TWI600743B - 導體元件接著用樹脂糊組成物以及半導體裝置 - Google Patents

導體元件接著用樹脂糊組成物以及半導體裝置 Download PDF

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TWI600743B
TWI600743B TW102110572A TW102110572A TWI600743B TW I600743 B TWI600743 B TW I600743B TW 102110572 A TW102110572 A TW 102110572A TW 102110572 A TW102110572 A TW 102110572A TW I600743 B TWI600743 B TW I600743B
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paste composition
resin paste
meth
silver powder
resin
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TW102110572A
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Chinese (zh)
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TW201430098A (zh
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井上愉加吏
藤田賢
山田和彦
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日立化成股份有限公司
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JP6420121B2 (ja) * 2014-10-31 2018-11-07 京セラ株式会社 半導体接着用樹脂組成物及び半導体装置
JP6620457B2 (ja) * 2015-08-11 2019-12-18 味の素株式会社 樹脂組成物
JP2017066393A (ja) * 2015-09-30 2017-04-06 太陽インキ製造株式会社 導電性接着剤および電子部品
CN110462752B (zh) * 2017-03-29 2021-01-29 京瓷株式会社 电极形成用树脂组合物以及芯片型电子部件及其制造方法
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US20220243086A1 (en) * 2019-06-27 2022-08-04 Dowa Electronics Materials Co., Ltd. Silver powder and method for producing same
JP7461191B2 (ja) 2020-03-27 2024-04-03 株式会社ノリタケカンパニーリミテド 銀ペースト

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