TWI611458B - 氣體混合裝置 - Google Patents
氣體混合裝置 Download PDFInfo
- Publication number
- TWI611458B TWI611458B TW102121573A TW102121573A TWI611458B TW I611458 B TWI611458 B TW I611458B TW 102121573 A TW102121573 A TW 102121573A TW 102121573 A TW102121573 A TW 102121573A TW I611458 B TWI611458 B TW I611458B
- Authority
- TW
- Taiwan
- Prior art keywords
- container
- gas
- processing
- mixing device
- gas mixing
- Prior art date
Links
- 239000007789 gas Substances 0.000 claims abstract description 190
- 238000000034 method Methods 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims 2
- 239000006185 dispersion Substances 0.000 claims 1
- 210000002381 plasma Anatomy 0.000 description 63
- 150000002500 ions Chemical class 0.000 description 10
- 230000004907 flux Effects 0.000 description 5
- 230000015654 memory Effects 0.000 description 5
- 238000007654 immersion Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/10—Mixing gases with gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/10—Mixing gases with gases
- B01F23/19—Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/10—Mixing by creating a vortex flow, e.g. by tangential introduction of flow components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/10—Mixing by creating a vortex flow, e.g. by tangential introduction of flow components
- B01F25/103—Mixing by creating a vortex flow, e.g. by tangential introduction of flow components with additional mixing means other than vortex mixers, e.g. the vortex chamber being positioned in another mixing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/40—Static mixers
- B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
- B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
- B01F25/431—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor
- B01F25/4315—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor the baffles being deformed flat pieces of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/40—Static mixers
- B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
- B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
- B01F25/431—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor
- B01F25/4316—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor the baffles being flat pieces of material, e.g. intermeshing, fixed to the wall or fixed on a central rod
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
- B01F25/40—Static mixers
- B01F25/42—Static mixers in which the mixing is affected by moving the components jointly in changing directions, e.g. in tubes provided with baffles or obstructions
- B01F25/43—Mixing tubes, e.g. wherein the material is moved in a radial or partly reversed direction
- B01F25/431—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor
- B01F25/43197—Straight mixing tubes with baffles or obstructions that do not cause substantial pressure drop; Baffles therefor characterised by the mounting of the baffles or obstructions
- B01F25/431971—Mounted on the wall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261670654P | 2012-07-12 | 2012-07-12 | |
| US61/670,654 | 2012-07-12 | ||
| US13/918,033 | 2013-06-14 | ||
| US13/918,033 US10232324B2 (en) | 2012-07-12 | 2013-06-14 | Gas mixing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201407660A TW201407660A (zh) | 2014-02-16 |
| TWI611458B true TWI611458B (zh) | 2018-01-11 |
Family
