TWI579652B - 干涉儀、微影設備、和製造物品的方法 - Google Patents
干涉儀、微影設備、和製造物品的方法 Download PDFInfo
- Publication number
- TWI579652B TWI579652B TW103122848A TW103122848A TWI579652B TW I579652 B TWI579652 B TW I579652B TW 103122848 A TW103122848 A TW 103122848A TW 103122848 A TW103122848 A TW 103122848A TW I579652 B TWI579652 B TW I579652B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- interferometer
- substrate
- optical system
- measurement
- Prior art date
Links
- 238000001459 lithography Methods 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims description 134
- 230000003287 optical effect Effects 0.000 claims description 132
- 238000005259 measurement Methods 0.000 claims description 107
- 230000003595 spectral effect Effects 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 29
- 238000005286 illumination Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 7
- 210000001747 pupil Anatomy 0.000 claims description 7
- 230000002452 interceptive effect Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 3
- 230000001427 coherent effect Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 description 32
- 230000007423 decrease Effects 0.000 description 19
- 238000003384 imaging method Methods 0.000 description 17
- 230000009467 reduction Effects 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000010363 phase shift Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005305 interferometry Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012014 optical coherence tomography Methods 0.000 description 2
- 238000012887 quadratic function Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005315 distribution function Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7034—Leveling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/0209—Low-coherence interferometers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Spectrometry And Color Measurement (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- General Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013152096A JP6271896B2 (ja) | 2013-07-22 | 2013-07-22 | 干渉計測装置、リソグラフィ装置および物品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201504771A TW201504771A (zh) | 2015-02-01 |
| TWI579652B true TWI579652B (zh) | 2017-04-21 |
Family
ID=52343344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103122848A TWI579652B (zh) | 2013-07-22 | 2014-07-02 | 干涉儀、微影設備、和製造物品的方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9625836B2 (enExample) |
| JP (1) | JP6271896B2 (enExample) |
| KR (1) | KR101790830B1 (enExample) |
| TW (1) | TWI579652B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10437033B2 (en) | 2014-01-18 | 2019-10-08 | Daylight Solutions, Inc. | Modulating spectroscopic imaging system using substantially coherent illumination |
| JP6449310B2 (ja) | 2014-01-18 | 2019-01-09 | デイライト ソリューションズ、インコーポレイテッド | 低ノイズ分光画像化システム |
| US11803044B2 (en) | 2014-01-18 | 2023-10-31 | Daylight Solutions, Inc. | Low-noise spectroscopic imaging system with steerable substantially coherent illumination |
| EP2966489A1 (de) * | 2014-06-30 | 2016-01-13 | Carl Zeiss SMT GmbH | Beleuchtungsoptik sowie abbildende optik für ein metrologiesystem für die untersuchung eines objekts mit euv-beleuchtungs- und abbildungslicht sowie metrologiesystem mit einer derartigen beleuchtungsoptik bzw. einer derartigen abbildungsoptik |
| CN111158220A (zh) | 2015-02-23 | 2020-05-15 | 株式会社尼康 | 测量装置及方法、光刻系统、曝光装置及方法 |
| TWI693477B (zh) * | 2015-02-23 | 2020-05-11 | 日商尼康股份有限公司 | 測量裝置、微影系統及曝光裝置、以及元件製造方法 |
| CN107278279B (zh) | 2015-02-23 | 2020-07-03 | 株式会社尼康 | 基板处理系统及基板处理方法、以及组件制造方法 |
| EP3309616A1 (en) | 2016-10-14 | 2018-04-18 | ASML Netherlands B.V. | Method of inspecting a substrate, metrology apparatus, and lithographic system |
| JP6818501B2 (ja) * | 2016-10-19 | 2021-01-20 | キヤノン株式会社 | リソグラフィ装置、および物品製造方法 |
| JP2020060690A (ja) * | 2018-10-10 | 2020-04-16 | ウシオ電機株式会社 | 光照射方法、機能素子の製造方法および光照射装置 |
| US11162897B2 (en) * | 2019-05-15 | 2021-11-02 | Onto Innovation Inc. | Optical metrology device using numerical aperture reduction |
| US11841548B2 (en) * | 2020-08-18 | 2023-12-12 | Zygo Corporation | Variable-zoom imaging apparatus |
| JP7743209B2 (ja) * | 2021-06-08 | 2025-09-24 | キヤノン株式会社 | 成形装置、成形方法及び物品の製造方法 |
| KR102492803B1 (ko) | 2022-04-19 | 2023-01-31 | (주)오로스테크놀로지 | 조리개를 이용하여 입사 각도 또는 개구수를 조절하는 편광 분석 장치 및 방법 |
| CN118565358B (zh) * | 2024-07-31 | 2024-11-22 | 合肥合视科达智能科技有限公司 | 一种厚度及双侧面形同步检测系统及方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070086013A1 (en) * | 2005-10-11 | 2007-04-19 | Zygo Corporation | Interferometry method and system including spectral decomposition |
| US20090225327A1 (en) * | 2008-03-05 | 2009-09-10 | Canon Kabushiki Kaisha | Position measurement apparatus, position measurement method, and exposure apparatus |
| US20120307258A1 (en) * | 2010-01-22 | 2012-12-06 | Universitaet Stuttgart | Method and arrangement for robust interferometry |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5398113A (en) | 1993-02-08 | 1995-03-14 | Zygo Corporation | Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms |
| JP3685667B2 (ja) * | 1999-10-27 | 2005-08-24 | 株式会社日立製作所 | 立体形状検出方法及び装置、並びに検査方法及び装置 |
| US7884947B2 (en) | 2005-01-20 | 2011-02-08 | Zygo Corporation | Interferometry for determining characteristics of an object surface, with spatially coherent illumination |
| JP5084558B2 (ja) | 2008-02-28 | 2012-11-28 | キヤノン株式会社 | 表面形状計測装置、露光装置及びデバイス製造方法 |
| JP5787483B2 (ja) * | 2010-01-16 | 2015-09-30 | キヤノン株式会社 | 計測装置及び露光装置 |
| JP2013024747A (ja) * | 2011-07-21 | 2013-02-04 | Canon Inc | 計測装置、露光装置およびデバイス製造方法 |
-
2013
- 2013-07-22 JP JP2013152096A patent/JP6271896B2/ja active Active
-
2014
- 2014-07-02 TW TW103122848A patent/TWI579652B/zh active
- 2014-07-10 US US14/327,650 patent/US9625836B2/en active Active
- 2014-07-14 KR KR1020140088285A patent/KR101790830B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070086013A1 (en) * | 2005-10-11 | 2007-04-19 | Zygo Corporation | Interferometry method and system including spectral decomposition |
| US20090225327A1 (en) * | 2008-03-05 | 2009-09-10 | Canon Kabushiki Kaisha | Position measurement apparatus, position measurement method, and exposure apparatus |
| US20120307258A1 (en) * | 2010-01-22 | 2012-12-06 | Universitaet Stuttgart | Method and arrangement for robust interferometry |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201504771A (zh) | 2015-02-01 |
| KR20150011313A (ko) | 2015-01-30 |
| US20150022796A1 (en) | 2015-01-22 |
| JP6271896B2 (ja) | 2018-01-31 |
| KR101790830B1 (ko) | 2017-10-26 |
| US9625836B2 (en) | 2017-04-18 |
| JP2015021904A (ja) | 2015-02-02 |
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