TWI603158B - Exposure device, exposure method - Google Patents

Exposure device, exposure method Download PDF

Info

Publication number
TWI603158B
TWI603158B TW102120332A TW102120332A TWI603158B TW I603158 B TWI603158 B TW I603158B TW 102120332 A TW102120332 A TW 102120332A TW 102120332 A TW102120332 A TW 102120332A TW I603158 B TWI603158 B TW I603158B
Authority
TW
Taiwan
Prior art keywords
exposure
substrate
unit
disposed
moving
Prior art date
Application number
TW102120332A
Other languages
English (en)
Chinese (zh)
Other versions
TW201351067A (zh
Inventor
三宅健
高木俊博
Original Assignee
三榮技研股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三榮技研股份有限公司 filed Critical 三榮技研股份有限公司
Publication of TW201351067A publication Critical patent/TW201351067A/zh
Application granted granted Critical
Publication of TWI603158B publication Critical patent/TWI603158B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
TW102120332A 2012-06-12 2013-06-07 Exposure device, exposure method TWI603158B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012132802A JP6082884B2 (ja) 2012-06-12 2012-06-12 露光装置、露光方法

Publications (2)

Publication Number Publication Date
TW201351067A TW201351067A (zh) 2013-12-16
TWI603158B true TWI603158B (zh) 2017-10-21

Family

ID=49828382

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102120332A TWI603158B (zh) 2012-06-12 2013-06-07 Exposure device, exposure method

Country Status (4)

Country Link
JP (1) JP6082884B2 (https=)
KR (1) KR102205976B1 (https=)
CN (1) CN103488055A (https=)
TW (1) TWI603158B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102558072B1 (ko) * 2015-03-31 2023-07-20 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 노광 방법
WO2016159200A1 (ja) * 2015-03-31 2016-10-06 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
CN112162465B (zh) * 2015-03-31 2023-06-20 株式会社尼康 曝光装置、平面显示器的制造方法、元件制造方法、及曝光方法
CN105217311A (zh) * 2015-09-09 2016-01-06 合肥芯碁微电子装备有限公司 一种ldi单机自动装置
JP5997409B1 (ja) * 2016-05-26 2016-09-28 株式会社 ベアック 両面露光装置及び両面露光装置におけるマスクとワークとの位置合わせ方法
CN109656104B (zh) * 2018-12-26 2021-03-16 深圳市华星光电半导体显示技术有限公司 一种基板曝光方法及装置
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
CN110647017A (zh) * 2019-10-26 2020-01-03 东莞科视自动化科技有限公司 一种自动对位曝光设备及方法
CN115335772A (zh) * 2020-03-23 2022-11-11 三荣技研股份有限公司 曝光装置及曝光方法
CN116520643B (zh) * 2022-01-24 2025-08-01 成都辰显光电有限公司 基板制备方法及显示面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015615A1 (ja) * 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2006350022A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 描画装置及び描画方法
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004012900A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
US7429532B2 (en) 2005-08-08 2008-09-30 Applied Materials, Inc. Semiconductor substrate process using an optically writable carbon-containing mask
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method
JP4887165B2 (ja) * 2007-02-02 2012-02-29 富士フイルム株式会社 描画装置及び方法
JP5420942B2 (ja) * 2009-03-19 2014-02-19 大日本スクリーン製造株式会社 パターン描画装置およびパターン描画方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015615A1 (ja) * 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2006350022A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 描画装置及び描画方法
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置

Also Published As

Publication number Publication date
JP2013257409A (ja) 2013-12-26
KR20130139170A (ko) 2013-12-20
CN103488055A (zh) 2014-01-01
KR102205976B1 (ko) 2021-01-20
TW201351067A (zh) 2013-12-16
JP6082884B2 (ja) 2017-02-22

Similar Documents

Publication Publication Date Title
TWI603158B (zh) Exposure device, exposure method
JP4616514B2 (ja) 電気部品装着システムおよびそれにおける位置誤差検出方法
CN103085450B (zh) 基板处理设备、工作台机构、定位方法以及程序
WO2003097290A1 (en) Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
JP5813555B2 (ja) 露光描画装置及び露光描画方法
JP2010105106A (ja) 生産装置
TW201350935A (zh) 偏光紫外線照射裝置
TW201537309A (zh) 位置偏移檢測方法、位置偏移檢測裝置、描繪裝置及基板檢查裝置
JP2008250072A (ja) 描画装置及び方法
JP2012171628A (ja) テーピング装置及びテーピング方法
JP5747396B1 (ja) 光軸調整装置
JP2017092342A (ja) 導電性ボールを搭載するシステム
CN115128813B (zh) 虚像显示模组主动对准的方法
CN112514553B (zh) 表面安装机
JP6762527B2 (ja) 部品実装機および部品実装ヘッド
CN114384093A (zh) 面板检测装置以及面板检测方法
JPWO2019234821A1 (ja) 印刷装置
JP5994084B2 (ja) 分割逐次近接露光装置及び分割逐次近接露光方法
CN103517628A (zh) 元件安装装置及元件安装方法
CN208528512U (zh) 一种基于图像检测的仪表组件装配精度控制装置
JP2021015914A (ja) アライメント条件の設定方法
CN114354619A (zh) 定位组件、面板检测装置及其方法
TWI856625B (zh) 描繪位置資訊取得方法以及描繪方法
JP2008051866A (ja) パターン描画装置、パターン描画方法、および基板処理システム
CN115621174B (zh) 预治式晶圆载盘的置载装置及其方法