TWI587444B - 晶圓載具 - Google Patents

晶圓載具 Download PDF

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Publication number
TWI587444B
TWI587444B TW101129184A TW101129184A TWI587444B TW I587444 B TWI587444 B TW I587444B TW 101129184 A TW101129184 A TW 101129184A TW 101129184 A TW101129184 A TW 101129184A TW I587444 B TWI587444 B TW I587444B
Authority
TW
Taiwan
Prior art keywords
wafer
container
door
housing
fingers
Prior art date
Application number
TW101129184A
Other languages
English (en)
Chinese (zh)
Other versions
TW201324678A (zh
Inventor
麥克Ｓ 亞當斯
貝瑞 葛瑞格森
馬修Ａ 富勒
Original Assignee
恩特葛瑞斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 恩特葛瑞斯股份有限公司 filed Critical 恩特葛瑞斯股份有限公司
Publication of TW201324678A publication Critical patent/TW201324678A/zh
Application granted granted Critical
Publication of TWI587444B publication Critical patent/TWI587444B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101129184A 2011-08-12 2012-08-13 晶圓載具 TWI587444B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161523254P 2011-08-12 2011-08-12

Publications (2)

Publication Number Publication Date
TW201324678A TW201324678A (zh) 2013-06-16
TWI587444B true TWI587444B (zh) 2017-06-11

Family

ID=47715660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101129184A TWI587444B (zh) 2011-08-12 2012-08-13 晶圓載具

Country Status (7)

Country Link
US (2) US9312157B2 (https=)
EP (1) EP2742526A4 (https=)
JP (1) JP6096776B2 (https=)
KR (1) KR102011159B1 (https=)
CN (2) CN106941087B (https=)
TW (1) TWI587444B (https=)
WO (1) WO2013025629A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具

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US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US20130299384A1 (en) * 2010-10-19 2013-11-14 Entegris, Inc. Front opening wafer container with wafer cushion
WO2014196011A1 (ja) * 2013-06-03 2014-12-11 ミライアル株式会社 基板収納容器
US10304710B2 (en) * 2013-06-18 2019-05-28 Entegris, Inc. Front opening wafer container with weight ballast
JP6162803B2 (ja) * 2013-06-19 2017-07-12 ミライアル株式会社 基板収納容器
JP6067123B2 (ja) 2013-08-22 2017-01-25 ミライアル株式会社 基板収納容器
JP6498758B2 (ja) * 2015-05-22 2019-04-10 ミライアル株式会社 基板収納容器
KR20180016543A (ko) * 2015-06-15 2018-02-14 엔테그리스, 아이엔씨. 일체형 본체를 갖는 도어를 갖는 웨이퍼 캐리어
KR102363033B1 (ko) 2015-07-03 2022-02-15 미라이얼 가부시키가이샤 기판 수납 용기
JP2018526824A (ja) * 2015-08-25 2018-09-13 インテグリス・インコーポレーテッド モジュール式基板支持柱のインターロック
TWI715623B (zh) * 2015-08-31 2021-01-11 美商恩特葛瑞斯股份有限公司 具有壓縮閂鎖之前開基板容器
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US10388554B2 (en) 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
KR200492425Y1 (ko) * 2016-04-08 2020-10-13 엔테그리스, 아이엔씨. 퍼지 성능을 갖는 웨이퍼 운반기 미세 환경
JP2017188609A (ja) * 2016-04-08 2017-10-12 インテグリス・インコーポレーテッド パージ性能を備えたウエハシッパー微環境
CN106428923A (zh) * 2016-10-08 2017-02-22 无锡宏纳科技有限公司 晶圆储存箱
KR102605057B1 (ko) * 2017-04-06 2023-11-24 미라이얼 가부시키가이샤 기판 수납 용기
US10764270B2 (en) 2017-11-20 2020-09-01 Allstate Insurance Company Cryptographically transmitting and storing identity tokens and/or activity data among spatially distributed computing devices
TWI720881B (zh) * 2018-01-11 2021-03-01 家登精密工業股份有限公司 快拆式氣閥及應用其之基板容器
US10978326B2 (en) 2018-10-29 2021-04-13 Taiwan Semiconductor Manufacturing Co, , Ltd. Semiconductor wafer storage device
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
KR102662971B1 (ko) * 2019-04-26 2024-05-03 엔테그리스, 아이엔씨. 기판 컨테이너용 퍼지 연결부 및 모듈
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
US12486120B2 (en) 2020-03-23 2025-12-02 Applied Materials, Inc. Substrate processing system carrier
USD980176S1 (en) * 2020-06-02 2023-03-07 Applied Materials, Inc. Substrate processing system carrier
USD954769S1 (en) * 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf
TWI746045B (zh) * 2020-07-07 2021-11-11 家登精密工業股份有限公司 基板載具鎖扣結構
KR102849355B1 (ko) * 2021-03-10 2025-08-25 엔테그리스, 아이엔씨. 전방 및 후방 개구를 갖는 반도체 기판 운반 용기
TWI782689B (zh) * 2021-09-02 2022-11-01 家登精密工業股份有限公司 快拆式氣閥、具有快拆式氣閥的基板容器及快拆式氣閥的安裝和拆卸方法
US12312127B2 (en) * 2021-09-22 2025-05-27 Entegris, Inc. Process carrier
CN113562309B (zh) * 2021-09-27 2021-12-14 徐州和润电子材料有限公司 一种通讯电子产品制造用硅晶片无损存储装置
KR102733145B1 (ko) * 2022-04-05 2024-11-25 주식회사 삼에스코리아 웨이퍼 수납용기 및 그에 사용되는 캡 조립체
TWI848670B (zh) * 2022-06-30 2024-07-11 家登精密工業股份有限公司 保護包裝組件
TWD232262S (zh) * 2023-01-18 2024-07-11 日商信越聚合物股份有限公司 (日本) 儲存及運送晶圓之容器
US20250029857A1 (en) * 2023-07-21 2025-01-23 Entegris, Inc. Module retainer
CN116805608A (zh) * 2023-08-29 2023-09-26 芯岛新材料(浙江)有限公司 一种晶圆盒
CN121175787A (zh) * 2023-10-03 2025-12-19 未来儿股份有限公司 基板收纳容器
WO2025163816A1 (ja) * 2024-01-31 2025-08-07 ミライアル株式会社 基板収納容器

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US20110005967A1 (en) * 2008-01-13 2011-01-13 Entegris, Inc. Methods and apparatuses for large diameter wafer handling
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具

Also Published As

Publication number Publication date
US20150041353A1 (en) 2015-02-12
KR20140054205A (ko) 2014-05-08
EP2742526A4 (en) 2015-01-14
US9312157B2 (en) 2016-04-12
CN106941087B (zh) 2020-03-10
US10147624B2 (en) 2018-12-04
TW201324678A (zh) 2013-06-16
JP2014527721A (ja) 2014-10-16
EP2742526A2 (en) 2014-06-18
WO2013025629A3 (en) 2013-04-18
CN106941087A (zh) 2017-07-11
KR102011159B1 (ko) 2019-08-14
JP6096776B2 (ja) 2017-03-15
CN103828033B (zh) 2016-11-16
US20160254172A1 (en) 2016-09-01
WO2013025629A2 (en) 2013-02-21
CN103828033A (zh) 2014-05-28

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