TWI600545B - 除濕基材、除濕基材成形裝置及其成形方法 - Google Patents

除濕基材、除濕基材成形裝置及其成形方法 Download PDF

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TWI600545B
TWI600545B TW104123197A TW104123197A TWI600545B TW I600545 B TWI600545 B TW I600545B TW 104123197 A TW104123197 A TW 104123197A TW 104123197 A TW104123197 A TW 104123197A TW I600545 B TWI600545 B TW I600545B
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substrate
dehumidifying
film layer
release film
adsorbent
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TW104123197A
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TW201704000A (zh
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洪敏郎
曾鵬樟
陳幸婷
康育豪
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財團法人工業技術研究院
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Priority to TW104123197A priority Critical patent/TWI600545B/zh
Priority to CN201510477218.0A priority patent/CN106345239A/zh
Priority to US15/078,508 priority patent/US9889402B2/en
Priority to JP2016076548A priority patent/JP6259485B2/ja
Publication of TW201704000A publication Critical patent/TW201704000A/zh
Priority to JP2017185070A priority patent/JP2018008273A/ja
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    • B01D53/28Selection of materials for use as drying agents
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B01D53/261Drying gases or vapours by adsorption
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Description

除濕基材、除濕基材成形裝置及其成形方法
本揭露係關於一種除濕基材製造技術,詳而言之,係關於一種除濕基材、除濕基材成形裝置以及其成形方法。
關於除濕乾燥設備內除濕元件中的除濕基材的形成,過去是使用手工黏合方式來完成,通過手工方式黏合時,會產生黏合膠膜貼合不均、吸附材料黏合掉落與加工速度過慢等情況,此會導致除濕基材之性能不是很穩定、效能不足等情況。另外,除濕基材使用之膠膜層為氧化矽與氧化鋁之無機膠或為如聚乙烯醇縮丁醛(poly(vinyl butyral),PVB)之有機膠時,在高溫環境下會產生二次硬化,造成元件變形之問題。
