TWI606110B - 異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置 - Google Patents

異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置 Download PDF

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Publication number
TWI606110B
TWI606110B TW102137986A TW102137986A TWI606110B TW I606110 B TWI606110 B TW I606110B TW 102137986 A TW102137986 A TW 102137986A TW 102137986 A TW102137986 A TW 102137986A TW I606110 B TWI606110 B TW I606110B
Authority
TW
Taiwan
Prior art keywords
adhesive composition
circuit
group
anisotropic conductive
conductive adhesive
Prior art date
Application number
TW102137986A
Other languages
English (en)
Chinese (zh)
Other versions
TW201422764A (zh
Inventor
川上晋
Original Assignee
日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司
Publication of TW201422764A publication Critical patent/TW201422764A/zh
Application granted granted Critical
Publication of TWI606110B publication Critical patent/TWI606110B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
TW102137986A 2012-10-22 2013-10-22 異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置 TWI606110B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012232971A JP6044261B2 (ja) 2012-10-22 2012-10-22 異方導電性接着剤組成物

Publications (2)

Publication Number Publication Date
TW201422764A TW201422764A (zh) 2014-06-16
TWI606110B true TWI606110B (zh) 2017-11-21

Family

ID=50566041

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137986A TWI606110B (zh) 2012-10-22 2013-10-22 異向導電性接著劑組成物、膜狀接著劑、連接結構體、連接結構體的製造方法以及半導體裝置

Country Status (4)

Country Link
JP (1) JP6044261B2 (ja)
KR (1) KR102185169B1 (ja)
CN (1) CN103773265B (ja)
TW (1) TWI606110B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101721732B1 (ko) * 2014-07-25 2017-04-10 삼성에스디아이 주식회사 접착 조성물, 이방 도전성 필름 및 이를 이용한 반도체 장치
JP6614127B2 (ja) * 2015-01-14 2019-12-04 東洋紡株式会社 導電性銀ペースト
JP6462702B2 (ja) * 2015-04-16 2019-01-30 古河電気工業株式会社 導電性接着フィルムおよびダイシングダイボンディングフィルム
JP6672837B2 (ja) * 2016-01-28 2020-03-25 日立化成株式会社 異方導電性接着剤組成物、フィルム状接着剤、接続構造体及び半導体装置
JP7273283B2 (ja) * 2018-09-10 2023-05-15 デクセリアルズ株式会社 接着剤組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2706833B2 (ja) 1990-02-14 1998-01-28 三新化学工業株式会社 カチオン重合開始剤および重合性組成物
JPH06345726A (ja) 1993-06-15 1994-12-20 Nippon Soda Co Ltd 新規スルホニウム塩化合物および重合開始剤
JP4228652B2 (ja) * 1993-07-29 2009-02-25 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
US7192991B2 (en) * 2003-11-26 2007-03-20 3M Innovative Properties Company Cationically curable composition
CN1989145B (zh) * 2004-05-28 2010-06-23 三亚普罗株式会社 新颖的氟代烷基氟磷酸鎓盐和过渡金属络合物盐
CN101689410B (zh) * 2007-08-02 2013-10-16 日立化成株式会社 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法
JP5226562B2 (ja) * 2008-03-27 2013-07-03 デクセリアルズ株式会社 異方性導電フィルム、並びに、接合体及びその製造方法
KR101403846B1 (ko) * 2009-11-05 2014-06-03 히타치가세이가부시끼가이샤 열 중합계 개시제 시스템 및 접착제 조성물
CN104877611B (zh) * 2009-11-17 2020-04-10 日立化成株式会社 电路连接材料、使用其的连接结构体、临时压接方法以及应用
JP2011111557A (ja) * 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
JP2011111556A (ja) * 2009-11-27 2011-06-09 Hitachi Chem Co Ltd 接着剤組成物、回路接続材料、接続体及び回路部材の接続方法、並びに半導体装置
JP5706651B2 (ja) * 2010-09-13 2015-04-22 サンアプロ株式会社 フッ素化アルキルリン酸スルホニウム塩、酸発生剤及び硬化性組成物
JP5561199B2 (ja) * 2011-02-17 2014-07-30 日立化成株式会社 接着剤組成物、回路接続材料、接続体及びその製造方法、並びに半導体装置

Also Published As

Publication number Publication date
KR20140051085A (ko) 2014-04-30
JP6044261B2 (ja) 2016-12-14
KR102185169B1 (ko) 2020-12-01
TW201422764A (zh) 2014-06-16
JP2014084357A (ja) 2014-05-12
CN103773265A (zh) 2014-05-07
CN103773265B (zh) 2018-07-10

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