TWI576301B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI576301B
TWI576301B TW101105781A TW101105781A TWI576301B TW I576301 B TWI576301 B TW I576301B TW 101105781 A TW101105781 A TW 101105781A TW 101105781 A TW101105781 A TW 101105781A TW I576301 B TWI576301 B TW I576301B
Authority
TW
Taiwan
Prior art keywords
substrate
processing apparatus
substrate processing
roller
chamber
Prior art date
Application number
TW101105781A
Other languages
English (en)
Chinese (zh)
Other versions
TW201242876A (en
Inventor
濱田智秀
木內徹
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW201242876A publication Critical patent/TW201242876A/zh
Application granted granted Critical
Publication of TWI576301B publication Critical patent/TWI576301B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B05B14/30—Arrangements for collecting, re-using or eliminating excess spraying material comprising enclosures close to, or in contact with, the object to be sprayed and surrounding or confining the discharged spray or jet but not the object to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/083—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets being passed between the coating roller and one or more backing rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/032—Controlling transverse register of web
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Advancing Webs (AREA)
  • Liquid Crystal (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Replacement Of Web Rolls (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Drying Of Solid Materials (AREA)
TW101105781A 2011-02-24 2012-02-22 基板處理裝置 TWI576301B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161446197P 2011-02-24 2011-02-24

Publications (2)

Publication Number Publication Date
TW201242876A TW201242876A (en) 2012-11-01
TWI576301B true TWI576301B (zh) 2017-04-01

Family

ID=46720919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101105781A TWI576301B (zh) 2011-02-24 2012-02-22 基板處理裝置

Country Status (5)

Country Link
JP (4) JP5780291B2 (ja)
KR (2) KR101723354B1 (ja)
CN (1) CN103384637B (ja)
TW (1) TWI576301B (ja)
WO (1) WO2012115143A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI683345B (zh) * 2012-11-06 2020-01-21 日商尼康股份有限公司 偏光分束器、使用該偏光分束器之曝光裝置、以及元件製造方法
JP7041482B2 (ja) * 2017-09-13 2022-03-24 株式会社オーク製作所 露光装置
CN107450284B (zh) * 2017-09-27 2019-06-07 武汉华星光电技术有限公司 曝光设备及透明基板的曝光方法
JP7089920B2 (ja) * 2018-03-29 2022-06-23 株式会社オーク製作所 露光装置
JP7040981B2 (ja) * 2018-03-29 2022-03-23 株式会社オーク製作所 露光装置
JP7037416B2 (ja) * 2018-03-29 2022-03-16 株式会社オーク製作所 露光装置
WO2020031697A1 (ja) * 2018-08-06 2020-02-13 東京エレクトロン株式会社 溶射システム、溶射方法およびリチウム二次電池の製造方法
CN113441340B (zh) * 2021-06-29 2022-09-20 辽宁分子流科技有限公司 一种制备纳米银丝电极薄膜的卷对卷设备
CN115636283B (zh) * 2022-11-01 2023-05-30 海安华诚新材料有限公司 一种张力变化可调的张力分段涂镁卷取设备及其生产方法
CN118719370A (zh) * 2024-09-02 2024-10-01 山西医科大学 一种纳米抗菌喷雾装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002035982A (ja) * 2000-07-27 2002-02-05 Uht Corp レーザー加工装置
CN1986872A (zh) * 2005-12-22 2007-06-27 应用材料有限责任与两合公司 处理底材的机器及方法
US20090223551A1 (en) * 2008-03-04 2009-09-10 Solexant Corp. Process for making solar cells
TW201001039A (en) * 2008-06-30 2010-01-01 Nikon Corp Method and apparatus for manufacturing display element, method and apparatus for manufacturing thin film transistor, and circuit forming apparatus

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
JPS5934668A (ja) * 1982-08-21 1984-02-25 Agency Of Ind Science & Technol 薄膜太陽電池の製造方法
JPH0732136B2 (ja) * 1987-12-09 1995-04-10 東京エレクトロン東北株式会社 半導体製造装置
JPH07117741B2 (ja) * 1988-04-27 1995-12-18 富士写真フイルム株式会社 フィルム処理装置
JPH05335406A (ja) * 1992-06-03 1993-12-17 Fujitsu Ltd 基板格納装置
JP3652726B2 (ja) * 1994-12-26 2005-05-25 三共株式会社 連続成形シートへの表面デポジット層形成方法および装置
JP2000303178A (ja) * 1999-04-16 2000-10-31 Sanyo Electric Co Ltd 薄膜形成装置
JP2005002423A (ja) * 2003-06-12 2005-01-06 Fuji Electric Holdings Co Ltd 薄膜形成装置
ITTO20030690A1 (it) * 2003-09-11 2005-03-12 Edison Termoelettrica Spa Metodo e apparecchiatura di deposizione di film di materiali
JP2006100868A (ja) 2004-09-28 2006-04-13 Hitachi Kokusai Electric Inc 無線通信システム
JP4076995B2 (ja) * 2005-01-31 2008-04-16 株式会社名機製作所 積層成形品製造装置および積層成形品製造方法
WO2006100868A1 (ja) * 2005-03-18 2006-09-28 Konica Minolta Holdings, Inc. 有機化合物層の形成方法、有機ｅｌ素子の製造方法、有機ｅｌ素子
CN101768726B (zh) * 2008-12-30 2012-12-12 深圳市鹏桑普太阳能股份有限公司 一种连续卷绕式磁控溅射真空镀膜装置
JP5393290B2 (ja) * 2009-06-25 2014-01-22 株式会社クラレ ウェブ加工装置及び電子装置の製造方法
CN201560233U (zh) * 2009-08-26 2010-08-25 兰州大成科技股份有限公司 一种太阳能选择性吸收膜的连续卷绕镀膜装置
CN201519642U (zh) * 2009-09-17 2010-07-07 淄博泰宝包装制品有限公司 一种具有恒湿装置的涂布机

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002035982A (ja) * 2000-07-27 2002-02-05 Uht Corp レーザー加工装置
CN1986872A (zh) * 2005-12-22 2007-06-27 应用材料有限责任与两合公司 处理底材的机器及方法
US20090223551A1 (en) * 2008-03-04 2009-09-10 Solexant Corp. Process for making solar cells
TW201001039A (en) * 2008-06-30 2010-01-01 Nikon Corp Method and apparatus for manufacturing display element, method and apparatus for manufacturing thin film transistor, and circuit forming apparatus

Also Published As

Publication number Publication date
JP6015819B2 (ja) 2016-10-26
JP2016020278A (ja) 2016-02-04
KR20140007382A (ko) 2014-01-17
JP6206538B2 (ja) 2017-10-04
CN103384637B (zh) 2015-09-09
TW201242876A (en) 2012-11-01
KR101633540B1 (ko) 2016-06-24
CN103384637A (zh) 2013-11-06
JPWO2012115143A1 (ja) 2014-07-07
JP5780291B2 (ja) 2015-09-16
JP6390771B2 (ja) 2018-09-19
KR101723354B1 (ko) 2017-04-05
JP2018043884A (ja) 2018-03-22
WO2012115143A1 (ja) 2012-08-30
JP2016199402A (ja) 2016-12-01
KR20160074682A (ko) 2016-06-28

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