TWI588173B - A low-release epoxy resin and a partially esterified epoxy resin, the production method, and a curable resin composition containing the same - Google Patents

A low-release epoxy resin and a partially esterified epoxy resin, the production method, and a curable resin composition containing the same Download PDF

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Publication number
TWI588173B
TWI588173B TW105104930A TW105104930A TWI588173B TW I588173 B TWI588173 B TW I588173B TW 105104930 A TW105104930 A TW 105104930A TW 105104930 A TW105104930 A TW 105104930A TW I588173 B TWI588173 B TW I588173B
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TW
Taiwan
Prior art keywords
general formula
group
epoxy resin
carbon atoms
epoxy
Prior art date
Application number
TW105104930A
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English (en)
Chinese (zh)
Other versions
TW201619231A (zh
Inventor
Taikou Usui
Masahiro Morimoto
Original Assignee
Kyoritu Chemical & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoritu Chemical & Co Ltd filed Critical Kyoritu Chemical & Co Ltd
Publication of TW201619231A publication Critical patent/TW201619231A/zh
Application granted granted Critical
Publication of TWI588173B publication Critical patent/TWI588173B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
TW105104930A 2010-10-01 2011-09-27 A low-release epoxy resin and a partially esterified epoxy resin, the production method, and a curable resin composition containing the same TWI588173B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010223842A JP5736613B2 (ja) 2010-10-01 2010-10-01 低溶出性エポキシ樹脂及びその部分エステル化エポキシ樹脂、その製造方法、並びにそれを含む硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
TW201619231A TW201619231A (zh) 2016-06-01
TWI588173B true TWI588173B (zh) 2017-06-21

Family

ID=45892693

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100134793A TWI534170B (zh) 2010-10-01 2011-09-27 A low-dissolution epoxy resin and a partially esterified epoxy resin thereof, the production method, and the hardened resin composition containing the same
TW105104930A TWI588173B (zh) 2010-10-01 2011-09-27 A low-release epoxy resin and a partially esterified epoxy resin, the production method, and a curable resin composition containing the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW100134793A TWI534170B (zh) 2010-10-01 2011-09-27 A low-dissolution epoxy resin and a partially esterified epoxy resin thereof, the production method, and the hardened resin composition containing the same

Country Status (5)

Country Link
JP (1) JP5736613B2 (ja)
KR (1) KR101812832B1 (ja)
CN (2) CN103140535B (ja)
TW (2) TWI534170B (ja)
WO (1) WO2012043222A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5979972B2 (ja) * 2012-05-17 2016-08-31 協立化学産業株式会社 エステル化エポキシ樹脂、その製造方法、及びそれを含む硬化性組成物
JP6445780B2 (ja) * 2013-05-09 2018-12-26 積水化学工業株式会社 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子
JP6046866B1 (ja) * 2015-05-08 2016-12-21 積水化学工業株式会社 液晶表示素子用シール剤、及び、上下導通材料、及び、液晶表示素子
CN109789782B (zh) 2016-09-26 2021-10-29 富士胶片株式会社 投影型显示装置、投影显示方法、及存储介质
JP6601634B2 (ja) * 2017-03-31 2019-11-06 協立化学産業株式会社 変性樹脂及びそれを含む硬化性樹脂組成物
CN111560111A (zh) * 2020-06-22 2020-08-21 陕西科技大学 一种bpa-ga酚醛环氧树脂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063227A (ja) * 2004-08-27 2006-03-09 Sakamoto Yakuhin Kogyo Co Ltd 熱硬化性エポキシ樹脂組成物
JP2009185116A (ja) * 2008-02-04 2009-08-20 Air Water Inc カルボキシル基含有エポキシアクリレート樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性樹脂組成物およびその硬化物

Family Cites Families (12)

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JPS5936361B2 (ja) * 1976-08-03 1984-09-03 三菱電機株式会社 マイカ薄葉材
DE2829236A1 (de) * 1977-07-06 1979-01-25 Ciba Geigy Ag Lineare, glycidyl- und hydroxylgruppenhaltige polyaetherharze
JPH06157712A (ja) * 1992-11-27 1994-06-07 Nippon Kayaku Co Ltd 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2001310927A (ja) * 2000-04-28 2001-11-06 Nippon Shokubai Co Ltd 不飽和基含有カルボン酸化合物
JP4813647B2 (ja) * 2000-09-28 2011-11-09 三井化学株式会社 低臭気樹脂組成物およびそれを含む被覆材およびそれを用いた被覆工法
JP4524083B2 (ja) * 2003-01-22 2010-08-11 阪本薬品工業株式会社 活性エネルギー線硬化性樹脂組成物
JP4117838B2 (ja) * 2003-02-14 2008-07-16 三井化学株式会社 エポキシ部分エステル化物の製造方法
JP4524127B2 (ja) * 2004-03-18 2010-08-11 阪本薬品工業株式会社 新規なエポキシ樹脂およびそれを含む硬化性樹脂組成物
JP4779362B2 (ja) * 2005-01-06 2011-09-28 三菱化学株式会社 水素化エポキシ樹脂及びエポキシ樹脂組成物
JP5172321B2 (ja) * 2006-12-26 2013-03-27 三井化学株式会社 液晶シール剤
JP5424021B2 (ja) * 2009-03-04 2014-02-26 Ｄｉｃ株式会社 繊維強化複合材料用樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、繊維強化複合材料、繊維強化樹脂成形品、及びその製造方法
CN101747594B (zh) * 2009-12-11 2014-03-05 上海新天和树脂有限公司 环氧丙烯酸预聚体树脂及其制法和在光固化涂料中的应用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063227A (ja) * 2004-08-27 2006-03-09 Sakamoto Yakuhin Kogyo Co Ltd 熱硬化性エポキシ樹脂組成物
JP2009185116A (ja) * 2008-02-04 2009-08-20 Air Water Inc カルボキシル基含有エポキシアクリレート樹脂、それを含有するアルカリ現像可能な光硬化性・熱硬化性樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
JP5736613B2 (ja) 2015-06-17
TWI534170B (zh) 2016-05-21
KR101812832B1 (ko) 2017-12-27
CN103140535A (zh) 2013-06-05
CN103140535B (zh) 2015-09-02
JP2012077202A (ja) 2012-04-19
CN105131251B (zh) 2017-08-04
TW201229081A (en) 2012-07-16
WO2012043222A1 (ja) 2012-04-05
CN105131251A (zh) 2015-12-09
TW201619231A (zh) 2016-06-01
KR20130118324A (ko) 2013-10-29

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