TWI607850B - Mold and transfer molding device - Google Patents

Mold and transfer molding device Download PDF

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Publication number
TWI607850B
TWI607850B TW105127045A TW105127045A TWI607850B TW I607850 B TWI607850 B TW I607850B TW 105127045 A TW105127045 A TW 105127045A TW 105127045 A TW105127045 A TW 105127045A TW I607850 B TWI607850 B TW I607850B
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TW
Taiwan
Prior art keywords
mold
exhaust port
resin
cavity
depth
Prior art date
Application number
TW105127045A
Other languages
English (en)
Other versions
TW201733770A (zh
Inventor
Takeori Maeda
Ryoji Matsushima
Makoto Kawaguchi
Masaaki Wakui
Original Assignee
Toshiba Memory Corp
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Filing date
Publication date
Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp
Publication of TW201733770A publication Critical patent/TW201733770A/zh
Application granted granted Critical
Publication of TWI607850B publication Critical patent/TWI607850B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/54—Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/78—Measuring, controlling or regulating of temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/80—Measuring, controlling or regulating of relative position of mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28—Shaping operations therefor
    • B29C70/40—Shaping or impregnating by compression not applied
    • B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B29C70/48—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM], e.g. by vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76006—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/7604—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76083—Position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76287—Moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76568—Position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

模具及轉注成型裝置
本發明之實施形態係關於一種模具及轉注成型裝置。
半導體裝置等例如有藉由樹脂等將經積層之複數個半導體元件密封而成者。如此之半導體裝置例如藉由使用模具之轉注成型裝置而製造。例如，若未適當地填充樹脂，會產生成型不良。故期望成型性良好之模具及轉注成型裝置。
