JP6271896B2 - 干渉計測装置、リソグラフィ装置および物品の製造方法 - Google Patents

干渉計測装置、リソグラフィ装置および物品の製造方法 Download PDF

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Publication number
JP6271896B2
JP6271896B2 JP2013152096A JP2013152096A JP6271896B2 JP 6271896 B2 JP6271896 B2 JP 6271896B2 JP 2013152096 A JP2013152096 A JP 2013152096A JP 2013152096 A JP2013152096 A JP 2013152096A JP 6271896 B2 JP6271896 B2 JP 6271896B2
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Japan
Prior art keywords
light
interference
measurement
substrate
test object
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JP2013152096A
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English (en)
Japanese (ja)
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JP2015021904A5 (enExample
JP2015021904A (ja
Inventor
渉 山口
渉 山口
松本　隆宏
隆宏 松本
稲　秀樹
秀樹 稲
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013152096A priority Critical patent/JP6271896B2/ja
Priority to TW103122848A priority patent/TWI579652B/zh
Priority to US14/327,650 priority patent/US9625836B2/en
Priority to KR1020140088285A priority patent/KR101790830B1/ko
Publication of JP2015021904A publication Critical patent/JP2015021904A/ja
Publication of JP2015021904A5 publication Critical patent/JP2015021904A5/ja
Application granted granted Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/0209—Low-coherence interferometers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • General Health & Medical Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
JP2013152096A 2013-07-22 2013-07-22 干渉計測装置、リソグラフィ装置および物品の製造方法 Active JP6271896B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013152096A JP6271896B2 (ja) 2013-07-22 2013-07-22 干渉計測装置、リソグラフィ装置および物品の製造方法
TW103122848A TWI579652B (zh) 2013-07-22 2014-07-02 干涉儀、微影設備、和製造物品的方法
US14/327,650 US9625836B2 (en) 2013-07-22 2014-07-10 Interferometer, lithography apparatus, and method of manufacturing article
KR1020140088285A KR101790830B1 (ko) 2013-07-22 2014-07-14 간섭계, 리소그래피 장치, 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013152096A JP6271896B2 (ja) 2013-07-22 2013-07-22 干渉計測装置、リソグラフィ装置および物品の製造方法

Publications (3)

Publication Number Publication Date
JP2015021904A JP2015021904A (ja) 2015-02-02
JP2015021904A5 JP2015021904A5 (enExample) 2016-09-08
JP6271896B2 true JP6271896B2 (ja) 2018-01-31

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JP2013152096A Active JP6271896B2 (ja) 2013-07-22 2013-07-22 干渉計測装置、リソグラフィ装置および物品の製造方法

Country Status (4)

Country Link
US (1) US9625836B2 (enExample)
JP (1) JP6271896B2 (enExample)
KR (1) KR101790830B1 (enExample)
TW (1) TWI579652B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10437033B2 (en) 2014-01-18 2019-10-08 Daylight Solutions, Inc. Modulating spectroscopic imaging system using substantially coherent illumination
JP6449310B2 (ja) 2014-01-18 2019-01-09 デイライト ソリューションズ、インコーポレイテッド 低ノイズ分光画像化システム
US11803044B2 (en) 2014-01-18 2023-10-31 Daylight Solutions, Inc. Low-noise spectroscopic imaging system with steerable substantially coherent illumination
EP2966489A1 (de) * 2014-06-30 2016-01-13 Carl Zeiss SMT GmbH Beleuchtungsoptik sowie abbildende optik für ein metrologiesystem für die untersuchung eines objekts mit euv-beleuchtungs- und abbildungslicht sowie metrologiesystem mit einer derartigen beleuchtungsoptik bzw. einer derartigen abbildungsoptik
CN111158220A (zh) 2015-02-23 2020-05-15 株式会社尼康 测量装置及方法、光刻系统、曝光装置及方法
TWI693477B (zh) * 2015-02-23 2020-05-11 日商尼康股份有限公司 測量裝置、微影系統及曝光裝置、以及元件製造方法
CN107278279B (zh) 2015-02-23 2020-07-03 株式会社尼康 基板处理系统及基板处理方法、以及组件制造方法
EP3309616A1 (en) 2016-10-14 2018-04-18 ASML Netherlands B.V. Method of inspecting a substrate, metrology apparatus, and lithographic system
JP6818501B2 (ja) * 2016-10-19 2021-01-20 キヤノン株式会社 リソグラフィ装置、および物品製造方法
JP2020060690A (ja) * 2018-10-10 2020-04-16 ウシオ電機株式会社 光照射方法、機能素子の製造方法および光照射装置
US11162897B2 (en) * 2019-05-15 2021-11-02 Onto Innovation Inc. Optical metrology device using numerical aperture reduction
US11841548B2 (en) * 2020-08-18 2023-12-12 Zygo Corporation Variable-zoom imaging apparatus
JP7743209B2 (ja) * 2021-06-08 2025-09-24 キヤノン株式会社 成形装置、成形方法及び物品の製造方法
KR102492803B1 (ko) 2022-04-19 2023-01-31 (주)오로스테크놀로지 조리개를 이용하여 입사 각도 또는 개구수를 조절하는 편광 분석 장치 및 방법
CN118565358B (zh) * 2024-07-31 2024-11-22 合肥合视科达智能科技有限公司 一种厚度及双侧面形同步检测系统及方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5398113A (en) 1993-02-08 1995-03-14 Zygo Corporation Method and apparatus for surface topography measurement by spatial-frequency analysis of interferograms
JP3685667B2 (ja) * 1999-10-27 2005-08-24 株式会社日立製作所 立体形状検出方法及び装置、並びに検査方法及び装置
US7884947B2 (en) 2005-01-20 2011-02-08 Zygo Corporation Interferometry for determining characteristics of an object surface, with spatially coherent illumination
WO2007044786A2 (en) * 2005-10-11 2007-04-19 Zygo Corporation Interferometry method and system including spectral decomposition
JP5084558B2 (ja) 2008-02-28 2012-11-28 キヤノン株式会社 表面形状計測装置、露光装置及びデバイス製造方法
JP2009210466A (ja) * 2008-03-05 2009-09-17 Canon Inc 位置測定装置、位置測定方法及び露光装置
JP5787483B2 (ja) * 2010-01-16 2015-09-30 キヤノン株式会社 計測装置及び露光装置
US8934104B2 (en) * 2010-01-22 2015-01-13 Universitaet Stuttgart Method and arrangement for robust interferometry for detecting a feature of an object
JP2013024747A (ja) * 2011-07-21 2013-02-04 Canon Inc 計測装置、露光装置およびデバイス製造方法

Also Published As

Publication number Publication date
TW201504771A (zh) 2015-02-01
KR20150011313A (ko) 2015-01-30
TWI579652B (zh) 2017-04-21
US20150022796A1 (en) 2015-01-22
KR101790830B1 (ko) 2017-10-26
US9625836B2 (en) 2017-04-18
JP2015021904A (ja) 2015-02-02

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