WO2013190977A1 - 切削工具 - Google Patents
切削工具 Download PDFInfo
- Publication number
- WO2013190977A1 WO2013190977A1 PCT/JP2013/065181 JP2013065181W WO2013190977A1 WO 2013190977 A1 WO2013190977 A1 WO 2013190977A1 JP 2013065181 W JP2013065181 W JP 2013065181W WO 2013190977 A1 WO2013190977 A1 WO 2013190977A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- rake face
- region
- area
- cutting tool
- cutting
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/10—Shank-type cutters, i.e. with an integral shaft
- B23C5/1009—Ball nose end mills
- B23C5/1018—Ball nose end mills with permanently fixed cutting inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2200/00—Details of milling cutting inserts
- B23C2200/08—Rake or top surfaces
- B23C2200/086—Rake or top surfaces with one or more grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/12—Boron nitride
- B23C2226/125—Boron nitride cubic [CBN]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/31—Diamond
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2226/00—Materials of tools or workpieces not comprising a metal
- B23C2226/31—Diamond
- B23C2226/315—Diamond polycrystalline [PCD]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/20—Tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T407/00—Cutters, for shaping
- Y10T407/24—Cutters, for shaping with chip breaker, guide or deflector
- Y10T407/245—Cutters, for shaping with chip breaker, guide or deflector comprising concave surface in cutting face of tool
Definitions
- This invention relates to a cutting tool in which at least a part involved in cutting is made of a high hardness material represented by diamond, and a method for manufacturing the cutting tool.
- Cutting tools that perform precision cutting work use diamond, which has high hardness and excellent wear resistance, as a material for parts involved in cutting.
- this cutting tool for precision cutting also has a cutting edge composed of a rake face, a flank face, and a ridge line at a position where these faces intersect.
- Patent Documents 1 to 3 Since the material of the part involved in the cutting is high-hardness diamond or the like, the surface of the material that is easy to cut is dug down by laser processing when manufacturing a cutting tool for precision cutting. Tool manufacturing with a laser processing machine is shown in, for example, the following Patent Documents 1 to 3.
- polishing apparatus and the grinding apparatus are burdened, resulting in a cost increase.
- an object of the present invention is to realize the stabilization of the cutting performance of a cutting tool for precision cutting by reducing the area of polishing and grinding during tool manufacture.
- a cutting tool having a portion composed of a high hardness material was configured as follows. That is, the portion is provided with a cutting edge formed by a rake face, a flank face, and a ridge line at the intersection of the rake face and the flank face, and the area along the cutting edge of the rake face is A, the rake face
- the area excluding the area A is defined as B, the surface roughness of the area A is made smaller than the surface roughness of the area B, and the area B has a structure that falls from the position of the area A.
- the region A of the rake face can be a smoothed surface (polished surface or ground surface) obtained by machining, and the region B can be a non-smoothed surface processed by a laser beam.
- the present invention can also be applied to a cutting tool using a CBN (cubic boron nitride) sintered body as the high hardness material.
- CBN cubic boron nitride sintered body
- the diamond used for the cutting tool of the present invention may be any of single crystal diamond, sintered diamond, and polycrystalline diamond produced by a vapor phase synthesis method. Moreover, the cutting tool of this invention is preferable when the said area
- This cutting tool first processes a rake face provided on a high hardness material with a laser processing machine.
- the area B of the rake face is dug deeper than the area A, and then the rake face of the area A is smoothed by mechanical polishing or grinding to form a cutting edge between the flank face and the flank face. It can be manufactured by a method of generating.
- the present invention also provides such a manufacturing method.
- flank is also polished or ground.
- the flank polishing and grinding may be performed either before or after the rake face smoothing process.
- the rake face is divided into an area A along the cutting edge and an area B excluding the area A of the rake face, and the area B is lowered from the position of the area A.
- the areas A and B of the surface can be processed by a laser processing machine, and then the area A can be smoothed by mechanical polishing or grinding.
- the area of the region A to be smoothed can be reduced to the minimum necessary, and the polishing and grinding time can be greatly shortened.
- the processing burden on the polishing apparatus and the grinding apparatus is reduced, and the processing cost is reduced.
- FIG. 3 is an enlarged sectional view taken along line III-III in FIG. 2.