本發明之實施形態之目的係提供一種成型性良好之模具及轉注成型裝置。 本發明之實施形態之模具包含：基板夾緊面；腔部；吸引部；排氣口部；中間腔；及開閉部。上述基板夾緊面與被處理基板之表面相接。上述腔部自上述基板夾緊面退縮。上述吸引部自上述基板夾緊面退縮。上述排氣口部設置於上述腔部與上述吸引部之間，與上述腔部連結，成為上述腔部內之氣體之排出路徑，且以排氣口部深度自上述基板夾緊面退縮。上述中間腔於上述路徑上設置於上述排氣口部與上述吸引部之間，與上述排氣口部連結，且以較上述排氣口部更深之中間腔深度自上述基板夾緊面退縮。上述開閉部於上述路徑上設置於上述中間腔與上述吸引部之間，且開閉上述路徑。
以下，針對本發明之各實施形態，一面參照圖式一面進行說明。 圖式係示意性或概念性者，各部分之厚度與寬度之關係、部分間之大小之比例等未必與現實者相同。即使表示相同部分之情形時，亦存在相互之尺寸或比例於不同圖式中標示為不同之情形。 於本案說明書與各圖中，就既述之圖，對於與前述者相同之要件附加相同之符號而省略詳細說明。 圖1係例示實施形態之模具及轉注成型裝置之示意剖視圖。 圖2(a)及圖2(b)係例示實施形態之模具之示意圖。 圖1對應於圖2(a)之A1－A2線剖面。圖2(a)係自圖1之箭頭符號AA觀察之俯視圖。圖2(b)係對應於圖2(a)之B1－B2線剖面之剖視圖。 如圖1所示，實施形態之模具10M包含：第1模具10；及第2模具20。第1模具10之主面10a以對向於第2模具20之主面20a之方式配置。圖1係顯示2個模具相互分離之狀態之例。 於該例中，於第2模具20之主面20a上，配置有被處理物70之被處理基板71。於被處理基板71上，例如設置有半導體晶片72。被處理基板71及半導體晶片72為製造之半導體裝置之一部分。 於實施形態中，亦可於第1模具10上配置被處理基板71，於其上配置第2模具。於實施形態中，亦可於第2模具20上配置被處理基板71，於其上設置位置與第1模具10。 將自第2模具20朝向第1模具10之方向作為Z軸方向，將相對於Z軸方向垂直之一方向作為X軸方向。將相對於Z軸方向及X軸方向垂直之方向作為Y軸方向。模具之主面例如沿著X-Y平片擴展。 如圖2(a)所示，於模具10M設置有澆口側模具夾緊部13gm及澆口側基板夾緊部13gs。於模具10M設置有排氣口側模具夾緊部13vm及排氣口側基板夾緊部13vs。於2個模具間配置有被處理基板71，於閉合2個模具之狀態中，基板夾緊部之表面例如與被處理基板71相接。 圖2(b)顯示2個模具閉合之狀態。 如圖1及圖2(b)所示，第1模具10具有基板夾緊面11(基板夾緊部之表面)。如圖2(b)所示，於第1模具10與第2模具20之間配置有被處理基板71(被處理物70)時，基板夾緊面11與被處理基板71之表面71a相接。藉由基板夾緊面11與第2模具20之表面(主面20a)夾緊被處理基板71。 如圖1所示，於第1模具10之主面10a設置凹部。對凹部導入樹脂40。將樹脂40加工成與凹部之形狀相應之形狀而製造半導體裝置。 於該例中，於第1模具10之主面10a，作為凹部設置有剔除部10u、流道10r、澆口部10g、腔部10c、排氣口部10v、中間腔10d及吸引部10e。該等各部係自第1模具10之主面10a之平坦部(基板夾緊面11)退縮之區域。該等之各部相連。 於該例中，於第1模具10設置有開閉部12。開閉部12例如為截斷銷。設置有使開閉部12動作之驅動部12d。藉由利用驅動部12d驅動之開閉部12之動作，例如形成凹部與外部相連之狀態與不相連之狀態。 吸引部10e與吸引路徑20p之一端相連。吸引路徑20p之另一端相連於減壓裝置(例如減壓罐等，未圖示)。 如後述，於2個模具之間配置被處理物70，且以該等模具靠近而2個模具之一部分彼此相接之方式設置。例如，於開閉部12為開狀態下，腔部10c內之氣體(例如空氣)，經由排氣口部10v、中間腔10d、吸引部10e及吸引路徑20p排出。吸引部10e例如為空氣吸引部。對經排出內部氣體之腔部10c導入樹脂40。於該例中，吸引路徑20p設置於第2模具20。於實施形態中，吸引路徑20p亦可設置於第1模具10。 樹脂40經由設置於模具10M之罐部23導入。於該例中，罐部23設置於第2模具20。於實施形態中，罐部23亦可設置於第1模具10。自罐部23填充樹脂40。 實施形態之轉注成型裝置110包含：模具10M、轉注部31、及感測器部50。於該例中，設置有柱塞32與控制部60。控制部60例如進行經由吸引部10e排出來自模具10M內之空間之氣體之控制，及基於轉注部31之動作將樹脂40向模具10M內之空間導入之控制。 罐部23之至少一部分例如為筒狀。於罐部23之內部配置有柱塞32。於柱塞32之端部配置有樹脂40。轉注部31例如可於上下(沿著Z軸方向)移動。於初始狀態中，轉注部31之底部之位置為初始位置31q。轉注部31朝上方向移動，轉注之底部之位置為移動後位置31p。