TWI593810B - Sputtering target - Google Patents

Sputtering target Download PDF

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TWI593810B
TWI593810B TW103104039A TW103104039A TWI593810B TW I593810 B TWI593810 B TW I593810B TW 103104039 A TW103104039 A TW 103104039A TW 103104039 A TW103104039 A TW 103104039A TW I593810 B TWI593810 B TW I593810B
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phase
powder
ratio
sputtering target
sputtering
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TW103104039A
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TW201446975A (en
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Atsushi Sato
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Jx Nippon Mining & Metals Corp
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/851Coating a support with a magnetic layer by sputtering
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/0466Alloys based on noble metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C30/00Alloys containing less than 50% by weight of each constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C33/00Making ferrous alloys
    • C22C33/02Making ferrous alloys by powder metallurgy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Description

濺鍍靶 Sputter target

本發明係有關一種使用於形成磁記錄媒體之磁性薄膜的濺鍍靶。 The present invention relates to a sputtering target for use in forming a magnetic film of a magnetic recording medium.

於硬碟驅動機所代表之磁記錄領域,磁記錄媒體之磁性薄膜材料一直使用以強磁性金屬Co、Fe或Ni作為基底之材料。例如,於採用水平磁記錄方式之硬碟的磁性薄膜,係使用以Co作為主成分之Co-Cr系或Co-Cr-Pt系的強磁性合金。 In the field of magnetic recording represented by a hard disk drive machine, a magnetic film material of a magnetic recording medium has been using a material having a ferromagnetic metal Co, Fe or Ni as a base. For example, a magnetic film of a hard disk using a horizontal magnetic recording method is a Co-Cr-based or Co-Cr-Pt-based ferromagnetic alloy containing Co as a main component.

又,採用近年來已實用化之垂直磁記錄方式之硬碟的磁性薄膜,多使用由主成分為Co之Co-Cr-Pt系強磁性合金與氧化物構成的複合材料。而且,由於生產性高,上述磁性薄膜大多係以磁控濺鍍裝置對以上述材料作為成分之濺鍍靶進行濺鍍來製作。 Further, a magnetic material of a hard disk having a perpendicular magnetic recording method which has been put into practical use in recent years is often a composite material composed of a Co-Cr-Pt-based ferromagnetic alloy having a main component of Co and an oxide. Further, since the magnetic properties are high, the magnetic thin film is often produced by sputtering a sputtering target having the above-mentioned material as a component by a magnetron sputtering apparatus.

另一方面,硬碟之記錄密度逐年迅速地增大,持續超過1Tbit/in2。若記錄密度達到1Tbit/in2,則記錄bit之尺寸會低於10nm,可預料於該情形時由熱波動所引起之超順磁性化將成為問題。預料就現在所使用之磁記錄媒體材料例如於Co基合金添加Pt而提高結晶磁異向性的材料而言並不足夠。其原因在於:尺寸在10nm以下穩定地以強磁性動作之磁性粒子需具有更高之結晶磁異向性。 On the other hand, the recording density of hard disks has rapidly increased year by year, exceeding 1 Tbit/in 2 . If the recording density reaches 1 Tbit/in 2 , the size of the recording bit will be less than 10 nm, and it is expected that superparamagnetization caused by thermal fluctuations in this case will become a problem. It is expected that the magnetic recording medium material currently used is not sufficient for a material in which a P-based alloy is added to a Co-based alloy to increase crystal magnetic anisotropy. The reason for this is that magnetic particles which are stably magnetized with a size of 10 nm or less are required to have higher crystal magnetic anisotropy.

由於上述理由,具有L10結構之Fe-Pt合金作為超高密度記 錄媒體用材料而受到注意。具有L10結構之Fe-Pt合金不僅具有高的結晶磁異向性,且耐蝕性、抗氧化性優異,因此被期待為適合應用作為磁記錄媒體的材料。 For the above reasons, an Fe-Pt alloy having an L1 0 structure has been attracting attention as a material for an ultrahigh-density recording medium. The Fe-Pt alloy having the L1 0 structure not only has high crystal magnetic anisotropy, but also has excellent corrosion resistance and oxidation resistance, and therefore is expected to be suitable as a material for a magnetic recording medium.

可是,藉由濺鍍法所成膜之Fe-Pt膜為準安定相之不規則相,為了顯現出規則相之L10結構,必須以規則化溫度進行熱處理。由於此規則化溫度高,故會發生基板之耐熱性的問題。因此,嘗試在Fe-Pt合金添加Ag或Cu以降低規則化溫度。 However, the Fe-Pt film formed by the sputtering method is an irregular phase of a quasi-stable phase, and in order to develop the L1 0 structure of the regular phase, heat treatment must be performed at a regularized temperature. Since this regularizing temperature is high, the problem of heat resistance of the substrate occurs. Therefore, attempts have been made to add Ag or Cu to the Fe-Pt alloy to lower the regularization temperature.

並且於將Fe-Pt合金使用作為超高密度記錄媒體用材料之情形時,要求開發如下之技術:使Fe-Pt合金作為L10結構之磁性粒子於磁孤立之狀態下儘量高密度且方向一致地分散。 Further, when the Fe-Pt alloy is used as a material for an ultra-high-density recording medium, it is required to develop a technique in which the Fe-Pt alloy is as high-density and uniform in direction as the magnetic particles of the L1 0 structure in a magnetic isolation state. Disperse.

因此,以氧化物或碳等非磁性材料將磁性粒子孤立的粒狀(granular)結構磁性薄膜,被提出來作為次世代硬碟之磁記錄媒體用。此粒狀結構磁性薄膜係呈藉由隔著非磁性物質而使磁性粒子彼此磁絕緣的結構。具有粒狀結構磁性薄膜的磁記錄媒體以及與其相關的公知文獻,例如,可舉專利文獻1。 Therefore, a granular structured magnetic film in which magnetic particles are isolated by a non-magnetic material such as an oxide or carbon has been proposed as a magnetic recording medium for a next-generation hard disk. The granular magnetic film is a structure in which magnetic particles are magnetically insulated from each other by a non-magnetic substance. A magnetic recording medium having a magnetic film of a granular structure and a related document related thereto, for example, Patent Document 1 can be cited.

此種粒狀結構磁性薄膜,以往大多準備由不同材料構成之靶,進行共濺鍍來製作。然而,共濺鍍裝置由於價格高且裝置本身亦大,故量產時通常使用由Fe-Pt系合金與非磁性材料構成之一體型濺鍍靶,來製作磁性薄膜。並且此種靶係藉由粉末燒結法來製作。 Such a granular magnetic film is conventionally prepared by co-sputtering a target made of a different material. However, since the common sputtering apparatus is expensive and the apparatus itself is large, a magnetic thin film is usually produced by using a sputtering type target composed of an Fe-Pt-based alloy and a non-magnetic material in mass production. And such a target is produced by a powder sintering method.

然而,在對由Fe-Pt系合金與C構成之濺鍍靶進行濺鍍時,於濺鍍面C容易脫離,而發生附著於基板上之問題。此附著物被稱為顆粒(particle)。隨著提升硬碟驅動機之記錄密度,磁頭之浮動量變小,故容許 於磁記錄媒體之顆粒的尺寸與個數,越來越嚴格地被限制。 However, when the sputtering target composed of the Fe-Pt-based alloy and C is sputtered, the sputtering surface C is easily detached, and the problem of adhesion to the substrate occurs. This attachment is called a particle. As the recording density of the hard disk drive is increased, the floating amount of the magnetic head becomes smaller, so The size and number of particles in a magnetic recording medium are increasingly restricted.

