TWI580547B - 模具清理用樹脂組成物 - Google Patents

模具清理用樹脂組成物 Download PDF

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Publication number
TWI580547B
TWI580547B TW101125113A TW101125113A TWI580547B TW I580547 B TWI580547 B TW I580547B TW 101125113 A TW101125113 A TW 101125113A TW 101125113 A TW101125113 A TW 101125113A TW I580547 B TWI580547 B TW I580547B
Authority
TW
Taiwan
Prior art keywords
mass
resin composition
parts
mold cleaning
mold
Prior art date
Application number
TW101125113A
Other languages
English (en)
Chinese (zh)
Other versions
TW201311423A (zh
Inventor
野村弘明
吉村勝則
佐藤太地
Original Assignee
日本電石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電石工業股份有限公司 filed Critical 日本電石工業股份有限公司
Publication of TW201311423A publication Critical patent/TW201311423A/zh
Application granted granted Critical
Publication of TWI580547B publication Critical patent/TWI580547B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Detergent Compositions (AREA)
TW101125113A 2011-07-15 2012-07-12 模具清理用樹脂組成物 TWI580547B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011156953 2011-07-15

Publications (2)

Publication Number Publication Date
TW201311423A TW201311423A (zh) 2013-03-16
TWI580547B true TWI580547B (zh) 2017-05-01

Family

ID=47558054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101125113A TWI580547B (zh) 2011-07-15 2012-07-12 模具清理用樹脂組成物

Country Status (5)

Country Link
JP (1) JP5972266B2 (ko)
KR (1) KR101934065B1 (ko)
CN (1) CN103702813B (ko)
TW (1) TWI580547B (ko)
WO (1) WO2013011876A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5991997B2 (ja) * 2012-01-23 2016-09-14 日本カーバイド工業株式会社 金型清掃用樹脂組成物
JP6715627B2 (ja) * 2016-03-18 2020-07-01 日本カーバイド工業株式会社 金型清掃用樹脂組成物
KR102274604B1 (ko) * 2019-11-27 2021-07-07 아쿠아켐(주) 반도체 금형 세정용 멜라민 수지 조성물
KR102304403B1 (ko) 2019-12-18 2021-09-17 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
KR102325676B1 (ko) 2019-12-18 2021-11-11 황진상 반도체 패키지 몰드용 이형필름 및 그 제조방법
JP7265495B2 (ja) * 2020-01-17 2023-04-26 日本カーバイド工業株式会社 金型清掃用樹脂組成物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131460A (ja) * 1991-11-15 1993-05-28 Matsushita Electric Works Ltd 金型清掃用樹脂組成物
JP2002160225A (ja) * 2000-11-28 2002-06-04 Sumitomo Bakelite Co Ltd 半導体封止用金型クリーニング材
TW537956B (en) * 2000-10-11 2003-06-21 Nippon Carbide Kogyo Kk Mold cleaning resin composition
TWI271295B (en) * 2001-04-25 2007-01-21 Nippon Carbide Kogyo Kk Mold cleaning resin composition
TW201107462A (en) * 2009-07-17 2011-03-01 Nitto Denko Corp Mold cleaning composition and mold cleaning material, and method for cleaning mold using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006335913A (ja) * 2005-06-03 2006-12-14 Daicel Polymer Ltd 洗浄用樹脂組成物
JP6116789B2 (ja) 2009-07-17 2017-04-19 日立化成株式会社 半導体装置成形用金型洗浄シートおよびそれを用いた半導体装置成形用金型のクリーニング方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05131460A (ja) * 1991-11-15 1993-05-28 Matsushita Electric Works Ltd 金型清掃用樹脂組成物
TW537956B (en) * 2000-10-11 2003-06-21 Nippon Carbide Kogyo Kk Mold cleaning resin composition
JP2002160225A (ja) * 2000-11-28 2002-06-04 Sumitomo Bakelite Co Ltd 半導体封止用金型クリーニング材
TWI271295B (en) * 2001-04-25 2007-01-21 Nippon Carbide Kogyo Kk Mold cleaning resin composition
TW201107462A (en) * 2009-07-17 2011-03-01 Nitto Denko Corp Mold cleaning composition and mold cleaning material, and method for cleaning mold using the same

Also Published As

Publication number Publication date
JPWO2013011876A1 (ja) 2015-02-23
KR101934065B1 (ko) 2019-01-02
WO2013011876A1 (ja) 2013-01-24
CN103702813A (zh) 2014-04-02
JP5972266B2 (ja) 2016-08-17
CN103702813B (zh) 2016-03-30
KR20140039047A (ko) 2014-03-31
TW201311423A (zh) 2013-03-16

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