CN115038327B - Electronic component mounting equipment - Google Patents
Electronic component mounting equipment Download PDFInfo
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- CN115038327B CN115038327B CN202210954700.9A CN202210954700A CN115038327B CN 115038327 B CN115038327 B CN 115038327B CN 202210954700 A CN202210954700 A CN 202210954700A CN 115038327 B CN115038327 B CN 115038327B
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- mounting
- grabbing
- conveying device
- circuit board
- electronic component
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- 238000003860 storage Methods 0.000 claims abstract description 54
- 238000013519 translation Methods 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims description 97
- 230000005540 biological transmission Effects 0.000 claims description 75
- 239000000463 material Substances 0.000 claims description 29
- 238000007599 discharging Methods 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 230000007306 turnover Effects 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides electronic component mounting equipment, and relates to the technical field of circuit board production and processing. The device comprises a first conveying device, a storage device, a first image acquisition device, a second conveying device, a first translation track, a first grabbing and mounting device and a control device; the first conveying device is used for conveying the circuit board. The first grabbing and mounting device moves to the first grabbing position to grab the first suction nozzle, then the first image acquisition device and the control device are used for judging whether grabbing is correct, then the first suction nozzle is used for picking up the first electronic component, the first image acquisition device and the control device are used for judging whether picking up is correct, finally the first grabbing and mounting device is used for placing the first electronic component at the first mounting position for mounting operation, manual intervention is not needed in the whole mounting process, mounting of multiple groups of first electronic components can be achieved, and mounting accuracy and efficiency can be improved.
Description
Technical Field
The invention relates to the technical field of circuit board production and processing, in particular to electronic component mounting equipment.
Background
The process of manufacturing a printed circuit board with electronic components typically involves attaching a solder paste to the circuit board, then applying the solder paste to pads on the circuit board, positioning the leads, and heating the solder paste to fuse the leads to the pads.
The existing electronic component mounting process generally adopts a mechanical arm to attach electronic components to a circuit board one by one, and because the electronic components needed by the circuit board are numerous, the mode not only occupies a longer production line, but also has low efficiency, and cannot meet the requirement of mass production.
Disclosure of Invention
The invention aims to provide electronic element mounting equipment which solves the problems of low efficiency and overlong production line of the existing mounting mode.
In order to solve the above problems, the present invention provides an electronic component mounting apparatus, which includes a first conveying device, a storage device, a first image acquisition device, a second conveying device, a first translation rail, a first capturing and mounting device, and a control device; the first conveying device is used for conveying the circuit board; the storage device is adjacent to the first conveying device, and a plurality of first suction nozzles are stored in the storage device; the first image acquisition device is adjacent to the storage device and the first conveying device respectively; the second conveying device is adjacent to the first image acquisition device and is used for conveying the first electronic component; the first translation track is arranged above the first conveying device, the storage device and the second conveying device; the first grabbing and mounting device is mounted on the first translation track, can move to a first grabbing position, a second grabbing position, a first image recognition position and a first mounting position on the first translation track, is located at the first grabbing position, and can grab the first suction nozzle and is located at the second grabbing position, and can suck the first electronic component through the first suction nozzle and is located at the first mounting position, and the first grabbing and mounting device mounts the first electronic component on the first surface of the circuit board; and the control device is respectively connected with the first conveying device, the second conveying device, the first image acquisition device and the first grabbing mounting device and is positioned at the first image recognition position, the first image acquisition device can acquire a grabbed first suction nozzle image and a first electronic element image, and the control device judges whether grabbing is correct or not based on the image acquired by the first image acquisition device.
By adopting the technical scheme, the first grabbing and mounting device moves to the first grabbing position to grab the first suction nozzle, then the first image acquisition device and the control device are used for judging whether grabbing is correct, then the first suction nozzle is used for picking up the first electronic component, the first image acquisition device and the control device are used for judging whether picking up is correct, finally the first grabbing and mounting device is used for placing the first electronic component at the first mounting position for mounting operation, manual intervention is not needed in the whole mounting process, mounting of multiple groups of first electronic components can be achieved, and mounting accuracy and efficiency can be improved.
Further, the first conveying device comprises a first belt conveying mechanism, a support bracket, a first sliding rail and a second sliding rail; the support bracket is arranged on the first belt conveying mechanism and is provided with a first sliding part, a second sliding part and a limiting assembly for limiting the circuit board; the first sliding track and the second sliding track are respectively positioned on two sides of the support bracket in the second horizontal direction, the second horizontal direction is perpendicular to the first horizontal direction, the first sliding part is slidably mounted on the first sliding track, and the second sliding part is slidably mounted on the second sliding track.
By adopting the technical scheme, the support bracket can move in the second horizontal direction under the drive of the first belt conveying mechanism, and the two sides of the support bracket are limited and fixed through the first sliding rail and the second sliding rail, so that the stability of the circuit board during mounting is improved.
Further, the limiting assembly comprises a first limiting plate, a second limiting plate and a compressing structure; the first limiting plate and the second limiting plate are oppositely arranged, the first limiting plate comprises a first stop wall and a second stop wall which is vertically connected with two ends of the first stop wall, and the second limiting plate comprises a third stop wall and a fourth stop wall which is vertically connected with two ends of the third stop wall; the pressing structure is connected with the first limiting plate and used for driving the first limiting plate to approach or deviate from the second limiting plate.
By adopting the technical scheme, a limiting space is formed between the first limiting plate and the second limiting plate, and the limiting of the circuit board can be relieved through the pressing structure, so that the feeding and the discharging of the circuit board are facilitated.
Further, the limiting assembly further comprises a negative pressure suction structure which is arranged on the support bracket and used for sucking the circuit board.
By adopting the technical scheme, the negative pressure suction structure can play a certain role in adsorbing the bottom surface of the circuit board, so that the stability of the circuit board in the transportation and mounting processes is further improved.