以下揭示使用Fe-Pt系材料之記錄媒體用濺鍍靶相關之專利文獻做為參考。 The following is a disclosure of a patent document relating to a sputtering target for a recording medium using an Fe-Pt-based material.

專利文獻1:日本特開2004-152471號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2004-152471

專利文獻2:日本特開2003-313659號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2003-313659

專利文獻3:日本特開2011-210291號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2011-210291

專利文獻4:日本特許第5041262號 Patent Document 4: Japanese Patent No. 50412262

專利文獻5:日本特許第5041261號 Patent Document 5: Japanese Patent No. 5041261

專利文獻6:日本特開2012-214874號公報 Patent Document 6: Japanese Laid-Open Patent Publication No. 2012-214874

本發明之課題在於提供一種由Fe-Pt系合金與Ag及C構成之濺鍍靶,該濺鍍靶可大幅降低濺鍍時產生之顆粒量。 An object of the present invention is to provide a sputtering target comprising an Fe-Pt-based alloy and Ag and C, which can greatly reduce the amount of particles generated during sputtering.

為了解決上述課題,本發明人等經潛心研究的結果發現,藉由調整濺鍍靶之組成、組織構造,而可大幅降低濺鍍時產生之顆粒量。另,於本發明,在分析靶之組織構造時,由於使用垂直於靶濺鍍面之剖面,故後述之靶剖面或切割面係指垂直於此濺鍍面之剖面。 In order to solve the problem, the inventors of the present invention have found that the amount of particles generated during sputtering can be greatly reduced by adjusting the composition and structure of the sputtering target. Further, in the present invention, when the structure of the target is analyzed, since the cross section perpendicular to the target sputter surface is used, the target cross section or the cut surface to be described later means a cross section perpendicular to the sputter surface.

根據此種見解,本發明提供: Based on this insight, the present invention provides:

1)一種濺鍍靶,係由Fe-Pt系合金相、Ag相及C相構成,其特徵在於:於濺鍍靶整體之組成中,將C原子數比率除以Ag原子數比率所得之值在4以上10以下,於濺鍍靶之剖面中,Ag相被包含在以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。 1) A sputtering target comprising an Fe-Pt-based alloy phase, an Ag phase, and a C phase, wherein a value obtained by dividing a C atom number ratio by an Ag atom number ratio in a composition of a sputtering target as a whole In the cross section of the sputtering target, the Ag phase is included in all the imaginary circles having a radius of 10 μm centered on any point in the Ag phase, or the Ag phase has the following shape: The circle has a tangent or intersection of at least 2 points or more between the outer edge of the Ag phase.

2)如上述1)記載之濺鍍靶,其中,於濺鍍靶之剖面中,C相之面積比率在10%以上45%以下。 2) The sputtering target according to the above 1), wherein the area ratio of the C phase in the cross section of the sputtering target is 10% or more and 45% or less.

3)一種濺鍍靶,係由Fe-Pt系合金相、Ag相、C相及氧化物相構成,其特徵在於:於濺鍍靶整體之組成中,將C原子數比率除以Ag原子數比率所得之值在4以上10以下,於濺鍍靶之剖面中,Ag相被包含在以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。 3) A sputtering target comprising an Fe-Pt-based alloy phase, an Ag phase, a C-phase, and an oxide phase, wherein the ratio of the number of C atoms is divided by the number of Ag atoms in the composition of the entire sputtering target The value obtained by the ratio is 4 or more and 10 or less. In the cross section of the sputtering target, the Ag phase is included in all imaginary circles having a radius of 10 μm centered on an arbitrary point in the Ag phase, or the Ag phase has the following shape : There is a tangent or intersection point of at least 2 points between the imaginary circle and the outer edge of the Ag phase.

4)如上述3)記載之濺鍍靶,其中,氧化物相係以選自Al、B、Ba、Be、Bi、Ca、Ce、Co、Cr、Cs、Cu、Dy、Er、Eu、Fe、Ga、Gd、Ge、Hf、Ho、La、Li、Lu、Mg、Mo、Nb、Nd、Ni、Pr、Sb、Sc、Si、Sm、Sn、Sr、Ta、Tb、Te、Ti、Tm、V、W、Y、Yb、Zn、Zr中一種以上之元素作為構成成分的氧化物。 4) The sputtering target according to the above 3), wherein the oxide phase is selected from the group consisting of Al, B, Ba, Be, Bi, Ca, Ce, Co, Cr, Cs, Cu, Dy, Er, Eu, Fe , Ga, Gd, Ge, Hf, Ho, La, Li, Lu, Mg, Mo, Nb, Nd, Ni, Pr, Sb, Sc, Si, Sm, Sn, Sr, Ta, Tb, Te, Ti, Tm One or more elements of V, W, Y, Yb, Zn, and Zr are oxides of constituent components.

5)如上述3)或4)記載之濺鍍靶,其剖面中,C相與氧化物相之面積比率合計在10%以上45%以下。 5) The sputtering target according to the above 3) or 4), wherein the area ratio of the C phase to the oxide phase in the cross section is 10% or more and 45% or less in total.

6)如上述1)~5)中任一項記載之濺鍍靶,其含有選自Au、B、Co、Cr、Cu、Ga、Ge、Mn、Mo、Nb、Ni、Pd、Re、Rh、Ru、Sn、Ta、W、V、Zn中一種以上之元素作為金屬成分,其含有率以金屬成分中之原子數的比率計,在0.5%以上15%以下。 The sputtering target according to any one of the above 1), wherein the sputtering target is selected from the group consisting of Au, B, Co, Cr, Cu, Ga, Ge, Mn, Mo, Nb, Ni, Pd, Re, Rh. One or more elements of Ru, Sn, Ta, W, V, and Zn are used as the metal component, and the content thereof is 0.5% or more and 15% or less in terms of the ratio of the number of atoms in the metal component.

根據本發明,可提供一種大幅降低濺鍍時產生之顆粒量的濺鍍靶。因此,具有可提升濺鍍成膜時之產率的優異效果。 According to the present invention, it is possible to provide a sputtering target which greatly reduces the amount of particles generated at the time of sputtering. Therefore, it has an excellent effect of improving the yield at the time of sputtering film formation.

圖1係顯示本發明之Ag相形狀一例的示意圖。 Fig. 1 is a schematic view showing an example of the shape of the Ag phase of the present invention.

圖2係顯示本發明範圍外之Ag相形狀一例的示意圖。 Fig. 2 is a schematic view showing an example of the shape of an Ag phase outside the scope of the present invention.

圖3係以電子探針顯微分析儀(EPMA)觀察實施例1濺鍍靶之剖面時的二次電子影像及元素分布影像。 Fig. 3 is a view showing a secondary electron image and an element distribution image when the cross section of the sputtering target of Example 1 was observed by an electron probe microanalyzer (EPMA).

本發明之濺鍍靶,其特徵在於:由Fe-Pt系合金相、Ag相及C相構成。此處,前述Fe-Pt系合金相,係指含有Fe與Pt作為主成分之合金,除了僅含Fe與Pt之2元系合金外,而且亦包含含有Fe與Pt作為主成分且含有Fe與Pt以外之金屬元素的3元系以上之合金。作為3元系以上之合金,例如可舉Fe-Pt-Cu等。 The sputtering target of the present invention is characterized by comprising an Fe-Pt-based alloy phase, an Ag phase, and a C phase. Here, the Fe-Pt-based alloy phase refers to an alloy containing Fe and Pt as a main component, and contains Fe and Pt as a main component and contains Fe and Fe, in addition to a ternary alloy containing only Fe and Pt. An alloy of three or more elements of a metal element other than Pt. Examples of the alloy of the ternary system or higher include Fe-Pt-Cu.

