TWI573675B - 振動控制的基板傳送機械臂、系統及方法 - Google Patents

振動控制的基板傳送機械臂、系統及方法 Download PDF

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Publication number
TWI573675B
TWI573675B TW102142889A TW102142889A TWI573675B TW I573675 B TWI573675 B TW I573675B TW 102142889 A TW102142889 A TW 102142889A TW 102142889 A TW102142889 A TW 102142889A TW I573675 B TWI573675 B TW I573675B
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TW
Taiwan
Prior art keywords
vibration
substrate
end effector
sensor
arm
Prior art date
Application number
TW102142889A
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English (en)
Chinese (zh)
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TW201429653A (zh
Inventor
馬利尼爾
明柯維奇艾力克斯
哈德俊傑佛利C
堤爾布藍登
Original Assignee
應用材料股份有限公司
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Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201429653A publication Critical patent/TW201429653A/zh
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Publication of TWI573675B publication Critical patent/TWI573675B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1628—Program controls characterised by the control loop
    • B25J9/1653—Program controls characterised by the control loop parameters identification, estimation, stiffness, accuracy, error analysis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102142889A 2012-11-30 2013-11-25 振動控制的基板傳送機械臂、系統及方法 TWI573675B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261731816P 2012-11-30 2012-11-30

Publications (2)

Publication Number Publication Date
TW201429653A TW201429653A (zh) 2014-08-01
TWI573675B true TWI573675B (zh) 2017-03-11

Family

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TW102142889A TWI573675B (zh) 2012-11-30 2013-11-25 振動控制的基板傳送機械臂、系統及方法

Country Status (6)

