CN115038327A - Electronic component pastes dress equipment - Google Patents
Electronic component pastes dress equipment Download PDFInfo
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- CN115038327A CN115038327A CN202210954700.9A CN202210954700A CN115038327A CN 115038327 A CN115038327 A CN 115038327A CN 202210954700 A CN202210954700 A CN 202210954700A CN 115038327 A CN115038327 A CN 115038327A
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- mounting
- electronic component
- grabbing
- conveyor
- circuit board
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- 238000003860 storage Methods 0.000 claims abstract description 54
- 238000013519 translation Methods 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims description 89
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 6
- 230000003028 elevating effect Effects 0.000 claims description 5
- 238000013459 approach Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 51
- 239000000463 material Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 16
- 230000007306 turnover Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005267 amalgamation Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides electronic component mounting equipment, and relates to the technical field of circuit board production and processing. The device comprises a first conveying device, a storage device, a first image acquisition device, a second conveying device, a first translation rail, a first grabbing and mounting device and a control device; the first conveying device is used for conveying the circuit board. According to the invention, the first grabbing and mounting device moves to the first grabbing position to grab the first suction nozzle, then whether grabbing is correct is judged through the first image acquisition device and the control device, then the first suction nozzle is used for picking up the first electronic element, whether picking is correct is judged through the first image acquisition device and the control device, and finally the first electronic element is placed in the first mounting position through the first grabbing and mounting device for mounting.
Description
Technical Field
The invention relates to the technical field of circuit board production and processing, in particular to electronic component mounting equipment.
Background
Printed circuit boards with electronic components are typically manufactured by first attaching the components to the board, then applying solder paste to the pads on the board, positioning the leads, and heating the solder paste to fuse the leads to the pads.
The existing mounting process of the electronic elements generally adopts a mechanical arm to attach the electronic elements to a circuit board one by one, and because the circuit board needs a plurality of electronic elements, the mode not only occupies a longer production line, but also has low efficiency and can not meet the requirement of large-scale production.
Disclosure of Invention
The invention aims to provide electronic component mounting equipment to solve the problems of low efficiency and overlong production line of the existing mounting mode.
In order to solve the above problems, the present invention first provides an electronic component mounting apparatus, which includes a first conveying device, a storage device, a first image obtaining device, a second conveying device, a first translation rail, a first grabbing and mounting device, and a control device; the first conveying device is used for conveying the circuit board; the storage device is adjacent to the first conveying device, and a plurality of first suction nozzles are stored in the storage device; the first image acquisition device is respectively adjacent to the storage device and the first conveying device; the second conveying device is adjacent to the first image acquisition device and is used for conveying the first electronic element; the first translation track is arranged above the first conveying device, the storage device and the second conveying device; the first grabbing and mounting device is mounted on the first translation rail, can move to a first grabbing position, a second grabbing position, a first image identification position and a first mounting position on the first translation rail, is located at the first grabbing position, can grab the first suction nozzle and is located at the second grabbing position, can suck the first electronic component through the first suction nozzle and is located at the first mounting position, and can mount the first electronic component on the first surface of the circuit board; and the control device is respectively connected with the first conveying device, the second conveying device, the first image acquisition device and the first grabbing and mounting device and is positioned at the first image recognition position, the first image acquisition device can acquire a grabbed first suction nozzle image and a first electronic component image, and the control device judges whether the grabbing is correct or not based on the image acquired by the first image acquisition device.
By adopting the technical scheme, the first grabbing and mounting device moves to the first grabbing position to grab the first suction nozzle, then whether the first suction nozzle is grabbed correctly or not is judged through the first image acquisition device and the control device, then the first suction nozzle is used for picking up the first electronic element, the first image acquisition device and the control device are used for judging whether the first electronic element is picked up correctly or not, finally the first grabbing and mounting device is used for placing the first electronic element in the first mounting position, mounting operation is carried out, the whole mounting process does not need manual intervention, mounting of multiple groups of first electronic elements can be realized, and mounting accuracy and efficiency can be improved.
Further, the first conveying device comprises a first belt conveying mechanism, a support bracket, a first sliding rail and a second sliding rail; the supporting bracket is arranged on the first belt conveying mechanism and is provided with a first sliding part, a second sliding part and a limiting assembly for limiting the circuit board; the first sliding rail and the second sliding rail are respectively located on two sides of the support frame in the second horizontal direction, the second horizontal direction is perpendicular to the first horizontal direction, the first sliding portion is slidably mounted on the first sliding rail, and the second sliding portion is slidably mounted on the second sliding rail.