又,本發明之濺鍍靶,其特徵在於:於濺鍍靶整體之組成中,將C原子數比率除以Ag原子數比率所得之值在4以上10以下。Ag相具有下述效果:於濺鍍時可抑制靶表面之C脫落,可顯著抑制顆粒之產生。根據本發明人等之研究,若將C原子數比除以Ag原子數比所得之值未達4,則抑制產生顆粒之效果會很明顯地大幅地減少。又,此值大於10之情形時,雖然具有抑制產生顆粒之效果,但是於濺鍍膜中會有Ag偏析,而有損壞磁性薄膜的磁特性之虞。 Further, the sputtering target of the present invention is characterized in that the value of the ratio of the number of C atoms divided by the ratio of the number of Ag atoms in the composition of the entire sputtering target is 4 or more and 10 or less. The Ag phase has an effect of suppressing C detachment of the target surface during sputtering and remarkably suppressing generation of particles. According to the study by the inventors of the present invention, if the value obtained by dividing the C atom number ratio by the Ag atom number ratio is less than 4, the effect of suppressing the generation of particles is remarkably greatly reduced. Further, when the value is larger than 10, although the effect of suppressing generation of particles is suppressed, Ag segregation occurs in the sputtering film, and the magnetic properties of the magnetic film are impaired.

又,本發明之濺鍍靶,其特徵在於:於其剖面中,Ag相被包含在以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。此特徵係指於靶組織中幾乎不存在粗大之Ag相。若粗大之Ag相存在於靶組織中,則會發生下述問題:高濺鍍速率之Ag會選擇性地 被濺鍍,而損傷濺鍍面之平滑性,使顆粒量增加。惟,即使是存在不具備上述形狀之粗大Ag相的情形時,若其面積率相對於Ag相整體之面積未達20%,則亦可得到本發明之效果。 Further, in the sputtering target of the present invention, the Ag phase is included in all imaginary circles having a radius of 10 μm which is drawn around an arbitrary point in the Ag phase, or the Ag phase has the following shape. : There is a tangent or intersection point of at least 2 points between the imaginary circle and the outer edge of the Ag phase. This feature refers to the fact that there is almost no coarse Ag phase in the target tissue. If a coarse Ag phase is present in the target tissue, the following problem occurs: Ag at a high sputtering rate selectively It is sputtered and damages the smoothness of the sputtered surface, increasing the amount of particles. However, even in the case where there is a coarse Ag phase which does not have the above shape, the effect of the present invention can be obtained if the area ratio is less than 20% with respect to the entire Ag phase.

又,本發明之濺鍍靶,於其剖面中,C相之面積比率較佳在10%以上45%以下。C相之面積比率若未達10%,則有時會於濺鍍膜中C無法使磁性粒子間之磁相互作用充分絶緣,因而無法獲得良好之磁特性。又,大於45%之情形時,有時C會凝聚而於靶組織中產生粗大之C相,顆粒之產生變多。另,前述C相之面積比率,為了減少因觀察位置導致之變動,較佳觀察合計為1mm2左右之複數個剖面,自該平均求出。 Further, in the sputtering target of the present invention, the area ratio of the C phase in the cross section is preferably 10% or more and 45% or less. If the area ratio of the C phase is less than 10%, C may not sufficiently insulate the magnetic interaction between the magnetic particles in the sputtering film, and thus good magnetic properties may not be obtained. Further, in the case of more than 45%, C may aggregate and cause a coarse C phase in the target tissue, and the generation of particles may increase. Further, in order to reduce the variation in the area ratio of the C phase, it is preferable to observe a plurality of cross sections of about 1 mm 2 in total, and obtain the average ratio from the average.

本發明之濺鍍靶,可於由Fe-Pt系合金相、Ag相及C相構成之組織中,進一步含有氧化物相。氧化物相於濺鍍膜中,與C同樣地對於使磁性粒子間之磁相互作用絶緣是有效的。 The sputtering target of the present invention may further contain an oxide phase in a structure composed of an Fe-Pt-based alloy phase, an Ag phase, and a C phase. The oxide phase is effective in insulating the magnetic interaction between the magnetic particles in the same manner as in the sputtering film.

又,作為氧化物相,可舉以選自Al、B、Ba、Be、Bi、Ca、Ce、Co、Cr、Cs、Cu、Dy、Er、Eu、Fe、Ga、Gd、Ge、Hf、Ho、La、Li、Lu、Mg、Mo、Nb、Nd、Ni、Pr、Sb、Sc、Si、Sm、Sn、Sr、Ta、Tb、Te、Ti、Tm、V、W、Y、Yb、Zn、Zr中一種以上之元素作為構成成分的氧化物。此等可根據想要之磁特性,任意地選擇。 Further, the oxide phase may be selected from the group consisting of Al, B, Ba, Be, Bi, Ca, Ce, Co, Cr, Cs, Cu, Dy, Er, Eu, Fe, Ga, Gd, Ge, Hf, Ho, La, Li, Lu, Mg, Mo, Nb, Nd, Ni, Pr, Sb, Sc, Si, Sm, Sn, Sr, Ta, Tb, Te, Ti, Tm, V, W, Y, Yb, One or more elements of Zn and Zr are oxides of constituent components. These can be arbitrarily selected depending on the desired magnetic characteristics.

又,於本發明中,含有上述氧化物相之濺鍍靶中的C相與氧化物相的面積比率合計較佳在10%以上45%以下。若C相與氧化物相的面積比率合計未達10%,則有時會於濺鍍膜中,由於C相及氧化物無法使磁性粒子間之磁相互作用充分絶緣,故而無法獲得良好之磁特性。又,當大於45%之情形,有時C相及氧化物會凝聚而於靶組織中產生粗大之C相 或氧化物相,顆粒之產生變多。另,前述C相與氧化物相的面積比率,為了減少因觀察位置導致之變動,較佳觀察合計為1mm2左右之複數個剖面,自該平均求出。 Further, in the present invention, the area ratio of the C phase to the oxide phase in the sputtering target containing the oxide phase is preferably 10% or more and 45% or less in total. When the total area ratio of the C phase to the oxide phase is less than 10%, the C phase and the oxide cannot sufficiently insulate the magnetic interaction between the magnetic particles in the sputtering film, so that good magnetic properties cannot be obtained. . Further, when it is more than 45%, the C phase and the oxide may aggregate to form a coarse phase C or an oxide phase in the target structure, and the generation of particles may increase. Further, in order to reduce the variation in the area ratio of the C phase and the oxide phase, it is preferable to observe a plurality of cross sections having a total of about 1 mm 2 and to obtain the average cross section.