Further, the first grabbing and mounting device comprises a first mobile machine seat, a first driving mechanism, a second mobile machine seat, a second driving mechanism, a first lifting mechanism and a grabbing mechanism; the first mobile machine seat is arranged on the first translation track, and the first driving mechanism is connected with the first mobile machine seat and drives the first mobile machine seat to move along a second horizontal direction on the first translation track; the second mobile machine seat is arranged on the first mobile machine seat, and the second driving mechanism is connected with the second mobile machine seat and is used for driving the second mobile machine seat to move in a first horizontal direction; the first lifting mechanism is installed on the second mobile machine base, and the grabbing mechanism is installed on the first lifting mechanism.
By adopting the technical scheme, the first driving mechanism is utilized to drive the movable base to move in the second horizontal direction, the second driving mechanism is utilized to drive the grabbing mechanism and the lifting mechanism to move in the first horizontal direction, and the lifting mechanism is utilized to drive the grabbing mechanism to lift, so that the grabbing mechanism has higher flexibility and meets grabbing and mounting requirements.
Further, the grabbing mechanism comprises a mounting plate and a plurality of spliced heads connected to the bottom surface of the mounting plate, the spliced heads are provided with suction heads which can be matched with the suction ports of the first suction nozzles, and the suction heads are communicated with a negative pressure adsorption assembly.
By adopting the technical scheme, the connection between the assembly head and the suction nozzle is realized by utilizing the matching of the suction head and the negative pressure suction assembly, and the connection and the disconnection are quick and efficient.
Further, the storage device comprises a storage seat and a protective cover, a plurality of containing positions for containing the first suction nozzles are arranged on the storage seat, and the protective cover is arranged on the storage seat and is provided with suction nozzle outlets corresponding to the containing positions one by one.
By adopting the technical scheme, the first suction nozzle is protected by the protective cover, and the first suction nozzle is prevented from being polluted by external impurities.
Further, the storage device further comprises a pushing mechanism, wherein the pushing mechanism is connected with the protection cover and used for driving the protection cover and the storage seat to move.
By adopting the technical scheme, the position of the storage mechanism can be adjusted by utilizing the pushing mechanism, so that the first grabbing and mounting device is convenient for grabbing the first suction nozzle, the second grabbing and mounting device is convenient for grabbing the second suction nozzle, and the storage structure is not required to be independently arranged for the second suction nozzle.
Further, the protection cover is hinged and matched with the storage seat.
By adopting the technical scheme, the protective cover is convenient to open and close.
Further, the device also comprises a first rack, wherein a moving wheel is arranged at the bottom of the first rack; the first conveying device, the second conveying device, the storage device, the first translation track, the first image acquisition device and the first grabbing and mounting device are all mounted on the first frame.
By adopting the technical scheme, all the functional devices can be integrated by utilizing the first frame, and the whole equipment can be conveniently moved by utilizing the moving wheel.
Further, the device also comprises a turnover conveying device, a third conveying device, a fourth conveying device, a second image acquisition device, a second translation track and a second grabbing and mounting device; the overturning conveying device, the third conveying device, the fourth conveying device, the second image acquisition device and the second grabbing and mounting device are all connected with the control device; the first conveying device is provided with a first feeding end and a first discharging end, and the overturning conveying device is configured to receive the circuit board of the first discharging end and to overturn and convey the circuit board to the third conveying device; the second image acquisition device is positioned between the third conveying device and the fourth conveying device; the fourth conveying device is adjacent to the second image acquisition device and is used for conveying a second electronic component; the second translation track is located third conveyor, fourth conveyor and second image acquisition device top, the second snatchs the subsides dress device install in translation track, and can be on the second translation track moves to third snatch the position, fourth snatch position, second image recognition position and second subsides dress position, be located the third snatch position, the second snatchs the subsides dress device can snatch the second suction nozzle, be located the fourth snatchs the position, the second snatchs the dress device can be through the second suction nozzle absorbs the second electronic component, be located the second subsides dress position, the second snatchs the dress device with the second electronic component pastes to the second surface of circuit board.
By adopting the technical scheme, the overturning and conveying device is utilized to overturn and convey the circuit board subjected to the first surface mounting to the third conveying device, and then the second grabbing and mounting device is utilized to sequentially absorb the second suction nozzle and absorb and mount the second electronic component, so that the circuit board needing double-sided mounting can be subjected to double-sided mounting, manual intervention is not needed, the mounting efficiency is improved, and the mounting requirement of the double-sided circuit board is met.
Further, the overturning and conveying device comprises a first mounting frame, a third driving mechanism, a transmission shaft, a driving rotating arm, a first transmission rod, a second transmission rod, a first receiving arm and a second receiving arm; the third driving mechanism is mounted on the first mounting frame; the transmission shaft is connected with the third driving mechanism and is driven by the third driving mechanism to rotate; the driving rotating arm is connected with the transmission shaft and synchronously rotates, the driving rotating arm is provided with a first connecting end and a second connecting end, and the axial distance between the first connecting end and the transmission shaft is equal to the axial distance between the second connecting end and the transmission shaft; one end of the first transmission rod is in hinged fit with the first connecting end, and one end of the second transmission rod is in hinged fit with the second connecting end; the first material receiving arm comprises a first transmission part and a first material receiving part which are integrally connected and mutually angled, the lower end of the first transmission part is hinged and matched with the other end of the first transmission rod, the lower end of the second transmission part is hinged and matched with the other end of the second transmission rod, the joint of the first transmission part and the first material receiving part is hinged to the first mounting frame through a first pivot, the second material receiving arm comprises a second transmission part and a second material receiving part which are integrally connected and mutually angled, the joint of the second transmission part and the second material receiving part is hinged to the first mounting frame through a second pivot, and the first hinge shaft and the second hinge shaft are positioned above the transmission shaft; the third driving mechanism drives the transmission shaft to rotate, so that the first receiving arm and the second receiving arm can rotate between a first state and a second state, the first receiving part can receive the circuit board at the first discharging end and can transmit the circuit board to the third conveying device; in the second state, the first material receiving part and the second material receiving part are close to each other to the limit distance, and the first material receiving arm transmits the circuit board to the second material receiving arm.
