TWI595051B - 有機聚矽氧烷、可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置 - Google Patents

有機聚矽氧烷、可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置 Download PDF

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TWI595051B
TWI595051B TW102138301A TW102138301A TWI595051B TW I595051 B TWI595051 B TW I595051B TW 102138301 A TW102138301 A TW 102138301A TW 102138301 A TW102138301 A TW 102138301A TW I595051 B TWI595051 B TW I595051B
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Taiwan
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group
carbons
composition
mass
sio
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TW102138301A
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TW201420685A (zh
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須藤通孝
佐川貴志
竹內香須美
飯村智浩
西島一裕
森田好次
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道康寧東麗股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
TW102138301A 2012-10-24 2013-10-23 有機聚矽氧烷、可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置 TWI595051B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012235183A JP6084808B2 (ja) 2012-10-24 2012-10-24 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置

Publications (2)

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TW201420685A TW201420685A (zh) 2014-06-01
TWI595051B true TWI595051B (zh) 2017-08-11

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TW102138301A TWI595051B (zh) 2012-10-24 2013-10-23 有機聚矽氧烷、可硬化性聚矽氧組合物、其硬化產品、及光半導體裝置

Country Status (7)

Country Link
US (1) US9688822B2 (https=)
EP (1) EP2912128B1 (https=)
JP (1) JP6084808B2 (https=)
KR (1) KR101772376B1 (https=)
CN (1) CN104812856B (https=)
TW (1) TWI595051B (https=)
WO (1) WO2014065432A1 (https=)

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JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
KR101980935B1 (ko) * 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
JP7158100B2 (ja) 2016-09-30 2022-10-21 日産化学株式会社 架橋性オルガノポリシロキサン組成物、その硬化物及びｌｅｄ装置
CN109716544B (zh) 2016-09-30 2021-11-09 日产化学株式会社 Led用密封材料组合物
JPWO2018088316A1 (ja) 2016-11-11 2019-10-03 ダウ・東レ株式会社 硬化性シリコーン組成物およびそれを用いた光半導体装置
JP6884458B2 (ja) * 2017-02-27 2021-06-09 デュポン・東レ・スペシャルティ・マテリアル株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP6710175B2 (ja) * 2017-04-03 2020-06-17 信越化学工業株式会社 白色熱硬化性エポキシ・シリコーンハイブリッド樹脂組成物及び光半導体装置
TWI829640B (zh) * 2017-07-10 2024-01-21 美商陶氏有機矽公司 可固化聚矽氧組合物及光學半導體裝置
TWI787444B (zh) * 2018-02-07 2022-12-21 日商陶氏東麗股份有限公司 可固化聚矽氧組成物、其固化產物、及光學半導體裝置
KR102435198B1 (ko) * 2018-08-17 2022-08-22 와커 헤미 아게 가교성 오르가노실록산 조성물
KR102471220B1 (ko) * 2018-08-17 2022-11-25 와커 헤미 아게 가교성 오르가노실록산 조성물

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JP6081774B2 (ja) 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置

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Also Published As

Publication number Publication date
US20150329681A1 (en) 2015-11-19
EP2912128A1 (en) 2015-09-02
EP2912128B1 (en) 2016-09-21
CN104812856A (zh) 2015-07-29
KR101772376B1 (ko) 2017-08-29
WO2014065432A1 (en) 2014-05-01
US9688822B2 (en) 2017-06-27
CN104812856B (zh) 2017-03-08
TW201420685A (zh) 2014-06-01
JP2014084417A (ja) 2014-05-12
JP6084808B2 (ja) 2017-02-22
KR20150077453A (ko) 2015-07-07

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