Country Link
US (1) US9296105B2 (enExample)
JP (1) JP6254180B2 (enExample)
KR (2) KR101859441B1 (enExample)
CN (1) CN104813462B (enExample)
TW (1) TWI573675B (enExample)
WO (1) WO2014085163A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160020338A (ko) * 2014-08-13 2016-02-23 박호석 매니플레이터용 진동 모니터링 장치
US10014198B2 (en) * 2015-08-21 2018-07-03 Lam Research Corporation Wear detection of consumable part in semiconductor manufacturing equipment
NL2016330B1 (en) * 2016-02-26 2017-09-20 Mecal Intellectual Property And Standards B V Active inertial damper system and method
JP6739258B2 (ja) * 2016-07-06 2020-08-12 株式会社ダイヘン 振動低減制御装置、及びロボット
DE102017104335A1 (de) * 2017-03-02 2018-09-06 Physik Instrumente (Pi) Gmbh & Co. Kg Vorrichtung zur Bewegungsanalyse und Antriebsvorrichtung
JP6939024B2 (ja) 2017-03-31 2021-09-22 セイコーエプソン株式会社 ロボット制御装置、ロボットおよびロボットシステム
JP7106816B2 (ja) * 2017-03-31 2022-07-27 セイコーエプソン株式会社 制御装置、制御システム、およびロボットシステム
JP6870433B2 (ja) * 2017-03-31 2021-05-12 セイコーエプソン株式会社 制御装置、およびロボットシステム
JP2018171668A (ja) * 2017-03-31 2018-11-08 セイコーエプソン株式会社 制御装置、ロボット、およびロボットシステム
US10406562B2 (en) * 2017-07-21 2019-09-10 Applied Materials, Inc. Automation for rotary sorters
US10695907B2 (en) * 2017-09-29 2020-06-30 Intel Corporation Methods and apparatus for monitoring robot health in manufacturing environments
JP7051045B2 (ja) * 2017-11-08 2022-04-11 オムロン株式会社 移動式マニピュレータ、移動式マニピュレータの制御方法及びプログラム
DE102018207826A1 (de) * 2018-05-18 2019-11-21 Kuka Deutschland Gmbh Handhabung, insbesondere, Transport von Gütern, insbesondere Wafern, durch einen Roboter
US10533852B1 (en) * 2018-09-27 2020-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Leveling sensor, load port including the same, and method of leveling a load port
CN109240087B (zh) * 2018-10-23 2022-03-01 固高科技股份有限公司 实时改变指令规划频率抑制振动的方法和系统
JP7181055B2 (ja) * 2018-11-02 2022-11-30 ファナック株式会社 ロボット装置
JP2020157402A (ja) * 2019-03-26 2020-10-01 セイコーエプソン株式会社 ロボット制御装置、ロボットの制御方法、およびロボットシステム
CN110154057B (zh) * 2019-06-14 2023-08-01 中国计量大学 能够实现变位加工的减振末端执行器及变位加工制孔方法
JP7045353B2 (ja) * 2019-10-02 2022-03-31 株式会社アルバック 基板搬送装置、および、基板搬送方法
WO2021086745A1 (en) 2019-11-01 2021-05-06 Lam Research Corporation Wafer handling robot with gravitational field sensor
CN110757463B (zh) * 2019-11-20 2023-06-27 贵州大学 一种机械手抓取力度控制方法及装置
TWI728762B (zh) * 2020-03-27 2021-05-21 財團法人工業技術研究院 減低機械手臂振動之方法
US20210407837A1 (en) * 2020-06-30 2021-12-30 Applied Materials, Inc. Robot apparatus and systems, and methods for transporting substrates in electronic device manufacturing
TWI899391B (zh) * 2020-12-21 2025-10-01 日商發那科股份有限公司 機器人控制裝置及機器人系統
CN115338903A (zh) * 2021-04-28 2022-11-15 三和技研股份有限公司 具薄型脆性基材擦碰震荡传感器的入匣机械臂及传感器
DE102021204935A1 (de) * 2021-05-17 2022-11-17 Kuka Deutschland Gmbh Verfahren und System zum Betreiben einer Maschine
WO2023083573A1 (en) * 2021-11-15 2023-05-19 Asml Netherlands B.V. Method and system of reducing chamber vibration
TWI800174B (zh) 2021-12-22 2023-04-21 微程式資訊股份有限公司 具埋入式感測器之機械手臂承載裝置
CN116476102A (zh) * 2021-12-22 2023-07-25 微程式资讯股份有限公司 具埋入式感测器的机械手臂承载装置
US12552029B2 (en) 2022-09-01 2026-02-17 International Business Machines Corporation Controlling movement to avoid resonance
US20240203767A1 (en) * 2022-12-15 2024-06-20 Applied Materials, Inc. Vibration sensor assembly
KR102607486B1 (ko) * 2023-03-24 2023-11-29 주식회사 아임토리 로봇팔의 진동 노이즈 제거 방법 및 장치
TWI870230B (zh) * 2024-02-06 2025-01-11 三和技研股份有限公司 振動分析系統及包含其之工業自動化系統
CN120791719B (zh) * 2025-08-29 2026-07-31 浙江大学 一种针对多自由度scara机械臂的区块协同控制方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100178146A1 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5699145A (en) * 1993-07-14 1997-12-16 Nikon Corporation Scanning type exposure apparatus