By adopting the technical scheme, the bearing bracket can move in the second horizontal direction under the driving of the first belt conveying mechanism, and the two sides of the bearing bracket are limited and fixed by the first sliding rail and the second sliding rail, so that the stability of the circuit board in mounting is improved.
Further, the limiting assembly comprises a first limiting plate, a second limiting plate and a compressing structure; the first limiting plate and the second limiting plate are arranged oppositely, the first limiting plate comprises a first stopping wall and a second stopping wall vertically connected to two ends of the first stopping wall, and the second limiting plate comprises a third stopping wall and a fourth stopping wall vertically connected to two ends of the third stopping wall; the compressing structure is connected with the first limiting plate and used for driving the first limiting plate to be close to or deviate from the second limiting plate.
By adopting the technical scheme, the limiting space is formed between the first limiting plate and the second limiting plate, and the limiting of the circuit board can be removed through the pressing structure, so that the circuit board can be conveniently fed and discharged.
Furthermore, the limiting assembly further comprises a negative pressure suction structure arranged on the support bracket and used for adsorbing the circuit board.
By adopting the technical scheme, the negative pressure suction structure can play a certain adsorption role on the bottom surface of the circuit board, and the stability of the circuit board in the transportation and mounting process is further improved.
Further, the first grabbing and mounting device comprises a first moving base, a first driving mechanism, a second moving base, a second driving mechanism, a first lifting mechanism and a grabbing mechanism; the first moving machine base is arranged on the first translation rail, and the first driving mechanism is connected with the first moving machine base and drives the first moving machine base to move on the first translation rail along a second horizontal direction; the second moving machine base is arranged on the first moving machine base, and the second driving mechanism is connected with the second moving machine base and is used for driving the second moving machine base to move in a first horizontal direction; the first lifting mechanism is installed on the second moving base, and the grabbing mechanism is installed on the first lifting mechanism.
By adopting the technical scheme, the first driving mechanism is utilized to drive the moving base to move in the second horizontal direction, the second driving mechanism is utilized to drive the grabbing mechanism and the lifting mechanism to move in the first horizontal direction, and the lifting mechanism is utilized to drive the grabbing mechanism to lift, so that the grabbing mechanism has higher flexibility and meets the grabbing and mounting requirements.
Furthermore, snatch the mechanism and include the mounting panel and connect in a plurality of amalgamation heads of mounting panel bottom surface, the amalgamation head be equipped with can with the suction nozzle of suction inlet looks adaptation of first suction nozzle, the suction nozzle intercommunication has negative pressure adsorption component.
By adopting the technical scheme, the suction head and the suction nozzle are connected by matching with the negative pressure suction assembly, and the connection and disconnection are quick and efficient.
Furthermore, the storage device comprises a storage seat and a protective cover, the storage seat is provided with a plurality of accommodating positions for accommodating the first suction nozzle, and the protective cover is arranged on the storage seat and is provided with suction nozzle outlets in one-to-one correspondence with the accommodating positions.
Adopt above-mentioned technical scheme, adopt the safety cover to protect first suction nozzle, avoid external impurity to pollute first suction nozzle.
Furthermore, the storage device further comprises a pushing mechanism, wherein the pushing mechanism is connected with the protective cover and used for driving the protective cover and the storage seat to move.
By adopting the technical scheme, the position of the storage mechanism can be adjusted by utilizing the pushing mechanism, so that the first grabbing and mounting device can grab the first suction nozzle, the following second grabbing and mounting device can grab the second suction nozzle, and a storage structure is not required to be arranged for the second suction nozzle.
Further, the protective cover is matched with the storage seat in a hinged mode.
By adopting the technical scheme, the protection cover is convenient to open and close.
The device further comprises a first machine frame, wherein moving wheels are arranged at the bottom of the first machine frame; the first conveying device, the second conveying device, the storage device, the first translation rail, the first image acquisition device and the first grabbing and mounting device are all mounted on the first rack.
By adopting the technical scheme, the first machine frame can integrate all the functional devices, and the moving wheels are utilized to facilitate the movement of the whole equipment.