由上可知,需要一種讓除濕基材自動成形之裝置,藉此改善手工製作所導致之缺點,以提升除濕基材之成形品質與除濕元件性能。在除濕基材自動成形的過程中,首要考量的是吸附材料與黏合膠膜之間的貼合均勻,最佳狀態是要黏合膠膜上的吸附材料均勻佈滿,但在除濕基材成形過程,為了達到均勻佈滿的目的,需要控制吸附材料的提 供量,這是相當重要的,亦即,若吸附材料過少,會導致黏合膠膜上的吸附材料不足,此會讓效能減弱,若吸附材料過多,則會導致黏合膠膜上的吸附材料掉落,導致吸附材料的浪費。
因此,如何設計一種除濕基材成形裝置,特別是,可使除濕基材自動成形,並且在不過度使用吸附材料下,仍可使黏合膠膜上均勻佈滿吸附材料,實為目前本技術領域人員急迫解決之技術問題。
本揭露目的是要發展新的除濕基材及自動化形成除濕基材。
本揭露係提出一種除濕基材,其包含:金屬層;上膠膜層,係附著於該金屬層一側表面;下膠膜層,係附著於該金屬層另一側表面;以及上、下吸附材料層,係分別附著於該上膠膜層及該下膠膜層上。
本揭露係提出一種除濕基材成形裝置,其包含:放料部、上離形膜覆捲部、上吸附劑黏合部、下離形膜覆捲部、下吸附劑黏合部、輥輪組、壓合輥輪組以及基材覆捲部。放料部係供置放基材原料,該基材原料包含金屬層、上膠膜層、下膠膜層、上離形膜和下離形膜,而位於該放料部之後的該基材原料之前進路徑的周圍之該上離形膜覆捲部係用於收捲該上離形膜,位於該上離形膜已剝離之後的該基材原料之前進路徑的周圍之該上吸附劑黏合部包括第一料桶與第一漏料座,該第一料桶內裝有吸附材料,該第一 漏料座係供該上離形膜已剝離之該基材原料通過時,由該第一料桶落下該吸附材料於該上膠膜層上,位於該上吸附劑黏合部之後的該基材原料之前進路徑的周圍之該下離形膜覆捲部係用於收捲該下離形膜,位於該下離形膜已剝離之後的該基材原料之前進路徑的周圍之該下吸附劑黏合部包括第二料桶與第二漏料座,該第二料桶內裝有吸附材料,該第二漏料座係供該下離形膜已剝離之該基材原料通過時,由該第二料桶落下該吸附材料於該下膠膜層上,從而成為除濕基材,位於該基材原料或除濕基材的前進路徑上且接觸該基材原料或除濕基材的該輥輪組用於帶動該基材原料或除濕基材前進,位於該下吸附劑黏合部之後的該除濕基材之前進路徑處且接觸該除濕基材之吸附材料的該壓合輥輪組,可用以壓合該上膠膜層和該下膠膜層鋪佈有該吸附材料之該除濕基材,而位於該壓合輥輪組之後的該除濕基材之前進路徑的終端之該基材覆捲部,係用以收捲經該壓合輥輪組壓合之該除濕基材,所收捲之除濕基材即可為除濕元件內所使用者。
本揭露另提出一種除濕基材成形方法,包含:提供包括金屬層、上膠膜層、下膠膜層、上離形膜和下離形膜之基材原料;執行除濕基材之成形程序時,先剝離該基材原料之該上離形膜和該下離形膜並使該上離形膜和該下離形膜分別纏繞於不同覆捲部,令該基材原料以水平及垂直方式通過不同漏料座,最後將該基材原料一端纏繞於終端覆捲部上;啟動調整各馬達之轉速,剝離該上膠膜層後,於 該基材原料之該上膠膜層上鋪佈吸附材料;剝離該基材原料之該下離形膜;於該基材原料之該下膠膜層上鋪佈該吸附材料,從而成為除濕基材;壓合該上膠膜層和該下膠膜層鋪佈有該吸附材料之該除濕基材;以及收捲經壓合之該除濕基材。
相較於習知技術,本揭露所提出之除濕基材成形裝置及其形成方法,先提供包含金屬層、上膠膜層、下膠膜層、上離形膜和下離形膜組成之基材原料及包含放料部、上離形膜覆捲部、上吸附劑黏合部、下離形膜覆捲部、下吸附劑黏合部、輥輪組、壓合輥輪組和基材覆捲部的除濕基材成形裝置,通過簡單流程將吸附材料分別鋪佈上、下膠膜層上,特別是,透過厚薄規調整控制板位置,使得基材原料通過上、下吸附劑黏合部時,僅有一個吸附材料直徑的間隙,即間隙僅為單一個吸附材料的落下空間,如此,當吸附材料大量落下時,可均勻鋪佈在上、下膠膜層上,同時不會有落下的吸附材料過多的問題,故可減少吸附材料浪費或鋪佈不均勻等問題,實為一種簡易自動化成形裝置,同時能形成不浪費原料且高良率之除濕基材。
