TWI571954B - Substrate processing system and substrate reversing device - Google Patents

Substrate processing system and substrate reversing device Download PDF

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Publication number
TWI571954B
TWI571954B TW103102243A TW103102243A TWI571954B TW I571954 B TWI571954 B TW I571954B TW 103102243 A TW103102243 A TW 103102243A TW 103102243 A TW103102243 A TW 103102243A TW I571954 B TWI571954 B TW I571954B
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TW
Taiwan
Prior art keywords
substrate
pair
holding arm
transfer
arm groups
Prior art date
Application number
TW103102243A
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Chinese (zh)
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TW201436087A (en
Inventor
成尾徹
Original Assignee
三星鑽石工業股份有限公司
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Priority to JP2013043127A priority Critical patent/JP6064684B2/en
Application filed by 三星鑽石工業股份有限公司 filed Critical 三星鑽石工業股份有限公司
Publication of TW201436087A publication Critical patent/TW201436087A/en
Application granted granted Critical
Publication of TWI571954B publication Critical patent/TWI571954B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/248Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
    • B65G47/252Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them about an axis substantially perpendicular to the conveying direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Description

Substrate processing system and substrate reversing device
The present invention relates to a substrate processing system for processing both sides of a substrate, and more particularly to a substrate inverting device for performing substrate inversion.
As a method of dividing a brittle material substrate (hereinafter simply referred to as a substrate) such as a glass substrate, the following method is widely used, and even if the cutter wheel is pressed against one surface of the substrate and rotated to form a score line, The back surface of the substrate surface is reversed, and the cracking rod is pressed against the portion directly above the previously formed scribe line of the other surface to perform cracking. In the above case, it is necessary to have a mechanism for forming a back surface of the substrate after the scribe line is formed.
Further, in the process of the liquid crystal panel, generally, a large mother substrate, which is also referred to as a bonded substrate, is formed by bonding two blank brittle material substrates, and is formed by a scribe line by a cutter wheel, but As a method of the above-described breaking, the following method is widely used, and even if the cutter wheel is pressed against the front surface of the mother substrate in order to rotate, a scribe line is formed, and even if the cutter wheel is sequentially pressed against the constituent mother substrate, The surface of each of the brittle material substrates is rotated to form a score line. In this case, the substrate must also be reversed by the reversing mechanism.
For example, an inversion mechanism that sandwiches and reverses a substrate from above and below is provided, and a substrate having a score line formed on one surface of the substrate is temporarily attached to the inversion mechanism from the upstream side and inverted, and reversed. A substrate breaking system in which a substrate is transferred to a device on the downstream side is known (for example, refer to Patent Document 1).
Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-76957
In the case of the conventional reversing mechanism disclosed in Patent Document 1, the inversion of the next substrate cannot be started until the previous substrate that has been completed is reversed from the reversing mechanism. Therefore, there is a problem that the continuous breaking process cannot be performed and the work efficiency is low.
The present invention has been made in view of the above problems, and an object thereof is to realize a substrate inverting device capable of performing substrate processing with high processing efficiency by continuously inverting a substrate, and a substrate processing system including the same.
In order to solve the problem, the substrate processing system according to the first aspect of the invention includes the first transfer device and the second transfer device, wherein the brittle material substrate is transported in the first direction, and the substrate inverting device is disposed in the first transport device. The brittle material substrate conveyed by the first conveying device is reversely transferred to the second conveying device, and the first conveying device and the second conveying device are The plurality of unit transport elements arranged in the gap in the second direction orthogonal to the first direction are transported while supporting one of the brittle material substrates. The substrate inverting device includes a pair of holding arm groups. a rotation axis extending in two directions is arranged to be rotationally symmetrical; a rotation driving means rotates the pair of holding arm groups about the rotation axis; and a lifting means for moving the pair of holding arm groups in the first conveying device and the second conveying Between the devices, the height position of the brittle material substrate is transferred, that is, between the substrate transfer position and the upper portion thereof; and each of the pair of holding arm groups is disposed apart from each other in the second direction. a plurality of holding arms that pass through the gap when rotating around the rotating shaft; each of the plurality of holding arms includes a plurality of adsorption portions that are adsorbable on the substrate of the brittle material; and the pair of holding arm groups are disposed at the substrate transfer position In the state, the complex retaining arm belonging to one of the pair of holding arm groups is caused by the complex a plurality of adsorption portions are adsorbed to the substrate to be reversed which is the target material for reversal, and then the pair of holding arm groups are rotated by 180 degrees around the rotation axis to invert the substrate to be reversed; a pair of holding arm groups are lifted higher than the substrate transfer position after the inversion target substrate is adsorbed to the plurality of adsorption portions and before the inversion of the inversion target substrate is completed, and the substrate is reversed. After the reversal, the adsorption of the plurality of adsorption portions of the substrate to be reversed is released, and the substrate is lowered to the substrate transfer position.
According to a second aspect of the invention, in the substrate processing system of claim 1, the inversion target substrate of the pair of holding arm groups is adsorbed by the plurality of adsorption portions after being inverted at the substrate transfer position The height position of the surface is the same as the transport height position of the second transport device, and the second transport apparatus supports the reversed target substrate while supporting the reversed target substrate. Lifted.