移動後位置31p與初始位置31q之差為移動高度31h。藉由轉注部31之動作，柱塞32移動，而將樹脂40供給至模具10M內(即，第1模具10與第2模具20之間)。 例如，於閉合部12為開狀態中，將樹脂40導入至剔除部10u。通過剔除部10u之樹脂40通過流道10r到達澆口部10g。其後，將樹脂40導入至腔部10c。例如，於樹脂40到達排氣口部10v及中間腔10d時，開閉部12成為閉狀態。腔部10c、排氣口部10v及中間腔10d成為密閉空間，且於該等之各部內，藉由較高壓力填充樹脂40。 如此，實施形態之模具10M(於該例中為第1模具10)包含：基板夾緊面11、腔部10c、吸引部10e、排氣口部10v、中間腔10d及開閉部12。基板夾緊面11與被處理基板71之表面71a相接(參照圖2(b))。腔部10c自基板夾緊面11退縮(參照圖1)。吸引部10e自基板夾緊面11退縮(參照圖1)。 排氣口部10v設置於腔部10c與吸引部10e之間之路徑10p上(參照圖1及圖2(a))。排氣口部10v與腔部10c連結，成為腔部10c內之氣體之排出路徑。腔部10c以排氣口部深度Dc自基板夾緊面11退縮(參照圖1)。 中間腔10d於路徑10p上設置於排氣口部10v與吸引部10e之間。中間腔10d與排氣口部10v連結。中間腔10d以中間腔深度Dd自基板夾緊面11退縮。中間腔深度Dd深於排氣口部深度Dv(參照圖1)。 開閉部12(例如截斷銷)係於路徑10p上設置於中間腔10d與吸引部10e之間。開閉部12例如至少進行上下動作及旋轉動作之至少任一者。藉此，開閉部12可開閉中間腔10d與吸引部10e之間之連通部分。 例如，有未設置上述之較深之中間腔10d之參考例。於該參考例中，將開閉部12設為開狀態，將樹脂40導入至模具10M之腔部10c，於通過排氣口部10v後將開閉部12設為閉狀態，對樹脂40施加較高之壓力。於開閉部12自開狀態向閉狀態之切換之時序不適當之情形時，例如會產生樹脂40未填充或樹脂40洩漏。於該參考例中存在成型性不足之情形。 相對於此，於實施形態中，設置中間腔10d。中間腔深度Dd深於排氣口部深度Dv。藉此，例如，通過排氣口部10v之樹脂40之速度於中間腔10d中變慢。藉此，擴大為獲得正確之成型狀態之開閉部12之切換之時序之裕度。例如，可抑制樹脂40未填充或樹脂40洩漏。根據實施形態，可提供一種成型性良好之模具及轉注成型裝置。 於實施形態中，於設置澆口部10g之情形，澆口部10g深於排氣口部10v之深度。即，模具10M(第1模具10)進而包含以澆口部深度Dg自基板夾緊面11退縮之澆口部10g(參照圖1)。於澆口部10g與排氣口部10v之間之至少一部分設置腔部10c。排氣口部深度Dv較澆口部深度Dg淺。 例如，澆口部深度Dg大於150 μm，例如為250 μm以下。另一方面，排氣口部深度Dv為10 μm以上150 μm以下。藉由將排氣口部深度Dv設為較澆口部深度Dg淺，例如，可兼具樹脂40攔截效果與氣體(空氣)之排出效果。藉此，獲得良好之填充性。 實施形態之轉注成型裝置110包含：上述模具10M；使樹脂40導入至模具10M之轉注部31；及感測器部50。轉注部31係於開閉部12之開狀態下，將樹脂40填充至腔部10c。感測器部50感測樹脂40之至少一部分通過排氣口部10v而到達中間腔10d之至少一部分。開閉部12於感測器部50之感測後設為閉狀態。轉注部31係例如將該閉狀態下對樹脂40施加之壓力，設為高於上述開狀態下對樹脂40施加之壓力。藉此，可獲得較高之填充性。 該等動作之控制例如由控制部60進行。 感測器部50之感測，例如藉由感測轉注部31與腔部10c之間之路徑10q中之模具10M之溫度、樹脂40之壓力、模具10M之反射光及被處理部基板71之反射光之至少任一者而進行。 感測器部50之感測，例如亦可藉由感測腔部10c與吸引部10e之間之路徑10p中之模具10M之溫度、樹脂40之壓力、模具10M之反射光及被處理部基板71之反射光之至少任一者而進行。 感測器部50之檢測例如亦可藉由檢測轉注部31之位置而進行。 如圖1所示，於該例中，設置有第1壓力檢測部51。第1壓力檢測部51係檢測路徑10q中之樹脂40之壓力。於該例中，設置有第2壓力檢測部52。第2壓力檢測部52檢測路徑10p中之樹脂40之壓力。於該例中，設置有第1溫度檢測部53。第1溫度檢測部53檢測路徑10q中之模具10M之溫度。於該例中，設置有第2溫度檢測部54。第2溫度檢測部54檢測路徑10p中之模具10M之溫度。 例如，通過該等凹部時之樹脂40之壓力會根據設置於模具10M之各種凹部之深度而變化。藉由檢測樹脂40之壓力之變化，可判斷樹脂40之端部之到達位置。例如，模具10M之溫度會根據樹脂40通過設置於模具10M之各種凹部之狀態而變化。藉由檢測模具10M之溫度變化，可判斷樹脂40之端部之到達位置。另，照射光且藉由檢測模具10M或被處理基板71之反射光，可判斷樹脂40之端部之到達位置。 