TWI574781B - 在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤 - Google Patents

在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤 Download PDF

Info

Publication number
TWI574781B
TWI574781B TW102111803A TW102111803A TWI574781B TW I574781 B TWI574781 B TW I574781B TW 102111803 A TW102111803 A TW 102111803A TW 102111803 A TW102111803 A TW 102111803A TW I574781 B TWI574781 B TW I574781B
Authority
TW
Taiwan
Prior art keywords
workpiece
static pressure
carrier
pressure pad
loading
Prior art date
Application number
TW102111803A
Other languages
English (en)
Chinese (zh)
Other versions
TW201402271A (zh
Inventor
芝中篤志
川畑聰
Original Assignee
光洋機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光洋機械工業股份有限公司 filed Critical 光洋機械工業股份有限公司
Publication of TW201402271A publication Critical patent/TW201402271A/zh
Application granted granted Critical
Publication of TWI574781B publication Critical patent/TWI574781B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW102111803A 2012-04-05 2013-04-02 在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤 TWI574781B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012086335A JP5872947B2 (ja) 2012-04-05 2012-04-05 両頭平面研削におけるワーク搬入出方法及び両頭平面研削盤

Publications (2)

Publication Number Publication Date
TW201402271A TW201402271A (zh) 2014-01-16
TWI574781B true TWI574781B (zh) 2017-03-21

Family

ID=49290307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102111803A TWI574781B (zh) 2012-04-05 2013-04-02 在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤

Country Status (5)

Country Link
JP (1) JP5872947B2 (fr)
KR (1) KR102015666B1 (fr)
DE (1) DE102013205446A1 (fr)
SG (1) SG193771A1 (fr)
TW (1) TWI574781B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6250435B2 (ja) * 2014-02-26 2017-12-20 光洋機械工業株式会社 両頭平面研削法
JP6183301B2 (ja) * 2014-06-16 2017-08-23 信越半導体株式会社 自動ハンドリング装置
JP6383700B2 (ja) * 2015-04-07 2018-08-29 光洋機械工業株式会社 薄板状ワークの製造方法及び両頭平面研削装置
JP6707831B2 (ja) * 2015-10-09 2020-06-10 株式会社Sumco 研削装置および研削方法
CN105448795B (zh) * 2015-11-30 2018-03-16 北京中电科电子装备有限公司 一种晶圆抓取系统
CN114227524A (zh) * 2021-12-30 2022-03-25 西安奕斯伟材料科技有限公司 双面研磨装置和双面研磨方法
CN115070604B (zh) * 2022-06-09 2023-09-29 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN114986381B (zh) * 2022-06-16 2023-08-22 西安奕斯伟材料科技股份有限公司 双面研磨装置和双面研磨方法
CN117206999B (zh) * 2023-11-08 2024-02-20 瓦房店威远滚动体制造有限公司 一种能够提高打磨精度的双端面磨床

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280155A (ja) * 1999-03-30 2000-10-10 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
JP2008110477A (ja) * 2008-02-01 2008-05-15 Sumitomo Metal Fine Technology Co Ltd 両面研摩装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10249687A (ja) * 1997-03-07 1998-09-22 Super Silicon Kenkyusho:Kk 薄板状工作物の両面研削・研磨装置
JP4798480B2 (ja) * 2005-05-25 2011-10-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの製造方法および両面研削方法並びに半導体ウェーハの両面研削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000280155A (ja) * 1999-03-30 2000-10-10 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
JP2008110477A (ja) * 2008-02-01 2008-05-15 Sumitomo Metal Fine Technology Co Ltd 両面研摩装置
JP4621261B2 (ja) * 2008-02-01 2011-01-26 株式会社住友金属ファインテック 両面研摩装置

Also Published As

Publication number Publication date
KR102015666B1 (ko) 2019-08-28
TW201402271A (zh) 2014-01-16
KR20130113367A (ko) 2013-10-15
SG193771A1 (en) 2013-10-30
DE102013205446A1 (de) 2013-10-24
JP5872947B2 (ja) 2016-03-01
JP2013215813A (ja) 2013-10-24

Similar Documents

Publication Publication Date Title
TWI574781B (zh) 在兩頭平面硏磨的工件搬入出方法及兩頭平面硏磨盤
JP6250435B2 (ja) 両頭平面研削法
JP6335672B2 (ja) 搬送装置
TWI512877B (zh) 工件搬運方法及工件搬運裝置
JP6305272B2 (ja) 搬送装置
KR20160134665A (ko) 워크유지장치
JP2013154443A (ja) 板状部材の研削装置および研削方法
JP2014086485A (ja) 搬送方法
JP2015118719A (ja) ガラス基板分離装置、ガラス基板分離方法及びガラス基板の製造方法
JP2010137349A (ja) ウェーハ用チャックテーブルおよびウェーハ処理装置
JP6474233B2 (ja) フレームユニット
KR101569970B1 (ko) 웨이퍼 에지 연마 장치
JP5001133B2 (ja) ウエーハの搬送装置
JP2020168675A (ja) 積層メンブレン、積層メンブレンを備える基板保持装置および基板処理装置
JP2021107099A (ja) 積層体加工方法、積層体加工装置及び積層体加工物の製造方法
JP5524766B2 (ja) 平行度確認治具
KR20120103052A (ko) 웨이퍼 처리 장치 및 웨이퍼를 처리하는 방법
JP5841798B2 (ja) 研削装置
JP2016096294A (ja) 吸着パッド
KR20150069683A (ko) 패드 컨디셔닝 전용 장치 및 방법
JP2006289539A (ja) 研磨機及び被研磨体の研磨方法
JPH09254028A (ja) ポリッシング装置のプッシャー
JP2019098420A (ja) 研削加工方法及び研削加工装置
KR20160047396A (ko) 서브 척테이블
JP2004281596A (ja) 円盤状ワーク芯出し装置