又,本發明之濺鍍靶,較佳含有選自Au、B、Co、Cr、Cu、Ga、Ge、Mn、Mo、Nb、Ni、Pd、Re、Rh、Ru、Sn、Ta、W、V、Zn中一種以上之金屬元素。又,其含有率宜以金屬成分中之原子數的比率計,為0.5~15%。此等之添加金屬,係主要為了要降低用以顯現L10構造之熱處理溫度而添加者。若含有率未達0.5%,則難以得到上述之效果,另一方面,若大於15%,則有時會損及磁性薄膜之磁特性。 Further, the sputtering target of the present invention preferably contains a material selected from the group consisting of Au, B, Co, Cr, Cu, Ga, Ge, Mn, Mo, Nb, Ni, Pd, Re, Rh, Ru, Sn, Ta, W, One or more metal elements in V and Zn. Further, the content thereof is preferably 0.5 to 15% in terms of the ratio of the number of atoms in the metal component. Such added metals are primarily added to reduce the heat treatment temperature used to visualize the L1 0 structure. If the content is less than 0.5%, it is difficult to obtain the above-described effects. On the other hand, if it is more than 15%, the magnetic properties of the magnetic film may be impaired.

本發明之濺鍍靶係藉由粉末燒結法來製作。例如,可藉由以下之方法來製作。 The sputtering target of the present invention is produced by a powder sintering method. For example, it can be produced by the following method.

首先,準備Fe粉、Pt粉、Ag粉及視需要添加之金屬粉作為金屬粉。此時,不僅是單一元素的金屬粉,亦可使用合金粉。此等之金屬粉,宜使用平均粒徑為1~10μm者。若平均粒徑為1~10μm,則可更均勻地混合,而可防止靶組織中之偏析與粗大結晶化。另一方面,金屬粉之平均粒徑若超過10μm,則有時C相與氧化物相會無法均勻地分散,又,若未達1μm,則金屬粉氧化之影響有時會造成問題。惟,此粒徑範圍係較佳之條件,並不會因超過此範圍而否定本發明。另,Ag粉會因粒徑或形狀而具有強凝聚性,此情形時,較佳使用經實施過防止凝聚之塗佈處理者。 First, Fe powder, Pt powder, Ag powder, and metal powder added as needed are prepared as metal powder. At this time, not only a single element of metal powder but also an alloy powder can be used. For these metal powders, those having an average particle diameter of 1 to 10 μm should be used. When the average particle diameter is 1 to 10 μm, the mixture can be more uniformly mixed, and segregation and coarse crystallization in the target structure can be prevented. On the other hand, when the average particle diameter of the metal powder exceeds 10 μm, the C phase and the oxide phase may not be uniformly dispersed, and if it is less than 1 μm, the influence of oxidation of the metal powder may cause a problem. However, this particle size range is a preferred condition and does not deny the present invention beyond this range. Further, the Ag powder has strong cohesiveness due to particle size or shape. In this case, it is preferred to use a coating process which has been subjected to prevention of aggregation.

又,C粉宜使用平均粒徑為1~30μm者。若平均粒徑為1~30μm,則當與金屬粉混合時,C粉彼此難以凝聚,而可使C相均勻地分散。惟,此粒徑範圍係較佳之條件,並不會因超過此範圍而否定本發明。 作為C粉之種類,具有如石墨(graphite)或奈米管般具有結晶結構者與碳黑所代表之非晶質者,可使用任一者之C粉。 Further, the C powder should preferably be one having an average particle diameter of 1 to 30 μm. When the average particle diameter is 1 to 30 μm, when mixed with the metal powder, the C powders are less likely to aggregate, and the C phase can be uniformly dispersed. However, this particle size range is a preferred condition and does not deny the present invention beyond this range. As the type of the C powder, those having a crystal structure like a graphite or a nanotube and an amorphous one represented by carbon black can be used as the C powder.

又,氧化物粉宜使用平均粒徑為0.2~5μm者。若平均粒徑為0.2~5μm,則具有可輕易與金屬粉均勻混合之優點。另一方面,若氧化物粉之平均粒徑超過5μm,則有時會在燒結後產生粗大之氧化物相,又,若未達0.2μm,則有時會發生氧化物粉彼此凝聚。惟,此粒徑範圍係較佳之條件,並不會因超過此範圍而否定本發明。 Further, it is preferable to use an oxide powder of an average particle diameter of 0.2 to 5 μm. If the average particle diameter is 0.2 to 5 μm, there is an advantage that it can be easily mixed with the metal powder easily. On the other hand, when the average particle diameter of the oxide powder exceeds 5 μm, a coarse oxide phase may be generated after sintering, and if it is less than 0.2 μm, the oxide powder may aggregate with each other. However, this particle size range is a preferred condition and does not deny the present invention beyond this range.

接著,將上述原料粉秤量成想要的組成,使用球磨機等公知的方法,同時進行粉碎及混合。此時,宜在粉碎容器內放入非活性氣體,以抑制原料粉之氧化。 Next, the raw material powder is weighed into a desired composition, and pulverized and mixed at the same time using a known method such as a ball mill. At this time, it is preferred to put an inert gas in the pulverization container to suppress oxidation of the raw material powder.

於真空環境或非活性氣體環境,以熱壓法對以上述方式製得之混合粉末進行成型、燒結。又,除了前述熱壓以外,亦可使用電漿放電燒結法等各種加壓燒結方法。尤其是熱靜水壓燒結法對於提升燒結體之密度是有效的。 The mixed powder obtained in the above manner is molded and sintered by a hot press method in a vacuum atmosphere or an inert gas atmosphere. Further, in addition to the above-described hot pressing, various pressure sintering methods such as a plasma discharge sintering method can also be used. In particular, the hot hydrostatic sintering method is effective for increasing the density of the sintered body.

燒結時的保持溫度雖然亦取決於靶之構成成分,但大多數的情形,較佳在500~950℃之溫度範圍。並且,為了實現Ag相於靶之剖面中小於以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點的形狀,宜使溫度在900℃以下。其原因在於:溫度在900℃以上時,Ag粒會成長而變得難以滿足上述特徵。 The holding temperature at the time of sintering depends on the constituent components of the target, but in most cases, it is preferably in the temperature range of 500 to 950 °C. Further, in order to realize that the Ag phase is smaller than all imaginary circles having a radius of 10 μm centered on an arbitrary point in the Ag phase in the cross section of the target, or at least two points or more between the imaginary circle and the outer edge of the Ag phase Or the shape of the intersection point should be such that the temperature is below 900 °C. The reason is that when the temperature is 900 ° C or higher, Ag particles grow and it becomes difficult to satisfy the above characteristics.

以車床等將以上述方式製得之燒結體加工成想要的靶形狀,藉此可製作本發明之濺鍍靶。 The sintered body obtained in the above manner is processed into a desired target shape by a lathe or the like, whereby the sputtering target of the present invention can be produced.

以上述方式製得之濺鍍靶,由於可降低濺鍍時產生之顆粒量,因此具有可提升成膜時之產率的優異效果。 The sputtering target produced in the above manner has an excellent effect of improving the yield at the time of film formation because the amount of particles generated at the time of sputtering can be reduced.

實施例 Example

以下,根據實施例及比較例來說明。另,實施例等僅為一例示,並不受到此例示的任何限制。亦即,本發明僅受到申請專利範圍的限制,亦包含本發明所含之實施例以外的各種變形。 Hereinafter, it demonstrates based on an Example and a comparative example. In addition, the embodiment and the like are merely examples, and are not limited by the examples. That is, the present invention is limited only by the scope of the patent application, and includes various modifications other than the embodiments included in the invention.

(實施例1) (Example 1)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, and C powder (graphite powder) having an average particle diameter of 10 μm were prepared as raw material powders. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為2500g。 Then, the total weight was 2,500 g in the following composition ratio.

