CN106941087B - 晶片载具 - Google Patents

晶片载具 Download PDF

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Publication number
CN106941087B
CN106941087B CN201610905546.0A CN201610905546A CN106941087B CN 106941087 B CN106941087 B CN 106941087B CN 201610905546 A CN201610905546 A CN 201610905546A CN 106941087 B CN106941087 B CN 106941087B
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China
Prior art keywords
wafer
housing
wafers
door
base plate
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CN201610905546.0A
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English (en)
Chinese (zh)
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CN106941087A (zh
Inventor
迈克尔·S·亚当斯
巴里·格里格尔森
马修·A·富勒
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Entegris Inc
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Entegris Inc
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Publication of CN106941087A publication Critical patent/CN106941087A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201610905546.0A 2011-08-12 2012-08-13 晶片载具 Active CN106941087B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161523254P 2011-08-12 2011-08-12
US61/523,254 2011-08-12
CN201280045248.9A CN103828033B (zh) 2011-08-12 2012-08-13 晶片载具

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201280045248.9A Division CN103828033B (zh) 2011-08-12 2012-08-13 晶片载具

Publications (2)

Publication Number Publication Date
CN106941087A CN106941087A (zh) 2017-07-11
CN106941087B true CN106941087B (zh) 2020-03-10

Family

ID=47715660

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610905546.0A Active CN106941087B (zh) 2011-08-12 2012-08-13 晶片载具
CN201280045248.9A Active CN103828033B (zh) 2011-08-12 2012-08-13 晶片载具

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201280045248.9A Active CN103828033B (zh) 2011-08-12 2012-08-13 晶片载具

Country Status (7)

Country Link
US (2) US9312157B2 (https=)
EP (1) EP2742526A4 (https=)
JP (1) JP6096776B2 (https=)
KR (1) KR102011159B1 (https=)
CN (2) CN106941087B (https=)
TW (1) TWI587444B (https=)
WO (1) WO2013025629A2 (https=)

