TWI593486B - Cutting tools and cutting tools manufacturing methods - Google Patents
Cutting tools and cutting tools manufacturing methods Download PDFInfo
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- TWI593486B TWI593486B TW102121217A TW102121217A TWI593486B TW I593486 B TWI593486 B TW I593486B TW 102121217 A TW102121217 A TW 102121217A TW 102121217 A TW102121217 A TW 102121217A TW I593486 B TWI593486 B TW I593486B
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/10—Shank-type cutters, i.e. with an integral shaft
- B23C5/1009—Ball nose end mills
- B23C5/1018—Ball nose end mills with permanently fixed cutting inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2200/00—Details of milling cutting inserts
- B23C2200/08—Rake or top surfaces
- B23C2200/086—Rake or top surfaces with one or more grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/12—Boron nitride
- B23C2226/125—Boron nitride cubic [CBN]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/31—Diamond
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/31—Diamond
- B23C2226/315—Diamond polycrystalline [PCD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T407/00—Cutters, for shaping
- Y10T407/24—Cutters, for shaping with chip breaker, guide or deflector
- Y10T407/245—Cutters, for shaping with chip breaker, guide or deflector comprising concave surface in cutting face of tool
Description
本發明係關於一種至少參與切削之部位係由以金剛石為代表之高硬度素材構成之切削工具、及此切削工具之製造方法。
進行精密切削加工之切削工具於參與切削之部位係使用高硬度且耐磨損性優異之金剛石等作為材料。
該精密切削加工用之切削工具亦與一般的切削工具同樣地,具備由切削面、刀腹面及其等面交叉之位置之脊線構成的切削刃。
由於參與切削之部位之材料係高硬度之金剛石等,故於該精密切削加工用之切削工具之製造時材料之切斷、切削面之挖掘等係藉由雷射加工而進行。藉由雷射加工機之工具製作例如示於下述專利文獻1~3等。
[專利文獻1]日本專利特開2003-25118號公報
[專利文獻2]日本專利特開2004-344957號公報
[專利文獻3]日本專利特開2008-229810號公報
高硬度素材經雷射加工機加工後之面其表面粗糙度並不平滑。由於此原因,藉由雷射光線加工切削面、刀腹面之切削工具其性能並
不穩定,故採用對工具之表面、尤其係切削面進行機械研磨或研削加工而提高表面之平滑度之方法。但,由於要加工之材料較硬,故於研磨切削面之整個區域之先前方法中,存在研磨、研削花費大量時間之不佳狀況。
又,研磨裝置、研削裝置亦有負擔,結果亦存在成本提高之問題。
因此,本發明之課題在於減少工具製造時之研磨、研削加工之面積而實現精密切削加工用切削工具之切削性能之穩定化。
為解決上述課題,具有由高硬度素材構成之部位之切削工具係以如下方式構成。
即,形成如下構造:使上述部位具備由切削面、刀腹面及該切削面與刀腹面之交叉部之脊線形成的切削刃,將上述切削面之沿上述切削刃之區域設為A、將上述切削面之除上述區域A以外之區域設為B,上述區域A之表面粗糙度小於上述區域B之表面粗糙度,且上述區域B自上述區域A之位置下陷。