秤量組成(莫耳分率):30Fe-30Pt-5Ag-35C Weighing composition (mole fraction): 30Fe-30Pt-5Ag-35C

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球(zirconia ball)一起封閉在容量10公升之球磨鍋(ball mill pot),旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。又,保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia ball of a pulverizing medium in a ball mill pot having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. Moreover, it is naturally cooled directly in the chamber after the end of the hold.

切下以上述方式製得之燒結體的一部分,研磨其切割面,並以電子探針顯微分析儀(EPMA)進行觀察。其結果,確認Fe-Pt合金相、Ag相及C相彼此均勻分散之組織結構。又,以EPMA對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之 任意點為中心所描繪之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相面積比率的結果,為25.5%。 A part of the sintered body obtained in the above manner was cut out, and the cut surface thereof was ground and observed with an electron probe microanalyzer (EPMA). As a result, the structure in which the Fe-Pt alloy phase, the Ag phase, and the C phase were uniformly dispersed was confirmed. Furthermore, as a result of observing the range of 0.2 mm 2 by EPMA, it was confirmed that all of the imaginary circles having a radius of 10 μm, which is centered on an arbitrary point in the Ag phase, are 80% or more of the Ag phase. Or having a shape having a tangent point or an intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase. Further, as a result of obtaining a C-phase area ratio from an image in a range of 1 mm 2 observed by an optical microscope, it was 25.5%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量。自以此方式所得之重量比率計算原子數比率之結果,將C原子數比率除以Ag原子數比率所得之值為6.9。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, and Ag were measured using an ICP-AES apparatus, and C was measured by a carbon analyzer using a high-frequency induction heating furnace-infrared absorption method. As a result of calculating the atomic ratio from the weight ratio obtained in this manner, the value obtained by dividing the ratio of the number of C atoms by the ratio of the number of Ag atoms was 6.9.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華(CANON ANELVA)製C-3010濺鍍系統),進行濺鍍。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. The target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by CANON ANELVA) for sputtering.

使濺鍍的條件為輸入電功率1kW、Ar氣壓1.7Pa,實施2kWhr的預濺鍍後,在4吋直徑的Si基板上成膜20秒。然後以顆粒計數器測量附著於基板上的顆粒個數。其結果,顆粒個數為83個。 The sputtering conditions were such that the input electric power was 1 kW, the Ar gas pressure was 1.7 Pa, and after 2 kWhr of pre-sputtering, film formation was performed on a 4 吋 diameter Si substrate for 20 seconds. The number of particles attached to the substrate is then measured with a particle counter. As a result, the number of particles was 83.

(比較例1) (Comparative Example 1)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, and C powder (graphite powder) having an average particle diameter of 10 μm were prepared as raw material powders. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為2500g。 Then, the total weight was 2,500 g in the following composition ratio.

秤量組成(莫耳分率):30Fe-30Pt-2Ag-38C Weighing composition (mole fraction): 30Fe-30Pt-2Ag-38C

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使 熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia grinding ball of a pulverizing medium in a ball pulverizer having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. Make The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

切下以上述方式製得之燒結體的一部分,研磨其剖面,並以電子探針顯微分析儀(EPMA)進行觀察。其結果,確認Fe-Pt合金相、Ag相及C相彼此均勻分散之組織結構。又,以EPMA對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相面積比率的結果,為28.4%。 A part of the sintered body obtained in the above manner was cut out, the cross section was ground, and observed by an electron probe microanalyzer (EPMA). As a result, the structure in which the Fe-Pt alloy phase, the Ag phase, and the C phase were uniformly dispersed was confirmed. Furthermore, as a result of observing the range of 0.2 mm 2 by EPMA, it was confirmed that all of the imaginary circles having a radius of 10 μm, which is centered on an arbitrary point in the Ag phase, are 80% or more of the Ag phase. Or having a shape having a tangent point or an intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase. Further, the C-phase area ratio was determined from an image in the range of 1 mm 2 observed by an optical microscope, and was 28.4%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量。自以此方式所得之重量比率計算原子數比率,將C原子數比率除以Ag原子數比率,結果為18.5。此值,不在本案請求項所規定之範圍者。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, and Ag were measured using an ICP-AES apparatus, and C was measured by a carbon analyzer using a high-frequency induction heating furnace-infrared absorption method. The atomic ratio was calculated from the weight ratio obtained in this manner, and the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and as a result, it was 18.5. This value is not within the scope of the request in this case.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為561個,顆粒數較實施例1大幅增加。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was performed under the same conditions as in Example 1. As a result, the number of particles was 561, and the number of particles was significantly increased as compared with Example 1.

(比較例2) (Comparative Example 2)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑30μm之Ag粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。然後以下述 之組成比,秤量成合計重量為2500g。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 30 μm, and C powder (graphite powder) having an average particle diameter of 10 μm were prepared as raw material powders. Then with the following The composition ratio was weighed to a total weight of 2,500 g.

秤量組成(莫耳分率):30Fe-30Pt-5Ag-35C Weighing composition (mole fraction): 30Fe-30Pt-5Ag-35C

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度960℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia grinding ball of a pulverizing medium in a ball pulverizer having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 960 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

切下以上述方式製得之燒結體的一部分,研磨其剖面,並以電子探針顯微分析儀進行觀察。其結果,確認Fe-Pt合金相、Ag相及C相彼此均勻分散之組織結構。又,對0.2mm2之範圍進行觀察之結果,觀察到粗大之Ag相,確認Ag相被包含在以其相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相沒有具備「在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點」的形狀者,以面積率計,佔Ag相整體面積的20%以上。其原因認為是使用大粒徑之Ag粉,以及燒結溫度高。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相面積比率的結果,為25.5%。 A part of the sintered body obtained in the above manner was cut out, the cross section was ground, and observed with an electron probe microanalyzer. As a result, the structure in which the Fe-Pt alloy phase, the Ag phase, and the C phase were uniformly dispersed was confirmed. Further, as a result of observing the range of 0.2 mm 2 , a coarse Ag phase was observed, and it was confirmed that the Ag phase was included in all the imaginary circles having a radius of 10 μm centered on any point in the phase, or the Ag phase was not provided. The shape of "the tangent point or the intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase" accounts for 20% or more of the entire area of the Ag phase by the area ratio. The reason for this is considered to be the use of a large particle size Ag powder and a high sintering temperature. Further, as a result of obtaining a C-phase area ratio from an image in a range of 1 mm 2 observed by an optical microscope, it was 25.5%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量。自以此方式所得之重量比率計算原子數比率,將C原子數比率除以Ag原子數比率,結果為7.0。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, and Ag were measured using an ICP-AES apparatus, and C was measured by a carbon analyzer using a high-frequency induction heating furnace-infrared absorption method. The atomic ratio was calculated from the weight ratio obtained in this manner, and the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and as a result, it was 7.0.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C -3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為245個,顆粒數較實施例1增加。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. Mount the target on a magnetron sputtering device (Canon Annewa C -3010 sputtering system), sputtering was carried out under the same conditions as in Example 1. As a result, the number of particles was 245, and the number of particles was increased as compared with Example 1.

(比較例3) (Comparative Example 3)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, and C powder (graphite powder) having an average particle diameter of 10 μm were prepared as raw material powders. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為1800g。 Then, the combined weight was 1800 g in the following composition ratio.

