TWI580547B - Resin composition for mold cleaning - Google Patents

Description

Resin composition for mold cleaning

The present invention relates to a resin composition for mold cleaning.

When a sealing molding material containing a thermosetting resin composition represented by an epoxy resin, an oxime ketone resin, a phenol resin, a polyimide resin, or the like is used, the sealing molding operation of an integrated circuit or an LED element is continued for a long period of time. The dirt derived from the seal molding material adheres to the inner surface of the forming mold. When the dirt adhering to the inner surface of the molding die is neglected, the surface of the sealed molded article such as the integrated circuit or the LED element is contaminated with dirt. In order to prevent the defects as described above, it is necessary to remove the dirt adhering to the inner surface of the forming mold in the sealing forming step. Specifically, the resin molding composition for mold cleaning is formed in place of the sealing molding material at a ratio of several shots per number of shot molding operations, and the dirt on the inner surface of the molding die is removed.

As for the discussion of the resin composition for mold cleaning, various discussions have been made from the past. As a specific example of the resin composition for mold cleaning, a resin composition for mold cleaning comprising an amine-based resin such as a melamine resin and a mineral powder having a maximum particle diameter and an average particle diameter is disclosed (for example, refer to Japanese special Open 2003-62835). According to the resin composition for mold cleaning disclosed in Patent Document 1, the content of the mineral-based powder having a maximum particle diameter of 180 μm or less and a particle diameter of 100 μm or more is set to be 1 relative to the total amount of the mineral-based powder. The content of the mineral-based powder is set to be 5 to 30% by mass based on the total amount of the resin composition for mold cleaning, and is good in fluidity, and is made to extend throughout the gap of the mold. In every corner, capture dirt.

In recent years, with the high performance of electronic devices and the like, the shape and structure of the sealed molding of an integrated circuit or an LED element are being diversified and refined. Therefore, the shape and structure of the molding die are required to be diversified and refined. In the cleaning of the forming die as described above, it is necessary to remove the corners or narrow void portions where the dirt is likely to remain, and the dirt to the respective corners of the cavity of the forming die.

In the case of the resin composition for mold cleaning disclosed in the above-mentioned Japanese Patent Laid-Open Publication No. 2003-62835, the conventional resin composition for mold cleaning is in the shape of a molding die which is diversified and refined as described above. And the corresponding aspects of the structure, the effect is not enough, there is room for improvement.

Further, the dirt derived from the sealing molding material adhering to the inner surface of the molding die can be easily removed by using the resin composition for mold cleaning if the inner surface of the molding die is in a nearly smooth state. Usually the inner surface of the forming mold is plated.

However, in the conventional resin composition for mold cleaning, since the filler contained in the resin composition for mold cleaning causes the internal surface of the mold to be worn and injured, there is a loss of the plating surface or a rough surface state. . Neglecting the damage to the inner surface of the forming mold causes the dirt to remain on the inner surface of the forming mold, and also deteriorates the workability of the mold cleaning. Furthermore, when the gate portion of the cavity of the forming mold is worn, it is necessary to repair or replace the forming mold.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin composition for mold cleaning which can be sufficiently cleaned to various corners of a cavity of a molding die, and which is hard to be worn on the inner surface of the molding die and the gate portion. Or damage.

A first aspect of the present invention is a resin composition for cleaning a mold, comprising at least a melamine-based resin and an inorganic filler, wherein the inorganic filler has an average particle diameter of 4 to 12 μm, a standard deviation of particle diameters of 10 μm or less, an average aspect ratio of the particle diameter of 1 to 1.3, and an aspect ratio of the particle diameter. The standard deviation is 0.5 or less.

The resin composition for mold cleaning further preferably comprises a metal salt of a saturated fatty acid having a carbon number of 14 to 18 and a saturated fatty acid selected from the group consisting of calcium, zinc, and magnesium.

The resin composition for mold cleaning, wherein the inorganic filler is at least one selected from the group consisting of niobium carbide, niobium oxide, titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, and calcium oxide. Preferably, at least one selected from the group consisting of cerium oxide and aluminum oxide is more preferable.

The resin composition for mold cleaning described above is preferably used for transfer molding.

According to the resin composition for mold cleaning of the present invention, it is possible to sufficiently clean the respective corners of the cavity of the molding die, and it is hard to cause abrasion or damage on the inner surface of the molding die and the gate portion.

In the following, the specific embodiments of the present invention are described in detail, but the present invention is not limited to the following embodiments, and can be appropriately modified and implemented within the scope of the object of the present invention.

In recent years, with the high performance of electronic devices and the like, the shape and structure of the sealed molding of an integrated circuit or an LED element are being diversified and refined. In the cleaning of the forming mold, it is necessary to remove the corners or narrow void portions where the dirt easily remains, and the dirt to the respective corners of the cavity of the forming mold. However, in the past mold cleaning In the resin composition, the shape and structure of the mold cannot be sufficiently diversified and refined, and in particular, it is difficult to remove the dirt adhering to the corner portion or the narrow portion to a satisfactory extent. In addition, the filler contained in the conventional resin composition for mold cleaning is a cause of wear or injury of the inner surface of the mold. When the damage to the inner surface of the forming mold is neglected, the dirt remains on the inner surface of the forming mold, and the workability of cleaning the mold is lowered. Further, when the gate portion of the cavity of the molding die wears, it is necessary to repair or replace the molding die.

In the present invention, at least a melamine resin and an inorganic filler are selected as constituent components, and an average particle diameter of the inorganic filler, a standard deviation of the particle diameter, an average aspect ratio of the particle diameter, and a long particle diameter are controlled. The standard deviation of the width ratio can be sufficiently cleaned to all corners of the cavity of the forming mold, and it is difficult to cause wear or damage on the inner surface of the forming mold and the gate portion, and the resin composition for mold cleaning can be provided. Aspects have their meaning.