根據該構造,上述切削面之區域A可作為機械加工之平滑化面(研磨面或研削加工面),上述區域B可作為經雷射光線加工之非平滑化面。
再者,本發明亦可適用於使用CBN(Cubic Boron Nitride,立方晶氮化硼)燒結體作為上述高硬度素材之切削工具。而且,若應用於使用硬且切削面之粗加工只能依存於雷射加工之金剛石之切削工具,則發明之效果尤其顯著。
本發明之切削工具所利用之金剛石可為單晶金剛石、燒結金剛石、藉由氣相合成法製造之多晶金剛石之任一者。又,本發明之切削工具較佳為上述切削面之上述區域A係由單一面構成。
該切削工具係首先藉由雷射加工機對設於高硬度素材之切削面進行加工。此雷射加工之步驟中可藉由如下方法進行製造,即,將上述切削面之上述區域B較上述區域A更深挖掘,其後藉由機械研磨、研削加工對上述區域A之切削面進行平滑化而使其與上述刀腹面之間產生切削刃。本發明亦一併提供該製造方法。
該方法中之上述區域B之挖掘針對上述區域B之一部分進行時亦可獲得發明之效果。
再者,該方法中較佳為上述刀腹面亦進行研磨或研削加工。上述刀腹面之研磨、研削可於切削面之平滑化加工前或後之任一者進行。
本發明之切削工具可藉由如下方法製造,即,將切削面劃分為沿切削刃之區域A、及上述切削面之除上述區域A以外之區域B,上述區域B係自上述區域A之位置下陷,故藉由雷射加工機對切削面之上述區域A、B進行加工,其後藉由機械研磨、研削加工對上述區域A進行平滑化。
根據該方法,可將平滑化之上述區域A之面積減少至必要最小限度,從而可大幅度縮短研磨、研削之時間。
又,藉由縮小平滑化之上述區域A之面積,亦可減輕研磨裝置、研削裝置之加工負擔從而亦降低加工成本。
1‧‧‧切削工具
2‧‧‧本體部
2a‧‧‧柄
3‧‧‧切削頭
4‧‧‧切削面
5‧‧‧刀腹面
6‧‧‧切削刃
7‧‧‧切除面
A‧‧‧切削面之沿切削刃之區域
B‧‧‧切削面之除區域A以外之區域
圖1係表示本發明之切削工具之一例(球形端銑刀)之立體圖。
圖2係將圖1之切削工具之要部放大表示之立體圖。
圖3係沿著圖2之III-III線之放大剖面圖。
圖4(a)係表示利用本發明之製造方法之切削面之加工次序之圖。
圖4(b)係表示利用本發明之製造方法之切削面之加工次序之圖。
圖4(c)係表示利用本發明之製造方法之切削面之加工次序之圖。
以下,基於隨附圖式之圖1~圖4(c)對本發明之切削工具之實施形態進行說明。
圖1及圖2表示將本發明應用於前端之R半徑為0.5mm(直徑1mm)之1片刀之球形端銑刀之例。圖示之切削工具(球形端銑刀)1係於具有柄2a之本體部2之前端接合包含高硬度素材之切削頭3。而且,此切削頭3上設有由切削面4、刀腹面5、及切削面與刀腹面交叉之位置之脊線構成的切削刃6。
圖中,7係切削頭3之除去無切削刃6之側之切除面。
本體部2係由高速鋼等之工具鋼或超硬合金形成,切削頭3例如係由不使用結合材而使奈米尺寸之多晶金剛石結合之無黏合金剛石燒結體形成。
設於此切削頭3之切削面4係劃分為沿切削刃6之區域A及除區域A以外之區域B之2個區域。區域B係自區域A之位置略微下陷,進而其表面之表面粗糙度亦大於區域A之表面粗糙度。
區域A係經機械加工而成之面,區域B係經雷射光線加工而成之面。包含該區域A、B之切削面4係經由以下之步驟而形成者。
即,首先如圖4(a)所示,藉由雷射加工對切削面4之全體進行加工。此時之加工可於與切削面4交叉之方向上照射雷射光線而進行,亦可於與切削面4平行之方向上照射雷射光線而進行。
其次,藉由雷射加工機對切削面4之除區域A以外之部位(即區域B)進一步進行挖掘。圖示之切削工具(球形端銑刀)係自正上方對切削面4之區域B照射雷射光線而進行上述加工。
該情形時,如圖4(b)所示,若使雷射光線相對於區域B以殘留半圓之加工痕跡之方式掃描,則可使區域A之寬度穩定。
又,此時若挖掘區域B之全體,則可最大限度發揮切削面之精加工面積削減之效果。藉由雷射光線掃描而產生之槽間雖然殘留頂點處於與區域A相同高度位置之山,而並未達到全域挖掘之效果,但仍可減少切削面之研削面積。
圖4(c)係表示使雷射光線之掃描位置一面於端銑刀之半徑方向移動一面挖掘區域B之整個區域的狀態。
此時之區域B之自區域A之下陷量(圖3所示之區域B之最深地點至區域A為止之高度H)為100μm以下時,可抑制雷射光線之無用挖掘而較佳。下陷量之下限亦可為1μm。又,圖4(c)所示之區域A之寬度W可為切削刃6之直徑之50%以下。於精密切削加工中,一般而言切入係設定為10μm以下之微小值,故對於寬度W並不要求大數值。自區域A之面積削減方面而言越窄越好,下限亦允許為1μm。
若區域B之挖掘完成,接著藉由機械研磨、研削加工對區域A進行精加工。區域A之面積縮小且占切削面4全體之比例顯著減少,故機械研磨、研削所需之工夫及時間大幅度削減。