By adopting the technical scheme, the third driving mechanism is utilized to drive the first receiving arm and the second receiving arm to act simultaneously, and the receiving, overturning and conveying of the circuit board can be completed sequentially by only one driving mechanism, so that the structure is ingenious, and the power source cost is saved.
Further, a plurality of first limit stops are arranged at intervals at one end, close to the first transmission part, of the first material receiving part, and first limit walls are arranged at two sides of the first limit stops; a plurality of second limit stops are arranged at intervals at one end of the second receiving part, which is close to the second transmission part, and second limit walls are arranged at two sides of the second limit stops; the first limit stop is provided with a first limit surface for limiting the circuit board, the second limit stop is provided with a second limit surface for limiting the circuit board, and when in the second state, a plurality of second limit stops and a plurality of first limit stops are staggered, and the first limit surface and the second limit surface incline downwards.
By adopting the technical scheme, when the first material receiving part and the second material receiving part are in the second state, the first limit stop and the second limit stop form a blanking inclined plane, so that the circuit board can enter the second material receiving part from the first material receiving part without other structural assistance, and the overturning of the circuit board can be realized, and the structure is ingenious.
Further, the device also comprises a jacking mechanism arranged on the support bracket; the support bracket comprises a first layer of frame body, a support body and a second layer of frame body which are sequentially connected from top to bottom, the first limiting plate is provided with a sliding block which penetrates through the first layer of frame body and is slidably arranged on the second layer of frame body, the sliding block is connected with a sliding rack, and the sliding rack is driven to synchronously move by the movement of the first limiting plate; the jacking mechanism comprises a transmission gear, a rocker and a sliding rod; the transmission gear is arranged on the support body through a third pivot and meshed with the transmission gear; the lower end of the rocker is arranged on the third pivot and can rotate around the third pivot; the sliding rod can be slidably arranged on the first layer of frame body along the vertical direction, and the lower end of the sliding rod is hinged and matched with the upper end of the rocker; the negative pressure suction structure comprises a negative pressure suction part, a communication pipeline and a negative pressure suction nozzle which are sequentially connected, wherein the negative pressure suction part is installed in the support bracket, the communication pipeline penetrates through the sliding rod, and the negative pressure suction nozzle is installed at the upper end of the sliding rod.
By adopting the technical scheme, the circuit board after the first surface mounting is completed can be lifted by the jacking mechanism, the first receiving part is convenient to receive the circuit board, the jacking mechanism does not need other power, and the jacking mechanism can be realized by only utilizing the movement of the first limiting plate, so that the structure is ingenious, and the power source cost is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic component mounting apparatus according to an embodiment of the present invention;
Fig. 2 is a schematic structural diagram of a first conveying device of the electronic component mounting apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first capturing and mounting device of an electronic component mounting apparatus according to an embodiment of the present invention;
Fig. 4 is a schematic structural diagram of a gripping mechanism of an electronic component mounting apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a storage device of the electronic component mounting apparatus according to an embodiment of the present invention;
Fig. 6 is a schematic structural diagram of a turnover conveying device of an electronic component mounting apparatus according to an embodiment of the present invention;
Fig. 7 is a schematic structural diagram of a turnover conveying device of an electronic component mounting apparatus in a first state according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a turnover conveying device of an electronic component mounting apparatus in a second state according to an embodiment of the present invention;
Fig. 9 is a schematic structural view of a support bracket of an electronic component mounting apparatus according to an embodiment of the present invention.
Reference numerals illustrate:
100-a first conveying device; 110-a first belt transport mechanism; 120-supporting brackets; 121-a limiting assembly; 1211-a first stop plate; 12111-a slider; 1212-a second limiting plate; 1213-a compression structure; 1214-negative pressure suction structure; 12141 negative pressure suction; 12142-connecting tubing; 12143-negative pressure suction nozzle; 122-a first layer frame; 123-a support; 124-a second tier frame; 125-jack-up mechanism; 1251-sliding rack; 1252-a drive gear; 1253-rocker; 1254-slide bar; 1255-a third pivot; 130-a first sliding track; 140-a second slide rail;
200-a storage device; 210-a storage seat; 220-a protective cover; 221-nozzle outlet; 230-pushing mechanism; 240-a first suction nozzle; 250-a second suction nozzle;
300-a first image acquisition device;
400-a second conveying device;
500-a first translation track;
600-a first grabbing mounting device; 610-a first mobile chassis; 620-a first drive mechanism; 630-a second mobile chassis; 640-a second drive mechanism; 650-a first lifting mechanism; 660-a grasping mechanism; 661-mounting plate; 662-assembling heads; 6621-tip;
700-turning over the conveying device; 710-a first mount; 720-a third drive mechanism; 730-a drive shaft; 740-an active rotating arm; 741-a first connection; 742-a second connection; 750-a first transmission rod; 760-a second drive rod; 770-a first receiving arm; 771-a first transmission; 772-a first receiving portion; 7721-first limit stop; 7722-first limiting wall; 780-a second receiving arm; 781-a second transmission; 782-a second receiving portion; 7821-a second limit stop; 7822-a second limiting wall;
800-a third conveying device; 900-fourth conveying device; 1000-a second image acquisition device; 1100-a second translation track; 1200-second gripper mounting device.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Based on the problems of low efficiency and overlong production line of the existing mounting equipment, the embodiment provides electronic component mounting equipment, which aims to solve the technical problems by improving the structure of the electronic component mounting equipment.