[Resin composition for mold cleaning]

The resin composition for mold cleaning according to the present invention comprises at least a melamine resin and an inorganic filler. The inorganic filler has an average particle diameter of 4 to 12 μm, a standard deviation of particle diameters of 10 μm or less, and an average length and width of the particle diameter. The ratio is 1 to 1.3, and the standard deviation of the aspect ratio of the particle diameter is 0.5 or less. The resin composition for mold cleaning of the present invention may be further composed of a saturated fatty acid or a metal salt thereof, an organic filler, other additives, or the like, as needed.

The resin composition for mold cleaning of the present invention is suitable for removing dirt on the inner surface of a molding die, and particularly for removing impurities derived from an epoxy resin, an anthrone resin, a phenol resin, a polyimide resin, and the like. The heat of the thermosetting resin composition seals the formed material.

(melamine resin)

The resin composition for mold cleaning of the present invention contains a melamine resin. In the present invention, "melamine resin" means melamine resin and melamine-phenol. a condensate, and a melamine-urea cocondensate. More specifically, in the present invention, "melamine resin" means a reaction product of methylol melamine as a reaction product of melamine and formaldehyde, and melamine, phenol, or urea and methylol melamine. In the present invention, one or more of these are used.

Since the resin composition for mold cleaning of the present invention contains a melamine-based resin, it exhibits excellent cleanability against dirt on the inner surface of the molding die. The melamine-based resin has a highly polar hydroxymethyl group. In the present invention, the hydroxymethyl group having a high polarity of the melamine-based resin acts on the scale derived from the sealing molding material containing the thermosetting resin composition, thereby achieving an excellent cleaning effect. Further, since the melamine-based resin is stable to heat, the resin composition for mold cleaning of the present invention exhibits stable cleanability even in the vicinity of 160 to 190 ° C which is a general temperature at the time of cleaning of the molding die.

The melamine resin is a condensate of a triazabenzene and an aldehyde. Examples of the triazabenzenes include melamine, benzoguanamine, and acetamide. Examples of the aldehydes include formaldehyde, trioxane, acetaldehyde, and the like.

In the present invention, the melamine resin is preferably derived from a molar ratio of a repeating unit of a triazabenzene group to a repeating unit derived from an aldehyde of from 1:1.2 to 1:4.

The melamine-phenol cocondensate is a cocondensate of triazabenzenes with phenols and aldehydes. Examples of the phenols include phenol, cresol, xylenol, ethylphenol, and butanol.

In the present invention, the melamine-phenol cocondensate is derived from a molar ratio of a repeating unit derived from a triazabenzene to a repeating unit derived from a phenol and a repeating unit derived from an aldehyde: 0.3:1~1:1:3 is preferred.

The melamine-urea cocondensate is a cocondensate of triazabenzenes with ureas and aldehydes. Examples of the ureas include urea, thiourea, and ethylene urea.

The melamine-based resin in the present invention can be produced by a known method. For example, the melamine resin is stirred by crystallization of melamine and formaldehyde at a molar ratio of 1:1.2 to 1:4, a reaction temperature of 80 to 90 ° C, and a pH of 7 to 7.5, and at 60 ° C. An aqueous solution of 3 mass% of the reactant was reacted until the time before the turbidity, and NaOH was added thereto, followed by cooling. Further, in the present invention, a melamine-based resin produced by a known method as described above or a commercially available melamine-based resin may be used.

The content of the melamine-based resin of the present invention is preferably 60 to 80 parts by mass, more preferably 65 to 75 parts by mass, per 100 parts by mass of the total solid content of the resin composition for mold cleaning. When the content of the melamine-based resin is within the above range, the strength of the resin composition for mold cleaning is maintained at the time of molding, and the hardening during the cleaning is appropriately performed, so that the resin composition for mold cleaning exhibits excellent performance. Cleaning performance.

(inorganic filler)

The resin composition for mold cleaning of the present invention contains an inorganic filler. The inorganic filler in the present invention may, for example, be cerium carbide, cerium oxide, titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, calcium oxide or calcium carbonate. In the present invention, these inorganic fillers may be used alone or in combination.

The inorganic filler of the present invention is preferably at least one selected from the group consisting of cerium carbide, cerium oxide, titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, and calcium oxide. These inorganic fillers are preferred in view of the fact that the mixing with the melamine resin is good at the time of production of the resin composition for mold cleaning.

In the present invention, the inorganic filler is preferably at least one selected from the group consisting of cerium oxide, titanium oxide, and aluminum oxide, and more preferably the inorganic filler is at least one selected from the group consisting of cerium oxide and aluminum oxide. A particularly good inorganic filler is cerium oxide.

Because it is also based on the material or state of the mold, it cannot be said in a nutshell, but yttrium oxide, titanium oxide, and aluminum oxide have appropriate hardness, and since the inner surface of the mold and the gate portion are prevented from being worn or damaged, Therefore, it is ideal. Also, the temperature at which the mold is cleaned is usually 160 to 190 ° C, but due to cerium oxide, titanium oxide, and Alumina is also thermally stable in the vicinity of the aforementioned temperature, which is preferable.

Further, the hardness (new Mohs hardness) of the inorganic filler listed above is 13 for lanthanum carbide, 8 for lanthanum oxide, 9 for titanium carbide, 8 for titanium oxide, 14 for boron carbide, and 3 for boron oxide. The alumina is 12, the magnesium oxide is 4, and the calcium oxide is 3.

The inorganic filler of the present invention has an average particle diameter of 4 to 12 μm, a standard deviation of particle diameters of 10 μm or less, an average aspect ratio of the particle diameter of 1 to 1.3, and a standard deviation of the aspect ratio of the particle diameter of 0.5 or less. .