於該例中，設置有轉注位置檢測部58。轉注位置檢測部58係檢測轉注部31之位置(沿著Z軸方向之位置)。例如，轉注部31之位置會根據樹脂40通過設置於模具10M之各種凹部之狀態而變化。藉由檢測位置之變化，可判斷樹脂40之端部之到達位置。轉注位置檢測部58含於感測器部50之一部分。 以下，針對轉注成型裝置110之動作之例進行說明。 圖3係例示實施形態之轉注成型裝置之動作之流程圖。 圖4～圖8係例示實施形態之轉注成型裝置之動作之步驟順序之示意剖視圖。 如圖4所示，於第1模具10與第2模具20之間，配置被處理物70，且閉合該等模具。且，將該等模具間之空間減壓。此時，開閉部12為開狀態。 其後，如圖3所示，驅動轉注部31(步驟S110)。 即，如圖5所示，藉由轉注部31之驅動，柱塞32向上方移動。藉此，將樹脂40供給至腔部10c內。 如圖3所示，判斷樹脂40是否填充至特定位置(步驟S120)。於「否」之情形，返回至步驟S110。於「是」之情形，進入後述之步驟S130。 例如，於步驟S120中，如圖6所示，藉由感測器部50(第2壓力檢測部52、第2溫度檢測部54或轉注位置檢測部58等)，檢測樹脂40之位置。例如，檢測樹脂40自腔部10c之溢出。亦可基於檢測結果，變更轉注部31之動作之狀態。 如圖7所示，樹脂40通過排氣口部10v，且樹脂40之至少一部分到達中間腔10d。例如，此時，判斷為「樹脂40填充至特定位置」。於此時，將開閉部12(截斷銷)設為閉狀態。於該例中，截斷銷向下方移動而遮斷路徑。 如此，於圖3之步驟S130中，驅動開閉部12。即，將開閉部12設為閉狀態。 且，如圖8所示，於開閉部12為閉狀態中，進一步供給樹脂40。將樹脂40填充至中間腔10d。 如圖3所示，判斷是否完成適當之轉注動作。即，例如，判斷樹脂40是否已填充至模具10M內。一面施加較高之填充壓力，一面開始將樹脂40熱硬化。且，如圖3所示，停止轉注部31之驅動(步驟S150)。 於實施形態中，於樹脂所含之填料之平均粒徑為0.5 μm以上3 μm以下時，排氣口部深度Dv例如可為40 μm以上150 μm以下。於排氣口深度Dv未達40 μm時，雖樹脂40之攔截效果較高，但氣體之排出效果變低。若排氣口部深度Dv超過150 μm，則氣體之排出效果雖獲改善，但樹脂40之攔截效果降低。於排氣口深度Dv為40 μm以上150 μm以下時，例如，樹脂40之攔截效果高且氣體之排出效果亦高。 另一方面，於實施形態中，樹脂所含之填料之平均粒徑大於3 μm時(例如5 μm以上6 μm以下)，排氣口部深度Dv例如可為40 μm以上200 μm以下。於排氣口深度Dv未達40 μm時，雖樹脂40之攔截效果較高，但氣體之排出效果變低。若排氣口部深度Dv超過200 μm，則氣體之排出效果雖獲改善，但樹脂40之攔截效果降低。於排氣口深度Dv為40 μm以上200 μm以下時，例如，樹脂40之攔截效果高且氣體之排出效果亦高。 圖9(a)～圖9(f)係例示實施形態之模具之示意俯視圖。 如圖9(a)所示，於第1模具10A中設置有流道10r、澆口部10g、腔部10c、排氣口部10v、中間腔10d、吸引部10e及開閉部12(例如截斷銷等)。於該例中，設置有中間排氣口部10x。中間排氣口部10x之深度(自基板夾緊面11之深度)較排氣口部10v之排氣口部深度Dv更淺。中間排氣口部10x設置於腔部10c與中間腔10d之間。於與自腔部10c朝向中間腔10d之方向交叉之方向上，中間排氣口部10x與排氣口部10v並排。於該例中，較淺之排氣口部10v與較深之中間排氣口部10x並列連接。藉由並列連接之該等排氣口部，將腔部10c與中間腔10d連接。藉由使用深度不同之複數個排氣口部，例如，容易進行樹脂40之攔截效果與排氣效果之調整。 如圖9(b)所示，於第1模具10B中，開閉部12(例如截斷銷)之粗細與中間腔10d之寬度實質上相同。藉此，例如，因攔截中間腔10d且亦攔截吸引部10e，故可獲得樹脂40之更高之攔截效果。 如圖9(c)所示，於第1模具10C中，排氣孔部10v沿著腔部10c之邊延伸，且以較長之長度設置。藉此，例如，樹脂40之攔截於面內(X-Y平面內)變得均一，且可使來自腔部10c之樹脂40於面內均一地流出。 如圖9(d)所示，於第1模具10D中，中間排氣口部10x不經由中間腔10d而連接於吸引部10e。藉此，例如，除了容易進行樹脂40之攔截效果與排氣效果之調整外，亦可於將開閉部12設為閉狀態後仍持續排氣效果。 如圖9(e)所示，於第1模具10E中，中間腔10d沿著腔部10c之邊以較長之長度設置。且，於中間腔10d之一部分與腔部10c之間設置有寬度較窄之複數個排氣口部10v。於該構成中，例如，可獲得樹脂40之更高之攔截效果。 如圖9(f)所示，於第1模具10F中，對複數個中間腔10d之各者各設置有1個排氣口部10v。於該構成中，例如，根據樹脂於複數個中間腔10d之流動之差異，可獨立控制複數個開閉部12之開閉狀態。 