秤量組成(莫耳分率):17Fe-17Pt-6Ag-60C Weighing composition (mole fraction): 17Fe-17Pt-6Ag-60C

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia grinding ball of a pulverizing medium in a ball pulverizer having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

對以上述方式製得之燒結體的剖面進行研磨,並以電子探針顯微分析儀(EPMA)進行觀察之結果,確認Fe-Pt合金相、Ag相及C相彼此均勻分散之組織結構。又,以EPMA對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之任意點為中心所形成之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相面積比率的結果,C相面積比率為48.1%。此值不在本案請求項規定之範圍。 The cross section of the sintered body obtained in the above manner was polished, and observed by an electron probe microanalyzer (EPMA), and the structure in which the Fe-Pt alloy phase, the Ag phase, and the C phase were uniformly dispersed was confirmed. Further, as a result of observing the range of 0.2 mm 2 by EPMA, it was confirmed that all the imaginary circles having a radius of 10 μm formed around an arbitrary point in the Ag phase were contained in an area ratio of 80% or more of the Ag phase. Or having a shape having a tangent point or an intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase. Further, as a result of obtaining a C-phase area ratio from an image in a range of 1 mm 2 observed by an optical microscope, the C-phase area ratio was 48.1%. This value is outside the scope of the request in this case.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag係使用ICP-AES裝置來測量,C則以採用非活性氣體熔解-紅外線吸收法之氧分析計來測量。自以此方式所得之重量比率計算原子數比率之結果,將C原子數比率除以Ag原子數比率,結果為9.8。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, and Ag were measured using an ICP-AES apparatus, and C was measured by an oxygen analyzer using an inert gas melting-infrared absorption method. As a result of calculating the atomic ratio from the weight ratio obtained in this manner, the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and as a result, it was 9.8.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為880個,顆粒數較實施例1大幅增加。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was performed under the same conditions as in Example 1. As a result, the number of particles was 880, and the number of particles was significantly increased as compared with Example 1.

(實施例2) (Example 2)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑10μm之C粉(石墨粉)、平均粒徑1μm之SiO2粉作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, C powder (graphite powder) having an average particle diameter of 10 μm, and SiO 2 powder having an average particle diameter of 1 μm were prepared as a raw material powder. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為2200g。 Then, the total weight was 2,200 g in the following composition ratio.

秤量組成(莫耳分率):30Fe-30Pt-5Ag-30C-5SiO2 Weighing composition (mole fraction): 30Fe-30Pt-5Ag-30C-5SiO 2

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia grinding ball of a pulverizing medium in a ball pulverizer having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

切下以上述方式製得之燒結體的一部分,研磨其切割面,並以電子探針顯微分析儀(EPMA)進行觀察。其結果,確認Fe-Pt合金相、 Ag相、C相及氧化物(SiO2)相彼此均勻分散之組織結構。又,以EPMA對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之任意點為中心所形成之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相與氧化物相合計之面積比率的結果,為35.5%。 A part of the sintered body obtained in the above manner was cut out, and the cut surface thereof was ground and observed with an electron probe microanalyzer (EPMA). As a result, the structure in which the Fe-Pt alloy phase, the Ag phase, the C phase, and the oxide (SiO 2 ) phase were uniformly dispersed was confirmed. Further, as a result of observing the range of 0.2 mm 2 by EPMA, it was confirmed that all the imaginary circles having a radius of 10 μm formed around an arbitrary point in the Ag phase were contained in an area ratio of 80% or more of the Ag phase. Or having a shape having a tangent point or an intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase. Further, the area ratio of the C phase to the oxide phase was determined from an image in the range of 1 mm 2 observed by an optical microscope, and was 35.5%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag、Si係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量,而O以採用非活性氣體熔解-紅外線吸收法之氧分析裝置來測量。自以此方式所得之重量比率計算原子數比率,將C原子數比率除以Ag原子數比率,結果為6.0。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, Ag, and Si are measured using an ICP-AES device, and C is measured by a carbon analysis device using a high-frequency induction heating furnace-infrared absorption method, and O is using an inert gas melting-infrared absorption method. An oxygen analyzer is used to measure. The atomic ratio was calculated from the weight ratio obtained in this manner, and the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and the result was 6.0.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為34個。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was performed under the same conditions as in Example 1. As a result, the number of particles was 34.

(比較例4) (Comparative Example 4)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑10μm之C粉(石墨粉)、平均粒徑1μm之SiO2粉作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, C powder (graphite powder) having an average particle diameter of 10 μm, and SiO 2 powder having an average particle diameter of 1 μm were prepared as a raw material powder. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為2300g。 Then, the total weight was 2,300 g in the following composition ratio.

秤量組成(莫耳分率):32.5Fe-32.5Pt-2Ag-28C-5SiO2 Weighing composition (mole fraction): 32.5Fe-32.5Pt-2Ag-28C-5SiO 2

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨 球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in the Ar environment, weigh the powder and the zirconia mill of the pulverizing medium. The balls were closed together in a ball mill having a capacity of 10 liters, and were mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

對以上述方式製得之燒結體的剖面進行研磨,並以電子探針顯微分析儀(EPMA)進行觀察之結果,確認Fe-Pt合金相、Ag相、C相及氧化物(SiO2)相彼此均勻分散之組織結構。又,以EPMA對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之任意點為中心所形成之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相與氧化物相合計之面積比率的結果,為34.2%。 The cross section of the sintered body obtained in the above manner was ground and observed by an electron probe microanalyzer (EPMA) to confirm the Fe-Pt alloy phase, the Ag phase, the C phase, and the oxide (SiO 2 ). A tissue structure that is uniformly dispersed with each other. Further, as a result of observing the range of 0.2 mm 2 by EPMA, it was confirmed that all the imaginary circles having a radius of 10 μm formed around an arbitrary point in the Ag phase were contained in an area ratio of 80% or more of the Ag phase. Or having a shape having a tangent point or an intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase. Further, the area ratio of the C phase to the oxide phase was determined from an image in the range of 1 mm 2 observed by an optical microscope, and was 34.2%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag、Si係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量,而O以採用非活性氣體熔解-紅外線吸收法之氧分析裝置來測量。自以此方式所得之重量比率計算原子數比率,將C原子數比率除以Ag原子數比率,結果為13.9。此值不在本案請求項規定之範圍。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, Ag, and Si are measured using an ICP-AES device, and C is measured by a carbon analysis device using a high-frequency induction heating furnace-infrared absorption method, and O is using an inert gas melting-infrared absorption method. An oxygen analyzer is used to measure. The atomic ratio was calculated from the weight ratio obtained in this manner, and the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and as a result, it was 13.9. This value is outside the scope of the request in this case.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例2同樣之條件進行濺鍍。其結果,顆粒個數 為189個,顆粒數較實施例2大幅增加。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was carried out under the same conditions as in Example 2. As a result, the number of particles There were 189 particles, and the number of particles was significantly increased compared with Example 2.

(比較例5) (Comparative Example 5)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, and C powder (graphite powder) having an average particle diameter of 10 μm were prepared as raw material powders. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為1700g。 Then, the total weight was 1,700 g in the following composition ratio.

