TWI593133B - 封裝之製造方法及發光裝置之製造方法、與封裝及發光裝置 - Google Patents

封裝之製造方法及發光裝置之製造方法、與封裝及發光裝置 Download PDF

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Publication number
TWI593133B
TWI593133B TW104132273A TW104132273A TWI593133B TW I593133 B TWI593133 B TW I593133B TW 104132273 A TW104132273 A TW 104132273A TW 104132273 A TW104132273 A TW 104132273A TW I593133 B TWI593133 B TW I593133B
Authority
TW
Taiwan
Prior art keywords
electrode
package
resin
lead
manufacturing
Prior art date
Application number
TW104132273A
Other languages
English (en)
Chinese (zh)
Other versions
TW201618325A (zh
Inventor
福田真弓
Original Assignee
日亞化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日亞化學工業股份有限公司 filed Critical 日亞化學工業股份有限公司
Publication of TW201618325A publication Critical patent/TW201618325A/zh
Application granted granted Critical
Publication of TWI593133B publication Critical patent/TWI593133B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW104132273A 2014-09-29 2015-09-30 封裝之製造方法及發光裝置之製造方法、與封裝及發光裝置 TWI593133B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014198743 2014-09-29
JP2015147971A JP6477328B2 (ja) 2014-09-29 2015-07-27 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置

Publications (2)

Publication Number Publication Date
TW201618325A TW201618325A (zh) 2016-05-16
TWI593133B true TWI593133B (zh) 2017-07-21

Family

ID=55867400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104132273A TWI593133B (zh) 2014-09-29 2015-09-30 封裝之製造方法及發光裝置之製造方法、與封裝及發光裝置

Country Status (3)

Country Link
JP (2) JP6477328B2 (ja)
KR (1) KR101760574B1 (ja)
TW (1) TWI593133B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6337873B2 (ja) 2015-11-30 2018-06-06 日亜化学工業株式会社 パッケージ、パッケージ中間体、発光装置及びそれらの製造方法
JP6332251B2 (ja) 2015-12-09 2018-05-30 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP6332253B2 (ja) 2015-12-09 2018-05-30 日亜化学工業株式会社 パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置
JP7355998B2 (ja) * 2019-06-03 2023-10-04 日亜化学工業株式会社 リードフレーム

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04729A (ja) * 1990-04-10 1992-01-06 Sanken Electric Co Ltd 樹脂封止形電子部品の製造方法
JPH08195467A (ja) * 1995-01-17 1996-07-30 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置の製造方法
JP4654670B2 (ja) * 2003-12-16 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
JP4830768B2 (ja) * 2006-05-10 2011-12-07 日亜化学工業株式会社 半導体発光装置及び半導体発光装置の製造方法
JP5122172B2 (ja) * 2007-03-30 2013-01-16 ローム株式会社 半導体発光装置
JP2009021394A (ja) * 2007-07-12 2009-01-29 Nitto Denko Corp 光半導体素子収納用実装パッケージ用樹脂組成物およびそれを用いて得られる光半導体発光装置
JP4790750B2 (ja) * 2008-04-18 2011-10-12 オンセミコンダクター・トレーディング・リミテッド 樹脂封止型半導体装置の製造方法
JP5217800B2 (ja) * 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
JP5246662B2 (ja) * 2009-02-13 2013-07-24 パナソニック株式会社 半導体装置用パッケージおよびその製造方法
JP2010251493A (ja) * 2009-04-15 2010-11-04 Panasonic Corp 半導体発光装置用リードフレーム及び半導体発光装置
TW201128812A (en) * 2009-12-01 2011-08-16 Lg Innotek Co Ltd Light emitting device
TWM394578U (en) * 2010-04-20 2010-12-11 Sdi Corp Frame substrate of illumination device and its package structure
KR101859149B1 (ko) * 2011-04-14 2018-05-17 엘지이노텍 주식회사 발광 소자 패키지
JP6205686B2 (ja) * 2011-08-23 2017-10-04 大日本印刷株式会社 光半導体装置
KR101886157B1 (ko) * 2012-08-23 2018-08-08 엘지이노텍 주식회사 발광 소자 및 조명시스템
JP2015005584A (ja) * 2013-06-20 2015-01-08 日立アプライアンス株式会社 照明装置

Also Published As

Publication number Publication date
KR101760574B1 (ko) 2017-07-21
TW201618325A (zh) 2016-05-16
JP2019087755A (ja) 2019-06-06
JP6642746B2 (ja) 2020-02-12
JP2016072607A (ja) 2016-05-09
JP6477328B2 (ja) 2019-03-06
KR20160037789A (ko) 2016-04-06

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