TWI589715B - Copper alloy strip and with its high-current electronic components and cooling electronic components - Google Patents

Copper alloy strip and with its high-current electronic components and cooling electronic components Download PDF

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Publication number
TWI589715B
TWI589715B TW105100143A TW105100143A TWI589715B TW I589715 B TWI589715 B TW I589715B TW 105100143 A TW105100143 A TW 105100143A TW 105100143 A TW105100143 A TW 105100143A TW I589715 B TWI589715 B TW I589715B
Authority
TW
Taiwan
Prior art keywords
copper alloy
alloy strip
aging
tensile strength
ray diffraction
Prior art date
Application number
TW105100143A
Other languages
English (en)
Chinese (zh)
Other versions
TW201632634A (zh
Inventor
Akihiro Kakitani
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201632634A publication Critical patent/TW201632634A/zh
Application granted granted Critical
Publication of TWI589715B publication Critical patent/TWI589715B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW105100143A 2015-02-04 2016-01-05 Copper alloy strip and with its high-current electronic components and cooling electronic components TWI589715B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015020701A JP6207539B2 (ja) 2015-02-04 2015-02-04 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品

Publications (2)

Publication Number Publication Date
TW201632634A TW201632634A (zh) 2016-09-16
TWI589715B true TWI589715B (zh) 2017-07-01

Family

ID=56569932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105100143A TWI589715B (zh) 2015-02-04 2016-01-05 Copper alloy strip and with its high-current electronic components and cooling electronic components

Country Status (4)

Country Link
JP (1) JP6207539B2 (ja)
KR (1) KR101822374B1 (ja)
CN (1) CN105838915B (ja)
TW (1) TWI589715B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018066414A1 (ja) * 2016-10-05 2018-04-12 株式会社神戸製鋼所 放熱部品用銅合金板、放熱部品、及び放熱部品の製造方法
KR102259380B1 (ko) 2018-04-20 2021-06-01 주식회사 엘지에너지솔루션 버스바를 구비한 배터리 모듈 및 배터리 팩
TWI674326B (zh) * 2018-11-19 2019-10-11 財團法人工業技術研究院 銅鋯合金散熱元件及銅鋯合金殼體的製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05170916A (ja) 1991-12-20 1993-07-09 Tonen Corp ポリアリ−レンサルファイドとポリエステルとのグラフト共重合体の製法
US5370840A (en) * 1992-11-04 1994-12-06 Olin Corporation Copper alloy having high strength and high electrical conductivity
JP3351023B2 (ja) * 1993-04-28 2002-11-25 三菱マテリアル株式会社 吊架線
JP2005133185A (ja) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd 析出型銅合金の熱処理方法と析出型銅合金および素材
JP2010013691A (ja) * 2008-07-03 2010-01-21 Kanazawa Univ 高強度及び高導電性銅合金板材
KR101521408B1 (ko) * 2009-01-26 2015-05-18 후루카와 덴키 고교 가부시키가이샤 배선용 전선 도체, 배선용 전선 도체의 제조방법, 배선용 전선 및 구리합금 소선
JP5320541B2 (ja) 2009-04-07 2013-10-23 株式会社Ｓｈカッパープロダクツ 電気・電子部品用銅合金材
JP5320642B2 (ja) 2009-04-17 2013-10-23 株式会社Ｓｈカッパープロダクツ 銅合金の製造方法及び銅合金
JP5060625B2 (ja) 2011-02-18 2012-10-31 三菱伸銅株式会社 Ｃｕ−Ｚｒ系銅合金板及びその製造方法
JP5525101B2 (ja) * 2012-10-22 2014-06-18 Ｊｘ日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP5380621B1 (ja) * 2013-03-25 2014-01-08 Ｊｘ日鉱日石金属株式会社 導電性及び応力緩和特性に優れる銅合金板
JP6301734B2 (ja) * 2014-05-26 2018-03-28 古河電気工業株式会社 銅合金材及びその製造方法

Also Published As

Publication number Publication date
KR101822374B1 (ko) 2018-01-29
KR20160096041A (ko) 2016-08-12
JP2016141878A (ja) 2016-08-08
CN105838915A (zh) 2016-08-10
CN105838915B (zh) 2018-05-08
JP6207539B2 (ja) 2017-10-04
TW201632634A (zh) 2016-09-16

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