秤量組成(莫耳分率):24Fe-24Pt-5Ag-40C-7SiO2 Weighing composition (mole fraction): 24Fe-24Pt-5Ag-40C-7SiO 2

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia grinding ball of a pulverizing medium in a ball pulverizer having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

對以上述方式製得之燒結體的剖面進行研磨,並以電子探針顯微分析儀(EPMA)進行觀察之結果,確認Fe-Pt合金相、Ag相、C相及氧化物相(SiO2)彼此均勻分散之組織結構。又,以EPMA對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之任意點為中心所形成之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相與氧化物相合計之面積比率的結果,為47.4%。此值不在本案請求項規定之範圍。 The cross section of the sintered body obtained in the above manner was ground and observed by an electron probe microanalyzer (EPMA) to confirm the Fe-Pt alloy phase, the Ag phase, the C phase, and the oxide phase (SiO 2 ). ) an organization structure that is evenly dispersed from each other. Further, as a result of observing the range of 0.2 mm 2 by EPMA, it was confirmed that all the imaginary circles having a radius of 10 μm formed around an arbitrary point in the Ag phase were contained in an area ratio of 80% or more of the Ag phase. Or having a shape having a tangent point or an intersection point of at least 2 points or more between the imaginary circle and the outer edge of the Ag phase. Further, the area ratio of the C phase to the oxide phase was determined from the image in the range of 1 mm 2 observed by an optical microscope, and was 47.4%. This value is outside the scope of the request in this case.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、 Ag、Si係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量,而O以採用非活性氣體熔解-紅外線吸收法之氧分析裝置來測量。自以此方式所得之重量比率計算原子數比率之結果,將C原子數比率除以Ag原子數比率,結果為7.9。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, Ag and Si are measured using an ICP-AES device, C is measured by a carbon analyzer using a high-frequency induction heating furnace-infrared absorption method, and O is an oxygen analyzer using an inert gas melting-infrared absorption method. measuring. As a result of calculating the atomic ratio from the weight ratio obtained in this manner, the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and as a result, it was 7.9.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為716個,顆粒數較實施例1大幅增加。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was performed under the same conditions as in Example 1. As a result, the number of particles was 716, and the number of particles was significantly increased as compared with Example 1.

(實施例3) (Example 3)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑3μm之Cu粉、平均粒徑3μm之Co粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。Ag粉,為了防止凝聚,係使用經以有機系材料實施塗佈處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, Cu powder having an average particle diameter of 3 μm, Co powder having an average particle diameter of 3 μm, and C powder having an average particle diameter of 10 μm (graphite) Powder) as a raw material powder. In order to prevent aggregation, the Ag powder is used as a coating process by an organic material.

然後以下述之組成比,秤量成合計重量為2200g。 Then, the total weight was 2,200 g in the following composition ratio.

秤量組成(莫耳分率):26Fe-26Pt-6Cu-5Co-7Ag-30C Weighing composition (mole fraction): 26Fe-26Pt-6Cu-5Co-7Ag-30C

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in a Ar environment, the weighed powder was sealed with a zirconia grinding ball of a pulverizing medium in a ball pulverizer having a capacity of 10 liters, and mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

切下以上述方式製得之燒結體的一部分,研磨其切割面,並 以電子探針顯微分析儀(EPMA)進行觀察。其結果,確認Fe-Pt-Cu-Co合金相、Ag相及C相彼此均勻分散之組織結構。又,對0.2mm2之範圍進行觀察之結果,確認以面積率計Ag相中之80%以上,被包含在以Ag相內之任意點為中心所形成之半徑10μm的所有假想圓,或具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相面積比率的結果,為21.6%。 A part of the sintered body obtained in the above manner was cut out, and the cut surface thereof was ground and observed with an electron probe microanalyzer (EPMA). As a result, the structure in which the Fe-Pt-Cu-Co alloy phase, the Ag phase, and the C phase were uniformly dispersed was confirmed. Further, as a result of observing the range of 0.2 mm 2 , it was confirmed that all of the imaginary circles having a radius of 10 μm formed around an arbitrary point in the Ag phase were 80% or more in terms of the area ratio, or There is a shape in which a point or intersection of at least 2 points or more is provided between the imaginary circle and the outer edge of the Ag phase. Further, the C-phase area ratio was determined from an image in the range of 1 mm 2 observed by an optical microscope, and was 21.6%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag、Cu、Co係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量。自以此方式所得之重量比率計算原子數比率,將C原子數比率除以Ag原子數比率,結果為4.2。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, Ag, Cu, and Co are measured using an ICP-AES apparatus, and C is measured by a carbon analyzer using a high-frequency induction heating furnace-infrared absorption method. The atomic ratio was calculated from the weight ratio obtained in this manner, and the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and the result was 4.2.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為17個。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was performed under the same conditions as in Example 1. As a result, the number of particles was 17.

(比較例6) (Comparative Example 6)

準備平均粒徑3μm之Fe粉、平均粒徑3μm之Pt粉、平均粒徑2μm之Ag粉、平均粒徑3μm之Cu粉、平均粒徑3μm之Co粉、平均粒徑10μm之C粉(石墨粉)作為原料粉。Ag粉,使用未經實施防止凝聚之處理者。 Fe powder having an average particle diameter of 3 μm, Pt powder having an average particle diameter of 3 μm, Ag powder having an average particle diameter of 2 μm, Cu powder having an average particle diameter of 3 μm, Co powder having an average particle diameter of 3 μm, and C powder having an average particle diameter of 10 μm (graphite) Powder) as a raw material powder. Ag powder is used without treatment to prevent condensation.

然後以下述之組成比,秤量成合計重量為2200g。 Then, the total weight was 2,200 g in the following composition ratio.

秤量組成(莫耳分率):26Fe-26Pt-6Cu-5Co-7Ag-30C Weighing composition (mole fraction): 26Fe-26Pt-6Cu-5Co-7Ag-30C

接著,於Ar環境,將秤量之粉末與粉碎介質之二氧化鋯磨 球一起封閉在容量10公升之球磨鍋,旋轉4小時進行混合、粉碎。然後,將自鍋中取出之粉末填充於碳製模具,使用熱壓裝置進行成型、燒結。使熱壓的條件為真空環境、升溫速度300℃/小時、保持溫度900℃、保持時間2小時,自升溫開始時至保持結束以30MPa進行加壓。保持結束後直接在腔室內自然冷卻。 Next, in the Ar environment, weigh the powder and the zirconia mill of the pulverizing medium. The balls were closed together in a ball mill having a capacity of 10 liters, and were mixed and pulverized by rotating for 4 hours. Then, the powder taken out from the pot was filled in a carbon mold, and it was molded and sintered using a hot press apparatus. The conditions of the hot pressing were a vacuum atmosphere, a temperature increase rate of 300 ° C / hour, a holding temperature of 900 ° C, and a holding time of 2 hours, and the pressure was applied at 30 MPa from the start of the temperature rise to the end of the holding. After the end of the stay, it is naturally cooled directly in the chamber.

切下以上述方式製得之燒結體的一部分,研磨其剖面,並以電子探針顯微分析儀(EPMA)進行觀察之結果,確認Fe-Pt-Cu-Co合金相、Ag相及C相彼此均勻分散之組織結構。又,以EPMA對0.2mm2之區域進行觀察之結果,觀察到粗大之Ag相,確認Ag相被包含在以其相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相沒有具備「在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點」的形狀者,以面積率計,佔Ag相中的20%以上。其原因認為是Ag粉使用未經實施防止凝聚處理者。並且從以光學顯微鏡觀察1mm2之範圍的影像求出C相面積比率的結果,為21.7%。 A part of the sintered body obtained in the above manner was cut out, and the cross section was ground and observed by an electron probe microanalyzer (EPMA) to confirm the Fe-Pt-Cu-Co alloy phase, the Ag phase, and the C phase. An organizational structure that is evenly dispersed from each other. Further, as a result of observing a region of 0.2 mm 2 by EPMA, a coarse Ag phase was observed, and it was confirmed that the Ag phase was contained in all imaginary circles having a radius of 10 μm centered at any point in the phase, or Ag phase. A shape having a "cut point or intersection point of at least two points between the imaginary circle and the outer edge of the Ag phase" is not provided, and accounts for 20% or more of the Ag phase in terms of area ratio. The reason for this is considered to be that Ag powder is used without being treated to prevent aggregation. Further, the C-phase area ratio was determined from an image in the range of 1 mm 2 observed by an optical microscope, and was 21.7%.