ID=49912928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102121573A TWI611458B (zh) | 2012-07-12 | 2013-06-18 | 氣體混合裝置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10232324B2 (enExample) |
| JP (1) | JP6227642B2 (enExample) |
| KR (1) | KR102125764B1 (enExample) |
| CN (1) | CN104471672B (enExample) |
| TW (1) | TWI611458B (enExample) |
| WO (1) | WO2014011423A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI752324B (zh) * | 2018-11-20 | 2022-01-11 | 大陸商拓荊科技股份有限公司 | 混氣結構及反應設備 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014106523A1 (de) * | 2014-05-09 | 2015-11-12 | Aixtron Se | Vorrichtung und Verfahren zum Versorgen einer CVD- oder PVD-Beschichtungseinrichtung mit einem Prozessgasgemisch |
| KR20160147482A (ko) * | 2015-06-15 | 2016-12-23 | 삼성전자주식회사 | 가스 혼합부를 갖는 반도체 소자 제조 설비 |
| CN108138321B (zh) * | 2015-10-06 | 2020-03-20 | 株式会社爱发科 | 混合器、真空处理装置 |
| CN105546348A (zh) * | 2015-12-09 | 2016-05-04 | 无锡拓能自动化科技有限公司 | 应用于气体灌装站的高效混合气体灌装管道 |
| CN105546349A (zh) * | 2015-12-09 | 2016-05-04 | 无锡拓能自动化科技有限公司 | 应用于气体灌装站的气体灌装管道 |
| US10256075B2 (en) * | 2016-01-22 | 2019-04-09 | Applied Materials, Inc. | Gas splitting by time average injection into different zones by fast gas valves |
| JP6419745B2 (ja) * | 2016-03-15 | 2018-11-07 | 株式会社東芝 | ミキサ構造、流体通路装置、および処理装置 |
| US11164737B2 (en) * | 2017-08-30 | 2021-11-02 | Applied Materials, Inc. | Integrated epitaxy and preclean system |
| CN107413218B (zh) * | 2017-09-11 | 2020-11-24 | 张家口新金石科技发展有限公司 | 二氧化碳和氧气气体混合装置及混合气体助燃污染气体零排放系统 |
| CN112739451B (zh) * | 2018-09-20 | 2023-04-04 | 诺拉姆工程及建造有限公司 | 流体混合装置 |
| JP2022515081A (ja) * | 2018-12-20 | 2022-02-17 | アプライド マテリアルズ インコーポレイテッド | 処理チャンバの処理空間に改善されたガス流を供給するための方法および装置 |
| TWI844842B (zh) * | 2019-04-24 | 2024-06-11 | 美商應用材料股份有限公司 | 具有旋轉葉片與氣體注入之用於在固定腔室中塗覆粒子的反應器 |
| CN110237734A (zh) * | 2019-06-10 | 2019-09-17 | 中国石油大学(北京) | 气体混合器及废气处理装置 |
| CN112928008B (zh) * | 2019-12-06 | 2023-03-24 | 中微半导体设备(上海)股份有限公司 | 气体供应系统及其气体输送方法、等离子体处理装置 |
| US20230187229A1 (en) * | 2020-04-06 | 2023-06-15 | Lam Research Corporation | Ceramic additive manufacturing techniques for gas injectors |
| CN113430502B (zh) * | 2021-06-18 | 2022-07-22 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及其混合进气装置 |
| KR20230016923A (ko) * | 2021-07-27 | 2023-02-03 | 삼성전자주식회사 | 증착 장치 |
| AR131647A1 (es) * | 2023-01-20 | 2025-04-16 | Topsoe As | Método para la producción de amoníaco azul |
| US20240383201A1 (en) * | 2023-05-19 | 2024-11-21 | Ut-Battelle, Llc | Static mixing nozzles for fiber randomization in large scale additive manufacturing applications |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5573334A (en) * | 1992-12-02 | 1996-11-12 | Applied Materials, Inc. | Method for the turbulent mixing of gases |
| US20050252449A1 (en) * | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
| US7017514B1 (en) * | 2001-12-03 | 2006-03-28 | Novellus Systems, Inc. | Method and apparatus for plasma optimization in water processing |
| US20080202425A1 (en) * | 2007-01-29 | 2008-08-28 | Applied Materials, Inc. | Temperature controlled lid assembly for tungsten nitride deposition |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4520757A (en) * | 1982-10-27 | 1985-06-04 | Energy Conversion Devices, Inc. | Process gas introduction, confinement and evacuation system for glow discharge deposition apparatus |
| JP2922910B2 (ja) | 1988-12-14 | 1999-07-26 | ソニー株式会社 | 低温成膜装置 |
| JP2939823B2 (ja) | 1990-07-20 | 1999-08-25 | 日本酸素株式会社 | 有機金属気相成長装置 |
