TWI609938B - 電子零件接著材料及電子零件之接著方法 - Google Patents

電子零件接著材料及電子零件之接著方法 Download PDF

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Publication number
TWI609938B
TWI609938B TW103144950A TW103144950A TWI609938B TW I609938 B TWI609938 B TW I609938B TW 103144950 A TW103144950 A TW 103144950A TW 103144950 A TW103144950 A TW 103144950A TW I609938 B TWI609938 B TW I609938B
Authority
TW
Taiwan
Prior art keywords
parts
mass
electronic component
epoxy resin
electronic
Prior art date
Application number
TW103144950A
Other languages
English (en)
Chinese (zh)
Other versions
TW201540800A (zh
Inventor
Koujirou Ikoma
Yuuki Horio
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of TW201540800A publication Critical patent/TW201540800A/zh
Application granted granted Critical
Publication of TWI609938B publication Critical patent/TWI609938B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW103144950A 2013-12-26 2014-12-23 電子零件接著材料及電子零件之接著方法 TWI609938B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013269792 2013-12-26

Publications (2)

Publication Number Publication Date
TW201540800A TW201540800A (zh) 2015-11-01
TWI609938B true TWI609938B (zh) 2018-01-01

Family

ID=53477962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103144950A TWI609938B (zh) 2013-12-26 2014-12-23 電子零件接著材料及電子零件之接著方法

Country Status (5)

Country Link
JP (1) JP6301366B2 (ko)
KR (1) KR101862734B1 (ko)
CN (1) CN105814161A (ko)
TW (1) TWI609938B (ko)
WO (1) WO2015098059A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020139020A (ja) * 2019-02-27 2020-09-03 ナミックス株式会社 導電性接着剤
CN111500237A (zh) * 2020-06-08 2020-08-07 东莞市新懿电子材料技术有限公司 一种快速流动可低温固化的底部填充胶粘剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010272546A (ja) * 2010-08-27 2010-12-02 Sony Chemical & Information Device Corp 実装体の製造方法、接続方法及び異方性導電膜
TW201125951A (en) * 2009-10-15 2011-08-01 Hitachi Chemical Co Ltd Conductive adhesive, solar cell and fabricating thereof, and solar cell module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2083514A1 (en) 1990-06-08 1991-12-09 Joyce B. Hall Reworkable adhesive for electronic applications
JPH10279903A (ja) * 1997-04-04 1998-10-20 Asahi Chem Ind Co Ltd 導電性接着剤
JPH11209716A (ja) 1998-01-30 1999-08-03 Asahi Chem Ind Co Ltd 導電性の接着剤
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP2005294086A (ja) * 2004-04-01 2005-10-20 Sumitomo Electric Ind Ltd フィルム状接着剤
KR100776131B1 (ko) * 2006-12-22 2007-11-16 제일모직주식회사 열가소성 수지를 이용한 복층 구조의 이방 도전성 접착필름
JP2011184528A (ja) * 2010-03-05 2011-09-22 Hitachi Chem Co Ltd 回路接続材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201125951A (en) * 2009-10-15 2011-08-01 Hitachi Chemical Co Ltd Conductive adhesive, solar cell and fabricating thereof, and solar cell module
JP2010272546A (ja) * 2010-08-27 2010-12-02 Sony Chemical & Information Device Corp 実装体の製造方法、接続方法及び異方性導電膜

Also Published As

Publication number Publication date
KR20160102390A (ko) 2016-08-30
TW201540800A (zh) 2015-11-01
JPWO2015098059A1 (ja) 2017-03-23
CN105814161A (zh) 2016-07-27
KR101862734B1 (ko) 2018-07-04
JP6301366B2 (ja) 2018-03-28
WO2015098059A1 (ja) 2015-07-02

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