The system further comprises a turnover conveying device, a third conveying device, a fourth conveying device, a second image acquisition device, a second translation rail and a second grabbing and mounting device; the overturning and conveying device, the third conveying device, the fourth conveying device, the second image acquisition device and the second grabbing and mounting device are all connected with the control device; the first conveying device is provided with a first feeding end and a first discharging end, and the overturning conveying device is configured to receive the circuit board at the first discharging end and overturn and convey the circuit board to the third conveying device; the second image acquisition device is positioned between the third conveying device and the fourth conveying device; the storage is internally stored with a plurality of second suction nozzles, and the fourth conveying device is adjacent to the second image acquisition device and is used for conveying a second electronic component; the second translation track is located above the third conveying device, the fourth conveying device and the second image acquisition device, the second grabbing and mounting device is mounted on the translation track and can move to a third grabbing position, a fourth grabbing position, a second image identification position and a second mounting position on the second translation track, the second grabbing and mounting device is located at the third grabbing position, the second grabbing and mounting device can grab the second suction nozzle and is located at the fourth grabbing position, the second grabbing and mounting device can suck the second electronic component through the second suction nozzle and is located at the second mounting position, and the second grabbing and mounting device mounts the second electronic component to the second surface of the circuit board.
Adopt above-mentioned technical scheme, utilize upset conveyor to carry the circuit board upset that first surface mounting accomplished to third conveyor, then utilize the second to snatch the mounting device and carry out second suction nozzle absorption and second electronic component's absorption and dress in proper order, can carry out two-sided dress to the circuit board that needs two-sided dress, need not artifical the intervention, improve dress efficiency, satisfy the dress demand of pasting of two-sided circuit board.
Further, the overturning and conveying device comprises a first mounting frame, a third driving mechanism, a transmission shaft, a driving rotating arm, a first transmission rod, a second transmission rod, a first material receiving arm and a second material receiving arm; the third driving mechanism is arranged on the first mounting frame; the transmission shaft is connected with the third driving mechanism and driven by the third driving mechanism to rotate; the driving rotating arm is connected with the transmission shaft and synchronously rotates, the driving rotating arm is provided with a first connecting end and a second connecting end, and the distance between the first connecting end and the axis of the transmission shaft is equal to the distance between the second connecting end and the axis of the transmission shaft; one end of the first transmission rod is hinged and matched with the first connecting end, and one end of the second transmission rod is hinged and matched with the second connecting end; the first material receiving arm comprises a first transmission part and a first material receiving part which are integrally connected and form an angle with each other, the lower end of the first transmission part is hinged and matched with the other end of the first transmission rod, the lower end of the second transmission part is hinged and matched with the other end of the second transmission rod, the joint of the first transmission part and the first material receiving part is hinged on the first mounting frame through a first pivot, the second material receiving arm comprises a second transmission part and a second material receiving part which are integrally connected and form an angle with each other, the joint of the second transmission part and the second material receiving part is hinged on the first mounting frame through a second pivot, and the first hinge shaft and the second hinge shaft are positioned above the transmission shaft; when the third driving mechanism drives the transmission shaft to rotate, the first material receiving arm and the second material receiving arm can rotate between a first state and a second state, and in the first state, the first material receiving part can receive the circuit board at the first blanking end, and the second material receiving part can transfer the circuit board on the first material receiving part to the third conveying device; and in the second state, the first receiving part and the second receiving part approach to each other to a limit distance, and the first receiving arm transfers the circuit board to the second receiving arm.
By adopting the technical scheme, the third driving mechanism is utilized to drive the first material receiving arm and the second material receiving arm to move simultaneously, only one driving mechanism is needed to sequentially complete material receiving, overturning and conveying of the circuit board, the structure is ingenious, and the power source cost is saved.
Furthermore, a plurality of first limit stops are arranged at intervals at one end of the first material receiving part close to the first transmission part, and first limit walls are arranged on two sides of the plurality of first limit stops; a plurality of second limit stops are arranged at intervals at one end of the second material receiving part close to the second transmission part, and second limit walls are arranged on two sides of the plurality of second limit stops; the first limit stop is provided with a first limit surface used for limiting the circuit board, the second limit stop is provided with a second limit surface used for limiting the circuit board, when the first limit stop is in the second state, the plurality of second limit stops and the plurality of first limit stops are staggered, and the first limit surface and the second limit surface incline downwards.
By adopting the technical scheme, when the first material receiving part and the second material receiving part are in the second state, the first limit stop and the second limit stop form a blanking inclined plane, so that the circuit board can enter the second material receiving part from the first material receiving part, the circuit board can be turned over without assistance of other structures, and the structure is ingenious.
