TWI615998B - 螢光粉以及包含其之發光裝置封裝件 - Google Patents

螢光粉以及包含其之發光裝置封裝件 Download PDF

Info

Publication number
TWI615998B
TWI615998B TW103114181A TW103114181A TWI615998B TW I615998 B TWI615998 B TW I615998B TW 103114181 A TW103114181 A TW 103114181A TW 103114181 A TW103114181 A TW 103114181A TW I615998 B TWI615998 B TW I615998B
Authority
TW
Taiwan
Prior art keywords
light
phosphor
emitting device
wavelength
range
Prior art date
Application number
TW103114181A
Other languages
English (en)
Chinese (zh)
Other versions
TW201445774A (zh
Inventor
Tae Hun Kim
金泰勳
Ji Na Lee
李智娜
Mi Jung Han
韓美正
Original Assignee
Lg Innotek Co., Ltd.
Ｌｇ伊諾特股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130056027A external-priority patent/KR20140135556A/ko
Priority claimed from KR1020130117219A external-priority patent/KR102131309B1/ko
Application filed by Lg Innotek Co., Ltd., Ｌｇ伊諾特股份有限公司 filed Critical Lg Innotek Co., Ltd.
Publication of TW201445774A publication Critical patent/TW201445774A/zh
Application granted granted Critical
Publication of TWI615998B publication Critical patent/TWI615998B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77347—Silicon Nitrides or Silicon Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7783—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW103114181A 2013-05-16 2014-04-18 螢光粉以及包含其之發光裝置封裝件 TWI615998B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020130056027A KR20140135556A (ko) 2013-05-16 2013-05-16 형광체 및 이를 포함하는 발광소자 패키지
KR10-2013-0056027 2013-05-16
KR10-2013-0117219 2013-10-01
KR1020130117219A KR102131309B1 (ko) 2013-10-01 2013-10-01 형광체 및 이를 포함하는 발광소자 패키지

Publications (2)

Publication Number Publication Date
TW201445774A TW201445774A (zh) 2014-12-01
TWI615998B true TWI615998B (zh) 2018-02-21

Family

ID=50513029

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103114181A TWI615998B (zh) 2013-05-16 2014-04-18 螢光粉以及包含其之發光裝置封裝件

Country Status (5)

Country Link
US (1) US9252340B2 (enExample)
EP (1) EP2803715B1 (enExample)
JP (1) JP6542509B2 (enExample)
CN (1) CN104164234B (enExample)
TW (1) TWI615998B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104716246B (zh) * 2013-12-17 2017-09-26 展晶科技(深圳)有限公司 光电元件封装结构及其制造方法
DE102014202424A1 (de) * 2014-02-11 2015-08-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer reflektierenden Schichtenfolge und Verfahren zum Erzeugen einer reflektierenden Schichtenfolge
KR20160025782A (ko) * 2014-08-28 2016-03-09 엘지이노텍 주식회사 발광 소자 패키지
EP3239592B1 (en) 2014-11-18 2021-03-31 Seoul Semiconductor Co., Ltd. Light emitting device and vehicular lamp comprising same
JP2016225423A (ja) * 2015-05-29 2016-12-28 久豊技研株式会社 Ｌｅｄ用蛍光膜、ｌｅｄ用蛍光膜の製造方法、ｌｅｄ面発光装置、及び画像形成装置
WO2017111495A1 (ko) 2015-12-23 2017-06-29 엘지이노텍 주식회사 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치
CN107452849B (zh) * 2016-06-01 2019-08-27 光宝光电(常州)有限公司 发光二极管封装结构
TWI650884B (zh) * 2016-06-01 2019-02-11 光寶光電（常州）有限公司 發光二極體封裝結構
EP3309446A1 (en) * 2016-10-17 2018-04-18 Lumileds Holding B.V. Light converting device with clamped light converter
WO2021246778A1 (ko) * 2020-06-02 2021-12-09 서울바이오시스주식회사 디스플레이용 발광 소자의 전사 방법
JP7553776B2 (ja) * 2020-07-22 2024-09-19 日亜化学工業株式会社 波長変換部材及び発光装置
CN112490303A (zh) * 2020-10-28 2021-03-12 南昌大学 n面出光为特定几何图形的AlGaInP薄膜LED芯片结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200712177A (en) * 2005-09-27 2007-04-01 Dowa Mining Co Fluorescent substance, process for producing the same, and light emitting device using said fluorescent substance
TW200717866A (en) * 2005-07-29 2007-05-01 Toshiba Kk Semiconductor light emitting device
TW200811269A (en) * 2006-05-19 2008-03-01 Mitsubishi Chem Corp Nitrogen-containing alloy and method of manufacturing fluorescent substance using the same
CN102185076A (zh) * 2009-12-29 2011-09-14 三星电子株式会社 发光装置和具有该发光装置的显示设备
US20120267999A1 (en) * 2010-02-26 2012-10-25 Mitsubishi Chemical Corporation Halophosphate phosphor and white light-emitting device