The resin composition for mold cleaning according to the present invention contains an inorganic filler having a specific particle diameter, a standard deviation of the particle diameter, an average aspect ratio of the particle diameter, and a standard deviation of the aspect ratio of the particle diameter in a specific numerical range. Therefore, the corner portion of the cavity of the molding die can be sufficiently cleaned, and abrasion or damage is less likely to occur on the inner surface of the molding die and the gate portion.

The inorganic filler of the present invention has an average particle diameter in the range of 4 to 12 μm, preferably 6 to 10 μm. Since the inorganic filler having a significantly small average particle diameter has a small mass or surface area, it is difficult to exhibit cleaning performance in a cavity of a molding die.

In the present invention, since the inorganic filler has an average particle diameter of 4 μm or more, sufficient cleanliness is exhibited for the dirt on the inner surface of the molding die. Further, in the present invention, since the inorganic filler has an average particle diameter of 12 μm or less, it can be sufficiently cleaned to the corner portion of the cavity of the molding die, and the inner surface of the molding die and the gate portion are less likely to be worn or damaged. .

The standard deviation of the particle diameter of the inorganic filler of the present invention is 10 μm or less. When the standard deviation of the particle diameter of the inorganic filler is large, the fluidity of the resin composition for mold cleaning at the time of cleaning is deteriorated, and the cleaning effect of the corner portion of the cavity of the molding die which is likely to remain dirty is lowered.

In the present invention, since the standard deviation of the particle diameter of the inorganic filler is 10 μm or less, The fluidity of the resin composition for mold cleaning is maintained during cleaning, and as a result, it can be sufficiently cleaned to the corner portion of the cavity of the forming mold.

The average aspect ratio of the particle diameter of the inorganic filler of the present invention is in the range of 1 to 1.3, preferably in the range of 1 to 1.25, more preferably in the range of 1.10 to 1.23. When the average aspect ratio of the particle diameter of the inorganic filler is large, the fluidity of the resin composition for mold cleaning during cleaning is deteriorated, and the cleaning effect of the corner portion of the cavity of the molding die which is likely to remain dirty is lowered. Moreover, abrasion or damage is likely to occur on the inner surface of the forming mold and the gate portion.

In the present invention, since the average aspect ratio of the particle diameter of the inorganic filler is 1.3 or less, the fluidity of the resin composition for mold cleaning is maintained, and as a result, the corner portion of the cavity of the molding die can be sufficiently cleaned, and It is difficult to cause wear or damage on the inner surface of the forming mold and the gate portion.

The standard deviation of the aspect ratio of the particle diameter of the inorganic filler of the present invention is 0.5 or less, preferably 0.45 or less. When the standard deviation of the aspect ratio of the particle diameter of the inorganic filler is large, the fluidity of the resin composition for mold cleaning during cleaning is deteriorated, and the cleaning effect of the corner portion of the cavity of the molding die which is likely to remain dirt is likely to be It is lowered, and wear and damage are likely to occur on the inner surface of the forming mold and the gate portion.

In the present invention, the standard deviation of the aspect ratio of the particle size of the inorganic filler is 0.5 or less, and since the inorganic filler has a substantially uniform shape, the fluidity of the resin composition for mold cleaning is maintained during cleaning, and the result is sufficient. The corners of the cavity of the forming mold are cleaned, and abrasion or damage is less likely to occur on the inner surface of the forming mold and the gate portion.

The "particle diameter" of the present invention is a value measured by the following method. An inorganic filler was photographed at a magnification of 1500 times using an electron microscope (JSM-5510, manufactured by JEOL Ltd.). Shooting with about 30 inorganic fillers in one field of view, and 150 inorganic fillers for different 5 fields of view, each amount The long diameter (X) and the short diameter (Y) were measured five times each. Furthermore, the short diameter (Y) and the long diameter (X) are made orthogonal. The average value of the measured values of the major axis (X) and the minor axis (Y) was determined, and the particle diameter of one inorganic filler was calculated by the following formula 1.

Particle size = ((the average of the measured values of 5 times of X) + (the average of the measured values of 5 times of Y)) / 2... Formula 1

The "average particle diameter" of the present invention is an average value of the particle diameters of 150 inorganic fillers measured by the above-described method. Moreover, the "standard deviation of the particle diameter" of the present invention is the standard deviation of the particle diameters of 150 inorganic fillers measured by the above-described method.

The "aspect ratio of the particle diameter" of the present invention is a value measured by the following method. An inorganic filler was photographed at a magnification of 1500 times using an electron microscope (JSM-5510, manufactured by JEOL Ltd.). Approximately 30 inorganic fillers were included in one field of view and photographed, and for a total of 150 inorganic fillers included in different fields of view, the long diameter (X) and the short diameter (Y) were measured five times each. The short diameter (Y) and the long diameter (X) are orthogonal. The average value of the measured values of the long diameter (X) and the short diameter (Y) was determined, and the aspect ratio of the particle diameter of one inorganic filler was calculated by the following formula 2. Further, in the following formula 2, the long diameter (X) ≧ short diameter (Y).

The aspect ratio of the particle diameter = (the average of the measured values of 5 times of X) / (the average of the measured values of 5 times of Y)...

According to the measurement method specified above, when the major axis (X) and the minor axis (Y) are equal, the aspect ratio of the particle diameter is 1. Further, according to the above-described predetermined measurement method, the aspect ratio of the particle diameter does not take a value smaller than 1. The shape of the inorganic filler of the present invention is approximately spherical (confirmed by an electron microscope). Therefore, the closer the aspect ratio of the display particle diameter is to 1, the closer the shape of the inorganic filler is to the spherical shape. Further, the inorganic filler generally used for the resin composition for mold cleaning is a broken one, that is, an amorphous one. Broken inorganic In the filler, the aspect ratio of the particle diameter is, for example, 1.5 or more.