如此，於實施形態中，排氣口部10v及中間腔10d之構成可為各種變化。 實施形態包含轉注形成方法。該方法包含對模具10M(第1模具10)之腔部10c導入樹脂40。該模具10M(第1模具10)包含：基板夾緊面11，其與被處理基板71之表面71a相接；腔部10c，其自基板夾緊面11退縮；吸引部10e，其自基板夾緊面11退縮；排氣口部10v，其設置於腔部10c與吸引部10e之間之路徑10p上，與腔部10c連結，成為腔部10c內之氣體之排出路徑，且以排氣口部深度Dv自基板夾緊面11退縮；中間腔10d，其於路徑10p上設置於排氣口部10v與吸引部10e之間，與排氣口部10v連結，且以較排氣口部深度Dv深之中間腔深度Dd自基板夾緊面11退縮；及開閉部12，其於路徑10p上設置於中間腔10d與吸引部10e之間，且開閉路徑10p。 實施形態之方法係於樹脂40之至少一部分通過排氣口部10v而到達中間腔10d之至少一部分後，將開閉部12設為閉狀態。可提供一種成型性良好之轉注成型方法。 例如，以降低成本為目的，考慮廢止填充至包含TSV之晶片積層間之間隙之底部填充樹脂，而以模塑樹脂一次填充。例如，具有一面將模具之腔內減壓一面填充樹脂，且於即將完成填充之前使截斷銷作動之方法。然而，於為了填充狹窄之間隙而降低樹脂之黏度之情形，使用如此之方法仍容易產生樹脂洩漏或未填充。 於實施形態中，藉由於截斷銷之近前設置攔截樹脂之部分(排氣口10v)，可使截斷銷之作動延遲。且，藉由於排氣口10v與截斷銷之間設置深度較深之中間腔10d，可增加截斷銷之動作之時序之裕度。 根據實施形態，可提供一種成型性良好之模具及轉注成型裝置。 以上，一面參照具體例，一面針對本發明之實施形態進行說明。但，本發明之實施形態並不限定於該等具體例。例如，關於模具中所含之腔部、排氣口部、中間腔、吸引部、基板夾緊部及開閉部，及轉注成型裝置中所含之轉注部、感測器部及控制部等之各要件之具體構成，只要同業人士藉由自周知之範圍適當選擇，而可同樣地實施本發明且獲得同樣之效果者，皆含在本發明之範圍內。 又，於技術性可行之範圍內組合各具體例之任意2個以上之要件者，只要包含本發明之要旨者亦含在本發明之範圍內。 此外，作為本發明之實施形態，以上述模具及轉注成型裝置為基礎，但同業人士經過適當設計變更而可實施之所有的模具及轉注成型裝置，只要包含本發明之要旨，皆亦屬於本發明之範圍。 此外，於本發明之思想之範疇中，只要是同業人士可想到之各種變更例及修正例者，關於該等變更例及修正例應了解亦屬於本發明之範圍。 雖然已說明本發明之若干實施形態，但該等實施形態僅係作為實例而提出者，並非意欲限制本發明之範圍。該等之新穎實施形態可以其他各種形態實施，且在不脫離發明之主旨之範圍內，可進行各種省略、替代及變更。該等實施形態及其變化皆涵蓋於發明之範圍及主旨，且含在申請專利範圍所記載之發明及其等效之範圍內。 [相關申請案] 本申請案主張日本專利申請案第2016-52652號(申請日：2016年3月16日)之權益，該申請案揭示內容之全文以引用方式併入本文中。
10‧‧‧第1模具
10a‧‧‧主面
10A‧‧‧第1模具
10B‧‧‧第1模具
10c‧‧‧腔部
10C‧‧‧第1模具
10d‧‧‧中間腔部
10D‧‧‧第1模具
10e‧‧‧吸引部
10E‧‧‧第1模具
10F‧‧‧第1模具
10g‧‧‧澆口部
10M‧‧‧模具
10p‧‧‧路徑
10q‧‧‧路徑
10r‧‧‧流道
10u‧‧‧剔除部
10v‧‧‧排氣口部
10x‧‧‧中間排氣口部
11‧‧‧基板夾緊面
12‧‧‧開閉部
12d‧‧‧驅動部
13gm‧‧‧澆口側模具夾緊部
13gs‧‧‧澆口側基板夾緊部
13vm‧‧‧排氣口側模具夾緊部
13vs‧‧‧排氣口側基板夾緊部
20‧‧‧第2模具
20a‧‧‧主面
20p‧‧‧吸引路徑
23‧‧‧罐部
31‧‧‧轉注部
31h‧‧‧移動高度
31p‧‧‧移動後位置
31q‧‧‧初始位置
32‧‧‧柱塞
40‧‧‧樹脂
50‧‧‧感測器部
51‧‧‧第1壓力檢測部
52‧‧‧第2壓力檢測部
53‧‧‧第1溫度檢測部
54‧‧‧第2溫度檢測部
58‧‧‧轉注位置檢測部
60‧‧‧控制部
70‧‧‧被處理物
71‧‧‧被處理基板
71a‧‧‧表面
72‧‧‧半導體晶片
110‧‧‧轉注成型裝置
A1‧‧‧線
A2‧‧‧線
AA‧‧‧箭頭符號
B1‧‧‧線
B2‧‧‧線
Dc‧‧‧排氣口部深度
Dd‧‧‧中間腔深度
Dg‧‧‧澆口部深度
Dv‧‧‧排氣口部深度
S110‧‧‧步驟
S120‧‧‧步驟
S130‧‧‧步驟
S140‧‧‧步驟
S150‧‧‧步驟
X‧‧‧方向
Y‧‧‧方向
Z‧‧‧方向