1‧‧‧除濕基材
11、21‧‧‧金屬層
121、221‧‧‧上膠膜層
122、222‧‧‧下膠膜層
131‧‧‧上吸附材料層
132‧‧‧下吸附材料層
14‧‧‧吸附材料
2‧‧‧基材原料
231‧‧‧上離形膜
232‧‧‧下離形膜
3‧‧‧除濕基材成形裝置
31‧‧‧放料部
311‧‧‧轉軸
32‧‧‧基材覆捲部
33‧‧‧第一剝離輥輪
34‧‧‧上離形膜覆捲部
35‧‧‧上吸附劑黏合部
351‧‧‧第一料桶
352‧‧‧第一漏料座
3521‧‧‧第一上漏料座
3521a‧‧‧開孔
3522‧‧‧第一下漏料座
353‧‧‧厚薄規
354‧‧‧控制板
36‧‧‧第二剝離輥輪
37‧‧‧下離形膜覆捲部
38‧‧‧下吸附劑黏合部
39‧‧‧壓合輥輪組
4‧‧‧控制模組
41‧‧‧第一輥輪
42‧‧‧第二輥輪
43‧‧‧第三輥輪
44‧‧‧第四輥輪
5‧‧‧皮帶傳動系統
61‧‧‧基材覆捲部動力馬達
62‧‧‧上離形膜覆捲部動力馬達
63‧‧‧下離形膜覆捲部動力馬達
64‧‧‧輥輪動力馬達
P‧‧‧前進路徑
S91~S97‧‧‧步驟
第1圖係為本揭露之除濕基材之示意圖;第2圖係為本揭露之基材原料之示意圖;第3圖係為本揭露之除濕基材成形裝置前段結構之示意圖;第4圖係為本揭露之除濕基材成形裝置之示意圖; 第5圖係為本揭露之上吸附劑黏合部之示意圖;第6圖係為本揭露之除濕基材成形裝置中各馬達動力系統之示意圖;第7圖係為本揭露之除濕基材成形裝置的運作流程示意圖;第8圖係為本揭露之輥輪組皮帶傳動系統之示意圖;以及第9圖係為本揭露之除濕基材成形方法之步驟圖。
以下藉由特定的具體實施形態說明本揭露之技術內容,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本揭露之優點與功效。然本揭露亦可藉由其他不同的具體實施形態加以施行或應用。
請參照第1圖,係為本揭露之除濕基材之示意圖。如圖所示,其顯示依據本揭露之一實施例之除濕基材1,其包括金屬層11、上膠膜層121、下膠膜層122、上吸附材料層131與下吸附材料層132。上膠膜層121係附著於金屬層11一側表面,下膠膜層122係附著於金屬層11另一側表面,上吸附材料層131與下吸附材料層132分別附著在上膠膜層121與下膠膜層122上。具體來說,上、下吸附材料層131、132係以吸附材料14形成,該吸附材料14可為矽膠、活性氧化鋁、沸石或活性碳等多孔性材料,以熱傳導之方式將金屬層11所產生的熱能直接對上、下吸附材料層131、132進行加熱脫附。另外,上、下吸附材料層 131、132的厚度可為上、下膠膜層121、122之兩倍。
於一實施例中,金屬層11可例如為超導薄膜發熱片或正溫度係數(PTC,Positive Temperature Coefficient)熱敏電阻,或如鎢絲、熱電材料(thermal electric material)等其他可電致生熱之材料,而於金屬層11正反面分別與上、下吸附材料層131、132之間更可選擇性設置有上膠膜層121和下膠膜層122,上膠膜層121和下膠膜層122可為導熱、耐熱且絕緣之材料,例如丙烯酸(Acrylic)與聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)的組成或是矽氧樹脂(polymerized siloxanes,silicone)與聚巰亞胺(PI)的組成,舉例來說,可為0.075mm(Acrylic)+0.05mm(PET)+0.075mm(Acrylic),亦可以耐高溫高分子Silicone系黏結膠層取代Acrylic系黏結膠層,同時以聚巰亞胺(PI)取代(PET)。
