TWI598975B - 基板處理裝置及基板處理方法 - Google Patents
基板處理裝置及基板處理方法 Download PDFInfo
- Publication number
- TWI598975B TWI598975B TW101132390A TW101132390A TWI598975B TW I598975 B TWI598975 B TW I598975B TW 101132390 A TW101132390 A TW 101132390A TW 101132390 A TW101132390 A TW 101132390A TW I598975 B TWI598975 B TW I598975B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- unit
- peripheral portion
- processing
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011215458A JP5841389B2 (ja) | 2011-09-29 | 2011-09-29 | 基板処理装置および基板処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201314820A TW201314820A (zh) | 2013-04-01 |
| TWI598975B true TWI598975B (zh) | 2017-09-11 |
Family
ID=47992820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101132390A TWI598975B (zh) | 2011-09-29 | 2012-09-05 | 基板處理裝置及基板處理方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9508573B2 (https=) |
| JP (1) | JP5841389B2 (https=) |
| KR (1) | KR101289523B1 (https=) |
| TW (1) | TWI598975B (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150262848A1 (en) | 2014-03-11 | 2015-09-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method for discharge of processing liquid from nozzle |
| JP6316082B2 (ja) * | 2014-04-30 | 2018-04-25 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6339909B2 (ja) * | 2014-09-17 | 2018-06-06 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6423672B2 (ja) * | 2014-09-26 | 2018-11-14 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6254929B2 (ja) * | 2014-11-26 | 2017-12-27 | 東京エレクトロン株式会社 | 測定処理装置、基板処理システム、測定用治具、測定処理方法、及びその記憶媒体 |
| JP6475071B2 (ja) * | 2015-04-24 | 2019-02-27 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| TWI576958B (zh) * | 2015-05-27 | 2017-04-01 | Els System Technology Co Ltd | Wafer holding device |
| JP6541491B2 (ja) * | 2015-07-29 | 2019-07-10 | 株式会社Screenホールディングス | 流下判定方法、流下判定装置および吐出装置 |
| JP6880364B2 (ja) * | 2015-08-18 | 2021-06-02 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| WO2017061199A1 (ja) * | 2015-10-06 | 2017-04-13 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及び記憶媒体 |
| JP6737436B2 (ja) | 2015-11-10 | 2020-08-12 | 株式会社Screenホールディングス | 膜処理ユニットおよび基板処理装置 |
| JP6612632B2 (ja) * | 2016-01-26 | 2019-11-27 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6444909B2 (ja) * | 2016-02-22 | 2018-12-26 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 |
| JP6611652B2 (ja) * | 2016-03-30 | 2019-11-27 | 東京エレクトロン株式会社 | 基板処理装置の管理方法、及び基板処理システム |
| JP6815799B2 (ja) * | 2016-09-13 | 2021-01-20 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP6439766B2 (ja) * | 2016-09-23 | 2018-12-19 | 東京エレクトロン株式会社 | 塗布、現像方法及び塗布、現像装置 |
| JP6842934B2 (ja) * | 2017-01-27 | 2021-03-17 | 株式会社Screenホールディングス | 基板搬送装置、検出位置較正方法および基板処理装置 |
| JP6426223B2 (ja) * | 2017-03-31 | 2018-11-21 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP2019021747A (ja) * | 2017-07-14 | 2019-02-07 | 東京エレクトロン株式会社 | 基板位置調整方法、記憶媒体及び基板処理システム |
| JP7029914B2 (ja) * | 2017-09-25 | 2022-03-04 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6878240B2 (ja) * | 2017-10-10 | 2021-05-26 | 三菱電機株式会社 | エッジリンス幅測定装置、エッジリンス幅測定方法、およびレジスト塗布装置 |
