MY174738A - Sputtering target - Google Patents

Sputtering target

Info

Publication number
MY174738A
MY174738A MYPI2015703289A MYPI2015703289A MY174738A MY 174738 A MY174738 A MY 174738A MY PI2015703289 A MYPI2015703289 A MY PI2015703289A MY PI2015703289 A MYPI2015703289 A MY PI2015703289A MY 174738 A MY174738 A MY 174738A
Authority
MY
Malaysia
Prior art keywords
phase
sputtering target
based alloy
shape
atomic number
Prior art date
Application number
MYPI2015703289A
Inventor
Atsushi Sato
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY174738A publication Critical patent/MY174738A/en

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851—Coating a support with a magnetic layer by sputtering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C33/00—Making ferrous alloys
    • C22C33/02—Making ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

Provided is a sputtering target that comprises an Fe-Pt based alloy phase, a Ag phase, and a C phase. In the composition of the entire sputtering target, the value obtained by dividing the atomic number ratio of C by the atomic number ratio of Ag is 4 to 10. In a cross section of the sputtering target, the Ag phase has a shape that is included in every imaginary circle having a radius of 10 ?m drawn with its center at an arbitrary point in the Ag phase or a shape that has at least two tangent points or intersection points between the imaginary circle and the periphery of the Ag phase. It is an object of the present invention to provide a monolithic sputtering target comprising an Fe-Pt based alloy, Ag, and C, in which the amount of particles generated during sputtering is significantly reduced.
MYPI2015703289A 2013-04-15 2014-01-29 Sputtering target MY174738A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013084817 2013-04-15

Publications (1)

Publication Number Publication Date
MY174738A true MY174738A (en) 2020-05-12

Family

ID=51731122

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015703289A MY174738A (en) 2013-04-15 2014-01-29 Sputtering target

Country Status (5)

Country Link
JP (1) JP5944580B2 (en)
MY (1) MY174738A (en)
SG (1) SG11201506140WA (en)
TW (1) TWI593810B (en)
WO (1) WO2014171161A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6285043B2 (en) * 2014-09-22 2018-03-07 Ｊｘ金属株式会社 Sputtering target for forming a magnetic recording film and method for producing the same
CN106378455A (en) * 2015-07-31 2017-02-08 汉能新材料科技有限公司 Molybdenum alloy rotary metal pipe material and preparation method thereof
TWI761264B (en) * 2021-07-15 2022-04-11 光洋應用材料科技股份有限公司 Fe-pt-ag based sputtering target and method of preparing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080781A1 (en) * 2006-01-13 2007-07-19 Nippon Mining & Metals Co., Ltd. Nonmagnetic material particle dispersed ferromagnetic material sputtering target
US9011653B2 (en) * 2010-11-29 2015-04-21 Mitsui Mining & Smelting Co., Ltd. Sputtering target
CN103459656B (en) * 2011-03-30 2015-05-06 吉坤日矿日石金属株式会社 Sputtering target for magnetic recording film
WO2013046882A1 (en) * 2011-09-26 2013-04-04 Jx日鉱日石金属株式会社 Iron/platinum/carbon sputtering target
JP2014034730A (en) * 2012-08-10 2014-02-24 Mitsui Mining & Smelting Co Ltd Sintered body and sputtering target

Also Published As

Publication number Publication date
TWI593810B (en) 2017-08-01
TW201446975A (en) 2014-12-16
JP5944580B2 (en) 2016-07-05
WO2014171161A1 (en) 2014-10-23
JPWO2014171161A1 (en) 2017-02-16
SG11201506140WA (en) 2015-09-29

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