上、下吸附材料層131、132之形成係以顆粒狀之吸附材料14分別覆載在上膠膜層121和下膠膜層122上,藉此黏著固定於金屬層11之上。前述上膠膜層121和下膠膜層122之厚度可為0.16-0.25mm,金屬層11之厚度可為0.03-0.08mm,形成為吸附材料層之吸附材料14的顆粒直徑可為0.3-0.5mm,經輥壓過之吸附材料14將被壓扁。本揭露之另一實施例,即為將作為吸附材料層之吸附材料14快速且平均地覆載在上膠膜層121和下膠膜層122上。
請參照第2圖,係為本揭露之基材原料之示意圖。如圖所示,在將第1圖中吸附材料14覆載在上膠膜層121和 下膠膜層122上之前,須先有一基材原料2,該基材原料2包括金屬層21、上膠膜層221、下膠膜層222、上離形膜231及下離形膜232,其中,金屬層21、上膠膜層221、下膠膜層222之材料特性與第1圖所述相同,而上離形膜231、下離形膜232分別黏貼於上膠膜層221、下膠膜層222上。
基材原料2可將其轉成圓柱狀收藏,當要將吸附材料14覆載在上膠膜層221、下膠膜層222上時,才將上離形膜231、下離形膜232與上膠膜層221、下膠膜層222分離。
請參閱第3圖,係說明本揭露之除濕基材成形裝置前段結構,第4圖係說明本揭露之除濕基材成形裝置3,請一併參考兩圖式及第1和2圖。其中,除濕基材成形裝置3包括放料部31、基材覆捲部32、第一剝離輥輪33、上離形膜覆捲部34、上吸附劑黏合部35、第二剝離輥輪36、下離形膜覆捲部37、下吸附劑黏合部38以及壓合輥輪組39。其中,上離形膜覆捲部34係位於放料部31之後的基材原料2之前進路徑P的周圍,上吸附劑黏合部35位於上離形膜已剝離之後的基材原料2之前進路徑P的周圍,下離形膜覆捲部37係位於上吸附劑黏合部35之後的基材原料2之前進路徑P的周圍,下吸附劑黏合部38係位於下離形膜已剝離之後的基材原料2之前進路徑P的周圍,而基材覆捲部32係位於壓合輥輪組39之後的除濕基材1之前進路徑P的終端。
另外,第一剝離輥輪33位於放料部31與上吸附劑黏 合部35之間的基材原料2之前進路徑P上,第二剝離輥輪36係位於上吸附劑黏合部35與下吸附劑黏合部38之間的基材原料2之前進路徑P上。另外,除濕基材成形裝置3還包括一輥輪組,係位於基材原料2或除濕基材1的前進路徑P上,且接觸基材原料2或除濕基材1,用以帶動基材原料2或除濕基材1前進,後面會再詳述。壓合輥輪組39係位於下吸附劑黏合部38之後的除濕基材1之前進路徑P處,且接觸除濕基材1之吸附材料14,用以壓合上膠膜層和下膠膜層鋪佈有吸附材料之除濕基材1。
請一併參考第2圖所述之基材原料2,實際運作時,放料部31提供置放基材原料2,該基材原料2呈現圓筒狀並套設在放料部31之轉軸311上,該基材原料2先通過第一剝離輥輪33,使基材原料2之上離形膜231脫離基材原料2,該上離形膜231由上離形膜覆捲部34收捲,接著,已被第一剝離輥輪33剝離上離形膜231之基材原料2經第一輥輪41之上端後,基材原料2之上膠膜層221朝上,並以水平方式通過上漏料座3521與下漏料座3522之間的間距,使得上吸附劑黏合部35內之吸附材料14(如第1圖所示)覆載在該基材原料2之上膠膜層221上,形成第1圖所示之上吸附材料層131,之後,基材原料2經第二輥輪42之上端後,再通過第二剝離輥輪36,使下離形膜232脫離基材原料2,該下離形膜232由下離形膜覆捲部37收捲,接著,已被第二剝離輥輪36剝離下離形膜232之基材原料2再經第三輥輪43之下端後,使得基材原料2之下 膠膜層222朝向下吸附劑黏合部38,並以垂直方式通過上漏料座與下漏料座之間的間距,不僅可縮小除濕基材成形裝置3之體積及長度,並可使下吸附劑黏合部38內之吸附材料14覆載在基材原料2之下膠膜層222上,形成第1圖所示之下吸附材料層132,如此,即可形成最基本的除濕基材1。