再者,刀腹面5與切除面7係藉由雷射加工機而進行加工。刀腹面5係對切削面4之區域A進行平滑化加工後或前加工前進行研磨、研削而進行精加工。
刀腹面5亦可僅藉由雷射加工機進行加工,但如此處所述般,若對切削面4之區域A及刀腹面5之兩面均進行研磨或研削,則可獲得高精度且穩定之切削刃。
再者,本發明之應用對象並不限定於圖示之球形端銑刀。亦可應用於方形端銑刀、圓角端銑刀等,且亦可應用於端銑刀以外之切削工具、例如精密旋削用車刀、車刀用切削嵌入件、鑽孔器等開孔工具等。
又,例示之切削工具係利用高硬度素材形成切削頭3之全體。亦
可於切削頭3之一部分上接合高硬度素材而利用高硬度素材僅形成參與切削之部分(切削刃附近)。
此外,構成參與切削之部位之高硬度素材亦可為單晶金剛石、燒結金剛石或藉由氣相合成法製造之多晶金剛石。又,即便於CBN燒結體之情形時,雖無法達到使用金剛石時之效果但亦可期待發明之效果。
1‧‧‧切削工具
2‧‧‧本體部
3‧‧‧切削頭
4‧‧‧切削面
5‧‧‧刀腹面
6‧‧‧切削刃
7‧‧‧切除面
A‧‧‧切削面之沿切削刃之區域
B‧‧‧切削面之除區域A以外之區域
Claims (4)
- 一種切削工具,其係具有由高硬度素材構成之部位者,上述部位具有由切削面(4)、刀腹面(5)、及此切削面與刀腹面之交叉部之脊線所形成的切削刃(6),將上述切削面(4)之沿上述切削刃(6)之區域設為A,將上述切削面(4)之除上述區域A以外之區域設為B,上述區域A之表面粗糙度小於區域B之表面粗糙度,且上述區域B自上述區域A之位置下陷,其中上述高硬度素材係單晶金剛石、燒結金剛石、多晶金剛石中之任一者,上述區域B之自上述區域A之下陷量為1μm以上100μm以下。
- 如請求項1之切削工具,其中上述切削面(4)之上述區域A係經機械研磨或研削加工而成之平滑化面,上述區域B係經雷射加工而成之非平滑化面。
- 如請求項1或2之切削工具,其中上述切削面(4)之上述區域A係由單一面構成。
- 一種如請求項1之切削工具之製造方法,其包含使用雷射光線於高硬度素材上形成切削面(4)之雷射加工步驟,此雷射加工步驟中將切削面(4)之上述區域B較上述區域A更深地挖掘,其後將上述區域A之切削面(4)進行研磨或研削加工而於上述切削面(4)與刀腹面(5)之間產生切削刃(6)。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2012139469A JP5878086B2 (ja) | 2012-06-21 | 2012-06-21 | 切削工具の製造方法 |
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TW201404498A TW201404498A (zh) | 2014-02-01 |
TWI593486B true TWI593486B (zh) | 2017-08-01 |
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TW102121217A TWI593486B (zh) | 2012-06-21 | 2013-06-14 | Cutting tools and cutting tools manufacturing methods |
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US (1) | US9707629B2 (zh) |
EP (1) | EP2865468B1 (zh) |
JP (1) | JP5878086B2 (zh) |
KR (1) | KR20150023239A (zh) |
CN (1) | CN104411430B (zh) |
TW (1) | TWI593486B (zh) |
WO (1) | WO2013190977A1 (zh) |
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DE102014204700B4 (de) * | 2014-03-13 | 2022-02-17 | Kennametal Inc. | Rotationswerkzeug, insbesondere Bohrwerkzeug sowie Verfahren zur Herstellung eines Rotationswerkzeuges |
CN104148684B (zh) * | 2014-08-11 | 2016-08-24 | 天津市天塑科技集团有限公司 | 使用消解罐车削刀具的消解罐加工方法 |
JP6435801B2 (ja) * | 2014-11-18 | 2018-12-12 | 三菱マテリアル株式会社 | エンドミル |
JP6191839B2 (ja) * | 2014-12-10 | 2017-09-06 | 日進工具株式会社 | ダイヤモンド焼結体ボールエンドミルとその製造方法 |