圖1係例示實施形態之模具及轉注成型裝置之示意剖視圖。 圖2(a)及圖2(b)係例示實施形態之模具之示意圖。 圖3係例示實施形態之轉注成型裝置之動作之流程圖。 圖4係例示實施形態之轉注成型裝置之動作之步驟順序之示意剖視圖。 圖5係例示實施形態之轉注成型裝置之動作之步驟順序之示意剖視圖。 圖6係例示實施形態之轉注成型裝置之動作之步驟順序之示意剖視圖。 圖7係例示實施形態之轉注成型裝置之動作之步驟順序之示意剖視圖。 圖8係例示實施形態之轉注成型裝置之動作之步驟順序之示意剖視圖。 圖9(a)～圖9(f)係例示實施形態之模具之示意俯視圖。
10‧‧‧第1模具
10a‧‧‧主面
10c‧‧‧腔部
10d‧‧‧中間腔
10e‧‧‧吸引部
10g‧‧‧澆口部
10M‧‧‧模具
10p‧‧‧路徑
10r‧‧‧流道
10u‧‧‧剔除部
10v‧‧‧排氣口部
11‧‧‧基板夾緊面
12‧‧‧開閉部
12d‧‧‧驅動部
20‧‧‧第2模具
20p‧‧‧吸引路徑
23‧‧‧罐部
31‧‧‧轉注部
31h‧‧‧移動高度
31p‧‧‧移動後位置
31q‧‧‧初始位置
32‧‧‧柱塞
40‧‧‧樹脂
50‧‧‧感測器部
51‧‧‧第1壓力檢測部
52‧‧‧第2壓力檢測部
53‧‧‧第1溫度檢測部
54‧‧‧第2溫度檢測部
58‧‧‧轉注位置檢測部
60‧‧‧控制部
70‧‧‧被處理物
71‧‧‧被處理基板
72‧‧‧半導體晶片
110‧‧‧轉注成型裝置
AA‧‧‧箭頭符號
Dc‧‧‧排氣口部深度
Dd‧‧‧中間腔深度
Dg‧‧‧澆口部深度
Dv‧‧‧排氣口部深度
Z‧‧‧方向

Claims (4)

  1. 一種模具，其包含： 基板夾緊面，其與被處理基板之表面相接； 腔部，其自上述基板夾緊面退縮； 吸引部，其自上述基板夾緊面退縮； 排氣口部，其設置於上述腔部與上述吸引部之間之路徑上，與上述腔部連結，成為上述腔部內之氣體之排出路徑，且以排氣口部深度自上述基板夾緊面退縮； 中間腔，其於上述路徑上設置於上述排氣口部與上述吸引部之間，與上述排氣口部連結，且以較上述排氣口部深度深之中間腔深度自上述基板夾緊面退縮；及 開閉部，其於上述路徑上設置於上述中間腔與上述吸引部之間，且開閉上述路徑。
  2. 如請求項1之模具，其進而包含： 澆口部，其以澆口部深度自上述基板夾緊面退縮，且於上述澆口部與上述排氣口部之間之至少一部分設置上述腔部，並 上述排氣口部深度較上述澆口部深度淺。
  3. 一種轉注成型裝置，其包含： 如請求項1或2之模具； 轉注部，其將樹脂導入至上述模具；及 感測器部，且 上述轉注部係於上述開閉部之開狀態下將上述樹脂填充至上述腔部， 上述感測器部係感測上述樹脂之至少一部分通過上述排氣口部而到達上述中間腔之至少一部分， 上述開閉部係於上述感測器部之上述檢測之後設為閉狀態。
  4. 如請求項3之轉注成型裝置，其中： 上述感測器部之感測係藉由以下至少任一者而進行： 檢測上述轉注部與上述腔部之間之路徑中之上述模具之溫度、上述樹脂之壓力、上述模具之反射光及上述被處理基板之反射光之至少任一者； 檢測上述腔部與上述吸引部之間之上述路徑之上述模具之溫度、上述樹脂之壓力、上述模具之反射光及上述被處理基板之反射光之至少任一者；及 檢測上述轉注部之位置。
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JP6499105B2 (ja) 2016-03-11 2019-04-10 東芝メモリ株式会社 金型
JP6721525B2 (ja) 2017-03-03 2020-07-15 キオクシア株式会社 金型
JP6981935B2 (ja) * 2018-08-23 2021-12-17 アピックヤマダ株式会社 モールド金型及びそれを備えた樹脂モールド装置
JP6873178B2 (ja) * 2019-03-26 2021-05-19 日本碍子株式会社 半導体製造装置用部材、その製法及び成形型
US11114313B2 (en) * 2019-05-16 2021-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer level mold chase
NL2025807B1 (nl) * 2020-06-10 2022-02-16 Besi Netherlands Bv Werkwijze en mal voor het om hullen van op een drager bevestigde elektronische componenten

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201446458A (zh) * 2013-06-14 2014-12-16 Apic Yamada Corp 樹脂成型模具與樹脂成型裝置
TW201533831A (zh) * 2014-02-18 2015-09-01 Shinetsu Chemical Co 真空層壓裝置及半導體裝置的製造方法
TW201600297A (zh) * 2014-03-17 2016-01-01 Apic Yamada Corp 樹脂模製方法及樹脂模製模具