Referring to fig. 1, an electronic component mounting apparatus provided in this embodiment includes a first conveying device 100, a storage device 200, a first image acquisition device 300, a second conveying device 400, a first translation rail 500, a first capturing and mounting device 600, and a control device (not shown in the figure); the control device of the present embodiment is connected to the first conveying device 100, the second conveying device 400, the first image capturing device 300, and the first capturing and mounting device 600, respectively, and the connection manner may be a line connection or a wireless signal connection, and the control device of the present embodiment may be a conventional structure having a data processing, a signal receiving, and a control signal transmitting, such as a computer processor, and therefore, the present embodiment is not illustrated in the drawings and the description of the structure thereof.
Among the above-described functional devices, the first conveying device 100 of the present embodiment is used for conveying a circuit board, the storage device 200 of the present embodiment is adjacent to the first conveying device 100, and a plurality of first suction nozzles 240 for sucking a first electronic component (not shown) are stored in the storage device 200; the first image acquisition device 300 of the present embodiment is adjacent to the storage device 200 and the first conveying device 100, respectively; the second conveying device 400 of the present embodiment is adjacent to the first image capturing device 300 and is used for conveying a first electronic component (not shown in the figure).
The first translation track 500 of the present embodiment is disposed above the first conveying device 100, the storage device 200, and the second conveying device 400, where the "upper" is not necessarily located directly above, but may be understood as an obliquely upper direction in a broad sense; the first grabbing and mounting apparatus 600 of the present embodiment is mounted on the first translation rail 500, and can move on the first translation rail 500 to a first grabbing position at the storage device 200, a second grabbing position at the second conveying device, a first image recognition position at the first image capturing device 300, and a first mounting position at the first conveying device 100, where the first grabbing and mounting apparatus 600 of the present embodiment can grab the first suction nozzle 240, and where the first grabbing and mounting apparatus 600 of the present embodiment can suck the first electronic component through the first suction nozzle 240, and where the first grabbing and mounting apparatus 600 of the present embodiment mounts the first electronic component to the first surface of the circuit board; when located at the first image recognition position, the first image capturing apparatus 300 of the present embodiment is capable of capturing the captured image of the first nozzle 240 and the first electronic component image, and the control apparatus determines whether capturing is correct based on the image captured by the first image capturing apparatus 300.
During specific operation, the first capturing and mounting device of the embodiment moves to the first capturing position to capture the first suction nozzle 240, then the first image capturing device 300 is used for capturing images of the captured plurality of first suction nozzles 240, the control device judges whether capturing is correct based on the captured images, after capturing is to be recognized correctly, the first suction nozzle 240 is used for capturing the first electronic component, the first image capturing device 300 and the control device are used for recognizing whether capturing is correct, and finally the first capturing and mounting device is used for placing the first electronic component in the first mounting position for mounting operation after judging that the recognizing is correct.
Referring to fig. 2, in order to improve stability during conveyance, the first conveying apparatus 100 according to the present embodiment is configured to include a first belt conveying mechanism 110, a support bracket 120, a first slide rail 130, and a second slide rail 140; the support bracket 120 of the present embodiment is mounted on the first belt conveying mechanism 110, and the two sides of the support bracket 120 of the present embodiment are respectively provided with a first sliding portion and a second sliding portion (not shown in the drawing), the surface of the support bracket 120 is provided with a limiting component 121 for limiting a circuit board, correspondingly, the first sliding rail 130 and the second sliding rail 140 of the present embodiment are respectively located at two sides of the support bracket 120 in the first horizontal direction, the first sliding portion is slidably mounted on the first sliding rail 130, the second sliding portion is slidably mounted on the second sliding rail 140, and when conveying, the support bracket 120 of the present embodiment can be driven by the first belt conveying mechanism 110 to move in the second horizontal direction, and the two sides of the support bracket 120 are subjected to limiting and fixing effects through the first sliding rail 130 and the second sliding rail 140, so that the stability of the circuit board during mounting is improved.
Specifically, the limiting assembly 121 of the present embodiment includes a first limiting plate 1211, a second limiting plate 1212, and a compression structure 1213; the first limiting plate 1211 and the second limiting plate 1212 of this embodiment are oppositely disposed, the first limiting plate 1211 includes a first stop wall and a second stop wall vertically connected to two ends of the first stop wall, the second limiting plate includes a third stop wall and a fourth stop wall vertically connected to two ends of the third stop wall, the first stop wall, two second stop walls, the third stop wall and the two fourth stop walls enclose a limiting space, the compressing structure 1213 of this embodiment is connected with the first limiting plate 1211 and is used for driving the first limiting plate 1211 to approach or deviate from the second limiting plate 1212, and then adjusting the size of the limiting space, so that the limiting assembly 121 can perform good limiting fixation on the circuit board and facilitate releasing the limiting of the circuit board.
In addition, the limiting component 121 of the embodiment may further include a negative pressure suction structure 1214 for sucking a circuit board, where the negative pressure suction structure 1214 includes a negative pressure suction part 12141, a communication pipe 12142 and a negative pressure suction nozzle 12143 that are sequentially connected, and the negative pressure suction part 12141 may be a small air pump or other structure, and the bottom surface of the circuit board can be adsorbed to a certain extent by using the negative pressure suction structure 1214, so that stability of the circuit board in the transportation and mounting processes is further improved.
Referring to fig. 3, the first grabbing and mounting apparatus 600 of the present embodiment includes a first mobile frame 610, a first driving mechanism 620, a second mobile frame 630, a second driving mechanism 640, a first lifting mechanism 650 and a grabbing mechanism 660; the first mobile machine base 610 is mounted on the first translation rail 500, and the first driving mechanism 620 is connected with the first mobile machine base 610 and drives the first mobile machine base 610 to move along a second horizontal direction on the first translation rail 500, wherein the second horizontal direction is perpendicular to the first horizontal direction; the second mobile base 630 is installed on the first mobile base 610, and the second driving mechanism 640 is connected with the second mobile base 630 and is used for driving the second mobile base 630 to move in the first horizontal direction; the first elevating mechanism 650 is installed to the second moving frame 630, and the grasping mechanism 660 is installed in the first elevating mechanism 650.
