KR101790830B1 - 간섭계, 리소그래피 장치, 및 물품 제조 방법 - Google Patents

간섭계, 리소그래피 장치, 및 물품 제조 방법 Download PDF

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KR101790830B1
KR101790830B1 KR1020140088285A KR20140088285A KR101790830B1 KR 101790830 B1 KR101790830 B1 KR 101790830B1 KR 1020140088285 A KR1020140088285 A KR 1020140088285A KR 20140088285 A KR20140088285 A KR 20140088285A KR 101790830 B1 KR101790830 B1 KR 101790830B1
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South Korea
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light
interference
incident
substrate
optical system
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Korean (ko)
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KR20150011313A (ko
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와타루 야마구치
다카히로 마츠모토
히데키 이나
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캐논 가부시끼가이샤
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034Leveling
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00Measuring instruments characterised by the use of optical techniques
    • G01B9/02Interferometers
    • G01B9/0209Low-coherence interferometers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049Technique, e.g. interferometric
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
KR1020140088285A 2013-07-22 2014-07-14 간섭계, 리소그래피 장치, 및 물품 제조 방법 Active KR101790830B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013152096A JP6271896B2 (ja) 2013-07-22 2013-07-22 干渉計測装置、リソグラフィ装置および物品の製造方法
JPJP-P-2013-152096 2013-07-22

Publications (2)

Publication Number Publication Date
KR20150011313A KR20150011313A (ko) 2015-01-30
KR101790830B1 true KR101790830B1 (ko) 2017-10-26

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KR1020140088285A Active KR101790830B1 (ko) 2013-07-22 2014-07-14 간섭계, 리소그래피 장치, 및 물품 제조 방법

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Country Link
US (1) US9625836B2 (enExample)
JP (1) JP6271896B2 (enExample)
KR (1) KR101790830B1 (enExample)
TW (1) TWI579652B (enExample)

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* Cited by examiner, † Cited by third party
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US10437033B2 (en) 2014-01-18 2019-10-08 Daylight Solutions, Inc. Modulating spectroscopic imaging system using substantially coherent illumination
JP6449310B2 (ja) 2014-01-18 2019-01-09 デイライト ソリューションズ、インコーポレイテッド 低ノイズ分光画像化システム
US11803044B2 (en) 2014-01-18 2023-10-31 Daylight Solutions, Inc. Low-noise spectroscopic imaging system with steerable substantially coherent illumination
EP2966489A1 (de) * 2014-06-30 2016-01-13 Carl Zeiss SMT GmbH Beleuchtungsoptik sowie abbildende optik für ein metrologiesystem für die untersuchung eines objekts mit euv-beleuchtungs- und abbildungslicht sowie metrologiesystem mit einer derartigen beleuchtungsoptik bzw. einer derartigen abbildungsoptik
CN111158220A (zh) 2015-02-23 2020-05-15 株式会社尼康 测量装置及方法、光刻系统、曝光装置及方法
TWI693477B (zh) * 2015-02-23 2020-05-11 日商尼康股份有限公司 測量裝置、微影系統及曝光裝置、以及元件製造方法
CN107278279B (zh) 2015-02-23 2020-07-03 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
EP3309616A1 (en) 2016-10-14 2018-04-18 ASML Netherlands B.V. Method of inspecting a substrate, metrology apparatus, and lithographic system
JP6818501B2 (ja) * 2016-10-19 2021-01-20 キヤノン株式会社 リソグラフィ装置、および物品製造方法
JP2020060690A (ja) * 2018-10-10 2020-04-16 ウシオ電機株式会社 光照射方法、機能素子の製造方法および光照射装置
US11162897B2 (en) * 2019-05-15 2021-11-02 Onto Innovation Inc. Optical metrology device using numerical aperture reduction
US11841548B2 (en) * 2020-08-18 2023-12-12 Zygo Corporation Variable-zoom imaging apparatus
JP7743209B2 (ja) * 2021-06-08 2025-09-24 キヤノン株式会社 成形装置、成形方法及び物品の製造方法
KR102492803B1 (ko) 2022-04-19 2023-01-31 (주)오로스테크놀로지 조리개를 이용하여 입사 각도 또는 개구수를 조절하는 편광 분석 장치 및 방법
CN118565358B (zh) * 2024-07-31 2024-11-22 合肥合视科达智能科技有限公司 一种厚度及双侧面形同步检测系统及方法

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US20070086013A1 (en) * 2005-10-11 2007-04-19 Zygo Corporation Interferometry method and system including spectral decomposition
US20090225327A1 (en) * 2008-03-05 2009-09-10 Canon Kabushiki Kaisha Position measurement apparatus, position measurement method, and exposure apparatus
US20120307258A1 (en) * 2010-01-22 2012-12-06 Universitaet Stuttgart Method and arrangement for robust interferometry

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US5398113A (en) 1993-02-08 1995-03-14 Zygo Corporation Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms
JP3685667B2 (ja) * 1999-10-27 2005-08-24 株式会社日立製作所 立体形状検出方法及び装置、並びに検査方法及び装置
US7884947B2 (en) 2005-01-20 2011-02-08 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
JP5084558B2 (ja) 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
JP5787483B2 (ja) * 2010-01-16 2015-09-30 キヤノン株式会社 計測装置及び露光装置
JP2013024747A (ja) * 2011-07-21 2013-02-04 Canon Inc 計測装置、露光装置およびデバイス製造方法

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US20070086013A1 (en) * 2005-10-11 2007-04-19 Zygo Corporation Interferometry method and system including spectral decomposition
US20090225327A1 (en) * 2008-03-05 2009-09-10 Canon Kabushiki Kaisha Position measurement apparatus, position measurement method, and exposure apparatus
US20120307258A1 (en) * 2010-01-22 2012-12-06 Universitaet Stuttgart Method and arrangement for robust interferometry

Also Published As

Publication number Publication date
TW201504771A (zh) 2015-02-01
KR20150011313A (ko) 2015-01-30
TWI579652B (zh) 2017-04-21
US20150022796A1 (en) 2015-01-22
JP6271896B2 (ja) 2018-01-31
US9625836B2 (en) 2017-04-18
JP2015021904A (ja) 2015-02-02

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