的導管形狀，包括突出的上部與下部時，蒸發器3〇〇 使被洛發的有機物質沉積於基材的底面，而基材S的上表 面被支撐住。然而，當筆直導管形狀的蒸鍍排氣口 33〇被 14 200948993 彎曲時，基材s被垂直地置放，然後被蒸發的有機物 蒸鍍於基材S的一面，以在基材s上形成均勻的薄膜。 ^雖然本發明已以實施方式揭露如上，然其並非用以限 定本發明，任何所屬技術領域中具有通常知識者，在不^ 離本發明之精神和綱内’當可作鱗之更動與潤娜，故 本發明之保護範圍當視後附之申請專利範圍所界定者 準。 ’、、 ❿ 【圖式簡單說明】 一圖1為一實施例之具有蒸發器的真空沉積裝置的橫剖 面示意圖。 ” β 圖2為一實施例之蒸發器的爆炸透視圖。 ”圖3為一橫剖面示意圖，其在說明相關領域蒸發器的 操作。 圖4為一橫剖面示意圖，其在說明一實施例之蒸發器 的操作。 … 〇 圖5為另一實施例之包括蒸發器的真空沉積裝置的橫 剖面示意圖。 ' 圖6為另一實施例之蒸發器的爆炸透視圖。 圖7為一實施例之蒸發器的橫剖面示意圖。 圖8為又一實施例之蒸發器的爆炸透視圖。 【主要元件符號說明】 100 :腔體 15 200948993 110 :基材開口 120 :排出部分 130 :排出構件 140 :突出物 200 :基材支撐單元 210 :支撐物 220 :驅動部分 300、3(Π、302、303 :蒸發器 310 :容器罐 320 ··罐蓋 330 :蒸鍍排氣口 340 :擋板 350 :加熱件 400 :活動遮板 S :基材The shape of the substrate S is 4 in shape. For example, when the substrate S is a circle, the polygon ## ±1G may be circular corresponding to the substrate S, and when the substrate S is supported, the heat 21G may be polygonal corresponding to the substrate s. The efficiency of the process is intermediate, so the temperature required for the deposition process of 200948993 can be maintained. The driving portion 220 is coupled to the upper portion of the support 21a and the driving portion 220 moves the support 21 of the supporting substrate S. The driving portion 220 is provided with a driving member such as a motor 230 to provide a driving portion 220 - a driving force. The driving portion 22〇 can move the support 210 while rotating the support 21〇. The evaporator 300 is disposed at a lower portion inside the chamber 1 and evaporates the organic substance stored in the evaporator 300 in a solid or powder form, and supplies the surface of the substrate S with the evaporated organic substance. The evaporator includes a canister 310, a can lid 32 that covers the upper portion of the canister 310, and a plurality of vapor deposition ports 330 that are consumed by the can lid 320. The vapor deposition vent 33 〇 improves the uniformity of the film deposited on the substrate S. The evaporator 3〇〇 will be described in more detail later. The movable shutter 400 may be disposed between the substrate supporting unit 2A and the evaporator 300, and the movable shutter 400 controls the moving path of the evaporated organic matter. The inner surface of the cavity 100 may have protrusions 14' to support the movable shutter 400' and the movable shutter 400 may be disposed on the projections 14b and secured to the projections 140. The structure of the movable shutter 400 can be modified in different ways. A thickness measuring device (not shown) may be disposed in the cavity 1 to measure the total amount of organic matter evaporated by the evaporator 300. The evaporator 300 will be explained in more detail below. Referring to Figures 1 and 2', the evaporator 300 includes a container can 310, a can lid 320' covering the upper portion of the container can 31, and a vapor deposition port 33' through the can lid 320. The container can 310 is a hollow rectangular parallelepiped container having an open top portion and the organic substance is stored in a solid or powder form in the container can 31. The canister 310 can optionally have one of an elongate body shape and an elliptical shape extending in length. Container can = a heating element such as a heater (not shown) to evaporate the organic matter in the powder canister 31. The heated part is steamed to the base material s to form a uniform surface on the surface of the substrate s, and the cover 320 covers the opening provided at the top of the container can 310 or covers the side surface of the container can 310. The container can 31 is closed, and the can lid 32 has a shape corresponding to the canister 310. Referring to Fig. 2, the can lid 32 is provided with a plurality of through holes 322' which are spaced apart from each other by a predetermined distance. The through holes 322 may be arranged in a straight line at least in the long axis direction of the evaporator 3' or the through holes 322 may be arranged in a two-dimensional form. ◎ A plurality of steaming key vents 330, which may have different diameters and lengths from each other, and are respectively coupled to the through holes 322 of the can lid 32 。. For example, the vapor deposition vent 330 may have a cylindrical tubular shape with a predetermined diameter and length. When the vapor deposition exhaust ports 330 have different diameters and lengths from each other, the length of the vapor deposition exhaust port 330 may be increased from the center of the evaporator 3 to the edge of the evaporator 300 'or, the steam exhaust port 330 The diameter may be reduced from the center of the evaporator 300 to the edge of the evaporator 300. That is, the vapor deposition vent 330 disposed at the edge of the evaporator 300 may have a length greater than or smaller than the steam key vent 330 disposed at the center of the evaporator 3 to improve the vapor of the organic substance. The linearity of the vapor deposition on the edge of the substrate S. As such, when the length and diameter of the vapor deposition vent 330 differs depending on the relative position of the substrate S, the total amount of organic matter reaching the substrate S will be 摅10 200948993 The vapor deposition vent 330 differs. Therefore, in