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7202506B1 (en) * 1999-11-19 2007-04-10 Cree, Inc. Multi element, multi color solid state LED/laser
US8829546B2 (en) * 1999-11-19 2014-09-09 Cree, Inc. Rare earth doped layer or substrate for light conversion
JP3837588B2 (ja) * 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
KR101346580B1 (ko) * 2005-04-01 2014-01-02 미쓰비시 가가꾸 가부시키가이샤 무기 기능재 원료용 합금 분말 및 형광체
JP4228012B2 (ja) * 2006-12-20 2009-02-25 Ｎｅｃライティング株式会社 赤色発光窒化物蛍光体およびそれを用いた白色発光素子
TW200830580A (en) * 2007-01-05 2008-07-16 Solidlite Corp High color saturation three wavelength white-light LED
EP2141216B1 (en) * 2007-04-18 2014-05-07 Mitsubishi Chemical Corporation Phosphor and method for producing the same, phosphor-containing composition, light-emitting device, illuminating device, image display device, and nitrogen-containing compound
KR100986359B1 (ko) * 2008-03-14 2010-10-08 엘지이노텍 주식회사 발광 장치 및 이를 구비한 표시 장치
CN102106009B (zh) * 2008-07-03 2013-07-24 三星电子株式会社 波长转换发光二极管芯片和具有该芯片的发光二极管装置
US8008683B2 (en) * 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device
WO2010114061A1 (ja) * 2009-03-31 2010-10-07 三菱化学株式会社 蛍光体、蛍光体の製造方法、蛍光体含有組成物、発光装置、照明装置及び画像表示装置
JPWO2010119934A1 (ja) * 2009-04-14 2012-10-22 パナソニック株式会社 発光装置、光特性調整方法及び発光装置の製造方法
JP2011014890A (ja) * 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
WO2011145794A1 (ko) * 2010-05-18 2011-11-24 서울반도체 주식회사 파장변환층을 갖는 발광 다이오드 칩과 그 제조 방법, 및 그것을 포함하는 패키지 및 그 제조 방법
JP5437177B2 (ja) * 2010-06-25 2014-03-12 パナソニック株式会社 発光装置
JP2012060097A (ja) * 2010-06-25 2012-03-22 Mitsubishi Chemicals Corp 白色半導体発光装置
US8974695B2 (en) * 2010-11-11 2015-03-10 Auterra, Inc. Phosphors of rare earth and transition metal doped Ca1+xSr1-xGayIn2-ySzSe3-zF2; manufacturing and applications
WO2012120433A1 (en) * 2011-03-10 2012-09-13 Koninklijke Philips Electronics N.V. Phosphor composition for leds
KR101781437B1 (ko) * 2011-04-29 2017-09-25 삼성전자주식회사 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치
US8921875B2 (en) * 2011-05-10 2014-12-30 Cree, Inc. Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods
KR101806551B1 (ko) * 2011-06-16 2017-12-07 엘지이노텍 주식회사 형광체 및 이를 포함하는 발광소자 패키지
KR20130010283A (ko) * 2011-07-18 2013-01-28 삼성전자주식회사 백색 발광 장치 및 이를 이용한 디스플레이 및 조명장치
KR101395432B1 (ko) * 2011-07-28 2014-05-14 주식회사 막스 백색 ｌｅｄ 장치
US8558252B2 (en) * 2011-08-26 2013-10-15 Cree, Inc. White LEDs with emission wavelength correction
CN102391861B (zh) * 2011-09-29 2014-08-27 北京宇极科技发展有限公司 一种氮化合物发光材料及其制法以及由其制成的照明光源
US9082939B2 (en) * 2011-10-24 2015-07-14 Kabushiki Kaisha Toshiba White light source and white light source system including the same
JP2015026418A (ja) * 2011-11-18 2015-02-05 シャープ株式会社 有機エレクトロルミネッセンス表示装置およびそれを用いた電子機器、並びに、有機エレクトロルミネッセンス表示装置の製造方法
JP5885175B2 (ja) * 2012-07-25 2016-03-15 国立研究開発法人物質・材料研究機構 蛍光体およびその製造方法、蛍光体を用いた発光装置、画像表示装置、顔料および紫外線吸収剤
KR101957701B1 (ko) * 2012-11-14 2019-03-14 삼성전자주식회사 발광소자 패키지 및 그 제조방법
US8847261B1 (en) * 2013-03-14 2014-09-30 Cooledge Lighting Inc. Light-emitting devices having engineered phosphor elements
KR102075989B1 (ko) * 2013-06-20 2020-02-11 삼성전자주식회사 적색 형광체, 백색 발광장치, 디스플레이 장치 및 조명장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200717866A (en) * 2005-07-29 2007-05-01 Toshiba Kk Semiconductor light emitting device
TW200712177A (en) * 2005-09-27 2007-04-01 Dowa Mining Co Fluorescent substance, process for producing the same, and light emitting device using said fluorescent substance
TW200811269A (en) * 2006-05-19 2008-03-01 Mitsubishi Chem Corp Nitrogen-containing alloy and method of manufacturing fluorescent substance using the same
CN102185076A (zh) * 2009-12-29 2011-09-14 三星电子株式会社 发光装置和具有该发光装置的显示设备
US20120267999A1 (en) * 2010-02-26 2012-10-25 Mitsubishi Chemical Corporation Halophosphate phosphor and white light-emitting device

