TWI607499B - Polishing device, polishing pad attachment method, and polishing pad replacement method - Google Patents

Polishing device, polishing pad attachment method, and polishing pad replacement method Download PDF

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Publication number
TWI607499B
TWI607499B TW103103339A TW103103339A TWI607499B TW I607499 B TWI607499 B TW I607499B TW 103103339 A TW103103339 A TW 103103339A TW 103103339 A TW103103339 A TW 103103339A TW I607499 B TWI607499 B TW I607499B
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
pad
attached
polishing table
Prior art date
Application number
TW103103339A
Other languages
English (en)
Chinese (zh)
Other versions
TW201436939A (zh
Inventor
Ryuichi Kosuge
Tadakazu Sone
Soichi Isobe
Takeshi Sakurai
Eiji Hirai
Kaoru Hamaura
Suguru Ogura
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013016876A external-priority patent/JP2014147985A/ja
Priority claimed from JP2013091617A external-priority patent/JP2014176950A/ja
Priority claimed from JP2013172189A external-priority patent/JP2015039743A/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW201436939A publication Critical patent/TW201436939A/zh
Application granted granted Critical
Publication of TWI607499B publication Critical patent/TWI607499B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW103103339A 2013-01-31 2014-01-29 Polishing device, polishing pad attachment method, and polishing pad replacement method TWI607499B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013016876A JP2014147985A (ja) 2013-01-31 2013-01-31 研磨装置、及び、研磨パッド貼り替え方法
JP2013024425 2013-02-12
JP2013091617A JP2014176950A (ja) 2013-02-12 2013-04-24 研磨装置、及び研磨パッド貼り付け方法
JP2013172189A JP2015039743A (ja) 2013-08-22 2013-08-22 研磨装置、及び、研磨パッド剥離方法

Publications (2)

Publication Number Publication Date
TW201436939A TW201436939A (zh) 2014-10-01
TWI607499B true TWI607499B (zh) 2017-12-01

Family

ID=52113191

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103103339A TWI607499B (zh) 2013-01-31 2014-01-29 Polishing device, polishing pad attachment method, and polishing pad replacement method

Country Status (4)

Country Link
US (1) US20150118944A1 (ko)
KR (1) KR20150114382A (ko)
CN (1) CN104968472A (ko)
TW (1) TWI607499B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259366B2 (ja) * 2014-07-09 2018-01-10 株式会社荏原製作所 研磨装置
JP6585445B2 (ja) * 2015-09-28 2019-10-02 株式会社荏原製作所 研磨方法
CN106078493A (zh) * 2016-06-23 2016-11-09 上海汉虹精密机械有限公司 陶瓷盘砂轮片双面研磨加工蓝宝石晶片的方法
JP6883475B2 (ja) 2017-06-06 2021-06-09 株式会社荏原製作所 研磨テーブル及びこれを備える研磨装置
JP6894805B2 (ja) 2017-08-21 2021-06-30 株式会社荏原製作所 基板研磨装置および基板研磨装置における研磨液吐出方法
KR20210143726A (ko) * 2019-03-20 2021-11-29 마루이시 산교 가부시키가이샤 연마장치용 정반, 연마장치 및 연마방법
US11712778B2 (en) * 2019-08-23 2023-08-01 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10175158A (ja) * 1996-12-17 1998-06-30 Toshiba Microelectron Corp 半導体研磨装置
JP2011000671A (ja) * 2009-06-18 2011-01-06 Okamoto Machine Tool Works Ltd 基板用研磨定盤

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
JP2738392B1 (ja) * 1996-11-05 1998-04-08 日本電気株式会社 半導体装置の研磨装置及び研磨方法
US6033293A (en) * 1997-10-08 2000-03-07 Lucent Technologies Inc. Apparatus for performing chemical-mechanical polishing
US6036586A (en) * 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads
US6036589A (en) * 1998-10-27 2000-03-14 Reilly; Cliff Cleaner for a belt sander
US6299519B1 (en) * 1999-08-03 2001-10-09 Agere Systems Guardian Corp. Apparatus and method for removing a polishing pad from a platen
US6422921B1 (en) * 1999-10-22 2002-07-23 Applied Materials, Inc. Heat activated detachable polishing pad
US6746311B1 (en) * 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
US6609950B2 (en) * 2000-07-05 2003-08-26 Ebara Corporation Method for polishing a substrate
JP2002036098A (ja) * 2000-07-25 2002-02-05 Mitsubishi Materials Corp 研磨パッド
US6485359B1 (en) * 2000-09-15 2002-11-26 Applied Materials, Inc. Platen arrangement for a chemical-mechanical planarization apparatus
US6579604B2 (en) * 2000-11-29 2003-06-17 Psiloquest Inc. Method of altering and preserving the surface properties of a polishing pad and specific applications therefor
CN101130231A (zh) * 2001-11-13 2008-02-27 东洋橡胶工业株式会社 研磨垫及其制造方法
US6835118B2 (en) * 2001-12-14 2004-12-28 Oriol, Inc. Rigid plate assembly with polishing pad and method of using
JP4185851B2 (ja) * 2003-01-27 2008-11-26 セイコーエプソン株式会社 玉型加工用粘着テープの粘着力評価方法
CN1684233A (zh) * 2004-04-14 2005-10-19 皮斯洛奎斯特公司 防剥离的抛光垫
US20090098376A1 (en) * 2006-05-17 2009-04-16 Yoshiyuki Fukuoka Double-Sided Adhesive Tape for Securing Polishing-Pad
US7645186B1 (en) * 2008-07-18 2010-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad manufacturing assembly
US7820005B2 (en) * 2008-07-18 2010-10-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad manufacturing process
US8912095B2 (en) * 2009-12-15 2014-12-16 Osaka University Polishing method, polishing apparatus and polishing tool
JP5658976B2 (ja) * 2010-11-05 2015-01-28 日東電工株式会社 両面粘着テープおよび研磨部材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10175158A (ja) * 1996-12-17 1998-06-30 Toshiba Microelectron Corp 半導体研磨装置
JP2011000671A (ja) * 2009-06-18 2011-01-06 Okamoto Machine Tool Works Ltd 基板用研磨定盤

Also Published As

Publication number Publication date
US20150118944A1 (en) 2015-04-30
CN104968472A (zh) 2015-10-07
TW201436939A (zh) 2014-10-01
KR20150114382A (ko) 2015-10-12

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