最後,除濕基材1經第四輥輪44之上端後,再通過壓合輥輪組39壓合,將吸附材料14將被壓扁,使得吸附材料14分別與上膠膜層221及下膠膜層222更緊密結合,並由基材覆捲部32收捲除濕基材1。但正式將吸附材料14(如第1圖所示)覆載在該基材原料2之上膠膜層221上前,需手動先剝離上離形膜231將其固定在上離形膜覆捲部34上,依上述將基材原料2穿過上吸附劑黏合部35後,剝離下離形膜232將其固定在下離形膜覆捲部37上,並將已剝離上離形膜231及下離形膜232之基材原料2穿過下吸附劑黏合部38後,固定在基材覆捲部32上。
請參閱第5圖,係說明本揭露之上吸附劑黏合部之示意圖。請一併參考第2-4圖,如該圖所示,上吸附劑黏合部35包括第一料桶351與第一漏料座352,可於第一料桶351下端裝設感測器(圖未示)偵測吸附材料14是否用完,第一漏料座352更包括第一上漏料座3521、第一下漏料座3522、厚薄規353以及控制板354。
在上漏料座3521之內部中間設置一開孔3521a可容置第一料桶351落下之吸附材料14,其中,上漏料座3521 與下漏料座3522之間的間距,與吸附材料14之顆粒直徑加上上膠膜層221、金屬層21、下膠膜層222以及下離形膜232之厚度的大小相同,厚薄規353可因不同基材原料2厚度而調整前述之間距,使得基材原料2能穿過該間距,並可由控制板354控制吸附材料14經由第一上漏料座3521之開孔3521a,將吸附材料14均勻落料於上膠膜層221上。
同理,下吸附劑黏合部38也包括第二料桶與第二漏料座,第二漏料座同樣包括第二上漏料座、第二下漏料座、厚薄規及控制板,其組成方式與上吸附劑黏合部35相似,故不再贅述。特別的是,第二上漏料座與第二下漏料座之間的間距,與兩倍的吸附材料14之顆粒直徑加上上膠膜層221、金屬層21、下膠膜層222之厚度的大小相同,同樣地,厚薄規可因不同基材原料2厚度而調整前述間距,使得基材原料2能穿過該間距,並可由控制板控制吸附材料14經由第二上漏料座之開孔,將吸附材料14均勻落料於下膠膜層222上。
請參閱第6圖,係說明本揭露之除濕基材成形裝置中各馬達動力系統之示意圖。如圖所示,基材覆捲部動力馬達61控制基材覆捲部32之轉動,另外,上離形膜覆捲部動力馬達62和下離形膜覆捲部動力馬達63分別提供上離形膜覆捲部34和下離形膜覆捲部37轉動之動力。
請參閱第8圖,係說明本揭露之輥輪組皮帶傳動系統之示意圖。如圖所示,輥輪動力馬達64經由一皮帶傳動系統5控制第一至第四輥輪41、42、43和44以及壓合輥輪 組39為同一轉速,亦即帶動基材原料2前進。另外,還可於放料部31處設置一感測器,藉此偵測基材原料2是否斷料,舉例來說,當捲成圓筒狀之基材原料2的直徑小於一預定值時,判斷基材原料2即將斷料。或是在上吸附劑黏合部35與下吸附劑黏合部38之間的基材原料2上方處設置一感測器,藉此亦可偵測基材原料2是否斷料。
另外,如第6圖所示,除濕基材成形裝置3更包括控制模組4,係用於控制分別提供上離形膜覆捲部34、下離形膜覆捲部37、基材覆捲部32以及各輥輪和壓合輥輪之動力的上離形膜覆捲部動力馬達62、下離形膜覆捲部動力馬達63、基材覆捲部動力馬達61和輥輪動力馬達64之轉速。控制模組4可為觸控式或機械式的控制面板,其可分別調整上述四個動力馬達之轉速,即調整除濕基材整體處理速度。較佳者,各馬達之間的轉速可呈現一特定比例,透過設定將其以單一選項綁定,藉此同時控制四個動力馬達的轉速。