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US9859141B2 (en) 2010-04-15 2018-01-02 Suss Microtec Lithography Gmbh Apparatus and method for aligning and centering wafers
US20130299384A1 (en) * 2010-10-19 2013-11-14 Entegris, Inc. Front opening wafer container with wafer cushion
WO2014196011A1 (ja) * 2013-06-03 2014-12-11 ミライアル株式会社 基板収納容器
US10304710B2 (en) * 2013-06-18 2019-05-28 Entegris, Inc. Front opening wafer container with weight ballast
JP6162803B2 (ja) * 2013-06-19 2017-07-12 ミライアル株式会社 基板収納容器
JP6067123B2 (ja) 2013-08-22 2017-01-25 ミライアル株式会社 基板収納容器
JP6498758B2 (ja) * 2015-05-22 2019-04-10 ミライアル株式会社 基板収納容器
KR20180016543A (ko) * 2015-06-15 2018-02-14 엔테그리스, 아이엔씨. 일체형 본체를 갖는 도어를 갖는 웨이퍼 캐리어
KR102363033B1 (ko) 2015-07-03 2022-02-15 미라이얼 가부시키가이샤 기판 수납 용기
JP2018526824A (ja) * 2015-08-25 2018-09-13 インテグリス・インコーポレーテッド モジュール式基板支持柱のインターロック
TWI715623B (zh) * 2015-08-31 2021-01-11 美商恩特葛瑞斯股份有限公司 具有壓縮閂鎖之前開基板容器
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US10388554B2 (en) 2016-04-06 2019-08-20 Entegris, Inc. Wafer shipper with purge capability
KR200492425Y1 (ko) * 2016-04-08 2020-10-13 엔테그리스, 아이엔씨. 퍼지 성능을 갖는 웨이퍼 운반기 미세 환경
JP2017188609A (ja) * 2016-04-08 2017-10-12 インテグリス・インコーポレーテッド パージ性能を備えたウエハシッパー微環境
CN106428923A (zh) * 2016-10-08 2017-02-22 无锡宏纳科技有限公司 晶圆储存箱
KR102605057B1 (ko) * 2017-04-06 2023-11-24 미라이얼 가부시키가이샤 기판 수납 용기
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TWI720881B (zh) * 2018-01-11 2021-03-01 家登精密工業股份有限公司 快拆式氣閥及應用其之基板容器
US10978326B2 (en) 2018-10-29 2021-04-13 Taiwan Semiconductor Manufacturing Co, , Ltd. Semiconductor wafer storage device
NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
KR102662971B1 (ko) * 2019-04-26 2024-05-03 엔테그리스, 아이엔씨. 기판 컨테이너용 퍼지 연결부 및 모듈
US10964584B2 (en) 2019-05-20 2021-03-30 Applied Materials, Inc. Process kit ring adaptor
US11104496B2 (en) * 2019-08-16 2021-08-31 Gudeng Precision Industrial Co., Ltd. Non-sealed reticle storage device
US12027397B2 (en) 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
US12486120B2 (en) 2020-03-23 2025-12-02 Applied Materials, Inc. Substrate processing system carrier
USD980176S1 (en) * 2020-06-02 2023-03-07 Applied Materials, Inc. Substrate processing system carrier
USD954769S1 (en) * 2020-06-02 2022-06-14 Applied Materials, Inc. Enclosure system shelf
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
TWI746045B (zh) * 2020-07-07 2021-11-11 家登精密工業股份有限公司 基板載具鎖扣結構
KR102849355B1 (ko) * 2021-03-10 2025-08-25 엔테그리스, 아이엔씨. 전방 및 후방 개구를 갖는 반도체 기판 운반 용기
TWI782689B (zh) * 2021-09-02 2022-11-01 家登精密工業股份有限公司 快拆式氣閥、具有快拆式氣閥的基板容器及快拆式氣閥的安裝和拆卸方法
US12312127B2 (en) * 2021-09-22 2025-05-27 Entegris, Inc. Process carrier
CN113562309B (zh) * 2021-09-27 2021-12-14 徐州和润电子材料有限公司 一种通讯电子产品制造用硅晶片无损存储装置
KR102733145B1 (ko) * 2022-04-05 2024-11-25 주식회사 삼에스코리아 웨이퍼 수납용기 및 그에 사용되는 캡 조립체
TWI848670B (zh) * 2022-06-30 2024-07-11 家登精密工業股份有限公司 保護包裝組件
TWD232262S (zh) * 2023-01-18 2024-07-11 日商信越聚合物股份有限公司 (日本) 儲存及運送晶圓之容器
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CN116805608A (zh) * 2023-08-29 2023-09-26 芯岛新材料(浙江)有限公司 一种晶圆盒
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WO2025163816A1 (ja) * 2024-01-31 2025-08-07 ミライアル株式会社 基板収納容器

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CN101981684A (zh) * 2008-01-13 2011-02-23 诚实公司 用于大直径晶片运输的方法和设备

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CN1760092A (zh) * 2004-10-14 2006-04-19 未来儿株式会社 薄板支持容器用盖体
CN101400583A (zh) * 2006-01-25 2009-04-01 安格斯公司 具有花纹状接触面的传动联轴件
CN101981684A (zh) * 2008-01-13 2011-02-23 诚实公司 用于大直径晶片运输的方法和设备

Also Published As

Publication number Publication date
TWI587444B (zh) 2017-06-11
US20150041353A1 (en) 2015-02-12
KR20140054205A (ko) 2014-05-08
EP2742526A4 (en) 2015-01-14
US9312157B2 (en) 2016-04-12
US10147624B2 (en) 2018-12-04
TW201324678A (zh) 2013-06-16
JP2014527721A (ja) 2014-10-16
EP2742526A2 (en) 2014-06-18
WO2013025629A3 (en) 2013-04-18
CN106941087A (zh) 2017-07-11
KR102011159B1 (ko) 2019-08-14
JP6096776B2 (ja) 2017-03-15
CN103828033B (zh) 2016-11-16
US20160254172A1 (en) 2016-09-01
WO2013025629A2 (en) 2013-02-21
CN103828033A (zh) 2014-05-28

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