The first grabbing and mounting device can drive the mobile base to move in the first horizontal direction by using the first driving mechanism 620, drive the grabbing mechanism 660 and the lifting mechanism to move in the second horizontal direction by using the second driving mechanism 640, and drive the grabbing mechanism 660 to lift by using the lifting mechanism, so that the grabbing mechanism 660 has higher flexibility and meets the grabbing and mounting requirements.
Referring to fig. 4, the grabbing mechanism 660 includes a mounting plate 661 and a plurality of assembling heads 662 connected to the bottom surface of the mounting plate 661, the assembling heads 662 are provided with suction heads 6621 that can be matched with the suction ports of the first suction nozzles 240, the suction heads 6621 are communicated with a negative pressure adsorption component (not shown in the figure), the specifications of the assembling heads 662 in this embodiment can be different, and then the assembling heads can be matched with the first suction nozzles 240 in different specifications one by one, so that the connection and the disconnection are fast and efficient.
Referring to fig. 5, the storage device 200 of the present embodiment includes a storage base 210 and a protection cover 220, the protection cover 220 is preferably hinged to the storage base 210, a plurality of Rong Zhiwei for accommodating the first suction nozzles 240 are disposed on the storage base 210, the protection cover 220 is mounted on the storage base 210, suction nozzle outlets 221 corresponding to the plurality of accommodating positions one by one are disposed on the protection cover 220, and the protection cover 220 is used to protect the first suction nozzles 240 from external impurities to prevent the first suction nozzles 240 from being polluted.
In addition, the storage device 200 of the present embodiment further includes a pushing mechanism 230, where the pushing mechanism 230 is connected to the protective cover 220 and is used to drive the protective cover 220 and the storage seat 210 to move, and the pushing mechanism 230 is used to adjust the position of the storage mechanism, so that the first grabbing and mounting device 600 is convenient for grabbing the first suction nozzle 240, and the second grabbing and mounting device 1200 is convenient for grabbing the second suction nozzle 250, which is not required to separately set a storage structure for the second suction nozzle 250, so that the storage structure is simplified, and the cost and the installation space are reduced.
In addition to the above-described functional devices, the electronic component mounting apparatus of the present embodiment may further include a first frame (not shown), a moving wheel (not shown) is provided at the bottom of the first frame, the first conveying device 100, the second conveying device 400, the storage device 200, the first translation rail 500, the first image capturing device 300, and the first grabbing and mounting device 600 of the present embodiment are mounted on the first frame, the structural form of the first frame is not limited as long as the mounting of the above-described functional devices can be satisfied, each functional device can be formed into a whole by using the first frame, and the movement of the whole apparatus is facilitated by using the moving wheel.
Based on the above-described structure, the inventor has found that, although the mounting efficiency of the electronic component can be improved, for the circuit board requiring the double-sided mounting of the electronic component, after the mounting of the first surface of the circuit board is completed, the mounting of the other second surface of the circuit board opposite to the first surface is also required, and if the first surface step is repeated again by the first pick-and-place apparatus 600 to definitely affect the production efficiency, the mounting efficiency of the electronic component is still low by using the existing equipment, and in view of this, the embodiment further improves the electronic component mounting equipment.
Referring to fig. 1 again, the electronic component mounting apparatus of the present embodiment further includes a turnover conveying device 700, a third conveying device 800, a fourth conveying device 900, a second image acquiring device 1000, a second translation rail 1100, and a second capturing and mounting device 1200, where the fourth conveying device 900 is similar to or the same as the second conveying device 400 of the present embodiment, and may be an existing electronic component conveying structure, the second capturing and mounting device 1200 is similar to or the same as the first capturing and mounting device 600, and the second image acquiring device 1000 is similar to or the same as the first image acquiring device 300, for example, a structure such as an existing camera is not repeated for the structures of the fourth conveying device 900, the second image acquiring device 1000, and the second capturing and mounting device 1200.
The overturning and conveying device 700, the third conveying device 800, the fourth conveying device 900, the second image acquisition device 1000 and the second grabbing and mounting device 1200 of the present embodiment are also connected with the control device, that is, the above devices are controlled by the control device of the present embodiment, and the connection manner may be a line or a wireless signal connection.
The first conveying device 100 of the present embodiment has a first feeding end and a first discharging end, the flip conveying device 700 is configured to receive a circuit board of the first discharging end and flip and convey the circuit board to the third conveying device 800, and for the circuit board after the first surface mounting of the first conveying device 100, the solder paste and the first electronic component can be directly soldered on the first conveying device 100 by using the existing soldering device (not shown in the figure), so as to prevent the electronic component from shifting during the flip, and of course, since the electronic component can be fixed by the viscosity of the solder paste during the mounting, the shifting phenomenon of the electronic component will not occur during the flip.
Of course, a conventional soldering device (such an embodiment is not shown in the drawings) having a transfer function may be provided between the first conveying device 100 and the inverting conveying device 700, and the soldering device may be capable of receiving the circuit board on the first blanking end supporting plate and soldering the electronic component on the first surface, and then transferring the soldered circuit board to the inverting conveying device 700 of the present embodiment for inverting and then soldering by the remaining soldering devices. Or the first surface is directly soldered on the first conveying device 100 by a soldering device after being mounted, and then transferred to the turning conveying device 700 of the present embodiment.