The "average aspect ratio" of the present invention is an average value of the aspect ratios of the particle diameters of 150 inorganic fillers measured by the above-described method. Moreover, the "standard deviation of the aspect ratio" of the present invention is the standard deviation of the aspect ratio of the particle diameter of 150 inorganic fillers measured by the above-described method.

The inorganic filler of the present invention is also in accordance with the shape of the mold, but in addition to the above-described conditions of the average particle diameter, the standard deviation of the particle diameter, the average aspect ratio of the particle diameter, and the standard deviation of the aspect ratio of the particle diameter, The maximum particle diameter is preferably 100 μm or less, more preferably 75 μm or less. When the maximum particle diameter of the inorganic filler is 100 μm or less, it is preferable because the cleaning effect of the corner portion of the cavity of the molding die can be further improved.

The conditions for satisfying the above-described average particle diameter, the standard deviation of the particle diameter, the average aspect ratio of the particle diameter, and the standard deviation of the aspect ratio of the particle diameter, as an example of a commercially available product of an appropriate inorganic filler, for example, HS203 (manufactured by Nippon Steel Materials Co., Ltd.), HS205 (manufactured by Nippon Steel Materials Co., Ltd.), TS10-141 (manufactured by Nippon Steel Materials Co., Ltd.), FB7SDC (electrochemical industry limited stock) Oxidation of molten cerium oxide, CB-P10 (manufactured by Showa Denko KK), such as SE-40 (manufactured by Tokuyama Corporation), SE-15 (manufactured by Tokuyama Corporation), and SE-8T (manufactured by Tokuyama Corporation) Aluminum and so on.

The content of the inorganic filler of the present invention is preferably 10 to 30 parts by mass, more preferably 15 to 25 parts by mass, per 100 parts by mass of the total solid content of the resin composition for mold cleaning. When the content of the inorganic filler is within the above range, since the strength of the resin composition for mold cleaning is appropriately maintained at the time of molding, the workability after peeling from the mold after cleaning is good, and the inner surface of the mold is cleaned. The performance is also good.

(organic filler)

The resin composition for mold cleaning of the present invention preferably contains an organic filler as an additive in order to appropriately maintain the strength of the resin composition for cleaning the mold. Examples of the organic filler include pulp, wood flour, synthetic fibers, and the like. Especially the pulp is especially good.

Examples of the pulp include wood pulp (conifer pulp, hardwood pulp), non-wood pulp (藁, bamboo, bagasse, cotton). Any of these pulps, chemical pulp and mechanical pulp can be used. The size of the pulp is not particularly limited, but is preferably 5 to 1000 μm, more preferably 10 to 200 μm. When the size of the pulp is within the above range, the fluidity of the resin composition for mold cleaning is improved, which is preferable. In addition, it is preferable that the resin composition for mold cleaning maintains an appropriate strength at the time of molding, and the workability at the time of peeling from the mold is improved, in accordance with the size of the pulp.

The content of the organic filler in the present invention is preferably 3 to 20 parts by mass based on 100 parts by mass of the total solid content of the resin composition for mold cleaning. When the content of the organic filler is within the above range, the resin composition for mold cleaning tends to be suitable for fluidity, which is preferable. In addition, when the content of the organic filler is within the above range, the resin composition for mold cleaning at the time of molding maintains an appropriate strength, and the workability at the time of peeling from the mold after cleaning is preferably improved.

(metal salt of saturated fatty acids)

In the resin composition for mold cleaning of the present invention, in order to improve the workability when the molded article after cleaning and the inner surface of the mold are excellent in separation, and to improve the workability of peeling the molded article from the mold, it is preferable to include as an additive. a metal salt of a saturated fatty acid having a carbon number of 12 to 20 and a metal selected from the group consisting of calcium, zinc, and magnesium, more preferably a saturated fatty acid having a carbon number of 14 to 18 and selected from the group consisting of calcium, zinc, and magnesium The metal constitutes a metal salt of a saturated fatty acid.

Examples of the saturated fatty acid having 12 to 20 carbon atoms include lauric acid having a carbon number of 12 (IUPAC name: dodecanoic acid), myristic acid having a carbon number of 14 (IUPAC name: tetradecanoic acid), and carbon number 16 Palmitic acid (IUPAC name: hexadecanoic acid), stearic acid having a carbon number of 18 (IUPAC name: octadecanoic acid), and arganic acid having a carbon number of 20 (IUPAC name: icosonic acid).

In the present invention, zinc myristate consisting of a saturated fatty acid having a carbon number of 14 and zinc, zinc stearate composed of a saturated fatty acid having a carbon number of 18 and zinc, and a saturated fatty acid having a carbon number of 18 and calcium are contained. At least one of calcium stearate is more preferred, and it is particularly preferred to contain zinc myristate. Zinc myristate, which has a melting point of about 123 to 130 ° C, has sufficient fluidity at a temperature of 160 to 190 ° C when the mold is cleaned, and is likely to have an effect on dirt, and therefore is preferable.

The content of the metal salt of the saturated fatty acid of the present invention is preferably 0.1 to 5 parts by mass, more preferably 0.3 to 3 parts by mass, per 100 parts by mass of the total solid content of the resin composition for mold cleaning. When the content of the above-mentioned saturated fatty acid is within the above range, the release of the formed product from the inner surface of the molding die is improved, and the workability when the molded article is peeled off from the mold is improved, and the inner surface of the molding die becomes Clean up the performance.