CN105458842B (zh) * | 2015-11-27 | 2017-10-17 | 贵州西南工具(集团)有限公司 | 一种解决小刃径合金刀刃口微小崩刃的方法 |
CN105772763B (zh) * | 2016-04-26 | 2018-05-08 | 深圳市力博刀具技术有限公司 | 一种单晶金刚石刀具加工方法以及单晶金刚石刀具 |
JP6790731B2 (ja) * | 2016-11-01 | 2020-11-25 | 東洋製罐グループホールディングス株式会社 | ダイヤモンド膜表面に微細周期構造溝を形成する方法 |
US11052466B2 (en) | 2016-12-26 | 2021-07-06 | Sumitomo Electric Hardmetal Corp. | Cutting tool and manufacturing method thereof |
US11541464B2 (en) * | 2017-03-28 | 2023-01-03 | Sumitomo Electric Hardmetal Corp. | Method for manufacturing diamond single crystal cutting tool using laser pulses |
US11167382B2 (en) | 2017-09-18 | 2021-11-09 | Agathon AG, Maschinenfabrik | Method and machine equipment for manufacturing of a cutting tool |
US11241747B2 (en) * | 2017-10-16 | 2022-02-08 | Iscar, Ltd. | Cutting tool and undersized bore-less indexable insert therefor |
JPWO2020250499A1 (zh) * | 2019-06-13 | 2020-12-17 | ||
JP7444523B2 (ja) | 2019-09-18 | 2024-03-06 | 住友電工ハードメタル株式会社 | ダイヤモンド切削工具 |
JP7023263B2 (ja) * | 2019-10-03 | 2022-02-21 | 旭ダイヤモンド工業株式会社 | 回転切削工具 |
CN111113168B (zh) * | 2019-12-30 | 2022-01-25 | 北京理工大学 | 一种微小径铣磨复合pcd球头铣刀及其刃磨方法 |
EP4169645A4 (en) * | 2020-06-22 | 2023-12-13 | Sumitomo Electric Hardmetal Corp. | CUTTING TOOL |
JP7274807B1 (ja) | 2023-01-31 | 2023-05-17 | 国立大学法人 名古屋工業大学 | レーザ加工装置、レーザ加工方法およびプログラム |
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2013
- 2013-05-31 CN CN201380032705.5A patent/CN104411430B/zh active Active
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Publication number | Publication date |
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EP2865468A4 (en) | 2016-01-27 |
TW201404498A (zh) | 2014-02-01 |
CN104411430B (zh) | 2016-08-24 |
JP5878086B2 (ja) | 2016-03-08 |
CN104411430A (zh) | 2015-03-11 |
KR20150023239A (ko) | 2015-03-05 |
WO2013190977A1 (ja) | 2013-12-27 |
US9707629B2 (en) | 2017-07-18 |
EP2865468A1 (en) | 2015-04-29 |
JP2014000663A (ja) | 2014-01-09 |
US20150125226A1 (en) | 2015-05-07 |
EP2865468B1 (en) | 2019-06-26 |
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