The invention of claim 3, wherein in the substrate processing system of claim 2, the plurality of adsorption portions of the plurality of holding arms belonging to one of the pair of holding arm groups and the other one of the pair of holding arm groups The plurality of adsorption portions of the plurality of holding arms are disposed 180 degrees apart from each other, and the end positions of the two are located on a common plane parallel to the rotation axis; the conveying height of the first conveying device The position is different from the transport height position of the second transport device by a distance equal to the thickness of the brittle material substrate; and the pair of the retaining arm groups are disposed at the substrate transfer position, and the reverse is performed substantially simultaneously The release of the adsorption of the plurality of adsorption portions of the transfer target substrate and the plurality of adsorption portions of the plurality of holding arms belonging to the other of the pair of holding arm groups are opposite to each other being transported by the first transfer device The adsorption is performed on the substrate to be transferred.
The invention of claim 4, the basis of any one of claim 1 to claim 3 In the plate processing system, the rotating shaft has a disc-shaped flange portion at one end portion and the other end portion is coupled to a rod-shaped shaft of the rotational driving means; the substrate reversing device has the shaft rotatably supported And a pair of supporting means for supporting the lifting means; the flange portion is slidably fitted to the tubular member located in one of the pair of supporting means; and the first through hole provided in the flange portion is transmitted through the first suction pipe The second through hole provided in the tubular member is connected to the suction portion and connected to the suction means by the second suction pipe.
The substrate inverting device according to claim 5 is characterized in that the brittle material substrate transferred in the first direction is reversed, and the pair of holding arm groups are provided in a second direction orthogonal to the first direction. The extended rotating shaft is configured to be rotationally symmetrical; the rotational driving means rotates the pair of holding arm groups about the rotating shaft; and the lifting means causes the pair of holding arm groups to communicate with the outside to transfer the brittle material substrate a height position, that is, a lifting and lowering position between the substrate transfer position and the upper portion thereof; each of the pair of holding arm groups having a plurality of holding arms that pass through the gap when the second direction is separated from each other and rotates around the rotating shaft; the plurality of holding arms Each of the plurality of adsorption portions that are adsorbable on the substrate of the brittle material; and the plurality of holding arms that belong to one of the pair of holding arm groups in a state in which the pair of holding arm groups are disposed at the substrate transfer position The plurality of adsorption portions are adsorbed to the substrate to be reversed which is the target material for reversal, and then the pair of holding arm groups are rotated by 180 degrees around the rotation axis to cause the reaction. The target substrate is reversed, and the pair of holding arm groups are raised higher than the substrate transfer position after the inversion target substrate is adsorbed to the plurality of adsorption portions and before the inversion of the inversion target substrate is completed. After the inversion of the substrate to be reversed and the adsorption of the plurality of adsorption portions of the substrate to be reversed is released, the substrate is lowered to the substrate transfer position.
According to the invention of claim 1 to claim 5, the base to be reversed can be performed substantially simultaneously The loading operation of the board and the holding operation of the substrate. Further, the transfer of the substrate to be reversed, the transfer of the substrate which has been previously reversed, and the holding and holding of the holding arm to the loaded substrate can be performed substantially simultaneously. That is, the inversion of the substrate to be reversed and the inversion of the substrate can be performed substantially simultaneously. Thereby, a substrate processing system excellent in reverse processing efficiency can be realized.
100‧‧‧Substrate reversal device
101‧‧‧Axis
101a‧‧‧Front Department
101b‧‧‧Cylinder
101c‧‧‧Power Transmission Department
102‧‧‧ Keeping the arm
103‧‧‧Adsorption pad
110‧‧‧foot
120‧‧‧ shaft support
130‧‧‧Rotary drive
130a‧‧‧Rotary axis
140‧‧‧Attraction pump
200‧‧‧ scoring device
201‧‧‧ platform
202‧‧‧Bridge
203‧‧‧Scratch
300‧‧‧Transporting device
301‧‧‧Unit Transfer Department
302‧‧‧Roller
400‧‧‧Transfer device
401‧‧‧Adsorption pad
402‧‧‧Adsorption arm
403‧‧‧Guide
1000‧‧‧Substrate processing system
W (W1, W2) ‧ ‧ substrate
1 is a plan view showing a configuration of a main part of a substrate processing system 1000.
2 is a plan view showing a configuration in the vicinity of the substrate inverting device 100.
3 is a side view showing the YZ of the configuration in the vicinity of the substrate inverting device 100.
4 is a side view of the ZX on the -Y side in the vicinity of the substrate inverting device 100.
Fig. 5 is a side view of the ZX on the +Y side in the vicinity of the substrate inverting device 100.
Fig. 6 is a side view showing the YZ of the pair of holding arm groups as they rise from the substrate transfer position.
Fig. 7 is a view showing a state in which a pair of holding arm groups are raised by a predetermined distance.
8(a) to 8(d) are views sequentially showing the state in which the substrate W is reversed by the substrate inverting device 100.
9(a) to 9(d) are views sequentially showing how the substrate W is reversed by the substrate inverting device 100.
FIG. 10 is a YZ side view of the vicinity of the substrate inverting device 100 of the substrate processing system 1000 including the transfer device 300 according to a modification.