| JPH0610138A (ja) | 1991-07-01 | 1994-01-18 | Kokusai Chodendo Sangyo Gijutsu Kenkyu Center | Ｍｏｃｖｄ法による酸化物超電導体の製造方法 |
| JPH07211643A (ja) | 1994-01-20 | 1995-08-11 | Hitachi Electron Eng Co Ltd | Ｃｖｄ装置の反応ガス混合器 |
| KR100296494B1 (ko) | 1999-03-31 | 2001-07-03 | 윤영환 | 수소산소 혼합가스 발생장치 |
| US7780789B2 (en) * | 2001-10-26 | 2010-08-24 | Applied Materials, Inc. | Vortex chamber lids for atomic layer deposition |
| JP2003133300A (ja) | 2001-10-26 | 2003-05-09 | Tokyo Electron Ltd | 成膜装置及び成膜方法 |
| US6933010B2 (en) | 2001-12-03 | 2005-08-23 | Ulvac, Inc | Mixer, and device and method for manufacturing thin-film |
| JP4002768B2 (ja) | 2002-02-14 | 2007-11-07 | 株式会社アルバック | 成膜装置 |
| US6684719B2 (en) * | 2002-05-03 | 2004-02-03 | Caterpillar Inc | Method and apparatus for mixing gases |
| JP2004323894A (ja) | 2003-04-23 | 2004-11-18 | Sekisui Chem Co Ltd | ガス供給安定化器、気相成長装置および気相成長方法 |
| US20060042754A1 (en) * | 2004-07-30 | 2006-03-02 | Tokyo Electron Limited | Plasma etching apparatus |
| KR20080077642A (ko) | 2005-12-23 | 2008-08-25 | 엠케이에스 인스트루먼츠, 인코포레이티드 | 가스들의 다운스트림 해리용 방법들 및 장치들 |
| JP2007335755A (ja) | 2006-06-16 | 2007-12-27 | Matsushita Electric Ind Co Ltd | 基板処理装置および基板処理方法 |
| US8123902B2 (en) * | 2007-03-21 | 2012-02-28 | Applied Materials, Inc. | Gas flow diffuser |
| US8512509B2 (en) * | 2007-12-19 | 2013-08-20 | Applied Materials, Inc. | Plasma reactor gas distribution plate with radially distributed path splitting manifold |
| TW201112886A (en) | 2009-01-09 | 2011-04-01 | Ulvac Inc | Plasma treatment apparatus |
| US9312154B2 (en) | 2009-04-21 | 2016-04-12 | Applied Materials, Inc. | CVD apparatus for improved film thickness non-uniformity and particle performance |
| US20110203560A1 (en) | 2010-02-23 | 2011-08-25 | Wallace William K | Fuel conditioning vacuum module |
| CN106635740B (zh) * | 2011-09-30 | 2019-03-15 | 生命科技股份有限公司 | 具有膜喷洒器的容器 |
-
2013
- 2013-06-14 US US13/918,033 patent/US10232324B2/en not_active Expired - Fee Related
- 2013-06-18 TW TW102121573A patent/TWI611458B/zh active
- 2013-07-01 KR KR1020157003744A patent/KR102125764B1/ko active Active
- 2013-07-01 CN CN201380036866.1A patent/CN104471672B/zh active Active
- 2013-07-01 WO PCT/US2013/048855 patent/WO2014011423A1/en not_active Ceased
- 2013-07-01 JP JP2015521651A patent/JP6227642B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5573334A (en) * | 1992-12-02 | 1996-11-12 | Applied Materials, Inc. | Method for the turbulent mixing of gases |
| US7017514B1 (en) * | 2001-12-03 | 2006-03-28 | Novellus Systems, Inc. | Method and apparatus for plasma optimization in water processing |
| US20050252449A1 (en) * | 2004-05-12 | 2005-11-17 | Nguyen Son T | Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system |
| US20080202425A1 (en) * | 2007-01-29 | 2008-08-28 | Applied Materials, Inc. | Temperature controlled lid assembly for tungsten nitride deposition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI752324B (zh) * | 2018-11-20 | 2022-01-11 | 大陸商拓荊科技股份有限公司 | 混氣結構及反應設備 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104471672A (zh) | 2015-03-25 |
| JP6227642B2 (ja) | 2017-11-08 |
| CN104471672B (zh) | 2020-01-17 |
| US10232324B2 (en) | 2019-03-19 |
| JP2015528060A (ja) | 2015-09-24 |
| TW201407660A (zh) | 2014-02-16 |
| KR102125764B1 (ko) | 2020-06-23 |
| KR20150036567A (ko) | 2015-04-07 |
| WO2014011423A1 (en) | 2014-01-16 |
| US20140014270A1 (en) | 2014-01-16 |
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