TWI593810B - Sputtering target - Google Patents

Sputtering target Download PDF

Info

Publication number
TWI593810B
TWI593810B TW103104039A TW103104039A TWI593810B TW I593810 B TWI593810 B TW I593810B TW 103104039 A TW103104039 A TW 103104039A TW 103104039 A TW103104039 A TW 103104039A TW I593810 B TWI593810 B TW I593810B
Authority
TW
Taiwan
Prior art keywords
phase
powder
ratio
sputtering target
sputtering
Prior art date
Application number
TW103104039A
Other languages
English (en)
Chinese (zh)
Other versions
TW201446975A (zh
Inventor
Atsushi Sato
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201446975A publication Critical patent/TW201446975A/zh
Application granted granted Critical
Publication of TWI593810B publication Critical patent/TWI593810B/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
TW103104039A 2013-04-15 2014-02-07 Sputtering target TWI593810B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013084817 2013-04-15

Publications (2)

Publication Number Publication Date
TW201446975A TW201446975A (zh) 2014-12-16
TWI593810B true TWI593810B (zh) 2017-08-01

Family

ID=51731122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104039A TWI593810B (zh) 2013-04-15 2014-02-07 Sputtering target

Country Status (5)

Country Link
JP (1) JP5944580B2 (fr)
MY (1) MY174738A (fr)
SG (1) SG11201506140WA (fr)
TW (1) TWI593810B (fr)
WO (1) WO2014171161A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201701836YA (en) 2014-09-22 2017-04-27 Jx Nippon Mining & Metals Corp Sputtering target for forming magnetic recording film and method for producing same
CN106378455A (zh) * 2015-07-31 2017-02-08 汉能新材料科技有限公司 一种钼合金旋转金属管材及其制备方法
TWI761264B (zh) * 2021-07-15 2022-04-11 光洋應用材料科技股份有限公司 鐵鉑銀基靶材及其製法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201241218A (en) * 2011-03-30 2012-10-16 Jx Nippon Mining & Metals Corp Sputtering target for magnetic recording film
TW201313934A (zh) * 2011-09-26 2013-04-01 Jx Nippon Mining & Metals Corp Ｆｅ－Ｐｔ－Ｃ系濺鍍靶

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9034153B2 (en) * 2006-01-13 2015-05-19 Jx Nippon Mining & Metals Corporation Nonmagnetic material particle dispersed ferromagnetic material sputtering target
US9011653B2 (en) * 2010-11-29 2015-04-21 Mitsui Mining & Smelting Co., Ltd. Sputtering target
JP2014034730A (ja) * 2012-08-10 2014-02-24 Mitsui Mining & Smelting Co Ltd 焼結体およびスパッタリングターゲット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201241218A (en) * 2011-03-30 2012-10-16 Jx Nippon Mining & Metals Corp Sputtering target for magnetic recording film
TW201313934A (zh) * 2011-09-26 2013-04-01 Jx Nippon Mining & Metals Corp Ｆｅ－Ｐｔ－Ｃ系濺鍍靶

Also Published As

Publication number Publication date
WO2014171161A1 (fr) 2014-10-23
JP5944580B2 (ja) 2016-07-05
SG11201506140WA (en) 2015-09-29
TW201446975A (zh) 2014-12-16
JPWO2014171161A1 (ja) 2017-02-16
MY174738A (en) 2020-05-12

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