(summary of the system)
Fig. 1 is a plan view showing the configuration of a main part of a substrate processing system 1000 of the present embodiment. The substrate processing system 1000 of the present embodiment mainly includes a substrate inverting device 100 and two engravings. The device 200 (the first scribing device 200A and the second scribing device 200B) and the two transport devices 300 (the first transport device 300A and the second transport device 300B).
The substrate processing system 1000 is generally a system for processing a series of processes in which a main surface of a brittle material substrate (hereinafter simply referred to as a substrate) W such as a glass substrate is formed by the first scribing device 200A. After the scribing, the substrate W is reversed by the substrate inverting device 100, and then the other main surface is scribed by the second scribing device 200B.
Further, in FIG. 1 and the following drawings, the traveling direction of the substrate W in the horizontal plane when the substrate processing system 1000 is sequentially processed in series is the Y-axis positive direction and the direction orthogonal to the Y-axis in the horizontal plane. The right-handed XYZ coordinate in the X-axis direction and the vertical direction in the Z-axis direction.
The substrate inverting device 100 mainly includes a shaft 101 which is a rod-shaped member extending in the X-axis direction, and a plurality of holding arms 102 extending perpendicularly from the shaft 101. The plurality of holding arms 102 extend in two directions different from each other by 180 degrees, and the holding arms 102 in the same direction are disposed to be separated from each other. In the present embodiment, a configuration in which six holding arms 102 are provided in each direction is exemplified. Further, after that, a plurality of holding arms 102 extending in the same direction as appropriate will be collectively referred to as a holding arm group. In the substrate inverting device 100, two holding arm groups (a pair of holding arm groups) in which the extending directions of the holding arms 102 are different from each other are disposed.
Further, the adsorption pad 103 is disposed on the holding arm 102. In the state in which the substrate W that has been transported by the first transfer device 300A is sucked and held from below by the adsorption pad 103, the holding arm 102 is reversed by 180 degrees with the shaft 101 as a rotation axis, thereby making the substrate When the W is reversed, the substrate W is immediately transferred to the second transfer device 300B. The detailed configuration of the substrate inverting device 100 will be described later.
The scribing device 200 includes a platform 201 that is movable in the Y-axis direction while the substrate W is placed and fixed thereon, and a bridge portion 202 that is disposed in the longitudinal direction of the X-axis direction above the moving range of the stage 201, and is attached thereto. At least one of the bridges 202 (four in Figure 1) scribes the head 203. Further, in the vertical lower portion of the scribing head 203, a scribing wheel (not shown) having a disk shape and an outer peripheral portion serving as a tip end of the blade is rotatably attached in a vertical posture and in a plane.
In the scribing device 200 configured as described above, the scribing head 203 is placed at an appropriate position of the bridge portion 200, and the platform W is moved in the positive direction of the Y-axis while the substrate W is placed and fixed on the stage 201. The roller is crimped and rotated to the substrate W, whereby the substrate W can be formed with a scribe line along the Y-axis direction.
Further, the configuration of the scribing device 200 constituting the substrate processing system 100 is not limited thereto. For example, in a state in which the substrate W is disposed below, the scribe head 203 having the scribing wheel at the lower portion is moved in the X-axis direction, thereby forming a scribe line. Alternatively, a plurality of forms of the bridge portion 202 having the scribed head 203 may be disposed.
The transport device 300 is a device that transports the substrate W between the substrate inverting device 100 and the scribing device 200. Specifically, the first transfer device 300A transports the substrate W on which the score line is formed by the first scribing device 200A to the inversion start position of the substrate inverting device 100. The second transport apparatus 300B transports the substrate W inverted by the substrate inverting apparatus 100 from the inversion end position of the substrate inverting apparatus 100 toward the second scribing apparatus 200B.
The transport apparatus 300 includes a plurality of (seven in the present embodiment) unit transport units (unit transport elements) 301 that are disposed in parallel with the Y-axis and that are separated from each other. Each of the substrates W is transported in a state where the transport device 300 is supported by all of the unit transport units 301. More specifically, each unit transport unit 301 is a belt type in which the Y-axis direction is the longitudinal direction (transport direction) and operates in synchronization with each other. Conveyor.
Further, each unit conveying unit 301 is disposed so as to be able to be disposed in a gap between two adjacent unit conveying units 301 when the holding arm 102 of the substrate reversing device 100 is reversely rotated by the rotation of the shaft 101. However, the unit transport unit 301 (the first unit transport unit 301A) of the first transport apparatus 300A and the unit transport unit 301 (the second unit transport unit 301B) of the second transport apparatus 300B are disposed at the position in the vertical direction ( Height position) is different. Specifically, the second unit transport unit 301B is disposed at a position higher than the thickness t of the substrate W which is the processing target of the substrate processing system 1000, as compared with the first unit transport unit 301A.
The substrate processing system 1000 of the present embodiment further includes two transfer devices 400 (the first transfer device 400A and the second transfer device 400B). The transfer device 400 handles the transfer of the substrate W between the scribing device 200 and the adjacent transfer device 300. The transfer device 400 includes a suction arm 402 that extends in the X-axis direction and that is provided with a suction pad 401 that is vertically downward at the distal end portion, and a guide 403 that supports the adsorption arm 402 so as to be movable in the Y-axis direction.