| JP2019096669A (ja) * | 2017-11-20 | 2019-06-20 | 東京エレクトロン株式会社 | 基板処理装置及び塗布モジュールのパラメータの調整方法並びに記憶媒体 |
| CN112868089B (zh) * | 2018-10-23 | 2024-07-23 | 东京毅力科创株式会社 | 基板处理装置和基板处理方法 |
| JP6627954B2 (ja) * | 2018-11-20 | 2020-01-08 | 東京エレクトロン株式会社 | 塗布、現像方法、記憶媒体及び塗布、現像装置 |
| KR102211781B1 (ko) * | 2018-11-23 | 2021-02-05 | 세메스 주식회사 | 기판 처리 장치, 편심 검사 장치 및 방법 |
| KR102741054B1 (ko) * | 2018-12-21 | 2024-12-10 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
| KR102493877B1 (ko) * | 2019-12-31 | 2023-02-01 | 세메스 주식회사 | 기판처리장치 |
| JP7473407B2 (ja) * | 2020-06-15 | 2024-04-23 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| US12379200B2 (en) * | 2020-09-08 | 2025-08-05 | Tokyo Electron Limited | Peripheral edge processing apparatus, peripheral edge processing method, and computer-readable recording medium |
| JP7572564B2 (ja) * | 2021-07-26 | 2024-10-23 | 東京エレクトロン株式会社 | 基板処理装置、情報処理方法及び記憶媒体 |
| JP2024034443A (ja) * | 2022-08-31 | 2024-03-13 | キオクシア株式会社 | 位置決定方法および半導体装置の製造方法 |
| CN119426113B (zh) * | 2023-08-07 | 2026-03-06 | 宁德时代新能源科技股份有限公司 | 极片检测控制系统 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2835746B2 (ja) | 1989-08-24 | 1998-12-14 | 富士通株式会社 | ウェーハの周辺露光装置 |
| JPH11162833A (ja) | 1997-11-25 | 1999-06-18 | Nikon Corp | 基板周縁露光方法 |
| JPH11283895A (ja) | 1998-03-27 | 1999-10-15 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| KR100403862B1 (ko) | 2001-01-26 | 2003-11-01 | 어플라이드비전텍(주) | 반도체 웨이퍼 검사 장치 및 그 방법 |
| JP4342147B2 (ja) | 2002-05-01 | 2009-10-14 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP4069081B2 (ja) * | 2004-01-13 | 2008-03-26 | 東京エレクトロン株式会社 | 位置調整方法及び基板処理システム |
| KR20050099880A (ko) * | 2004-04-12 | 2005-10-17 | 삼성전자주식회사 | 반도체 웨이퍼의 센터링 감지 장치 및 이를 이용한 반도체웨이퍼의 센터링 감지 방법 |
| JP4601452B2 (ja) | 2005-02-22 | 2010-12-22 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| KR20070000922A (ko) * | 2005-06-28 | 2007-01-03 | 삼성전자주식회사 | 린스된 웨이퍼 에지 영역을 확인하기 위한 모니터링유니트를 갖는 반도체 소자 제조용 장치 |
| JP2007221070A (ja) | 2006-02-20 | 2007-08-30 | Dainippon Screen Mfg Co Ltd | 基板位置決め方法、基板位置決め装置および基板処理装置 |
| JP5099848B2 (ja) | 2006-08-10 | 2012-12-19 | 芝浦メカトロニクス株式会社 | 円盤状基板の検査装置及び検査方法 |
| JP2008060302A (ja) * | 2006-08-31 | 2008-03-13 | Sokudo:Kk | 基板処理装置 |
| JP2009032898A (ja) * | 2007-07-27 | 2009-02-12 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
| JP5410212B2 (ja) * | 2009-09-15 | 2014-02-05 | 株式会社Sokudo | 基板処理装置、基板処理システムおよび検査周辺露光装置 |
-
2011
- 2011-09-29 JP JP2011215458A patent/JP5841389B2/ja active Active
-
2012
- 2012-09-05 TW TW101132390A patent/TWI598975B/zh active
- 2012-09-17 KR KR1020120102617A patent/KR101289523B1/ko active Active
- 2012-09-21 US US13/624,536 patent/US9508573B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130035186A (ko) | 2013-04-08 |
| JP2013077639A (ja) | 2013-04-25 |
| US20130084393A1 (en) | 2013-04-04 |
| US9508573B2 (en) | 2016-11-29 |
| TW201314820A (zh) | 2013-04-01 |
| JP5841389B2 (ja) | 2016-01-13 |
| KR101289523B1 (ko) | 2013-07-24 |
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