KR101652384B1 - 전자 부품 반송 장치 및 전자 부품 검사 장치 - Google Patents

전자 부품 반송 장치 및 전자 부품 검사 장치 Download PDF

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Publication number
KR101652384B1
KR101652384B1 KR1020150013234A KR20150013234A KR101652384B1 KR 101652384 B1 KR101652384 B1 KR 101652384B1 KR 1020150013234 A KR1020150013234 A KR 1020150013234A KR 20150013234 A KR20150013234 A KR 20150013234A KR 101652384 B1 KR101652384 B1 KR 101652384B1
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KR
South Korea
Prior art keywords
chamber
humidity
electronic component
door
tray
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KR1020150013234A
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English (en)
Korean (ko)
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KR20160009482A (ko
Inventor
다이스케 기리하라
마사미 마에다
토시오키 시모지마
Original Assignee
세이코 엡슨 가부시키가이샤
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Publication of KR20160009482A publication Critical patent/KR20160009482A/ko
Application granted granted Critical
Publication of KR101652384B1 publication Critical patent/KR101652384B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020150013234A 2014-07-16 2015-01-28 전자 부품 반송 장치 및 전자 부품 검사 장치 KR101652384B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-145714 2014-07-16
JP2014145714A JP2016023939A (ja) 2014-07-16 2014-07-16 電子部品搬送装置および電子部品検査装置

Publications (2)

Publication Number Publication Date
KR20160009482A KR20160009482A (ko) 2016-01-26
KR101652384B1 true KR101652384B1 (ko) 2016-08-30

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Family Applications (1)

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KR1020150013234A KR101652384B1 (ko) 2014-07-16 2015-01-28 전자 부품 반송 장치 및 전자 부품 검사 장치

Country Status (4)

Country Link
JP (1) JP2016023939A (ja)
KR (1) KR101652384B1 (ja)
CN (1) CN105314400B (ja)
TW (2) TWI639843B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6543958B2 (ja) * 2015-02-26 2019-07-17 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
CN108291934B (zh) * 2015-09-29 2021-04-06 株式会社村田制作所 电子部件的检查装置以及检查方法
WO2017138247A1 (ja) 2016-02-10 2017-08-17 住友電気工業株式会社 炭化珪素エピタキシャル基板および炭化珪素半導体装置の製造方法
JP2017173075A (ja) * 2016-03-23 2017-09-28 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP6827385B2 (ja) 2017-08-03 2021-02-10 東京エレクトロン株式会社 検査システム
US10514416B2 (en) * 2017-09-29 2019-12-24 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus
TWI796713B (zh) * 2020-07-23 2023-03-21 旺矽科技股份有限公司 可緩衝受測物溫度之電子元件檢測設備

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050151549A1 (en) 2002-09-02 2005-07-14 Katsuya Okumura Probe method, prober, and electrode reducing/plasma-etching processing mechanism
KR100634122B1 (ko) * 1999-10-19 2006-10-16 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
JP2013167486A (ja) 2012-02-14 2013-08-29 Seiko Epson Corp 部品検査装置、及び、ハンドラー

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JPH08105938A (ja) 1994-10-06 1996-04-23 Advantest Corp Ｉｃテストハンドラ
US5611436A (en) * 1995-07-13 1997-03-18 Ashby; Harrel D. PC card conveyance and testing apparatus
JPH11334851A (ja) * 1998-05-22 1999-12-07 Sony Corp 電子機器の調整検査システム
TW432221B (en) * 1998-05-29 2001-05-01 Advantest Corp Tray for electronic device, the transporting apparatus of tray for electronic device and testing apparatus for electronic device
SG94851A1 (en) * 2000-07-12 2003-03-18 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP4148946B2 (ja) * 2002-07-30 2008-09-10 株式会社アドバンテスト 電子部品試験装置
EP1544909A4 (en) * 2002-09-02 2009-05-06 Octec Inc PROCEDURE, SONDERING, AND ELECTRODE REDUCTION / PLASMA PROCESS MECHANISM
KR20050031598A (ko) * 2003-09-30 2005-04-06 삼성전자주식회사 반도체 소자용 테스트 핸들러
JP4537400B2 (ja) * 2004-07-23 2010-09-01 株式会社アドバンテスト 電子部品ハンドリング装置の編成方法
JP4941645B2 (ja) * 2006-10-19 2012-05-30 株式会社島津製作所 基板検査装置
JP4767896B2 (ja) * 2007-03-29 2011-09-07 東京エレクトロン株式会社 被検査体の搬送装置及び検査装置
JP2012214252A (ja) * 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd 電子部品包装用カバーテープ
JP2013145132A (ja) * 2012-01-13 2013-07-25 Advantest Corp ハンドラ装置、試験方法
JP5938932B2 (ja) * 2012-02-14 2016-06-22 セイコーエプソン株式会社 ハンドラー、及び部品検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100634122B1 (ko) * 1999-10-19 2006-10-16 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US20050151549A1 (en) 2002-09-02 2005-07-14 Katsuya Okumura Probe method, prober, and electrode reducing/plasma-etching processing mechanism
JP2013167486A (ja) 2012-02-14 2013-08-29 Seiko Epson Corp 部品検査装置、及び、ハンドラー

Also Published As

Publication number Publication date
CN105314400B (zh) 2018-10-23
TW201734483A (zh) 2017-10-01
TWI639843B (zh) 2018-11-01
TW201604562A (zh) 2016-02-01
TWI582441B (zh) 2017-05-11
CN105314400A (zh) 2016-02-10
JP2016023939A (ja) 2016-02-08
KR20160009482A (ko) 2016-01-26

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