More specifically, the first transfer device 400A adsorbs and holds the substrate W that has been scribed by the first scribe device 200A and transfers it to the first transfer device 300A. The second transfer device 400B adsorbs and holds the substrate W transported by the second transfer device 300B and transfers it to the stage 201 of the second scribing device 200B.
Further, the transfer device 400 is not necessarily configured in the substrate processing system 1000. The substrate processing system 1000 may be configured such that the scribing device 200 directly transfers the substrate W to and from the transfer device 300. In the above case, the transfer device 400 is not required.
(Detailed structure of the substrate inverting device)
2 and 3 show the main part of the substrate processing system 1000 of the present embodiment, that is, A plan view and a YZ side view of the configuration in the vicinity of the substrate inverting device 100. In FIGS. 2 and 3, the state in which the substrate W is transferred between the first transfer device 300A and the substrate inverting device 100 is shown.
Further, FIGS. 4 and 5 are a ZX side view on the -Y side and a ZX side view on the +Y side in the vicinity of the substrate inverting device 100 in the state shown in FIGS. 2 and 3, respectively. However, in FIGS. 4 and 5, the components arranged on the +Y side are omitted, and in FIG. 5, the components arranged on the -Y side are omitted.
As described above, the substrate inverting device 100 includes the shaft 101 extending in the X-axis direction and rotatable in the X-axis direction, and the holding arm group including the plurality of holding arms 102 each having the plurality of adsorption pads 103 The shaft 101 extends in two directions different from each other by 180 degrees. Further, in FIG. 2, each of the holding arm groups is formed in a comb shape with respect to the shaft 101.
However, the holding arms 102 (generally referred to as holding arms 102A) belonging to one of the holding arm groups and the plurality of holding arms 102 belonging to the other holding arm group (referred to as holding arms 102B in particular) are The end position (adsorption position) of one of the adsorption pads 103 and the end position (adsorption position) of the other adsorption pad 103 are 180 degrees apart from each other in the direction of the adsorption pad 103 provided to each other, even if the holding arm 102A and the holding arm 102B are held The posture change is also located on a common plane parallel to the axis 101, and is fixed to the shaft 101.
For example, in the case where the holding arm 102 illustrated in FIGS. 1 to 5 has a horizontal posture, for example, as shown in FIG. 3, the suction pad 103 of the holding arm 102A faces downward (-Z direction), whereas the holding arm 102B is opposed thereto. The adsorption pad 103 faces vertically upward (+Z direction), but the end portion (lower end portion) of the former is located in the same plane as the end portion (upper end portion) of the latter. That is, at the same height position. By the rotation of the shaft 101, the posture of all the holding arms 102 changes, but the direction of the adsorption pad 103 disposed in the holding arm 102A is constant by 180 degrees from the direction of the adsorption pad 103 disposed in the holding arm 102B.
In other words, the holding arm 102A belonging to one of the holding arm groups and the holding arm 102B belonging to the other holding arm group are arranged to be rotationally symmetrical with respect to the shaft 101 in the YZ plane.
The substrate inverting device 100 further includes a pair of leg portions 110, a pair of shaft support portions 120, and a rotation driving means 130.
The pair of leg portions 110 are disposed apart from each other in the X-axis direction, and the shaft 101 that extends in the X-axis direction through the shaft support portion 120 is supported at its both end portions from below. Further, in the present embodiment, in order to simplify the illustration, the pair of leg portions 110 are arranged to be independently arranged, but the pair of leg portions 110 may be provided on a base (not shown).
The pair of shaft support portions 120 are connected to both end portions of the shaft 101, and are provided on the upper side of the corresponding leg portion 110 in a vertically movable manner. That is, the shaft support portion 120 can be raised and lowered while supporting the shaft 101. Thereby, in the substrate inverting device 100, the height position of the shaft 101 and the holding arm 102 fixed thereto can be changed. The details of the lifting range of the shaft support portion 120 will be described later. Further, the above-described lifting operation can be performed in parallel with the rotation of the shaft 101.
The specific configuration of the raising and lowering of the shaft support portion 120 can be realized by a known technique. Preferably, the lifting of the shaft support portion 120 is achieved by a linear motor mechanism. For example, a fixing member (not shown) is extended in the Z-axis direction of the leg portion 110, and a movable member (not shown) is provided in the shaft supporting portion 120 to move the movable member along the fixing member, thereby being as shown in FIGS. 4 and 5. As indicated by the arrow AR, the shaft support portion 120 can be moved up and down in a predetermined range in the Z-axis direction.
In the present embodiment, the two shaft support portions 120 are disposed between the pair of leg portions 110 in the X-axis direction. However, the arrangement relationship between the two is not limited thereto.
The rotary drive means 130 is a drive means for rotating the shaft 101. As a spin The turning drive means 130 is preferably, for example, a rotary cylinder.
More specifically, in the substrate inverting device 100, a disk-shaped flange portion 101a is fixed to one end portion of the shaft 101 (the +X side end portion in the present embodiment). On the other hand, the tubular support portion 120 is fixed to the tubular portion 101b that opens in the X-axis direction. Further, the outer peripheral portion of the flange portion 101a is fitted to the inner surface of the opening portion of the tubular portion 101b in a slidable state.