WO2000024053A1 (en) * 1998-10-19 2000-04-27 Kabushiki Kaisha Yaskawa Denki Protective device for clean robot
JP2002134583A (ja) * 2000-10-24 2002-05-10 Tokyo Electron Ltd 基板搬送装置
JP2002305140A (ja) * 2001-04-06 2002-10-18 Nikon Corp 露光装置及び基板処理システム
US6956268B2 (en) * 2001-05-18 2005-10-18 Reveo, Inc. MEMS and method of manufacturing MEMS
JP2003228422A (ja) * 2002-02-04 2003-08-15 Canon Inc ステージ制御装置及び露光装置並びにデバイスの製造方法
US7204669B2 (en) * 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
JP4003741B2 (ja) * 2003-12-04 2007-11-07 松下電器産業株式会社 モータ制御装置
US8167522B2 (en) * 2005-03-30 2012-05-01 Brooks Automation, Inc. Substrate transport apparatus with active edge gripper
US20070001638A1 (en) * 2005-07-01 2007-01-04 Fsi International, Inc. Robot with vibration sensor device
CN101263499B (zh) * 2005-07-11 2013-03-27 布鲁克斯自动化公司 智能状态监测和故障诊断系统
US20070097340A1 (en) * 2005-10-31 2007-05-03 Nikon Corporation Active damper with counter mass to compensate for structural vibrations of a lithographic system
JP2007251088A (ja) 2006-03-20 2007-09-27 Tokyo Electron Ltd 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法
JP4606388B2 (ja) * 2006-06-12 2011-01-05 川崎重工業株式会社 基板移載装置の搬送系ユニット
US7498759B2 (en) * 2006-08-17 2009-03-03 Micron Technology, Inc. Semiconductor wafer processing accelerometer
DE502006008851D1 (de) * 2006-11-08 2011-03-17 Integrated Dynamics Eng Gmbh Kombiniertes Motion-Control-System
US7778793B2 (en) * 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
US7861593B2 (en) * 2008-07-03 2011-01-04 Oracle America, Inc. Rotational vibration measurements in computer systems
US20100129940A1 (en) * 2008-11-24 2010-05-27 Texas Instruments Incorporated Vibration monitoring of electronic substrate handling systems
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8784033B2 (en) * 2009-01-11 2014-07-22 Applied Materials, Inc. Robot systems, apparatus and methods for transporting substrates
US20100222898A1 (en) * 2009-01-27 2010-09-02 Nikon Corporation Stage-control systems and methods including inverse closed loop with adaptive controller
US8451431B2 (en) * 2009-01-27 2013-05-28 Nikon Corporation Control systems and methods applying iterative feedback tuning for feed-forward and synchronization control of microlithography stages and the like
JP5549129B2 (ja) * 2009-07-06 2014-07-16 セイコーエプソン株式会社 位置制御方法、ロボット
JP2011152621A (ja) * 2010-01-28 2011-08-11 Yaskawa Electric Corp 基板搬送用装置
JP2011161562A (ja) * 2010-02-09 2011-08-25 Yaskawa Electric Corp 無線伝送装置とそれを用いたロボットの振動抑制制御装置およびロボット制御装置
US8318094B1 (en) * 2010-06-18 2012-11-27 Pacific Biosciences Of California, Inc. Substrate analysis systems
JP2012044014A (ja) * 2010-08-20 2012-03-01 Canon Inc 除振装置、それを用いた露光装置及びデバイスの製造方法
JP5645564B2 (ja) * 2010-09-14 2014-12-24 キヤノン株式会社 センサ装置及びロボット装置
JP5817142B2 (ja) * 2011-02-22 2015-11-18 セイコーエプソン株式会社 水平多関節ロボット
JP5118785B2 (ja) * 2011-04-12 2013-01-16 パナソニック株式会社 Mems圧力センサ
WO2013039550A2 (en) * 2011-09-13 2013-03-21 Persimmon Technologies Corporation Method for transporting a substrate with a substrate support
US8983660B1 (en) * 2012-10-01 2015-03-17 Kla-Tencor Corporation Substrate transporter

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100178146A1 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for transporting substrates

Also Published As

Publication number Publication date
WO2014085163A1 (en) 2014-06-05
CN104813462B (zh) 2017-04-26
US9296105B2 (en) 2016-03-29
KR20150091346A (ko) 2015-08-10
JP2015536253A (ja) 2015-12-21
TW201429653A (zh) 2014-08-01
KR101859441B1 (ko) 2018-05-21
JP6254180B2 (ja) 2017-12-27
CN104813462A (zh) 2015-07-29
KR20170038107A (ko) 2017-04-05
US20140156070A1 (en) 2014-06-05

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