order to obtain a film having a uniform thickness over the entire substrate S, it is necessary to make the pitch of the vapor deposition vents 330 different. That is, when the length of the vapor deposition exhaust port 330 is increased from the center of the evaporator 300 toward the edge of the evaporator 300, or the diameter of the steaming key exhaust port 330 is from the center of the evaporator 3〇〇 toward the edge of the evaporator 300 When it is reduced, the total amount of organic substances passing through the vapor deposition exhaust port 330 is reduced toward the edge of the container can 310. Therefore, the interval of the vapor deposition exhaust port 330 is reduced from the center of the evaporator 300 toward the edge of the evaporator 3's to increase the density of the vapor deposition exhaust port 330 toward the edge of the evaporator 300. The diameter of the vapor deposition vent 330 may range from about 1 millimeter (mm) to about 2 mm, and the length of the steam vent 310 may range from about imm to about i00 mm to maximize film uniformity. Although the canister 310 and the can lid 32 are separate parts as described above, the container can 31 and the can lid 32 can be integrally formed. Although the cross section of the vapor deposition vent 330 is circular, the cross section may be elliptical or polygonal, such as triangular and quadrangular. As shown in FIG. 5, the vapor deposition vent 330 may be a separate component coupled to the can lid 320 and the baffle 340' or the vapor key vent 330 may be integrally formed with the can lid 320 or the baffle 340. In the related art, referring to Fig. 3, since organic substances are vapor-deposited through through holes of the same length and the same diameter, the organic substances have the same vapor deposition angle. Thus, the total amount of organic matter deposited in the center of the substrate is greater than the total amount of organic matter deposited on the edge of the substrate, thus deteriorating the uniformity of the film and increasing the loss of organic matter. In addition, the heat of the evaporation source is directly incident on the substrate, thus subjecting the film on the substrate or substrate to damage by 11 200948993. On the other hand, according to the present embodiment, when the organic substance stored in the container can 310 in a solid or powder form is heated and evaporated, the evaporated organic substance is uniformly vaporized by the vapor deposition port 330 in a vapor form. Plated on substrate S. That is, 'please refer to FIG. 4' because the vapor deposition exhaust port 330 disposed at the center of the evaporator 3 has a short length or a large diameter, and therefore, the organic substance evaporated and diffused by the evaporator 300 It will be widely evaporated at a wide angle. Since the length of the vapor deposition exhaust port 330 increases toward the edge, or the diameter of the blackout plating port 330 decreases toward the edge, the evaporation of the organic substance by the vapor discharge port 330 decreases toward the edge. So that the organic matter is narrowed by the steamed ore' and increases the linearity of the organic matter towards the edge. In particular, since the vapor deposition vent 330 disposed at the outermost side corresponding to the edge of the substrate has the longest length or the shortest diameter, the organic material vapor-deposited on the outermost side has an optimum linearity. Since the total amount of the organic substance passing through the vapor deposition vent 33 is reduced toward the edge in the vapor form, the pitch of the vapor deposition vent 330 is reduced toward the edge, so that the thickness of the organic substance deposited on the substrate S is uniform, thereby Control the total amount of steam in the entire organic matter. Therefore, the evaporator described in accordance with the present embodiment is configured to make the thickness of the film deposited on the entire substrate S uniform, and to minimize the total amount of organic substances evaporated from the substrate S, thereby reducing the organic matter. Loss. Fig. 5 is a schematic cross-sectional view showing a vacuum deposition apparatus having an evaporator 3〇1 according to another embodiment. Figure 6 is an exploded perspective view of the evaporator of the present embodiment. Referring to Figures 5 and 6', in the present embodiment, the vacuum deposition apparatus package 12 200948993 includes a cavity 100, a base unit 200, and an evaporator 301 facing the substrate supporting unit 200. The substrate supporting unit is finely disposed on the upper portion of the inside of the cavity (8), and the substrate supporting unit 2 supports the substrate s. The new device 3〇1 includes a canister 310, a can lid 32〇 covering the upper portion of the canister 31〇, a baffle 340 disposed on the canister 320, and a steaming coupled to the can lid 32〇 and the baffle 34〇 Plated exhaust port 330. That is, the evaporator 3〇1 is different from the evaporator 3〇〇, and the evaporator 301 further includes a baffle 34〇 on the can lid 32〇. The baffle 340 disposed on the can lid 320 prevents the heat generated in the canister 31 or the