Moreover, the power transmission portion 101c is fixed to the other end portion of the shaft 101 (the -X side end portion in the present embodiment). In the power transmission unit 101c, the rotation shaft 130a of the rotation driving means 130 extending in the +X direction is supported by the shaft support portion 120 and coupled.
With the above configuration, when the rotation driving device 130 is operated by the substrate reversing device 100, the rotation portion 130a supported by the shaft support portion 120 and the power transmission portion 101c connected thereto can transmit the foot portion 110 and The shaft 101 supported by the shaft support portion 120 rotates. Thereby, the rotation of the holding arm 120 about the shaft 101 can be achieved. Moreover, at this time, since the flange portion 101a slides with respect to the tubular portion 101b at the other end portion of the shaft 101, the rotation operation can be stably performed.
Further, although not shown in FIGS. 1 to 3, as shown in FIGS. 4 and 5, two first 埠P1, which are through holes, are provided in the flange portion 101a, and the side surface of the tubular portion 101b is similarly The second hole P2 is provided as a through hole. Further, the first suction pipe T1 is connected to the first turn P1, and the second suction pipe T2 is connected to the second turn P2. Thereby, the first suction pipe T1 and the second suction pipe T2 are in a state of spatial communication.
Further, the other ends of the two first suction tubes T1 are connected to the adsorption pad 103 via suction paths provided on the holding arm 102, respectively. More specifically, one of the first suction tubes T1 is connected to the adsorption pad 103 on the holding arm 102A side, and the other first suction tube T1 is connected to the adsorption pad 103 on the holding arm 102B side. Further, the other end of the second suction pipe T2 is connected to the suction pump 140. With the above configuration, in the substrate inverting device 100, the suction pump 140 is operated while the substrate W is placed on the adsorption pad 103, whereby the substrate W can be adsorbed and fixed by the adsorption pad 103. FIG. 4 conceptually shows a state in which the first suction pipe T1 is connected to a part of the adsorption pads 103 and a connection between the second suction pipe T2 and the suction pump 140.
In addition, as described above, the flange portion 101a to which the first suction pipe T1 is connected is slidable with respect to the tubular body to which the second suction pipe T2 is connected when the shaft 101 rotates, so that even when the shaft 101 is rotated, Stay attractive. As a result, in the substrate inverting apparatus 100 of the present embodiment, the substrate W can be adsorbed and held by the adsorption pad 103 even if the holding arm 102 is rotated.
(Arrangement relationship between the transfer device 300 and the substrate inverting device)
Next, the arrangement relationship between the transport apparatus 300 and the substrate reversing apparatus 100 will be described. Specifically, the arrangement relationship between the unit transport unit 301 of the first transport apparatus 300A and the second transport apparatus 300B and the rotation of the shaft 101 after the shaft support unit 120 is raised and lowered will be described. The relationship between the position of the holding arm 102A and the holding arm 102B that are changed.
As described above, in the substrate processing system 1000 of the present embodiment, the height position of the unit transfer unit 301 of the first transfer device 300A and the unit transfer unit 301 of the second transfer device 300B differs by the thickness t of the substrate W. On the other hand, in the substrate inverting device 100, the holding arm 102A and the holding arm 102B are provided so as to be rotationally symmetrical with respect to the shaft 101 and the end portions of the adsorption pads 103 respectively provided are located on a common plane. Further, by rotating the shaft 101 by the rotation driving means 130, the pair of holding arm groups can be rotated about the shaft 101, and the height of the shaft 101 and the pair of holding arm groups can be changed by raising and lowering the shaft supporting portion 120. .
The arrangement relationship of the parts and the lifting range of the pair of holding arm groups are set to be efficiently performed from the unit conveying unit 301 of the first conveying apparatus 300A to the pair of holding arm groups. The transfer of one of the substrates, the transfer from the other of the pair of holding arm groups to the substrate W of the second transfer device 300B, and the reversal of the substrate W between the transfer and the first transfer device 300A and the second transfer The substrate W of the device 300B is transported.
Specifically, first, FIG. 1 to FIG. 5 show how a pair of holding arm groups are located at the substrate transfer position. As shown in FIG. 2 and FIG. 3, the substrate transfer position is defined as a pair of holding arm groups in a horizontal posture, and the height position of the lower end of the adsorption pad 103 provided in the holding arm 102A on the -Y side of the shaft 101 is lower than that of the first transfer. The upper surface of the first unit transfer unit 301A of the apparatus 300A is raised above the thickness t of the substrate W. When the pair of holding arm groups are located at the substrate transfer position, after the substrate W is transported to the +Y side end portion in the first transfer device 300A, the height position of the lower end of the adsorption pad 103 coincides with the height position of the upper surface of the substrate W, and thus the adsorption pad 103 can perform adsorption of the substrate W.
Further, at this time, according to the above-described arrangement relationship, the height position of the upper surface of the second conveying device 300B is the same as the height position of the upper end of the adsorption pad 103 provided on the holding arm 102B on the +Y side of the relatively axial axis 101, and thus the lower surface of the adsorption surface is The substrate W is held by the adsorption pad 103, and the substrate W can be supported by the second transfer device 300B.