請參考第7圖,係說明本揭露之除濕基材成形裝置3的運作流程示意圖,請一併參考第1和2圖,如圖所示,基材原料2裝設於放料部31上,在通過第一剝離輥輪33下方時,上離形膜231脫離基材原料2並由上離形膜覆捲部34收捲,接著,基材原料2經由第一輥輪41上方以水平方式進入上吸附劑黏合部35,此時,上吸附劑黏合部35內之吸附材料14會從上方鋪佈於基材原料2之上膠膜層221上,之後,基材原料2還是水平方式通過第二輥輪42 上方。
接著,基材原料2在通第二剝離輥輪36上方時,下離形膜232脫離基材原料2並由下離形膜覆捲部37收捲,接著,基材原料2經由第三輥輪43下方改變行進方向,亦即以垂直方式進入到下吸附劑黏合部38,此時,下吸附劑黏合部38內之吸附材料14從側方鋪佈至基材原料2之下膠膜層222上,此時基材原料2兩側的上、下膠膜層221、222皆完成鋪佈有吸附材料,亦即,初步完成除濕基材1。
接著,兩側鋪佈有吸附材料14之除濕基材1,會再經由第四輥輪44上方以改變行進方向,通過壓合輥輪組39壓合該除濕基材1,以使吸附材料14緊覆於基材原料2之上膠膜層221和下膠膜層222上,最後,由除濕基材覆捲部32收捲該除濕基材1,同樣地,可設置一感測器於除濕基材覆捲部32處,用於偵測收捲之除濕基材1之直徑,藉以判斷除濕基材1是否完成製造。
請參考第9圖,係說明本揭露之除濕基材成形方法之步驟圖。於步驟S91中,係提供包括金屬層、上膠膜層、下膠膜層、上離形膜和下離形膜之基材原料。該基材原料的組成結構包括分別附著於該金屬層之兩個表面的該上膠膜層及下膠膜層,而該上離形膜與該下離形膜分別附著在該上膠膜層與該下膠膜層上,該基材原料可捲成圓筒狀收藏,待需執行除濕基材之成形程序時,再套設於第7圖所示之放料部31。
於步驟S92中,執行除濕基材之成形程序時,係先剝 離該基材原料之部分該上離形膜和部分該下離形膜。詳言之,該上離形膜和下離形膜是用以隔絕該上膠膜層、該下膠膜層,避免與外物相黏,因此,若要將吸附材料與該基材原料結合,當然要先剝離該基材原料之該上離形膜和下離形膜,如此該吸附材料才可黏著至該上膠膜層和下膠膜層。並再分別將剝離之該上離形膜和下離形膜纏繞於上離形膜覆捲部及下離形膜覆捲部,並將已剝離之該上離形膜和下離形膜之基材原料,分別以水平及垂直方式通過上漏料座與下漏料座之間的間距,再將其纏繞於除濕基材覆捲部上。
於步驟S93中,啟動調整各馬達之轉速,剝離該上離形膜後,於該基材原料之該上膠膜層上鋪佈該吸附材料。本步驟即是在該上離形膜剝離後,將該吸附材料均勻的鋪佈至上膠膜層上,均勻的方式可如本案第5圖所示,透過厚薄規調整上漏料座與下漏料座之間距,使得落下之該吸附材料可平均且不浪費地鋪佈。
於步驟S94中,係剝離該基材原料之該下離形膜,為要將該吸附材料黏合於下膠膜層,因此,本步驟為將該下離形膜自該基材原料剝離。
於步驟S95中,於該基材原料之該下膠膜層上鋪佈該吸附材料,從而成為除濕基材。承接前一步驟,在該下離形膜剝離後,讓該吸附材料也均勻地鋪佈在該下膠膜層上,關於如何鋪佈均勻,已在本說明書之第5圖的內容中詳細描述,這裡不再贅述。
於步驟S96中,壓合該上膠膜層和該下膠膜層鋪佈有該吸附材料之該除濕基材。本步驟即是將形成為除濕基材之該基材原料上的吸附材料進一步緊壓黏合,因為,前面步驟S93和S95是將吸附材料落料至該上膠膜層和下膠膜層上,僅有該上膠膜層和下膠膜層上之膠的黏合力將該吸附材料與該上膠膜層和下膠膜層兩者附著在一起,故本步驟可將初步完成的除濕基材進入如第7圖所示之壓合輥輪組39進行壓合,目的是讓該吸附材料能更緊黏於該上膠膜層和下膠膜層上。
於步驟S97中,係收捲經壓合之該除濕基材。可同時參考第7圖,經壓合後的除濕基材已是除濕基材的完成品,為了方便該除濕基材之收藏,可將其捲成圓筒狀,如此,也可方便日後將該除濕基材運用於除濕元件(除濕設備內構件)上。