(other ingredients)

The resin composition for mold cleaning of the present invention may further contain a resin such as an alkyd resin, a polyester resin, an acrylic resin, or an epoxy resin, or a rubber, as long as the effect of the present invention is not impaired. Further, it may contain a known additive such as an additive such as a curing catalyst, a lubricant, a colorant, or an antioxidant.

Examples of the curing catalyst include organic acids such as phthalic anhydride, sulfamic acid, p-toluenesulfonic acid, benzoic acid, myristic acid, stearic acid, and oxalic acid, and inorganic acids such as hydrochloric acid and sulfuric acid.

The lubricant, for example, a fatty acid amide-based lubricant, specifically, for example, decyl laurate, decyl myristate, erucic acid decylamine, oleic acid decylamine, succinic acid sulphate saturated or unsaturated Mono-guanamine type lubricants, such as methylene bis-stearate, succinate, ethyl bis-stearate, saturated or unsaturated bis-amine lubricants.

[Preparation method of resin composition for mold cleaning]

The resin composition for mold cleaning of the present invention is, for example, by using a kneader, a belt blender, a Henschel mixer, a ball mill, a roll mill, a kneader, a drum mixer, and the like. The melamine-based resin and the inorganic filler are mixed, and the other components such as the organic filler, the metal salt of the saturated fatty acid, and the additive are uniformly mixed as necessary to prepare.

[How to use the resin composition for mold cleaning]

The resin composition for mold cleaning of the present invention is subjected to transfer molding to clean the inner surface of the mold, that is, a resin composition for mold cleaning which is suitable as a transfer type.

The resin composition for mold cleaning of the present invention is usually processed into a tablet shape and used for cleaning the inner surface of the molding die. Specifically, after the lead frame is placed on the molding die, the ingot-shaped resin composition for mold cleaning is inserted into the groove portion, and after the mold is closed, the plunger is pushed. At this time, the resin composition for mold cleaning of the groove portion flows into the cavity inside through the gate portion through the gate portion. After the predetermined molding time, the mold is opened, and the molded article integrated with the lead frame is removed, that is, the molded product of the resin composition for mold cleaning containing the dirt is removed.

In the resin composition for mold cleaning of the present invention, the dirt on the inner surface of the molding die which is generated during the sealing forming operation of the integrated circuit or the like is removed by the method described above. The material of the forming mold is, for example, iron or chromium, and is usually subjected to a plating treatment on the inner surface of the forming mold. Forming the inner surface of the mold, repeating the seal forming operation Micron-sized scars and wear are added to the cleaning operation. As a result, the plating treatment surface applied to the inner surface of the molding die was missing, and the surface state was rough. The absence or roughness of the plated surface results in a decrease in formability and release property during the sealing forming operation, an unsatisfactory appearance of the surface, and loss of the cleaning workability of the inner surface of the molding die.

The resin composition for mold cleaning of the present invention has a standard deviation of the average particle diameter, the standard deviation of the particle diameter, the average aspect ratio of the particle diameter, and the aspect ratio of the particle diameter of the inorganic filler as the constituent component. Within the range, the occurrence of damage or abrasion to the inner surface of the forming mold or the like can be suppressed.

The preferred embodiment of the resin composition for mold cleaning of the present invention is shown below.

<1> A resin composition for mold cleaning comprising at least a melamine resin and an inorganic filler, wherein the inorganic filler has an average particle diameter of 4 to 12 μm, a standard deviation of particle diameters of 10 μm or less, and an average aspect ratio of the particle diameter. It is 1 to 1.3, and the standard deviation of the aspect ratio of the particle diameter is 0.5 or less.

<2> The resin composition for mold cleaning according to the above <1>, which further comprises a metal salt of a saturated fatty acid composed of a saturated fatty acid having 14 to 18 carbon atoms and a metal selected from the group consisting of calcium, zinc, and magnesium.

The resin composition for mold cleaning according to the above <1>, wherein the inorganic filler is selected from the group consisting of niobium carbide, niobium oxide, titanium carbide, titanium oxide, boron carbide, boron oxide, and oxidation. At least one of aluminum, magnesium oxide, and calcium oxide.

The resin composition for mold cleaning according to the above <3>, wherein the inorganic filler is at least one selected from the group consisting of cerium oxide and aluminum oxide.

<5> The resin composition for mold cleaning according to any one of <1> to <4> which is used for transfer molding.

[Examples]

The present invention will be more specifically described below based on examples, but the present invention is not limited to the following examples as long as the present invention does not go beyond the gist of the invention.

-Preparation of resin composition for mold cleaning -

[Preparation of melamine-phenol cocondensate]

(Manufacturing Example 1)

346 parts by mass of melamine 346 parts by mass, phenol of 131 parts by mass, and 522 parts by mass of formaldehyde (37% aqueous solution), and 248 parts by mass of hardwood pulp (LDPR, manufactured by Nippon Paper Co., Ltd.) as an organic filler, at 80 to 90 ° C, pH 7~ Under an alkali condition of 7.5, an aqueous solution of 3 mass% of the reactant at 60 ° C is heated to a time before turbidity, and then dried under reduced pressure and powdered to obtain a melamine-phenol cocondensate containing an organic filler. .