The second image acquisition device 1000 of the present embodiment is located between the third conveying device 800 and the fourth conveying device 900; in order to simplify the structure, the present embodiment stores a plurality of second suction nozzles 250 in a memory, and the fourth conveying device 900 of the present embodiment is adjacent to the second image capturing device 1000 and is used for conveying the second electronic components; the second translation rail 1100 is located above the third conveying device 800, the fourth conveying device 900 and the second image acquiring device 1000, the second grabbing and mounting device 1200 is mounted on the translation rail and can move to a third grabbing position, a fourth grabbing position, a second image recognition position and a second mounting position on the second translation rail 1100, the second grabbing and mounting device 1200 is located at the third grabbing position, the second grabbing and mounting device 1200 can grab the second suction nozzle 250 and is located at the fourth grabbing position, the second grabbing and mounting device 1200 can suck the second electronic component through the second suction nozzle 250 and is located at the second mounting position, and the second grabbing and mounting device 1200 mounts the second electronic component on the second surface of the circuit board.
By adopting the structural design, the overturning and conveying device 700 is utilized to overturn and convey the circuit board subjected to the first surface mounting to the third conveying device 800, and then the second grabbing and mounting device 1200 is utilized to sequentially absorb the second suction nozzle 250 and absorb and mount the second electronic component, so that the circuit board needing double-sided mounting can be subjected to double-sided mounting, manual intervention is not needed, the mounting efficiency is improved, and the mounting requirement of the double-sided circuit board is met.
Referring to fig. 6, the present embodiment further provides a turnover conveying device 700, and specifically, the turnover conveying device 700 includes a first mounting frame 710, a third driving mechanism 720, a transmission shaft 730, an active rotation arm 740, a first transmission rod 750, a second transmission rod 760, a first receiving arm 770, and a second receiving arm 780; wherein, the third driving mechanism 720 of the present embodiment is mounted on the first mounting frame 710; the transmission shaft 730 is connected with the third driving mechanism 720 and is driven by the third driving mechanism 720 to rotate; the driving rotary arm 740 of the present embodiment is connected to the transmission shaft 730 and rotates synchronously, the driving rotary arm 740 has a first connection end 741 and a second connection end 742, and the distance between the first connection end 741 and the axis of the transmission shaft 730 is equal to the distance between the second connection end 742 and the axis of the transmission shaft 730.
One end of the first transmission rod 750 is in hinged fit with the first connection end 741, and one end of the second transmission rod 760 is in hinged fit with the second connection end 742; the first receiving arm 770 of this embodiment includes a first transmission portion 771 and a first receiving portion 772 that are integrally connected and form an angle with each other, the first receiving portion 772 and the second receiving portion 782 are approximately U-shaped, so that the circuit board on the support bracket 120 can be conveniently received, and meanwhile, the first electronic component on the first surface can be avoided from being disturbed as much as possible, the lower end of the first transmission portion 771 is hinged to the other end of the first transmission rod 750, the lower end of the second transmission portion 781 is hinged to the other end of the second transmission rod 760, the joint of the first transmission portion 771 and the first receiving portion 772 is hinged to the first mounting frame 710 through a first pivot, the joint of the second transmission portion 781 and the second receiving portion 782 that are integrally connected and form an angle with each other is hinged to the first mounting frame 710 through a second pivot, and the joint of the second transmission portion 781 and the second receiving portion 782 is hinged to the first mounting frame 710 through a second pivot.
The third driving mechanism 720 of the present embodiment drives the transmission shaft 730 to rotate, so that the first receiving arm 770 and the second receiving arm 780 can rotate between a first state and a second state, as shown in fig. 7, when in the first state, the first receiving portion 772 of the present embodiment can receive the circuit board at the first discharging end, and the second receiving portion 782 can transmit the circuit board thereon to the third conveying device 800; referring to fig. 8, in the second state, the first receiving portion 772 and the second receiving portion 782 of the present embodiment are close to each other to a limit distance, the first receiving arm 770 transfers the circuit board to the second receiving arm 780, and the third driving mechanism 720 is used to drive the first receiving arm 770 and the second receiving arm 780 to act simultaneously, so that the receiving, overturning and conveying of the circuit board can be completed sequentially only by one driving mechanism, the structure is ingenious, and the power source cost is saved.
Referring to fig. 6 again, in this embodiment, a plurality of first limit stops 772 are disposed at intervals at one end of the first receiving portion 772 near the first transmission portion 771, and first limit walls 7722 are disposed at two sides of the plurality of first limit stops 7721; a plurality of second limit stops 7821 are arranged at intervals at one end of the second receiving part 782 close to the second transmission part 781, and second limit walls 7822 are arranged at two sides of the second limit stops 7821; the first limit stop 7721 is provided with a first limit surface for limiting the circuit board, the second limit stop 7821 is provided with a second limit surface for limiting the circuit board, when the circuit board is in the second state, the second limit stops 7821 and the first limit stops 7721 are staggered, the first limit surfaces and the second limit surfaces incline downwards, and therefore, when the first receiving portion 772 and the second receiving portion 782 are in the second state, the first limit stop 7721 and the second limit stop 7821 form a blanking inclined surface, the circuit board can conveniently enter the second receiving portion 782 from the first receiving portion 772, overturning of the circuit board can be achieved without other structural assistance, and the structure is ingenious.