- FIG. 2 It is a figure which shows the processing procedure of the rake face by the manufacturing method of this invention. It is a figure which shows the processing procedure of the rake face by the manufacturing method of this invention. It is a figure which shows the processing procedure of the rake face by the manufacturing method of this invention. It is a figure which shows the processing procedure of the rake face by the manufacturing method of this invention.
- FIGS. 1 and 2 An example in which the present invention is applied to a one-blade ball end mill having a radius R of the tip of 0.5 mm (diameter 1 mm) is shown in FIGS. 1 and 2.
- a cutting head 3 made of a high-hardness material is joined to the tip of a main body 2 having a shank 2 a.
- the cutting head 3 is provided with a rake face 4, a flank face 5, and a cutting edge 6 constituted by a ridge line at a position where the rake face and the flank face intersect.
- 7 is a cut surface for removing the side of the cutting head 3 where the cutting edge 6 is not present.
- the main body 2 is formed of tool steel such as high-speed steel or cemented carbide, and the cutting head 3 is, for example, a binderless diamond sintered body in which nano-sized polycrystalline diamond is bonded without using a binder. It is formed with.
- the rake face 4 provided on the cutting head 3 is divided into two regions, a region A along the cutting edge 6 and a region B excluding the region A.
- the region B slightly falls from the position of the region A, and the surface roughness of the surface is rougher than the surface roughness of the region A.
- the heel region A is a machined surface
- the region B is a surface processed with a laser beam.
- the rake face 4 composed of the regions A and B is formed through the following steps.
- the entire rake face 4 is processed with a laser processing machine. Processing at this time may be performed by irradiating a laser beam in a direction intersecting the rake face 4 or by irradiating in a direction parallel to the rake face 4.
- region A of the rake face 4 is further dug down with a laser processing machine.
- the illustrated cutting tool (ball end mill) performs the processing by irradiating the region B of the rake face 4 with a laser beam from directly above.
- the width of the region A can be stabilized by scanning the laser beam so as to leave a semicircular processing trace on the region B as shown in FIG.
- the effect of reducing the finish processing area of the rake face is maximized. Even if a peak whose apex is at the same height as the region A is left between the grooves generated by the scanning of the laser beam, the grinding area of the rake face can be reduced, although not as much as in the case of digging the whole area.
- FIG. 4C shows a state where the entire region B is dug down while moving the scanning position of the laser beam in the radial direction of the end mill.
- the amount of depression of the region B from the region A is 100 ⁇ m or less, so that unnecessary dug by the laser beam can be suppressed. preferable.
- the lower limit of the sagging amount may be 1 ⁇ m.
- the width W of the region A shown in FIG. 4C is preferably 50% or less of the diameter of the cutting edge 6. In precision cutting, since the cut is generally set to a fine value of 10 ⁇ m or less, a large value is not required for the width W. From the aspect of area reduction of the region A, it is better that it is narrower, and the lower limit is 1 ⁇ m.
- the region A is then finished by mechanical polishing or grinding. Since the area of the region A is reduced and the proportion of the entire rake face 4 is significantly reduced, labor and time required for mechanical polishing and grinding are greatly reduced.
- flank 5 and the cut surface 7 are processed with a laser processing machine.
- the flank 5 is finished by polishing or grinding after or before smoothing the region A of the rake face 4.
- the flank 5 can be processed only by a laser processing machine. However, as described above, if both the region A of the rake face 4 and both sides of the flank 5 are polished or ground, the flank 5 is stable with high accuracy. A cutting edge can be obtained.
- the application object of the present invention is not limited to the illustrated ball end mill.
- the present invention can be applied to a square end mill, a radius end mill, and the like, and can also be applied to cutting tools other than the end mill, such as precision turning tools, cutting inserts for tools, drilling tools such as drills, and the like.
- the entire cutting head 3 is formed of a high hardness material.
- a high hardness material may be joined to a part of the cutting head 3 and only a portion related to cutting (near the cutting edge) may be formed of the high hardness material.
- the high-hardness material constituting the part involved in cutting may be single crystal diamond, sintered diamond, or polycrystalline diamond produced by a vapor phase synthesis method. Even in the case of a CBN sintered body, the effect of the invention can be expected although not as much as when diamond is used.