[Preparation of resin composition for mold cleaning]

(Example 1)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melted cerium oxide, HS203, manufactured by Nippon Steel Materials Co., Ltd.) as an inorganic filler, zinc stearate (zinc stearate GF200, sun oil) as a metal salt of a saturated fatty acid 0.5 parts by mass of 0.05 parts by mass of benzoic acid as a curing catalyst was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer (Nauta Mixer) to obtain a resin composition for mold cleaning of Example 1. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 2)

Melamine-phenol containing the aforementioned organic filler as a melamine resin 29.1 parts by mass of the cocondensate (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass, and the cerium oxide (melted cerium oxide, HS205) as an inorganic filler 20 parts by mass of zinc stearate (manufactured by Zinc Stearate GF200, manufactured by Nippon Oil Co., Ltd.) as a metal salt of a saturated fatty acid, and a benzoic acid as a hardening catalyst, 20 parts by mass of Nippon Steel Materials Co., Ltd. 0.05 parts by mass was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 2. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 3)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melting cerium oxide, SE-40, manufactured by Tokuyama Corporation) as an inorganic filler, zinc stearate as a metal salt of a saturated fatty acid (zinc stearate GF200, manufactured by Nippon Oil Co., Ltd.) 0.5 parts by mass of 0.05 parts by mass of benzoic acid as a hardening catalyst was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 3. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 4)

29.1 parts by mass of a melamine-phenol cocondensate containing the organic filler as a melamine resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, 7.8 parts by mass of the organic filler, and 50 parts by mass of the melamine resin, 20 parts by mass of cerium oxide (melted cerium oxide, SE-15, manufactured by Tokuyama Corporation) as an inorganic filler, and a hard fat as a metal salt of a saturated fatty acid. 0.5 parts by mass of zinc silicate (zinc stearate GF200, manufactured by Nippon Oil Co., Ltd.) and 0.05 parts by mass of benzoic acid as a curing catalyst were placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 4. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 5)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of alumina (CB-P10, manufactured by Showa Denko Co., Ltd.) as an inorganic filler, zinc stearate (manganese stearate GF200, manufactured by Nippon Oil Co., Ltd.) as a metal salt of a saturated fatty acid The mass parts, 0.05 parts by mass of benzoic acid as a hardening catalyst, were added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 5. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 6)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. As no 20 parts by mass of calcium carbonate (Whiton SB Blue, manufactured by Shiroishi Co., Ltd.) and 0.5 parts by mass of zinc stearate (manganese stearate GF200, manufactured by Nippon Oil Co., Ltd.) as a metal salt of a saturated fatty acid, 0.05 parts by mass of benzoic acid as a hardening catalyst was placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 6. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 7)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melted cerium oxide, HS203, manufactured by Nippon Steel Materials Co., Ltd.) as an inorganic filler, and calcium stearate (calcium stearate GF200, daily oil) as a metal salt of a saturated fatty acid 0.5 parts by mass of 0.05 parts by mass of benzoic acid as a curing catalyst was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 7. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 8)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. Cerium oxide as an inorganic filler (melted cerium oxide, HS203, Nippon Steel Materials) 20 parts by mass, as a metal salt of a saturated fatty acid, 0.5 parts by mass of zinc myristate (POWDER BASE M, manufactured by Nippon Oil Co., Ltd.), and 0.05 parts by mass of benzoic acid as a curing catalyst are added to a ball mill. And smash it. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 8. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 9)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melted cerium oxide, HS203, manufactured by Nippon Steel Materials Co., Ltd.) as an inorganic filler, and zinc laurate as a metal salt of a saturated fatty acid (ZS-3, Nitto Chemical Industry Co., Ltd.) 0.5 parts by mass of 0.05 parts by mass of benzoic acid as a hardening catalyst was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 9. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Embodiment 10)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melted cerium oxide, HS203, manufactured by Nippon Steel Materials Co., Ltd. Micron Co., Ltd.) as an inorganic filler, and a metal as a saturated fatty acid 0.5 parts by mass of zinc arganate salt and 0.05 parts by mass of benzoic acid as a hardening catalyst were placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 10. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Example 11)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melting cerium oxide, HS203, manufactured by Nippon Steel Materials Co., Ltd.), and 0.5 parts by mass of stearic acid (F-3, manufactured by Kawaken Fine Chemicals Co., Ltd.) as an inorganic filler. 0.05 parts by mass of benzoic acid as a hardening catalyst was placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Example 11. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Comparative Example 1)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (crushed cerium oxide, FS200, manufactured by Electrochemical Industry Co., Ltd.) as an inorganic filler, zinc stearate as a metal salt of a saturated fatty acid (zinc stearate GF200, Nippon Oil Co., Ltd.) Co., Ltd.) 0.5 parts by mass as a curing catalyst 0.05 parts by mass of benzoic acid was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 1. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.) and was broken.

(Comparative Example 2)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (melting cerium oxide, SO-C6, manufactured by Admatech Co., Ltd.) as an inorganic filler, zinc stearate as a metal salt of a saturated fatty acid (zinc stearate GF200, Nippon Oil Co., Ltd.) 0.5 parts by mass of 0.05 parts by mass of benzoic acid as a hardening catalyst was added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 2. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Comparative Example 3)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. Mass ratio of cerium oxide (melted cerium oxide, HS203, manufactured by Nippon Steel Materials Co., Ltd. Micron Co., Ltd.) as an inorganic filler to cerium oxide (melted cerium oxide, HS302, manufactured by Nippon Steel Materials Co., Ltd.) 20 parts by mass of a 1:1 mixture, zinc stearate (stearic acid as a metal salt of a saturated fatty acid) 0.5 parts by mass of zinc GF200 and Nippon Oil Co., Ltd., and 0.05 parts by mass of benzoic acid as a curing catalyst were placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 3. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), which was approximately spherical.

(Comparative Example 4)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. The mass ratio of cerium oxide (melted cerium oxide, TS10-141, manufactured by Nippon Steel Materials Co., Ltd.) and cerium oxide (crushed cerium oxide, F-CD10, KINSEI MATEC) as an inorganic filler 20 parts by mass of a mixture of 2, 0.5 parts by mass of zinc stearate (manganese stearate GF200, manufactured by Nippon Oil Co., Ltd.) as a metal salt of a saturated fatty acid, 0.05 parts by mass of benzoic acid as a curing catalyst, and added to a ball mill, and Smash it. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 4. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.), and it was mixed with a substantially spherical shape and a broken shape.