In other words, when the pair of holding arm groups are located at the substrate transfer position, the substrate from the first transfer device 300A to the substrate W of the substrate inverting device 100 and the substrate from the substrate inverting device 100 to the second transfer device 300B can be substantially simultaneously. The handover.
Further, Fig. 6 is a side view showing the YZ of the pair of holding arm groups as they rise from the substrate transfer position shown in Figs. 1 to 5 . However, the substrate W is omitted in FIG.
As shown in Fig. 6, in the present embodiment, the holding arm 102 is rotated as indicated by an arrow RT while raising the pair of holding arm groups. More specifically, while the holding arm 102A and the holding arm 102B are reversed by 180 degrees, the shaft support portion 120 is raised to raise the pair of holding arm groups. or, After the pair of holding arm groups are raised, the holding arm 102A and the holding arm 102B may be reversed by 180 degrees.
On the other hand, the state in which the pair of holding arm groups are raised by a predetermined distance is shown in FIG. However, the substrate W is also omitted in FIG.
FIG. 3 is compared with FIG. 3 in a state in which the pair of holding arm groups are located at the substrate transfer position. In the former case, the shaft support portion 120 is located at a higher position with respect to the leg portion 110, and the relative arrangement relationship of the pair of holding arm groups is the same. However, the arrangement relationship between the holding arm 102A and the holding arm 102B is replaced on both sides of the shaft 101 in the Y-axis direction.
Further, it has been confirmed that the rotation of the holding arm 102 does not collide with the unit conveying unit 301 from the arrangement relationship shown in FIG. 2 .
As shown in FIG. 7, the distance between the pair of holding arm groups rising from the substrate transfer position is constant, and the height position of the upper transfer unit 301B of the second transfer device 300B and the suction pad of the holding arm 102A on the +Y side of the lower axis 101 are shown. The distance d of the height position of the upper end of 103 is equal. In addition, the rise of the pair of holding arm groups is performed to prevent the interference between the adsorption pad 103 of the holding arm 102A and the substrate W to be conveyed during the conveyance of the substrate W in the +Y direction by the first conveying device 300A. Therefore, the rising distance of the pair of holding arm groups is sufficient as long as it is several mm. In Fig. 7, the above distance d is exaggerated.
The lowering of one of the holding arms to the substrate transfer position after the temporary rise is performed while the holding arm 102 is held in the horizontal posture. Further, it is not necessary to make the pair of holding arm groups rise and then stand still, and the ascending and descending may be continuously performed.
(substrate reverse order)
Next, the reverse sequence of the substrate W of the substrate inverting apparatus 100 having the above configuration will be described. 8 and 9 are views sequentially showing the state in which the substrate W of the substrate inverting device 100 is reversed. In addition, Fig. 8 mainly shows the state in which the substrate inverting device 100 starts to operate, and Fig. 9 mainly shows the normal state in which the inversion of the substrate W is continuously performed.
In the description, for convenience, as shown in FIG. 8( a ), the pair of holding arm groups are lifted from the substrate transfer position and are in a state of being in a horizontal posture. In the above-described state, first, the substrate W (W1) which has been subjected to the first scribing device 200A scribing process is placed on the first unit transport unit 301A of the first transport apparatus 300A. The substrate W1 is transported in the +Y direction by the first unit transport unit 301A as indicated by an arrow AR1.
Then, while the substrate W1 is being transported to the +Y side end side of the first unit transport unit 301A, as shown by an arrow AR2 in FIG. 8(b), the pair of holding arm groups are lowered toward the substrate transfer position. In other words, the transfer of the substrate W1 of the first transfer device 300A and the lowering of the pair of holding arm groups are performed substantially simultaneously (in parallel). This contributes to the efficiency of substrate inversion processing in the substrate processing system 1000.
After the pair of holding arm groups reach the substrate transfer position, as shown in FIG. 8(c), the lower end portion of the adsorption pad 103 disposed on the holding arm 102A is in contact with the upper surface of the substrate W1. Further, Fig. 8(c) shows the same situation as Fig. 3. As described above, in a state where the adsorption pad 103 is in contact with the substrate W1, the substrate W is adsorbed and held by the adsorption pad 103 by the suction pump 140 being activated.
Further, at this time, the holding arm 102B is located between the unit conveying portions 301B, and the height position of the upper end of the suction pad 103 is the same as the height position of the unit conveying portion 301B.
After the adsorption holding is performed, the rotation driving means 130 is driven to rotate the shaft 101, whereby the pair of holding arm groups rotate clockwise and reverse 180 degrees as indicated by an arrow RT1 in Fig. 8(d). Thereby, the holding arm 102A rotates in a state in which the substrate W1 is adsorbed and held by the adsorption pad 103. On the other hand, the holding arm 102B passes through the unit of the first conveying device 300A while rotating. The gap between the transport units 301B. Simultaneously with the above rotation, as shown by the arrow AR3, the pair of holding arm groups are raised.
The one shown in Fig. 9(a) is a state in which the pair of holding arm groups are reversed by 180 degrees and the pair of holding arm groups are raised. At this time, the substrate W1 is in a state of being sucked and held from below by the holding arm 102A on the +Y side of the relatively axial axis 101. In other words, the state is reversed by 180 degrees from the state in which the first transfer device 300A is initially placed. Further, a gap is formed between the holding arm 102B and the first unit conveying portion 301A on the -Y side of the smaller shaft 101.
In the first unit transfer unit 301A of the first transfer device 300A, the substrate after the first scribing device 200A is scribed by the first scribing device 200A is placed on the subsequent substrate W1 in the period before the state shown in Fig. 9(a) is realized. W (W2). The substrate W2 is transported in the +Y direction by the first unit transport unit 301A as indicated by an arrow AR4.
After the substrate W2 is transported to the +Y side end side of the first unit transport unit 301A, as shown by an arrow AR5 in FIG. 9(b), the pair of holding arm groups are lowered toward the substrate transfer position. The transport of the substrate W2 and the lowering of the pair of holding arm groups are performed in parallel as in the case of transporting the substrate W1, which contributes to the efficiency of the substrate inversion processing of the substrate processing system 1000 of the present embodiment.
After the pair of holding arm groups reach the substrate transfer position, as shown in FIG. 9(c), the lower surface of the substrate W1 supported by the adsorption pad 103 from below is in contact with the unit transfer portion 301B of the second transfer device 300B. When the contact state is obtained, the adsorption holding of the substrate W1 by the adsorption pad 103 is released. Thereby, the state in which the substrate W1 is placed on the unit transfer unit 301B is realized. After the above-described placement is completed, the unit transport unit 301B immediately transports the substrate W1 to the end portion on the +Y side as indicated by an arrow AR6. The transferred substrate W1 is carried out to the second scribing device 200B. Substrate The substrate W of the inversion device 100 reversed by 180 degrees is supplied to the scoring process performed by the second scribing device 200B.
On the other hand, on the -Y side of the lower shaft 101, a state in which the lower end portion of the adsorption pad 103 of the holding arm 102B is in contact with the upper surface of the substrate W2 is realized. After the suction holding of the substrate W1 is released and the transfer to the +Y side is performed, the suction pump 140 is again operated, and the substrate W2 is adsorbed and held by the adsorption pad 103.
The adsorption holding can be performed immediately after the adsorption of the holding arm 102A and the transfer of the substrate W of the second transfer device 300B, so that the substrate inverting device 100 reverses the substrate W to the second transfer device 300B. The adsorption holding of the substrate W and the next substrate W as the object of reversal can be performed substantially simultaneously (without time lag) as a series of continuous operations.
After the adsorption holding is performed, the rotation driving means 130 is again driven to rotate the shaft 101, whereby the pair of holding arm groups rotate clockwise and reverse 180 degrees as indicated by an arrow RT2 in Fig. 9(d). Then, the holding arm 102B rotates while holding the substrate W2. At the same time, as shown by the arrow AR7, the pair of holding arm groups are raised.
Thereafter, at the time when the pair of holding arm groups are raised, the same state as that of FIG. 9(a) is realized except that the holding arm 102A and the holding arm 102B are alternated. Therefore, when the order shown in FIG. 9(a) to FIG. 9(d) is repeated, the substrate W carried in from the first scribing device 200A is sequentially reversed, and can be supplied to the second scribing device 200B. Scoring.
As described above, according to the substrate processing system of the present embodiment, the loading operation of the substrate to be reversed and the holding operation of the substrate can be performed substantially simultaneously. Further, the next substrate to be reversed, the substrate after the previous inversion processing, and the holding and holding of the holding substrate by the holding arm can be performed substantially simultaneously. In summary, the substrate processing system of the present embodiment is substantially simultaneously The inversion of the substrate and the advancement of the substrate to be reversed are performed. Thereby, a substrate processing system excellent in reverse processing efficiency can be realized.
(Modification)
In the above embodiment, the unit conveying unit 301 of the conveying device 300 is configured as a belt conveyor, but the configuration of the unit conveying unit 301 is not limited thereto. FIG. 10 is a YZ side view of the vicinity of the substrate inverting device 100 of the substrate processing system 1000 including the transfer device 300 according to a modification.
In the substrate processing system 1000 shown in FIG. 10, the unit transfer unit 301 includes a plurality of rollers 302 that are disposed apart from each other in the Y-axis direction. The drum 302 may be rotationally driven by a driving means (not shown) or may be a driven roller that is driven by movement of the substrate W. In the case of the former, the roller 302 is rotated by the driving means while the substrate W is placed, whereby the substrate W can be transported to a desired position. In the latter case, when the substrate W is held while moving, for example, by the transfer device 400 or the like, the roller 302 that is in contact with the back surface of the substrate W is rotated, thereby assisting the conveyance of the substrate W.
Further, in the above-described embodiment, each of the holding arms 102 is provided to extend directly from the shaft 101. Alternatively, the frame 101 is provided with a frame that rotates integrally with the shaft around the shaft 101, and the holding arm 102 is provided in the frame. Also.
Further, in the above-described embodiment, each of the holding arms 102 has a rectangular shape in which the width and thickness in the longitudinal direction are uniform and perpendicular to the longitudinal direction, but the shape of the holding arm 102 is not limited thereto. For example, the shape having a smaller thickness toward the distal end portion in the longitudinal direction may be used.