綜上所述,本揭露除了改良除濕基材之材質外,並研發一除濕基材成形裝置及其成形方法,通過簡單製程以將吸附材料鋪佈於基材原料之上、下膠膜層上,特別是,透過厚薄規調整控制板位置,使得除濕基材通過上、下吸附劑黏合部時,僅有一個吸附材料之顆粒直徑的落料間隙,故吸附材料可大量落下以均勻鋪佈在上、下膠膜層上,但因落料間隙僅有吸附材料之顆粒直徑大小,故不會有吸附材料過多的問題,如此可克服吸附材料浪費或鋪佈不均勻等問題,將有助於除濕基材自動成形,同時可達到不浪費原料以及高良率的效果。
上述實施形態僅例示性說明本揭露之原理及其功效,而非用於限制本揭露。任何熟習此項技藝之人士均可在不違背本揭露之精神及範疇下,對上述實施形態進行修飾與改變。因此,本揭露之權利保護範圍,應如後述之申請專利範圍所列。
1‧‧‧除濕基材
2‧‧‧基材原料
3‧‧‧除濕基材成形裝置
31‧‧‧放料部
32‧‧‧基材覆捲部
33‧‧‧第一剝離輥輪
34‧‧‧上離形膜覆捲部
35‧‧‧上吸附劑黏合部
36‧‧‧第二剝離輥輪
37‧‧‧下離形膜覆捲部
38‧‧‧下吸附劑黏合部
39‧‧‧壓合輥輪組
41‧‧‧第一輥輪
42‧‧‧第二輥輪
43‧‧‧第三輥輪
44‧‧‧第四輥輪
P‧‧‧前進路徑

Claims (18)

  1. 一種除濕基材,包含:金屬層,係由超導薄膜發熱片或正溫度係數熱敏電阻之材料形成;上膠膜層,係附著於該金屬層一側表面;下膠膜層,係附著於該金屬層另一側表面;以及上、下吸附材料層,係分別附著於該上膠膜層及該下膠膜層上,該上、下吸附材料層由矽膠、活性氧化鋁、沸石或活性碳之多孔性材料形成。
  2. 如申請專利範圍第1項所述之除濕基材,其中,形成該上膠膜層及該下膠膜層之厚度為0.16-0.25mm。
  3. 如申請專利範圍第1項所述之除濕基材,其中,該金屬層之厚度為0.03-0.08mm。
  4. 如申請專利範圍第1項所述之除濕基材,其中,該上、下吸附材料層之吸附材料的顆粒直徑為0.3-0.5mm。
  5. 一種除濕基材成形裝置,包含:放料部,係供置放基材原料,該基材原料係包括金屬層、上膠膜層、下膠膜層、上離形膜和下離形膜;上離形膜覆捲部,係用於收捲該上離形膜,且該上離形膜覆捲部係位於該放料部之後的該基材原料之前進路徑的周圍; 上吸附劑黏合部,其包括第一料桶與第一漏料座,該第一料桶內裝有吸附材料,且該第一料桶與該第一漏料座係位於該上離形膜已剝離之後的該基材原料之前進路徑的周圍,該第一漏料座係供該上離形膜已剝離之該基材原料通過時,由該第一料桶落下該吸附材料於該上膠膜層上;下離形膜覆捲部,係用於收捲該下離形膜,且該下離形膜覆捲部係位於該上吸附劑黏合部之後的該基材原料之前進路徑的周圍;下吸附劑黏合部,包括第二料桶與第二漏料座,該第二料桶內裝有吸附材料,且該第二料桶與該第二漏料座係位於該下離形膜已剝離之後的該基材原料之前進路徑的周圍,該第二漏料座係供該下離形膜已剝離之該基材原料通過時,由該第二料桶落下該吸附材料於該下膠膜層上,從而成為除濕基材;輥輪組,係位於該基材原料或該除濕基材的前進路徑上,且接觸該基材原料或該除濕基材,用以帶動該基材原料或該除濕基材前進;壓合輥輪組,係位於該下吸附劑黏合部之後的該除濕基材之前進路徑處,且接觸該除濕基材之吸附材料,用以壓合該上膠膜層和該下膠膜層鋪佈有該吸附材料之該除濕基材;以及基材覆捲部,係位於該壓合輥輪組之後的該除 濕基材之前進路徑的終端,用以收捲經該壓合輥輪組壓合之該除濕基材。
  6. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括第一、二動力馬達,係分別提供該上離形膜覆捲部和該下離形膜覆捲部之動力。
  7. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括第三動力馬達,係提供該基材覆捲部之動力。
  8. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括第四動力馬達,係透過皮帶傳動系統轉動該輥輪組及該壓合輥輪組。