Abstract
Description
即ち、前記部位に、すくい面と逃げ面とそのすくい面と逃げ面の交差部の稜線で形成される切れ刃を備えさせ、前記すくい面の前記切れ刃に沿った領域をA、前記すくい面の前記領域Aを除いた領域をBとして、前記領域Aの面粗さを前記領域Bの面粗さよりも小さくし、前記領域Bは前記領域Aの位置から落ち込んでいる構造にした。
2 本体部
2a シャンク
3 切削ヘッド
4 すくい面
A すくい面の切れ刃に沿った領域
B すくい面の領域Aを除いた領域
5 逃げ面
6 切れ刃
7 切除面
Claims (5)
- 高硬度素材で構成される部位を有する切削工具であって、
前記部位が、すくい面(4)と、逃げ面(5)と、そのすくい面と逃げ面の交差部の稜線で形成される切れ刃(6)を有し、
前記すくい面(4)の前記切れ刃(6)に沿った領域をA、前記すくい面(4)の前記領域Aを除いた領域をBとして、前記領域Aの面粗さが領域Bの面粗さよりも小さく、前記領域Bは前記領域Aの位置から落ち込んでいる切削工具。 - 前記すくい面(4)の前記領域Aは機械研磨又は研削加工による平滑化面、前記領域Bは、レーザー加工された非平滑化面であることを特徴とする請求項1に記載の切削工具。
- 前記高硬度素材が、単結晶ダイヤモンド、焼結ダイヤモンド、多結晶ダイヤモンドのいずれかである請求項1又は2に記載の切削工具。
- 前記すくい面(4)の前記領域Aが単一の面で構成されていることを特徴とする請求項1~3のいずれかひとつに記載の切削工具。
- レーザー光線を用いて高硬度素材にすくい面(4)を形成するレーザー加工工程を有し、そのレーザー加工工程においてすくい面(4)の前記領域Bを前記領域Aよりも深く掘り下げ、その後、前記領域Aのすくい面(4)を研磨もしくは研削加工して前記すくい面(4)と逃げ面(5)との間に切れ刃(6)を生じさせる請求項1~4のいずれかひとつに記載の切削工具の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13806626.1A EP2865468B1 (en) | 2012-06-21 | 2013-05-31 | Cutting tool |
US14/402,144 US9707629B2 (en) | 2012-06-21 | 2013-05-31 | Cutting tool |
KR1020147030843A KR20150023239A (ko) | 2012-06-21 | 2013-05-31 | 절삭 공구 |
CN201380032705.5A CN104411430B (zh) | 2012-06-21 | 2013-05-31 | 切削工具 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012139469A JP5878086B2 (ja) | 2012-06-21 | 2012-06-21 | 切削工具の製造方法 |
JP2012-139469 | 2012-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013190977A1 true WO2013190977A1 (ja) | 2013-12-27 |
Family
ID=49768579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2013/065181 WO2013190977A1 (ja) | 2012-06-21 | 2013-05-31 | 切削工具 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9707629B2 (ja) |
EP (1) | EP2865468B1 (ja) |
JP (1) | JP5878086B2 (ja) |
KR (1) | KR20150023239A (ja) |
CN (1) | CN104411430B (ja) |
TW (1) | TWI593486B (ja) |
WO (1) | WO2013190977A1 (ja) |
Cited By (3)
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EP2918360A1 (de) * | 2014-03-13 | 2015-09-16 | Kennametal Inc. | Rotationswerkzeug, insbesondere bohrwerkzeug sowie verfahren zur herstellung eines rotationswerkzeuges |
WO2020250499A1 (ja) * | 2019-06-13 | 2020-12-17 | 住友電工ハードメタル株式会社 | 切削工具 |
JP7274807B1 (ja) | 2023-01-31 | 2023-05-17 | 国立大学法人 名古屋工業大学 | レーザ加工装置、レーザ加工方法およびプログラム |
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CN104148684B (zh) * | 2014-08-11 | 2016-08-24 | 天津市天塑科技集团有限公司 | 使用消解罐车削刀具的消解罐加工方法 |
JP6435801B2 (ja) * | 2014-11-18 | 2018-12-12 | 三菱マテリアル株式会社 | エンドミル |
JP6191839B2 (ja) * | 2014-12-10 | 2017-09-06 | 日進工具株式会社 | ダイヤモンド焼結体ボールエンドミルとその製造方法 |
CN105458842B (zh) * | 2015-11-27 | 2017-10-17 | 贵州西南工具(集团)有限公司 | 一种解决小刃径合金刀刃口微小崩刃的方法 |
CN105772763B (zh) * | 2016-04-26 | 2018-05-08 | 深圳市力博刀具技术有限公司 | 一种单晶金刚石刀具加工方法以及单晶金刚石刀具 |
JP6790731B2 (ja) * | 2016-11-01 | 2020-11-25 | 東洋製罐グループホールディングス株式会社 | ダイヤモンド膜表面に微細周期構造溝を形成する方法 |