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807914A (en) * 1972-12-04 1974-04-30 Control Process Inc Cavity pressure control system
US4359435A (en) * 1978-04-19 1982-11-16 Yamato Kogure Method for manufacturing plastic products
JP2744273B2 (ja) * 1988-02-09 1998-04-28 キヤノン株式会社 光電変換装置の製造方法
JP2733707B2 (ja) * 1990-08-31 1998-03-30 ファナック株式会社 射出成形機の部品保守警告方法
JPH05237864A (ja) 1992-02-19 1993-09-17 Nec Corp 樹脂封止型半導体装置の製造方法及びそれに用いる治具
JPH065644A (ja) 1992-06-22 1994-01-14 Nec Yamagata Ltd 樹脂封止型半導体装置の樹脂封止方法
US5397230A (en) * 1993-08-04 1995-03-14 Gencorp Inc. Vent apparatus for an injection mold
JPH08227637A (ja) * 1994-02-23 1996-09-03 Matsushita Electric Works Ltd コントロールスイッチ及びその製造方法
US5766526B1 (en) * 1994-04-20 1999-08-24 Fuji Photo Film Co Ltd Method and apparatus for injection molding
US5566743A (en) * 1994-05-02 1996-10-22 Guergov; Milko G. Method of injecting molten metal into a mold cavity
US6019918A (en) * 1997-01-17 2000-02-01 Guergov; Milko G. Gas assisted injection molding with controlled internal melt pressure
JPH08118387A (ja) * 1994-09-01 1996-05-14 Sumitomo Chem Co Ltd 熱可塑性樹脂成形体の製造方法
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
US6048483A (en) * 1996-07-23 2000-04-11 Apic Yamada Corporation Resin sealing method for chip-size packages
JPH1158454A (ja) 1997-08-27 1999-03-02 Citizen Watch Co Ltd 熱硬化性樹脂成形金型
DE19847152A1 (de) * 1998-10-13 2000-04-20 Decoufle Sarl Anordnung zum Überführen von ovalen Zigaretten aus einer axialen in eine queraxiale Förderbahn
US6228309B1 (en) * 1998-12-22 2001-05-08 Husky Injection Molding Systems Ltd. Method and apparatus for injection molding including valve stem positioning
US20020110658A1 (en) * 2001-02-12 2002-08-15 Lucke Robert V. Composite tank and method for preparing same
JP3725791B2 (ja) * 2001-02-20 2005-12-14 株式会社日本製鋼所 粉体離型剤塗布方法及び金型
ATE343443T1 (de) * 2001-09-21 2006-11-15 Fondarex Sa Entlüftungsventileinrichtung für giessformen
CA2471439A1 (en) * 2003-06-20 2004-12-20 Mold-Masters Limited Mold and hot runner controller located on the machine platen
ATE355145T1 (de) * 2003-10-15 2006-03-15 Fondarex Sa Druck- oder spritzgiessmaschine