(Comparative Example 5)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. Cerium oxide as an inorganic filler (melted cerium oxide, HS203, Nippon Steel Materials) 20 parts by mass of a mixture of cerium oxide (crushed cerium oxide, F-CD10, KINSEI MATEC) having a mass ratio of 1:3, and a zinc stearate as a metal salt of a saturated fatty acid (hard) 0.5 parts by mass of zinc citrate GF200 and Nippon Oil Co., Ltd., and 0.05 parts by mass of benzoic acid as a curing catalyst were placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 5. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.) and mixed in a substantially spherical shape and a broken shape.

(Comparative Example 6)

29.1 parts by mass of the melamine-phenol cocondensate containing the organic filler in the melamine-based resin (wherein the melamine-phenol cocondensate is 21.3 parts by mass, the organic filler is 7.8 parts by mass), and the melamine resin is 50 parts by mass. 20 parts by mass of cerium oxide (pure ochre powder, manufactured by Seto Kee Raw Materials Co., Ltd.) as an inorganic filler, zinc myristate as a metal salt of a saturated fatty acid (POWDER BASE M, manufactured by Nippon Oil Co., Ltd.) 0.5 The mass parts, 0.05 parts by mass of benzoic acid as a hardening catalyst, were added to a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 6. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

In addition, the inorganic filler was observed by an electron microscope (JSM-5510, manufactured by JEOL Ltd.) and was broken.

(Comparative Example 7)

76.1 parts by mass of hydroxymethyl melamine (Nikalet S-176, manufactured by Nippon Carbide Industries Co., Ltd.) as a melamine resin, and hardwood pulp (LDPR, manufactured by Nippon Paper Industries Co., Ltd.) 23 as an organic filler 0.5 parts by mass of zinc stearate (manganese stearate GF200, manufactured by Nippon Oil Co., Ltd.) as a metal salt of a saturated fatty acid, and 0.05 parts by mass of benzoic acid as a curing catalyst were placed in a ball mill and pulverized. Next, 0.35 parts by mass of decylamine stearate as a lubricant was placed in a cone mixer to obtain a resin composition for mold cleaning of Comparative Example 7. The resin composition for mold cleaning obtained as described above was tableted and used for mold cleaning evaluation.

- Determination -

The average particle diameter of the inorganic filler used in the resin composition for mold cleaning of Examples 1 to 11 and Comparative Examples 1 to 7, the standard deviation of the particle diameter, the average aspect ratio of the particle diameter, and the length and width of the particle diameter. Compared with the standard, it is obtained by the following method. Table 1 below shows the measurement results.

An inorganic filler was photographed at a magnification of 1500 times using an electron microscope (JSM-5510, manufactured by JEOL Ltd.). Approximately 30 inorganic fillers were included in one field of view and photographed, and for a total of 150 inorganic fillers included in different fields of view, the long diameter (X) and the short diameter (Y) were measured five times each. Furthermore, the short diameter (Y) and the long diameter (X) are made orthogonal. Then, the average value of the measured values of the long diameter (X) and the short diameter (Y) was obtained, and the particle size of one inorganic filler was calculated by the following formula 1, and 150 inorganic fillers were obtained. The average of the particle diameters and the standard deviation of the particle diameters of 150 inorganic fillers.

Particle size = ((the average of the measured values of 5 times of X) + (the average of the measured values of 5 times of Y)) / 2... Formula 1

Further, the average value of the measured values of the major axis (X) and the minor axis (Y) was obtained, and the aspect ratio of the particle diameter of one inorganic filler was calculated by the following formula 2, and 150 was obtained. The average of the aspect ratio of the particle diameter of the inorganic filler and the standard deviation of the aspect ratio of the particle diameter of the 150 inorganic fillers.

The aspect ratio of the particle size = (the average of the measured values of 5 times of X) / (5 times of Y) The average of the measured values).........2

-Evaluation-

The cleanability and damage of the resin composition for mold cleaning of Examples 1 to 11 and Comparative Examples 1 to 7 were evaluated by the following methods. The evaluation results are shown in Table 1 below.

(1) Cleanliness

A commercially available epoxy resin molding material (EME-G700L, manufactured by Sumitomo Bakelite Co., Ltd.) was used to transfer an automatic molding machine (mold temperature: 175 ° C, transfer pressure: 8.7 MPa, transfer time: 6.5 seconds, hardening time: 90) Second) Forming a QFP (Quad Flat Package) 400 shots to make the inner surface of the mold dirty.

Using the mold which was dirty, the resin composition for mold cleaning prepared as described above was repeatedly formed by the same molding conditions as described above. Then, the number of hairs required to completely remove the dirt adhering to the inner surface of the mold was measured, and the number of hairs was used as an index for evaluating the cleanability of the resin composition for mold cleaning. It is visually judged whether or not the dirt is completely removed.

In the evaluation, it is particularly concerned whether or not the dirt of the gate portion or the corner portion of the cavity attached to the mold is removed. The gate portion of the mold used in this evaluation was 800 μm in width and 300 μm in height.

The smaller the number of shots, the better the cleanliness.

(2) Damage

A commercially available Taber abrasion tester (MODEL 5155, manufactured by TABER INDUSTRIES) was used for the evaluation of the damage of the resin composition for mold cleaning.

A test piece (100 mm × 100 mm, thickness: 7 mm) to which hard chrome plating was applied was applied to a SUS plate (material: ASP-23H). The surface roughness of the test piece was measured using a laser microscope (VK-9710, manufactured by KEYENCE Co., Ltd.) (Ra: arithmetic The average roughness, according to JIS B 0601-2001), was 0.099 μm.