JP6657547B2 (ja) | 2016-12-26 | 2020-03-04 | 住友電工ハードメタル株式会社 | 切削工具及びその製造方法 |
EP3603858B1 (en) * | 2017-03-28 | 2022-03-30 | Sumitomo Electric Hardmetal Corp. | Method of manufacturing cutting tool |
US11167382B2 (en) * | 2017-09-18 | 2021-11-09 | Agathon AG, Maschinenfabrik | Method and machine equipment for manufacturing of a cutting tool |
US11241747B2 (en) | 2017-10-16 | 2022-02-08 | Iscar, Ltd. | Cutting tool and undersized bore-less indexable insert therefor |
US20220297201A1 (en) | 2019-09-18 | 2022-09-22 | Sumitomo Electric Hardmetal Corp. | Diamond cutting tool |
JP7023263B2 (ja) * | 2019-10-03 | 2022-02-21 | 旭ダイヤモンド工業株式会社 | 回転切削工具 |
CN111113168B (zh) * | 2019-12-30 | 2022-01-25 | 北京理工大学 | 一种微小径铣磨复合pcd球头铣刀及其刃磨方法 |
US20230182218A1 (en) * | 2020-06-22 | 2023-06-15 | Sumitomo Electric Hardmetal Corp. | Cutting tool |
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2012
- 2012-06-21 JP JP2012139469A patent/JP5878086B2/ja active Active
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2013
- 2013-05-31 US US14/402,144 patent/US9707629B2/en active Active
- 2013-05-31 WO PCT/JP2013/065181 patent/WO2013190977A1/ja active Application Filing
- 2013-05-31 CN CN201380032705.5A patent/CN104411430B/zh active Active
- 2013-05-31 EP EP13806626.1A patent/EP2865468B1/en active Active
- 2013-05-31 KR KR1020147030843A patent/KR20150023239A/ko not_active Application Discontinuation
- 2013-06-14 TW TW102121217A patent/TWI593486B/zh not_active IP Right Cessation
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JP2007216327A (ja) * | 2006-02-15 | 2007-08-30 | Aisin Seiki Co Ltd | チップブレーカの形成方法 |
JP2008229810A (ja) | 2007-03-23 | 2008-10-02 | Allied Material Corp | 超精密切削加工用ダイヤモンド工具 |
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EP2918360A1 (de) * | 2014-03-13 | 2015-09-16 | Kennametal Inc. | Rotationswerkzeug, insbesondere bohrwerkzeug sowie verfahren zur herstellung eines rotationswerkzeuges |
US9604285B2 (en) | 2014-03-13 | 2017-03-28 | Kennametal, Inc. | Rotary tool and method for manufacturing |
WO2020250499A1 (ja) * | 2019-06-13 | 2020-12-17 | 住友電工ハードメタル株式会社 | 切削工具 |
JP7274807B1 (ja) | 2023-01-31 | 2023-05-17 | 国立大学法人 名古屋工業大学 | レーザ加工装置、レーザ加工方法およびプログラム |
Also Published As
Publication number | Publication date |
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TWI593486B (zh) | 2017-08-01 |
US9707629B2 (en) | 2017-07-18 |
US20150125226A1 (en) | 2015-05-07 |
CN104411430A (zh) | 2015-03-11 |
EP2865468A4 (en) | 2016-01-27 |
KR20150023239A (ko) | 2015-03-05 |
JP2014000663A (ja) | 2014-01-09 |
CN104411430B (zh) | 2016-08-24 |
JP5878086B2 (ja) | 2016-03-08 |
EP2865468A1 (en) | 2015-04-29 |
EP2865468B1 (en) | 2019-06-26 |
TW201404498A (zh) | 2014-02-01 |
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