Referring to fig. 9, the jack-up mechanism 125 is further included on the support bracket 120; the support bracket 120 comprises a first layer of frame body 122, a support body 123 and a second layer of frame body 124123 which are sequentially connected from top to bottom, a first limiting plate 1211 of the embodiment is provided with a sliding block 12111 which passes through the first layer of frame body 122 and is slidably mounted on the second layer of frame body 124123, the sliding block 12111 is fixedly connected with a sliding rack 1251, and the sliding rack 1251 is driven to synchronously move by the movement of the first limiting plate 1211; the jack-up mechanism 125 includes a slide rack 1251, a transmission gear 1252, a rocker 1253, and a slide rod 1254; the transmission gear 1252 is mounted on the support body 123 through a third pivot 1255, and is meshed with the transmission gear 1252; the lower end of the rocker 1253 is mounted on the third pivot 1255 and can rotate around the third pivot 1255; the sliding rod 1254 is slidably mounted on the first layer frame 122 along the vertical direction, and the lower end of the sliding rod 1254 is hinged and matched with the upper end of the rocker 1253; the negative pressure suction structure 1214 includes a negative pressure suction member 12141, a communication pipe 12142, and a negative pressure suction nozzle 12143, which are sequentially connected, the negative pressure suction member 12141 is installed in the support bracket 120, the communication pipe 12142 is disposed through the sliding rod 1254, and the negative pressure suction nozzle 12143 is installed at the upper end of the sliding rod 1254.
When the first limiting plate 1211 releases the limitation of the circuit board, the first limiting plate 1211 moves towards the direction away from the second limiting plate 1212, so as to drive the sliding rack 1251, the transmission gear 1252 and the rocker 1253 to act, so that the sliding rod 1254 rises upwards, at this time, the suction of the negative pressure suction structure 1214 to the circuit board can be released through the control device, the first receiving portion 772 is convenient to receive the circuit board, and the jacking mechanism 125 does not need other power, only the movement of the first limiting plate 1211 is needed, the structure is ingenious, and the power source cost is saved.
In the description of the present embodiment, it should be noted that, it should be understood by those skilled in the art that all or part of the processes in the methods of the foregoing embodiments may be implemented by a computer level to instruct the control device, where the program may be stored in a computer readable storage medium, and the program may include the processes in the embodiments of the foregoing methods when executed, where the storage medium may be a memory, a magnetic disk, an optical disk, or the like.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. An electronic component mounting apparatus, characterized by comprising:
a first conveying device for conveying the circuit board in a first horizontal direction;
The storage device is adjacent to the first conveying device, and a plurality of first suction nozzles are stored in the storage device;
A first image acquisition device adjacent to the storage device and the first conveying device, respectively;
A second conveying device adjacent to the first image acquisition device and used for conveying the first electronic element;
The first translation track is arranged above the first conveying device, the storage device and the second conveying device;
The first grabbing mounting device is mounted on the first translation track, can move to a first grabbing position, a second grabbing position, a first image recognition position and a first mounting position on the first translation track, is located at the first grabbing position, can grab the first suction nozzle and is located at the second grabbing position, can absorb the first electronic component through the first suction nozzle and is located at the first mounting position, and the first grabbing mounting device mounts the first electronic component on the first surface of the circuit board; and
The control device is respectively connected with the first conveying device, the second conveying device, the first image acquisition device and the first grabbing mounting device and is positioned at the first image recognition position, the first image acquisition device can acquire a first suction nozzle image and a first electronic element image which are grabbed, and the control device judges whether the grabbing is correct or not based on the images acquired by the first image acquisition device;
The electronic component mounting apparatus further includes: the device comprises a turnover conveying device, a third conveying device, a fourth conveying device, a second image acquisition device, a second translation track and a second grabbing and mounting device; the overturning conveying device, the third conveying device, the fourth conveying device, the second image acquisition device and the second grabbing and mounting device are all connected with the control device; the first conveying device is provided with a first feeding end and a first discharging end, and the overturning conveying device is configured to receive the circuit board of the first discharging end and to overturn and convey the circuit board to the third conveying device; the second image acquisition device is positioned between the third conveying device and the fourth conveying device; the storage device is internally provided with a plurality of second suction nozzles, and the fourth conveying device is adjacent to the second image acquisition device and is used for conveying second electronic components; the second translation track is positioned above the third conveying device, the fourth conveying device and the second image acquisition device, and the second grabbing mounting device is arranged on the translation track and can move to a third grabbing position, a fourth grabbing position, a second image recognition position and a second mounting position on the second translation track; when the second grabbing mounting device is located at the third grabbing position, the second grabbing mounting device can grab the second suction nozzle; when the first grabbing mounting device is located at the fourth grabbing position, the first grabbing mounting device can absorb the second electronic component through the second suction nozzle; when the second grabbing mounting device is positioned at the second mounting position, the second grabbing mounting device mounts the second electronic component on the second surface of the circuit board;
The overturning conveying device comprises a first mounting frame, a third driving mechanism, a transmission shaft, a driving rotating arm, a first transmission rod, a second transmission rod, a first receiving arm and a second receiving arm; the third driving mechanism is mounted on the first mounting frame; the transmission shaft is connected with the third driving mechanism and is driven by the third driving mechanism to rotate; the driving rotating arm is connected with the transmission shaft and synchronously rotates, the driving rotating arm is provided with a first connecting end and a second connecting end, and the axial distance between the first connecting end and the transmission shaft is equal to the axial distance between the second connecting end and the transmission shaft; one end of the first transmission rod is in hinged fit with the first connecting end, and one end of the second transmission rod is in hinged fit with the second connecting end; the first material receiving arm comprises a first transmission part and a first material receiving part which are integrally connected and are mutually angled, and the second material receiving arm comprises a second transmission part and a second material receiving part which are integrally connected and are mutually angled; the lower end of the first transmission part is hinged with the other end of the first transmission rod, the lower end of the second transmission part is hinged with the other end of the second transmission rod, the joint of the first transmission part and the first receiving part is hinged with the first mounting frame through a first pivot, the joint of the second transmission part and the second receiving part is hinged with the first mounting frame through a second pivot, and the first pivot and the second pivot are positioned above the transmission shaft; the third driving mechanism drives the transmission shaft to rotate, so that the first receiving arm and the second receiving arm can rotate between a first state and a second state, when the first receiving arm and the second receiving arm are in the first state, the first receiving part can receive the circuit board at the first discharging end, and the second receiving part can transmit the circuit board to the third conveying device; when the circuit board is in the second state, the first material receiving part and the second material receiving part are close to each other to a limit distance, and the first material receiving arm transmits the circuit board to the second material receiving arm;