並且,使用採集自燒結體之小片,實施組成分析。Fe、Pt、Ag係使用ICP-AES裝置來測量,C則以採用高頻感應加熱爐燃燒-紅外線吸收法之碳分析裝置來測量。自以此方式所得之重量比率計算原子數比率,將C原子數比率除以Ag原子數比率,結果為4.2。 Further, composition analysis was carried out using a small piece collected from a sintered body. Fe, Pt, and Ag were measured using an ICP-AES apparatus, and C was measured by a carbon analyzer using a high-frequency induction heating furnace-infrared absorption method. The atomic ratio was calculated from the weight ratio obtained in this manner, and the ratio of the number of C atoms was divided by the ratio of the number of Ag atoms, and the result was 4.2.

接著,以車床將燒結體切削加工成直徑180.0mm、厚度5.0mm的形狀,製得圓盤狀之靶。將該靶安裝於磁控濺鍍裝置(佳能安內華製C-3010濺鍍系統),以與實施例1同樣之條件進行濺鍍。其結果,顆粒個數為183個,顆粒數較實施例3增加。 Next, the sintered body was cut into a shape having a diameter of 180.0 mm and a thickness of 5.0 mm on a lathe to obtain a disk-shaped target. This target was mounted on a magnetron sputtering apparatus (C-3010 sputtering system manufactured by Canon Annehua), and sputtering was performed under the same conditions as in Example 1. As a result, the number of particles was 183, and the number of particles was increased as compared with Example 3.

如以上所述,已知於任一實施例中,皆可降低濺鍍時產生之顆粒量,為了提升成膜時之產率具有非常重要的作用。 As described above, it is known that in any of the embodiments, the amount of particles generated at the time of sputtering can be reduced, and it is very important to increase the yield at the time of film formation.

另,於實施例,雖然例示含有Cu、Co作為添加金屬之靶,但含有其他金屬元素(Au、B、Cr、Ga、Ge、Mn、Mo、Nb、Ni、Pd、Re、Rh、Ru、Sn、Ta、W、V、Zn)之情形時,亦可得到同樣之結果。 Further, in the examples, although Cu and Co are contained as targets for addition metals, other metal elements (Au, B, Cr, Ga, Ge, Mn, Mo, Nb, Ni, Pd, Re, Rh, Ru, In the case of Sn, Ta, W, V, Zn), the same result can be obtained.

產業上可利用性 Industrial availability

本發明之濺鍍靶,具有下述優異之效果:可降低濺鍍時產生之顆粒量,提升成膜時之產率。因此,適用作為用以形成粒狀結構型之磁性薄膜的濺鍍靶。 The sputtering target of the present invention has an excellent effect of reducing the amount of particles generated at the time of sputtering and improving the yield at the time of film formation. Therefore, it is suitable as a sputtering target for forming a magnetic thin film of a granular structure type.

Claims (4)

一種濺鍍靶,係由Fe-Pt系合金相、Ag相及C相構成,其特徵在於:於濺鍍靶整體之組成中,將C原子數比率除以Ag原子數比率所得之值在4以上10以下,於濺鍍靶之剖面中,Ag相被包含在以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點,該剖面中,C相之面積比率在10%以上45%以下。 A sputtering target comprising an Fe-Pt-based alloy phase, an Ag phase, and a C phase, wherein a value obtained by dividing a C atom number ratio by an Ag atom number ratio in a composition of a sputtering target as a whole is 4 In the above-described 10 or less, in the cross section of the sputtering target, the Ag phase is included in all imaginary circles having a radius of 10 μm drawn around any point in the Ag phase, or the Ag phase has a shape in which the imaginary circle and There are at least two or more tangent points or intersections between the outer edges of the Ag phases, and the area ratio of the C phases in the cross section is 10% or more and 45% or less. 一種濺鍍靶,係由Fe-Pt系合金相、Ag相、C相及氧化物相構成,其特徵在於:於濺鍍靶整體之組成中,將C原子數比率除以Ag原子數比率所得之值在4以上10以下,於濺鍍靶之剖面中,Ag相被包含在以Ag相內之任意點為中心所描繪之半徑10μm的所有假想圓,或Ag相具備有下述形狀:在該假想圓與Ag相外緣之間具有至少2點以上之切點或交點,該剖面中,C相與氧化物相之面積比率合計在10%以上45%以下。 A sputtering target is composed of an Fe-Pt-based alloy phase, an Ag phase, a C-phase, and an oxide phase, and is characterized in that a ratio of a C atom number is divided by an Ag atom number ratio in a composition of a sputtering target as a whole. The value is 4 or more and 10 or less. In the cross section of the sputtering target, the Ag phase is included in all imaginary circles having a radius of 10 μm centered on an arbitrary point in the Ag phase, or the Ag phase has the following shape: The imaginary circle has a tangent point or an intersection point of at least two points or more between the outer edge of the Ag phase, and the area ratio of the C phase to the oxide phase in the cross section is 10% or more and 45% or less in total. 如申請專利範圍第2項之濺鍍靶,其中,氧化物相係以選自Al、B、Ba、Be、Bi、Ca、Ce、Co、Cr、Cs、Cu、Dy、Er、Eu、Fe、Ga、Gd、Ge、Hf、Ho、La、Li、Lu、Mg、Mo、Nb、Nd、Ni、Pr、Sb、Sc、Si、Sm、Sn、Sr、Ta、Tb、Te、Ti、Tm、V、W、Y、Yb、Zn、Zr中一種以上之元素作為構成成分的氧化物。 The sputtering target of claim 2, wherein the oxide phase is selected from the group consisting of Al, B, Ba, Be, Bi, Ca, Ce, Co, Cr, Cs, Cu, Dy, Er, Eu, Fe. , Ga, Gd, Ge, Hf, Ho, La, Li, Lu, Mg, Mo, Nb, Nd, Ni, Pr, Sb, Sc, Si, Sm, Sn, Sr, Ta, Tb, Te, Ti, Tm One or more elements of V, W, Y, Yb, Zn, and Zr are oxides of constituent components. 如申請專利範圍第1至3項中任一項之濺鍍靶,其含有選自Au、B、Co、Cr、Cu、Ga、Ge、Mn、Mo、Nb、Ni、Pd、Re、Rh、Ru、Sn、Ta、W、V、Zn中一種以上之元素作為金屬成分,其含有率以金屬成分中之原子數的比率計,在0.5%以上15%以下。 The sputtering target according to any one of claims 1 to 3, which is selected from the group consisting of Au, B, Co, Cr, Cu, Ga, Ge, Mn, Mo, Nb, Ni, Pd, Re, Rh, One or more elements of Ru, Sn, Ta, W, V, and Zn are used as the metal component, and the content thereof is 0.5% or more and 15% or less in terms of the ratio of the number of atoms in the metal component.
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