TWI600186B - 具有高折射率透鏡之發光二極體模組 - Google Patents
具有高折射率透鏡之發光二極體模組 Download PDFInfo
- Publication number
- TWI600186B TWI600186B TW104129079A TW104129079A TWI600186B TW I600186 B TWI600186 B TW I600186B TW 104129079 A TW104129079 A TW 104129079A TW 104129079 A TW104129079 A TW 104129079A TW I600186 B TWI600186 B TW I600186B
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- Prior art keywords
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- housing
- led
- lens
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H10H20/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/561,617 US9385285B2 (en) | 2009-09-17 | 2009-09-17 | LED module with high index lens |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201603333A TW201603333A (zh) | 2016-01-16 |
| TWI600186B true TWI600186B (zh) | 2017-09-21 |
Family
ID=43242886
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099128119A TWI505518B (zh) | 2009-09-17 | 2010-08-23 | 具有高折射率透鏡之發光二極體模組 |
| TW104129079A TWI600186B (zh) | 2009-09-17 | 2010-08-23 | 具有高折射率透鏡之發光二極體模組 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099128119A TWI505518B (zh) | 2009-09-17 | 2010-08-23 | 具有高折射率透鏡之發光二極體模組 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9385285B2 (enExample) |
| EP (1) | EP2478575B1 (enExample) |
| JP (3) | JP2013505572A (enExample) |
| KR (1) | KR101880767B1 (enExample) |
| CN (2) | CN102484191B (enExample) |
| TW (2) | TWI505518B (enExample) |
| WO (1) | WO2011033407A2 (enExample) |
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| US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
| US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
| US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
| JP6021485B2 (ja) * | 2012-07-17 | 2016-11-09 | 株式会社朝日ラバー | 光学部材付半導体発光装置 |
| DE102012106982A1 (de) | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Leuchtmittels |
| US8876330B2 (en) * | 2012-11-15 | 2014-11-04 | Illinois Tool Works Inc. | Illumination device |
| US20160172554A1 (en) * | 2013-07-19 | 2016-06-16 | Koninklijke Philips N.V. | Pc led with optical element and without ssubstrate carrier |
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| US9608177B2 (en) | 2013-08-27 | 2017-03-28 | Lumens Co., Ltd. | Light emitting device package and backlight unit having the same |
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| JP2017504215A (ja) * | 2014-01-23 | 2017-02-02 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | セルフアライン式プリフォームレンズを有する発光デバイス |
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| RU172080U1 (ru) * | 2017-01-09 | 2017-06-28 | федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" | Корпус светодиода для поверхностного монтажа |
| KR102528528B1 (ko) * | 2018-02-05 | 2023-05-04 | 엘지이노텍 주식회사 | 반도체 소자 패키지 및 이를 포함하는 발광장치 |
| CN109817797A (zh) * | 2019-01-23 | 2019-05-28 | 佛山市国星光电股份有限公司 | Led器件和灯组阵列 |
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-
2009
- 2009-09-17 US US12/561,617 patent/US9385285B2/en active Active
-
2010
- 2010-08-20 CN CN201080041382.2A patent/CN102484191B/zh active Active
- 2010-08-20 CN CN201510392659.0A patent/CN104953018B/zh active Active
- 2010-08-20 EP EP10757835.3A patent/EP2478575B1/en active Active
- 2010-08-20 JP JP2012529369A patent/JP2013505572A/ja active Pending
- 2010-08-20 KR KR1020127009716A patent/KR101880767B1/ko active Active
- 2010-08-20 WO PCT/IB2010/053772 patent/WO2011033407A2/en not_active Ceased
- 2010-08-23 TW TW099128119A patent/TWI505518B/zh active
- 2010-08-23 TW TW104129079A patent/TWI600186B/zh active
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2015
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2016001756A (ja) | 2016-01-07 |
| TWI505518B (zh) | 2015-10-21 |
| US20160240754A1 (en) | 2016-08-18 |
| TW201119098A (en) | 2011-06-01 |
| KR101880767B1 (ko) | 2018-07-20 |
| US9385285B2 (en) | 2016-07-05 |
| US9755124B2 (en) | 2017-09-05 |
| US20110062471A1 (en) | 2011-03-17 |
| TW201603333A (zh) | 2016-01-16 |
| CN102484191B (zh) | 2015-08-12 |
| EP2478575A2 (en) | 2012-07-25 |
| JP2013505572A (ja) | 2013-02-14 |
| CN102484191A (zh) | 2012-05-30 |
| JP6041948B2 (ja) | 2016-12-14 |
| WO2011033407A3 (en) | 2011-06-16 |
| EP2478575B1 (en) | 2019-10-09 |
| CN104953018A (zh) | 2015-09-30 |
| CN104953018B (zh) | 2018-09-18 |
| WO2011033407A2 (en) | 2011-03-24 |
| JP6310994B2 (ja) | 2018-04-11 |
| KR20120079105A (ko) | 2012-07-11 |
| JP2017028328A (ja) | 2017-02-02 |
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