TWI573500B - Manufacturing method of surface-treated copper foil, copper-clad laminate, printed wiring board, electronic machine and printed wiring board - Google Patents

Manufacturing method of surface-treated copper foil, copper-clad laminate, printed wiring board, electronic machine and printed wiring board Download PDF

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Publication number
TWI573500B
TWI573500B TW103143259A TW103143259A TWI573500B TW I573500 B TWI573500 B TW I573500B TW 103143259 A TW103143259 A TW 103143259A TW 103143259 A TW103143259 A TW 103143259A TW I573500 B TWI573500 B TW I573500B
Authority
TW
Taiwan
Prior art keywords
copper foil
copper
treated
brightness
measured
Prior art date
Application number
TW103143259A
Other languages
English (en)
Chinese (zh)
Other versions
TW201532485A (zh
Inventor
Hideta Arai
Atsushi Miki
Kohsuke Arai
Kaichiro Nakamuro
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201532485A publication Critical patent/TW201532485A/zh
Application granted granted Critical
Publication of TWI573500B publication Critical patent/TWI573500B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Laser Beam Processing (AREA)
TW103143259A 2013-12-10 2014-12-10 Manufacturing method of surface-treated copper foil, copper-clad laminate, printed wiring board, electronic machine and printed wiring board TWI573500B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013255472 2013-12-10

Publications (2)

Publication Number Publication Date
TW201532485A TW201532485A (zh) 2015-08-16
TWI573500B true TWI573500B (zh) 2017-03-01

Family

ID=53371241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103143259A TWI573500B (zh) 2013-12-10 2014-12-10 Manufacturing method of surface-treated copper foil, copper-clad laminate, printed wiring board, electronic machine and printed wiring board

Country Status (7)

Country Link
JP (1) JP5819571B1 (ko)
KR (1) KR101944166B1 (ko)
CN (1) CN105980609B (ko)
MY (1) MY183375A (ko)
PH (1) PH12016501130A1 (ko)
TW (1) TWI573500B (ko)
WO (1) WO2015087942A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6895936B2 (ja) * 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987889A (ja) * 1995-09-28 1997-03-31 Nikko Gould Foil Kk 印刷回路用銅箔の処理方法
JP2011240625A (ja) * 2010-05-19 2011-12-01 Jx Nippon Mining & Metals Corp 銅張積層板
JP2012212529A (ja) * 2011-03-30 2012-11-01 Jx Nippon Mining & Metals Corp 二次電池負極集電体用電解銅箔及びその製造方法
JP2012211351A (ja) * 2011-03-30 2012-11-01 Jx Nippon Mining & Metals Corp 電解銅箔及び電解銅箔の製造方法
JP2012224941A (ja) * 2011-03-23 2012-11-15 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984456B2 (en) 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
JP2004098659A (ja) 2002-07-19 2004-04-02 Ube Ind Ltd 銅張積層板及びその製造方法
JP3977790B2 (ja) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板
CN102224281B (zh) * 2008-11-25 2014-03-26 吉坤日矿日石金属株式会社 印刷电路用铜箔
TWI503062B (zh) 2012-05-21 2015-10-01 Jx Nippon Mining & Metals Corp Surface treatment of copper foil and the use of its laminated board, printed wiring board, electronic equipment and manufacturing printed wiring board method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0987889A (ja) * 1995-09-28 1997-03-31 Nikko Gould Foil Kk 印刷回路用銅箔の処理方法
JP2011240625A (ja) * 2010-05-19 2011-12-01 Jx Nippon Mining & Metals Corp 銅張積層板
JP2012224941A (ja) * 2011-03-23 2012-11-15 Jx Nippon Mining & Metals Corp 銅箔及びそれを用いた銅張積層板
JP2012212529A (ja) * 2011-03-30 2012-11-01 Jx Nippon Mining & Metals Corp 二次電池負極集電体用電解銅箔及びその製造方法
JP2012211351A (ja) * 2011-03-30 2012-11-01 Jx Nippon Mining & Metals Corp 電解銅箔及び電解銅箔の製造方法

Also Published As

Publication number Publication date
CN105980609B (zh) 2018-08-07
CN105980609A (zh) 2016-09-28
PH12016501130A1 (en) 2016-07-18
KR20160086378A (ko) 2016-07-19
WO2015087942A1 (ja) 2015-06-18
JP5819571B1 (ja) 2015-11-24
KR101944166B1 (ko) 2019-01-30
TW201532485A (zh) 2015-08-16
JPWO2015087942A1 (ja) 2017-03-16
MY183375A (en) 2021-02-18

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