The resin composition for mold cleaning was molded using a mold having a shape of a width of 10 mm, a length of 100 mm, and a thickness of 4 mm, and was used as a sample for evaluation. The apparatus was a transfer automatic forming machine (mold temperature: 170 ° C, transfer pressure: 6.9 MPa, transfer time: 30 seconds, hardening time: 90 seconds).

As a pre-preparation, the #1500 sandpaper was placed on the rotary table of the Taber abrasion tester, and the test sample of the resin composition for mold cleaning was placed face down with a face of 10 mm × 4 mm, and fixed using a test fixture. The turntable was rotated 30 times at a speed of 60 rpm to grind the plane of the sample for evaluation.

The test piece was placed on a rotary table of a Taber abrasion tester, and a test sample for fixing the grinding plane was fixed thereon with a test fixture, and a load of 1000 g was loaded while rotating the turntable at a speed of 60 rpm. Secondary wear test.

After the abrasion test, the surface roughness (Ra: arithmetic mean roughness, according to JIS B 0601-2001) of the surface of the test piece was measured using a laser microscope (VK-9710, manufactured by KEYENCE Co., Ltd.), and the surface was roughened. The numerical value is used as an index for evaluating the damage of the resin composition for mold cleaning.

The smaller the numerical value of the surface roughness of the surface of the test piece, the less the damage caused by the sample for evaluation. Therefore, the smaller the numerical value of the surface roughness of the surface of the test piece, the resin composition for mold cleaning which is hard to be worn or damaged on the inner surface of the mold and the gate portion.

[Table 1]

As shown in Table 1, according to the resin composition for mold cleaning of the present invention, it is apparent that the corner portion of the cavity of the molding die can be sufficiently cleaned, and it is difficult to cause abrasion or damage on the inner surface of the molding die and the gate portion. .

Fig. 1 shows the relationship between the particle diameter and the frequency of the inorganic filler used in the resin composition for mold cleaning of Example 8 and Comparative Example 6. The resin composition for mold cleaning used in Example 8 is an inorganic filler containing 7% (11 of 150) having a particle diameter of 2.5 μm or less.

Fig. 2 shows the relationship between the aspect ratio and the frequency of the particle diameter of the inorganic filler used in the resin composition for mold cleaning of Example 8 and Comparative Example 6. The resin composition for mold cleaning used in Example 8 is an inorganic filler containing 49% (74 of 150) having an aspect ratio of 1.0 to 1.1.

Fig. 3 shows the relationship between the approximate value and the frequency of the volume of the inorganic filler used in the resin composition for mold cleaning of Example 8 and Comparative Example 6. In addition, the volume of the inorganic filler is an average value of the major axis (X) and the minor axis (Y), and is approximated by the following formula 3.

Approximate volume = 4 × 3.14 × (particle size) ³ / 3 ... ... Equation 3

The inorganic filler used in the resin composition for mold cleaning of Example 8 was included in a range of 12% (18 of 150) and an approximate value of 10 to 100 μm ³ .

As shown in the above examples and comparative examples, a resin composition for mold cleaning can be provided, and at least a melamine resin and an inorganic filler are selected as constituent components, and the average particle diameter and particle diameter of the inorganic filler are controlled. The standard deviation, the average aspect ratio of the particle size, and the standard deviation of the aspect ratio of the particle size are within a specific range, and can be sufficiently cleaned to the respective corners of the cavity of the forming mold, and further, the inner surface of the forming mold and the pouring It is difficult to cause wear or damage to the mouth.

[Industrial availability]

The resin composition for mold cleaning of the present invention is a resin composition for transfer mold cleaning for removing dirt derived from the surface of the mold of the thermosetting resin composition, and can be sufficiently cleaned to each of the cavity of the molding die. The corners also prevent wear or injury of the inner surface of the forming mold and the gate portion.

Japanese Patent Application Laid-Open No. 2011-156953, the entire disclosure of which is incorporated herein by reference.

All the documents, patent applications, and technical specifications described in the present specification are specifically incorporated into the present invention with reference to the respective documents, patent applications, and technical specifications, and the same as the respective descriptions. The invention is incorporated by reference.

FIG. 1 is a view showing the relationship between the particle diameter and the frequency of the inorganic filler contained in the resin composition for mold cleaning according to the embodiment of the present invention.

FIG. 2 is a view showing the relationship between the aspect ratio and the frequency of the particle diameter of the inorganic filler contained in the resin composition for mold cleaning according to the embodiment of the present invention.

FIG. 3 is a view showing the relationship between the approximate value and the frequency of the volume of the inorganic filler contained in the resin composition for mold cleaning according to the embodiment of the present invention.

Claims (4)

A resin composition for cleaning a mold, comprising at least a melamine resin and an inorganic filler; and a metal salt of a saturated fatty acid having a carbon number of 14 to 18 and a metal selected from the group consisting of calcium, zinc, and magnesium, the inorganic filler The average particle diameter of the material is 4 to 12 μm, the standard deviation of the particle diameter is 10 μm or less, the average aspect ratio of the particle diameter is 1 to 1.3, and the standard deviation of the aspect ratio of the particle diameter is 0.5 or less. The resin composition for mold cleaning according to the first aspect of the invention, wherein the inorganic filler is selected from the group consisting of niobium carbide, niobium oxide, titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide, and At least one of calcium oxide. The resin composition for mold cleaning according to the second aspect of the invention, wherein the inorganic filler is at least one selected from the group consisting of cerium oxide and aluminum oxide. The resin composition for mold cleaning according to any one of claims 1 to 3, which is used for transfer molding.