Also Published As

Publication number Publication date
CN104164234A (zh) 2014-11-26
JP6542509B2 (ja) 2019-07-10
JP2014224247A (ja) 2014-12-04
EP2803715B1 (en) 2020-02-26
US9252340B2 (en) 2016-02-02
TW201445774A (zh) 2014-12-01
CN104164234B (zh) 2018-11-13
US20140339584A1 (en) 2014-11-20
EP2803715A1 (en) 2014-11-19

Similar Documents

Publication Publication Date Title
EP2803715B1 (en) Phosphor and light emitting device package including the same
EP3057131B1 (en) Light-emitting device package and lighting apparatus including the same
JP6490932B2 (ja) 発光素子パッケージ
EP2860770B1 (en) Light-emitting element
US10479932B2 (en) Phosphor composition, light-emitting device package including same, and lighting device
CN105322084A (zh) 发光器件模块
KR20160024533A (ko) 형광체 조성물 및 이를 포함하는 발광 소자 패키지
KR102131309B1 (ko) 형광체 및 이를 포함하는 발광소자 패키지
KR102261954B1 (ko) 형광체 필름, 이를 포함하는 발광 소자 패키지 및 조명 장치
KR102409189B1 (ko) 형광체 구조물, 이를 포함하는 발광 소자 패키지 및 조명 장치
CN108473868A (zh) 荧光体组合物、包括该荧光体组合物的发光器件封装和照明装置
KR20160094633A (ko) 구형 형광체, 이를 포함하는 발광 소자 패키지 및 조명 장치
US9882098B2 (en) Light-emitting device package containing oxynitride-based phosphor and lighting apparatus containing same
KR20120050089A (ko) 발광소자 및 그 제조방법
KR20150019490A (ko) 발광소자 모듈
KR102024296B1 (ko) 발광소자 패키지
KR102087942B1 (ko) 조명 장치
KR20140135556A (ko) 형광체 및 이를 포함하는 발광소자 패키지
KR20150027536A (ko) 발광소자
KR20140047855A (ko) 발광소자 모듈
KR20120099173A (ko) 발광소자 및 발광소자 제조방법
KR20120045119A (ko) 발광 소자 및 발광 소자 패키지
KR20140076880A (ko) 발광소자 패키지
KR20140092034A (ko) 발광소자 및 이를 포함하는 조명 통신 장치
KR20140073945A (ko) 발광소자

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees