TWI582441B - Electronic parts conveyor and electronic parts inspection device - Google Patents

Electronic parts conveyor and electronic parts inspection device Download PDF

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Publication number
TWI582441B
TWI582441B TW104122623A TW104122623A TWI582441B TW I582441 B TWI582441 B TW I582441B TW 104122623 A TW104122623 A TW 104122623A TW 104122623 A TW104122623 A TW 104122623A TW I582441 B TWI582441 B TW I582441B
Authority
TW
Taiwan
Prior art keywords
chamber
humidity
electronic component
room
door
Prior art date
Application number
TW104122623A
Other languages
English (en)
Chinese (zh)
Other versions
TW201604562A (zh
Inventor
Daisuke Kirihara
Masami Maeda
Toshioki Shimojima
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW201604562A publication Critical patent/TW201604562A/zh
Application granted granted Critical
Publication of TWI582441B publication Critical patent/TWI582441B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW104122623A 2014-07-16 2015-07-13 Electronic parts conveyor and electronic parts inspection device TWI582441B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014145714A JP2016023939A (ja) 2014-07-16 2014-07-16 電子部品搬送装置および電子部品検査装置

Publications (2)

Publication Number Publication Date
TW201604562A TW201604562A (zh) 2016-02-01
TWI582441B true TWI582441B (zh) 2017-05-11

Family

ID=55242873

Family Applications (2)

Application Number Title Priority Date Filing Date
TW106107292A TWI639843B (zh) 2014-07-16 2015-07-13 電子零件搬送裝置及電子零件檢查裝置
TW104122623A TWI582441B (zh) 2014-07-16 2015-07-13 Electronic parts conveyor and electronic parts inspection device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW106107292A TWI639843B (zh) 2014-07-16 2015-07-13 電子零件搬送裝置及電子零件檢查裝置

Country Status (4)

Country Link
JP (1) JP2016023939A (ja)
KR (1) KR101652384B1 (ja)
CN (1) CN105314400B (ja)
TW (2) TWI639843B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543958B2 (ja) * 2015-02-26 2019-07-17 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN108291934B (zh) * 2015-09-29 2021-04-06 株式会社村田制作所 电子部件的检查装置以及检查方法
WO2017138247A1 (ja) 2016-02-10 2017-08-17 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2017173075A (ja) * 2016-03-23 2017-09-28 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6827385B2 (ja) 2017-08-03 2021-02-10 東京エレクトロン株式会社 検査システム
US10514416B2 (en) * 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
TWI796713B (zh) * 2020-07-23 2023-03-21 旺矽科技股份有限公司 可緩衝受測物溫度之電子元件檢測設備

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611436A (en) * 1995-07-13 1997-03-18 Ashby; Harrel D. PC card conveyance and testing apparatus
TW509988B (en) * 2000-07-12 2002-11-11 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
CN101276771B (zh) * 2007-03-29 2010-06-09 东京毅力科创株式会社 被检查体的搬送装置和检查装置
TW201331603A (zh) * 2012-01-13 2013-08-01 Advantest Corp 處理裝置、試驗方法
US20130244027A1 (en) * 2010-09-30 2013-09-19 Sumitomo Bakelite Co., Ltd. Cover tape for electronic component packaging

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08105938A (ja) 1994-10-06 1996-04-23 Advantest Corp Ｉｃテストハンドラ
JPH11334851A (ja) * 1998-05-22 1999-12-07 Sony Corp 電子機器の調整検査システム
TW432221B (en) * 1998-05-29 2001-05-01 Advantest Corp Tray for electronic device, the transporting apparatus of tray for electronic device and testing apparatus for electronic device
US6402401B1 (en) * 1999-10-19 2002-06-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP4148946B2 (ja) * 2002-07-30 2008-09-10 株式会社アドバンテスト 電子部品試験装置
US7750654B2 (en) 2002-09-02 2010-07-06 Octec Inc. Probe method, prober, and electrode reducing/plasma-etching processing mechanism
EP1544909A4 (en) * 2002-09-02 2009-05-06 Octec Inc PROCEDURE, SONDERING, AND ELECTRODE REDUCTION / PLASMA PROCESS MECHANISM
KR20050031598A (ko) * 2003-09-30 2005-04-06 삼성전자주식회사 반도체 소자용 테스트 핸들러
JP4537400B2 (ja) * 2004-07-23 2010-09-01 株式会社アドバンテスト 電子部品ハンドリング装置の編成方法
JP4941645B2 (ja) * 2006-10-19 2012-05-30 株式会社島津製作所 基板検査装置
JP5938932B2 (ja) * 2012-02-14 2016-06-22 セイコーエプソン株式会社 ハンドラー、及び部品検査装置
JP5874427B2 (ja) * 2012-02-14 2016-03-02 セイコーエプソン株式会社 部品検査装置、及び、ハンドラー

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5611436A (en) * 1995-07-13 1997-03-18 Ashby; Harrel D. PC card conveyance and testing apparatus
TW509988B (en) * 2000-07-12 2002-11-11 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
CN101276771B (zh) * 2007-03-29 2010-06-09 东京毅力科创株式会社 被检查体的搬送装置和检查装置
US20130244027A1 (en) * 2010-09-30 2013-09-19 Sumitomo Bakelite Co., Ltd. Cover tape for electronic component packaging
TW201331603A (zh) * 2012-01-13 2013-08-01 Advantest Corp 處理裝置、試驗方法

Also Published As

Publication number Publication date
CN105314400B (zh) 2018-10-23
TW201734483A (zh) 2017-10-01
TWI639843B (zh) 2018-11-01
TW201604562A (zh) 2016-02-01
CN105314400A (zh) 2016-02-10
JP2016023939A (ja) 2016-02-08
KR101652384B1 (ko) 2016-08-30
KR20160009482A (ko) 2016-01-26

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MM4A Annulment or lapse of patent due to non-payment of fees