vapor deposition port 330 from being radiated to the substrate s. The outer surface or the inner side of the baffle 340 may be provided with a cooling member including a cooling water passage (not shown) to improve thermal insulating efficiency. In addition, the baffle 340 is provided with a plurality of through holes 342 which are spaced apart from each other by a predetermined distance, and the positions of the through holes 342 may correspond to the positions on the can cover 320 where the through holes 322 are disposed. Therefore, the vapor deposition vent 330 is coupled to the through hole 322 of the can lid 320 and the through hole 342 of the baffle 340. The baffle 340 can be in contact with the can lid 320 or spaced apart from the can lid 32. The baffle 340 can have the same shape as the can lid 320. Therefore, the vapor deposition vent 330 of the evaporator 301 improves the film uniformity deposited on the substrate S and the baffle 340 of the evaporator 3〇1 avoids heat radiation from the evaporation source to the substrate S. Figure 7 is a schematic cross-sectional view of an evaporator 302 of another embodiment. Referring to FIG. 7, the evaporator 302 includes a container can 302, a can lid 320 covering the upper portion of the canister 310, a baffle 34 disposed on the can lid 320, and a vapor deposition vent through the can lid 320 and the baffle 340. 330, and a heating element 350 disposed around the 13 200948993 steam vent 310. That is, the evaporator 302 is different from the hair expander 301, and the evaporator 302 further includes a heating member 350 disposed around the vapor deposition exhaust port 330. The heating member 350 heats the steam button exhaust port 330. For example, the heating element 350 can be disposed between the can lid 320 and the baffle 340, and the heating element 350 surrounds each of the vapor deposition vents 330. The heating member 35 加热 heats the vapor deposition vent 33 从而 to prevent the vapor deposition vent 330 from being clogged. That is, when the organic substance is continuously evaporated and passed through the vapor deposition port 330 to the substrate, the vapor deposition port 330 may be clogged by the continuously evaporated organic substance. In particular, 〇 is that at the edge of the evaporator 302, the vapor deposition vent 330 having a long length or a small diameter may be clogged more frequently. Therefore, when the periphery of the vapor deposition exhaust port 330 is heated, so that the vapor deposition exhaust port 330 is at a predetermined or higher temperature, the vapor deposition exhaust port 330 is prevented from being blocked by the organic substance and attached to the therapeutic ore row. The organic matter inside the gas port 330 is evaporated to prevent clogging of the vapor deposition exhaust port 330. Referring to FIG. 8 'in the example of the evaporator 303, the vapor discharge port 330 may be disposed outside the container can 310, and the can lid 320 may be covered in a manner to the container can 310 in a manner in which the vapor deposition port 330 is vaporized. Towards the substrate s. Although the vapor deposition vent 330 has a straight conduit shape including the protruding upper and lower portions, the straight conduit-shaped vapor deposition vent 330 can be bent. That is, when the vapor deposition vent 33 of the evaporator 3 has a straight duct shape including the upper portion and the lower portion of the protrusion, the evaporator 3 causes the organic substance to be deposited on the bottom surface of the substrate. While the upper surface of the substrate S is supported. However, when the straight duct-shaped vapor deposition vent 33 is bent by 14 200948993, the substrate s is placed vertically, and then the evaporated organic matter is evaporated on one side of the substrate S to form on the substrate s. A uniform film. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art may not change the spirit and scope of the present invention. Na, the scope of protection of the invention is defined by the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a vacuum deposition apparatus having an evaporator according to an embodiment. Fig. 2 is an exploded perspective view of the evaporator of an embodiment. Fig. 3 is a schematic cross-sectional view showing the operation of the evaporator in the related art. Figure 4 is a schematic cross-sectional view showing the operation of the evaporator of an embodiment. Fig. 5 is a schematic cross-sectional view showing a vacuum deposition apparatus including an evaporator of another embodiment. Figure 6 is an exploded perspective view of another embodiment of the evaporator. Figure 7 is a schematic cross-sectional view of an evaporator of an embodiment. Figure 8 is an exploded perspective view of an evaporator of still another embodiment. [Main component symbol description] 100: cavity 15 200948993 110: substrate opening 120: discharge portion 130: discharge member 140: protrusion 200: substrate support unit 210: support 220: drive portion 300, 3 (Π, 302 303 : evaporator 310 : container can 320 · · can lid 330 : vapor deposition exhaust port 340 : baffle 350 : heating element 400 : movable shutter S : substrate