JP4243177B2 (ja) * 2003-12-22 2009-03-25 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2006169576A (ja) * 2004-12-15 2006-06-29 Cyg Gijutsu Kenkyusho Kk 真空装置
EP1861879A4 (en) * 2005-03-25 2011-04-20 Fujifilm Corp SEMICONDUCTOR IMAGING ELEMENT AND MANUFACTURING METHOD THEREFOR
US7434829B2 (en) * 2005-04-22 2008-10-14 Visteon Global Technologies, Inc. Interior panel having airbag deployment door
US7585166B2 (en) * 2005-05-02 2009-09-08 Buja Frederick J System for monitoring temperature and pressure during a molding process
JP2008117998A (ja) * 2006-11-07 2008-05-22 Sony Corp 樹脂封止金型及び半導体パッケージの製造方法
KR101025716B1 (ko) * 2008-01-28 2011-03-30 가부시키가이샤 사이토 가나가타 세이사쿠쇼 금형 내의 기체방출구조 및 당해 구조를 구비한 금형
US8290179B2 (en) * 2008-08-21 2012-10-16 Apple Inc. Multiple-use acoustic port
US8635986B2 (en) * 2009-10-26 2014-01-28 Aisan Kogyo Kabushiki Kaisha Rotation angle sensors
JP5684498B2 (ja) * 2010-06-15 2015-03-11 住友重機械工業株式会社 射出成形方法及び射出成形機
CN103328178B (zh) * 2011-02-25 2015-08-05 东丽株式会社 Frp的制造方法
DE102012110307B4 (de) * 2012-10-29 2020-01-23 Kraussmaffei Technologies Gmbh Verfahren zur Herstellung von Verbundmaterial-Bauteilen aus Kunststoff durch Hochdruck-Harztransferpressen und zugehöriges Hochdruck-Harztransferpressen-Werkzeug
JP6058431B2 (ja) * 2013-03-08 2017-01-11 アピックヤマダ株式会社 樹脂モールド装置、および樹脂モールド方法
US9517582B2 (en) * 2014-12-04 2016-12-13 Extrude To Fill, LLC Method of molding a part
US20160279854A1 (en) * 2014-12-04 2016-09-29 Extrude To Fill, LLC Molding system and method of heating a material inside a molding system
KR20160142549A (ko) * 2015-06-03 2016-12-13 현대자동차주식회사 스킨 성형 장치 및 방법
JP6721525B2 (ja) * 2017-03-03 2020-07-15 キオクシア株式会社 金型
TWI666743B (zh) * 2017-09-29 2019-07-21 英屬開曼群島商鳳凰先驅股份有限公司 感測器封裝件及其製作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201446458A (zh) * 2013-06-14 2014-12-16 Apic Yamada Corp 樹脂成型模具與樹脂成型裝置
TW201533831A (zh) * 2014-02-18 2015-09-01 Shinetsu Chemical Co 真空層壓裝置及半導體裝置的製造方法
TW201600297A (zh) * 2014-03-17 2016-01-01 Apic Yamada Corp 樹脂模製方法及樹脂模製模具

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