A plurality of first limit stops are arranged at intervals at one end of the first material receiving part, which is close to the first transmission part, and first limit walls arranged along the length direction of the first material receiving part are arranged at the left side and the right side of the first limit stops; a plurality of second limit stops are arranged at intervals at one end, close to the second transmission part, of the second material receiving part, and second limit walls arranged along the length direction of the second material receiving part are arranged at the left side and the right side of the second limit stops; the first limit stop is provided with a first limit surface for limiting the circuit board in the length direction of the first material receiving part, and the second limit stop is provided with a second limit surface for limiting the circuit board in the length direction of the second material receiving part; when the first limiting stop is in the first state, the first limiting stop faces are staggered with the second limiting stop faces, and the first limiting surfaces and the second limiting surfaces are inclined downwards, so that the first limiting stop faces and the second limiting stop faces form a blanking inclined plane;
The first conveying device comprises a first belt conveying mechanism, a support bracket, a first sliding rail and a second sliding rail; the support bracket is arranged on the first belt conveying mechanism and is provided with a first sliding part, a second sliding part and a limiting assembly for limiting the circuit board; the first sliding rail and the second sliding rail are respectively positioned at two sides of the support bracket in a second horizontal direction, the second horizontal direction is perpendicular to the first horizontal direction, the first sliding part is slidably mounted on the first sliding rail, and the second sliding part is slidably mounted on the second sliding rail;
the limiting assembly comprises a first limiting plate, a second limiting plate and a pressing structure; the first limiting plate and the second limiting plate are oppositely arranged, the first limiting plate comprises a first stop wall and a second stop wall which is vertically connected with two ends of the first stop wall, and the second limiting plate comprises a third stop wall and a fourth stop wall which is vertically connected with two ends of the third stop wall; the pressing structure is connected with the first limiting plate and used for driving the first limiting plate to approach or deviate from the second limiting plate;
The support bracket comprises a first layer of frame body, a support body and a second layer of frame body which are sequentially connected from top to bottom, the first limiting plate is provided with a sliding block which penetrates through the first layer of frame body and is slidably arranged on the second layer of frame body, the sliding block is connected with a sliding rack, and the sliding rack is driven to synchronously move by the movement of the first limiting plate; the supporting bracket is also provided with a jacking mechanism which comprises a transmission gear, a rocker and a sliding rod; the transmission gear is arranged on the support body through a third pivot and meshed with the transmission gear; the lower end of the rocker is arranged on the third pivot and can rotate around the third pivot; the sliding rod can be slidably arranged on the first layer of frame body along the vertical direction, and the lower end of the sliding rod is hinged and matched with the upper end of the rocker; the negative pressure suction structure is characterized in that the support bracket is further provided with a negative pressure suction structure for adsorbing the circuit board, the negative pressure suction structure comprises a negative pressure suction part, a communication pipeline and a negative pressure suction nozzle which are sequentially connected, the negative pressure suction part is installed in the support bracket, the communication pipeline is arranged on the sliding rod in a penetrating mode, and the negative pressure suction nozzle is installed at the upper end of the sliding rod.
2. The electronic component mounting apparatus according to claim 1, wherein the first gripping and mounting device includes a first moving base, a first driving mechanism, a second moving base, a second driving mechanism, a first elevating mechanism, and a gripping mechanism;
The first mobile machine seat is arranged on the first translation track, and the first driving mechanism is connected with the first mobile machine seat and drives the first mobile machine seat to move along a second horizontal direction on the first translation track;
The second mobile machine seat is arranged on the first mobile machine seat, and the second driving mechanism is connected with the second mobile machine seat and is used for driving the second mobile machine seat to move in a first horizontal direction;
the first lifting mechanism is installed on the second mobile machine base, and the grabbing mechanism is installed on the first lifting mechanism.
3. The electronic component mounting apparatus according to claim 2, wherein the gripping mechanism includes a mounting plate and a plurality of pin-connected heads connected to a bottom surface of the mounting plate, the pin-connected heads being provided with suction heads adaptable to suction openings of the first suction nozzles, the suction heads being communicated with a negative pressure suction assembly.
4. The electronic component mounting apparatus according to claim 1, wherein the storage device includes a storage seat and a protection cover, a plurality of storage positions for accommodating the first suction nozzles are provided on the storage seat, and the protection cover is mounted on the storage seat and provided with suction nozzle outlets corresponding to the plurality of storage positions one by one.
5. The electronic component mounting apparatus according to claim 4, wherein the storage device further comprises a pushing mechanism connected to the protective cover or the storage seat, and configured to move the protective cover and the storage seat.
6. The electronic component mounting apparatus of claim 4, wherein the protective cover is hingedly mated with the storage seat.
7. The electronic component mounting apparatus according to any one of claims 1 to 6, further comprising a first frame, a moving wheel being provided at a bottom of the first frame; the first conveying device, the second conveying device, the storage device, the first translation track, the first image acquisition device and the first grabbing and mounting device are all mounted on the first frame.
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| CN202210954700.9A CN115038327B (en) | 2022-08-10 | 2022-08-10 | Electronic component mounting equipment |
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| CN202210954700.9A CN115038327B (en) | 2022-08-10 | 2022-08-10 | Electronic component mounting equipment |
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| CN115038327A (en) | 2022-09-09 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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Country or region after: China Address after: No. 19 Baoying South Road, Guangzhou, Guangdong Province, 510730 Applicant after: Prime Technology(Guangzhou) Inc. Address before: 510730 No. 19, Baoying South Road, free trade zone, Huangpu District, Guangzhou, Guangdong Applicant before: PRIME TECHNOLOGY (GUANGZHOU) Inc. Country or region before: China |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |