TWI594359B - 靜電夾頭及其製造方法 - Google Patents

靜電夾頭及其製造方法 Download PDF

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Publication number
TWI594359B
TWI594359B TW102118320A TW102118320A TWI594359B TW I594359 B TWI594359 B TW I594359B TW 102118320 A TW102118320 A TW 102118320A TW 102118320 A TW102118320 A TW 102118320A TW I594359 B TWI594359 B TW I594359B
Authority
TW
Taiwan
Prior art keywords
resin
electrostatic
electrostatic chuck
density distribution
resistance heating
Prior art date
Application number
TW102118320A
Other languages
English (en)
Chinese (zh)
Other versions
TW201401429A (zh
Inventor
栗林明宏
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201401429A publication Critical patent/TW201401429A/zh
Application granted granted Critical
Publication of TWI594359B publication Critical patent/TWI594359B/zh

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H10P72/722—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H10P72/0434—
    • H10P72/70—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102118320A 2012-05-29 2013-05-24 靜電夾頭及其製造方法 TWI594359B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012122201A JP5823915B2 (ja) 2012-05-29 2012-05-29 静電チャックの製造方法

Publications (2)

Publication Number Publication Date
TW201401429A TW201401429A (zh) 2014-01-01
TWI594359B true TWI594359B (zh) 2017-08-01

Family

ID=49669973

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102118320A TWI594359B (zh) 2012-05-29 2013-05-24 靜電夾頭及其製造方法

Country Status (4)

Country Link
US (1) US9019684B2 (enExample)
JP (1) JP5823915B2 (enExample)
KR (1) KR20130133673A (enExample)
TW (1) TWI594359B (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
JP6172301B2 (ja) 2014-11-20 2017-08-02 住友大阪セメント株式会社 静電チャック装置
KR101776562B1 (ko) * 2015-08-20 2017-09-07 엔지케이 인슐레이터 엘티디 정전 척 히터
KR101950897B1 (ko) 2015-09-25 2019-02-21 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
US10690414B2 (en) 2015-12-11 2020-06-23 Lam Research Corporation Multi-plane heater for semiconductor substrate support
JP6580999B2 (ja) * 2016-01-13 2019-09-25 日本特殊陶業株式会社 保持装置
US10582570B2 (en) * 2016-01-22 2020-03-03 Applied Materials, Inc. Sensor system for multi-zone electrostatic chuck
JP6633931B2 (ja) * 2016-02-10 2020-01-22 日本特殊陶業株式会社 保持装置および保持装置の製造方法
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10410900B2 (en) * 2016-08-05 2019-09-10 Applied Materials, Inc. Precision screen printing with sub-micron uniformity of metallization materials on green sheet ceramic
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
JP7050455B2 (ja) * 2017-03-15 2022-04-08 日本特殊陶業株式会社 静電チャックの製造方法
JP7012454B2 (ja) * 2017-04-27 2022-01-28 株式会社岡本工作機械製作所 静電吸着チャックの製造方法並びに半導体装置の製造方法
JP7233160B2 (ja) * 2017-09-26 2023-03-06 日本特殊陶業株式会社 保持装置および保持装置の製造方法
WO2019133457A1 (en) * 2017-12-28 2019-07-04 Rudolph Technologies, Inc. Conformal stage
CN112166496B (zh) 2018-05-28 2024-05-03 日本特殊陶业株式会社 保持装置及保持装置的制造方法
CN112204724B (zh) 2018-05-28 2024-06-18 日本特殊陶业株式会社 保持装置的制造方法以及保持装置
JP7278035B2 (ja) * 2018-06-20 2023-05-19 新光電気工業株式会社 静電チャック、基板固定装置
JP7278072B2 (ja) * 2018-12-27 2023-05-19 日本特殊陶業株式会社 静電チャックおよび静電チャックの製造方法
US11551951B2 (en) 2020-05-05 2023-01-10 Applied Materials, Inc. Methods and systems for temperature control for a substrate
KR102787867B1 (ko) * 2020-07-03 2025-04-01 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법
JP7601606B2 (ja) * 2020-10-28 2024-12-17 日本特殊陶業株式会社 保持装置
JP7701149B2 (ja) * 2020-12-24 2025-07-01 新光電気工業株式会社 静電チャックの製造方法
JP2022175500A (ja) 2021-05-13 2022-11-25 新光電気工業株式会社 静電チャック及び静電チャックの製造方法
JP2023180522A (ja) 2022-06-09 2023-12-21 新光電気工業株式会社 基板固定装置及び基板固定装置の製造方法
CN116759346B (zh) * 2023-08-16 2023-10-24 无锡尚积半导体科技有限公司 快速控温载片台、去胶刻蚀设备及去胶工艺
WO2025062583A1 (ja) * 2023-09-21 2025-03-27 日本碍子株式会社 ウエハ載置台およびウエハ載置台の製造方法
KR102864484B1 (ko) * 2025-01-21 2025-09-25 주식회사 엘케이엔지니어링 정전척의 온도 보정방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070139856A1 (en) * 2004-10-07 2007-06-21 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US20100078424A1 (en) * 2006-09-25 2010-04-01 Tokyo Electron Limited Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152475A (ja) 2007-12-21 2009-07-09 Shinko Electric Ind Co Ltd 基板温調固定装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070139856A1 (en) * 2004-10-07 2007-06-21 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US20100078424A1 (en) * 2006-09-25 2010-04-01 Tokyo Electron Limited Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system

Also Published As

Publication number Publication date
JP2013247342A (ja) 2013-12-09
US20130321974A1 (en) 2013-12-05
KR20130133673A (ko) 2013-12-09
TW201401429A (zh) 2014-01-01
JP5823915B2 (ja) 2015-11-25
US9019684B2 (en) 2015-04-28

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