100‧‧‧Substrate reversal device
101a‧‧‧Front Department
101b‧‧‧Cylinder
102,102A, 102B‧‧‧ Keep arm
103‧‧‧Adsorption pad
110‧‧‧foot
120‧‧‧ shaft support
301,301A, 301B‧‧‧Unit Transfer Department
W‧‧‧Substrate

Claims (5)

  1. A substrate processing system includes: a first transfer device and a second transfer device that transport a brittle material substrate in a first direction; and a substrate inverting device disposed between the first transfer device and the second transfer device; The brittle material substrate conveyed by the first conveying device is reversed and delivered to the second conveying device; the first conveying device and the second conveying device are second to each other in the first direction The plurality of unit transport elements arranged in the gaps are transported while supporting one of the brittle material substrates. The substrate inverting device includes a pair of holding arm groups, and is disposed in a rotating shaft extending in the second direction. Rotational symmetry; rotation driving means rotating the pair of holding arm groups around the rotating shaft; and lifting means for transferring the brittleness between the first conveying means and the second conveying means a height position of the material substrate, that is, a lifting position between the substrate transfer position and the upper portion thereof; each of the pair of holding arm groups having a position separated from each other in the second direction and passing through the rotating shaft a plurality of holding arms; each of the plurality of holding arms includes a plurality of adsorption portions that can be adsorbed on the substrate of the brittle material; and the pair of holding arm groups are disposed at the substrate transfer position, and the pair is held The plurality of adsorption portions of the plurality of holding arms of one of the holding arm groups are adsorbed to the reversing target substrate which is the brittle material substrate to be reversed, and then the pair of holding arm groups are rotated around the rotating shaft 180 degrees to reverse the substrate to be reversed; The pair of holding arm groups are raised to a position higher than the substrate transfer position after the inversion target substrate is adsorbed to the plurality of adsorption portions and before the inversion of the inversion target substrate is completed, and the inversion is performed. When the target substrate is reversed and the adsorption of the plurality of adsorption portions of the substrate to be reversed is released, the substrate is lowered to the substrate transfer position.
  2. The substrate processing system of claim 1, wherein the height of the adsorbed surface of the reverse target substrate adsorbed by the plurality of adsorption portions after the pair of holding arm groups are located at the substrate transfer position is reversed The position is the same as the conveyance height position of the second conveyance device, and the release of the suction of the reverse target substrate after the reverse rotation is supported by the second transfer device while the reversed substrate is supported. get on.
  3. The substrate processing system of claim 2, wherein the plurality of adsorption portions of the plurality of holding arms belonging to one of the pair of holding arm groups and the plural number belonging to the other of the pair of holding arm groups The plurality of adsorption portions of the holding arms are disposed 180 degrees apart from each other, and the end positions of the two are located on a common plane parallel to the rotation axis; the conveying height position of the first conveying device and the The conveyance height position of the second conveyance device is different from the thickness of the brittle material substrate; and the pair of holding arm groups are disposed at the substrate transfer position, and the reversed object is reversed at substantially the same time. The release of the adsorption of the plurality of adsorption portions of the substrate and the plurality of adsorption portions of the plurality of holding arms belonging to the other of the pair of holding arm groups are newly reversed by the first transfer device Adsorption by the substrate.
  4. The substrate processing system according to any one of claims 1 to 3, wherein the rotating shaft has a disc-shaped flange portion at one end portion and a rod-shaped shaft at the other end portion of the rotational driving means. ; The substrate inverting device includes a pair of supporting means for supporting the shaft so as to be rotatable and including the lifting means; the flange portion is slidably fitted to the tubular member located in one of the pair of supporting means; The first through hole of the flange portion is connected to the adsorption portion through the first suction pipe, and the second through hole provided in the tubular member is connected to the suction means by the second suction pipe.
  5. A substrate inverting device that reverses a brittle material substrate conveyed in a first direction, and includes a pair of holding arm groups that are disposed to extend in a second direction orthogonal to the first direction Rotatingly symmetrical; rotating driving means rotating the pair of holding arm groups around the rotating shaft; and lifting means for transferring the pair of holding arm groups between the outer portion and the height of the brittle material substrate Lifting between the position and the upper portion thereof; each of the pair of holding arm groups has a plurality of holding arms that pass through the gap when the second direction is separated from each other and rotates around the rotating shaft; each of the plurality of holding arms is permeable a plurality of adsorption portions on the brittle material substrate; and the plurality of adsorption portions of the plurality of holding arms belonging to one of the pair of holding arm groups in a state in which the pair of holding arm groups are disposed at the substrate transfer position Adsorbing on the substrate of the brittle material, which is the object of reversal, is the substrate to be reversed, and then rotating the pair of holding arm groups by 180 degrees around the rotation axis to reverse the substrate to be reversed The pair of holding arm groups, after the object to be reversed is adsorbed to the plurality of adsorption portions, the reverse During the period before the completion of the inversion of the substrate to be transferred, the substrate is raised to a position higher than the substrate, and after the inversion of the substrate to be reversed, the adsorption of the plurality of adsorption portions of the substrate to be inverted is released. To the substrate transfer position.
TW103102243A 2013-03-05 2014-01-22 Substrate processing system and substrate reversing device TWI571954B (en)

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CN104030558A (en) 2014-09-10
KR101830598B1 (en) 2018-02-22

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