  9. 如申請專利範圍第5項所述之除濕基材成形裝置,其中,該輥輪組更包括第一至第四輥輪。
  10. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括第一剝離輥,係位於該放料部與該上吸附劑黏合部之間的該基材原料之前進路徑上。
  11. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括第二剝離輥,係位於該上吸附劑黏合部與該下吸附劑黏合部之間的該基材原料之前進路徑上。
  12. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括控制模組,係用於控制分別提供該上離形膜覆捲部、該下離形膜覆捲部、該基材覆捲部以及該輥輪組和該壓合輥輪組之動力的第一、二、三和四動力馬達之轉速。
  13. 如申請專利範圍第5項所述之除濕基材成形裝置,其中,該上吸附劑黏合部之第一漏料座包括第一上漏料座和第一下漏料座,該第一上漏料座與該第一下漏料座之間距,與該吸附材料之直徑加上該上膠膜層、該金屬層、該下膠膜層以及該下離形膜之厚度相同。
  14. 如申請專利範圍第5項所述之除濕基材成形裝置,其中,該下吸附劑黏合部之第二漏料座包括第二上漏料座和第二下漏料座,該第二上漏料座與該第二下漏料座之間距,與兩倍該吸附材料之直徑加上該上膠膜層、該金屬層以及該下膠膜層之厚度相同。
  15. 如申請專利範圍第13或14項所述之除濕基材成形裝置,其中,該第一上漏料座與該第一下漏料座之間距以及該第二上漏料座與該第二下漏料座之間距分別由不同厚薄規控制。
  16. 如申請專利範圍第13或14項所述之除濕基材成形裝置,其中,該第一上漏料座與該第一下漏料座之間以及該第二上漏料座與該第二下漏料座之間分別包括一控制板,可控制該吸附材料均勻落料於該上、下膠膜層上。
  17. 如申請專利範圍第5項所述之除濕基材成形裝置,更包括一感測器,可偵測該放料部上之基材原料的直徑與該基材覆捲部上之除濕基材的直徑。
  18. 一種除濕基材成形方法,包含: 提供包括金屬層、上膠膜層、下膠膜層、上離形膜和下離形膜之基材原料;執行除濕基材之成形程序時,先剝離該基材原料之部分該上離形膜和部分該下離形膜並使該上離形膜和該下離形膜分別纏繞於不同覆捲部,令該基材原料以水平及垂直方式通過不同漏料座,最後將該基材原料一端纏繞於終端覆捲部上;啟動調整各馬達之轉速,剝離該上離形膜後,於該基材原料之該上膠膜層上鋪佈吸附材料;剝離該基材原料之該下離形膜;於該基材原料之該下膠膜層上鋪佈該吸附材料,從而成為除濕基材;壓合該上膠膜層和該下膠膜層鋪佈有該吸附材料之該除濕基材;以及收捲經壓合之該除濕基材。
TW104123197A 2015-07-17 2015-07-17 除濕基材、除濕基材成形裝置及其成形方法 TWI600545B (zh)

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US15/078,508 US9889402B2 (en) 2015-07-17 2016-03-23 Dehumidifying base material, and device and method for forming the same
JP2016076548A JP6259485B2 (ja) 2015-07-17 2016-04-06 除湿基材、除湿基材成形装置および除湿基材の成形方法
JP2017185070A JP2018008273A (ja) 2015-07-17 2017-09-26 除湿基材、除湿基材成形装置および除湿基材の成形方法

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