Further, the lifting mechanism is arranged on the supporting bracket; the bearing bracket comprises a first layer of bracket body, a supporting body and a second layer of bracket body which are sequentially connected from top to bottom, the first limiting plate is provided with a sliding block which penetrates through the first layer of bracket body and is slidably installed on the second layer of bracket body, the sliding block is connected with a sliding rack, and the sliding rack is driven by the movement of the first limiting plate to synchronously move; the jacking mechanism comprises a transmission gear, a rocker and a sliding rod; the transmission gear is arranged on the support body through a third pivot and meshed with the transmission gear; the lower end of the rocker is arranged on the third pivot and can rotate around the third pivot; the sliding rod can be installed on the first layer of frame body in a sliding mode along the vertical direction, and the lower end of the sliding rod is hinged and matched with the upper end of the rocker; the negative pressure suction structure comprises a negative pressure suction piece, a communication pipeline and a negative pressure suction nozzle which are sequentially connected, wherein the negative pressure suction piece is arranged in the bearing bracket, the communication pipeline penetrates through the sliding rod, and the negative pressure suction nozzle is arranged at the upper end of the sliding rod.
By adopting the technical scheme, the jacking mechanism can lift the circuit board after the first surface mounting is completed, so that the first material receiving part is convenient to accept the circuit board, the jacking mechanism does not need other power, the circuit board can be realized only by utilizing the movement of the first limiting plate, the structure is ingenious, and the power source cost is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic component mounting apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a first conveyor of an electronic component mounting apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a first pick-and-place device of an electronic component placement apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a grabbing mechanism of an electronic component mounting apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a storage device of an electronic component mounting apparatus according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a turnover conveyor of an electronic component mounting apparatus according to an embodiment of the present invention;
fig. 7 is a schematic structural view of a turnover conveyor of an electronic component mounting apparatus according to an embodiment of the present invention in a first state;
fig. 8 is a schematic structural view of a turnover conveyor of an electronic component mounting apparatus according to an embodiment of the present invention in a second state;
fig. 9 is a schematic structural diagram of a support bracket of an electronic component mounting apparatus according to an embodiment of the present invention.
Description of reference numerals:
100-a first conveyor; 110-a first belt transport mechanism; 120-a support bracket; 121-a spacing assembly; 1211-a first limit plate; 12111-sliding block; 1212-a second limit plate; 1213-a compact structure; 1214-negative pressure suction structure; 12141-negative pressure suction; 12142-connecting line; 12143-negative pressure suction nozzle; 122-first level shelf; 123-a support; 124-second layer of frame body; 125-a jack-up mechanism; 1251-sliding rack; 1252-drive gear; 1253-rocker; 1254-sliding bar; 1255-a third pivot; 130-a first sliding track; 140-a second sliding track;
200-a storage device; 210-a storage seat; 220-a protective cover; 221-nozzle outlet; 230-a pushing mechanism; 240-a first suction nozzle; 250-a second suction nozzle;
300-a first image acquisition device;
400-a second conveyor;
500-a first translation track;
600-a first pick and place device; 610-a first mobile chassis; 620-a first drive mechanism; 630-a second mobile chassis; 640-a second drive mechanism; 650-a first lifting mechanism; 660-a grasping mechanism; 661-mounting the plate; 662-an assembly head; 6621-suction head;
700-overturning the conveying device; 710-a first mount; 720-a third drive mechanism; 730-a drive shaft; 740-actively rotating the arm; 741-a first link end; 742-a second connection end; 750-a first transfer lever; 760-a second drive link; 770-a first receiving arm; 771-first transmission part; 772-a first material receiving part; 7721-first limit stop; 7722-first stop wall; 780-a second take-up arm; 781-a second transmission part; 782-a second receiving part; 7821-a second limit stop; 7822-a second retaining wall;
800-a third conveying device; 900-a fourth conveyor; 1000-a second image acquisition device; 1100-a second translation track; 1200-a second pick and place device.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
Based on the problems of low mode efficiency and overlong production line of the existing mounting equipment, the embodiment provides the mounting equipment for the electronic element, and aims to solve the technical problems through structural improvement of the mounting equipment.
Referring to fig. 1, the electronic component mounting apparatus according to the present embodiment includes a first conveyor 100, a storage device 200, a first image capturing device 300, a second conveyor 400, a first translation rail 500, a first pick and place device 600, and a control device (not shown in the drawings); the control device of the present embodiment is connected to the first conveyor 100, the second conveyor 400, the first image capturing device 300, and the first pick-and-place device 600 respectively, and the connection may be a wire connection or a wireless signal connection, and the control device of the present embodiment may be an existing structure such as a computer processor having data processing, signal receiving, and control signal sending functions, and therefore, the present embodiment does not describe the structure and the illustration of the present embodiment.
Among the above functional devices, the first conveying device 100 of the present embodiment is used for conveying circuit boards, the storage device 200 of the present embodiment is adjacent to the first conveying device 100, and a plurality of first suction nozzles 240 for sucking a first electronic component (not shown in the figure) are stored in the storage device 200; the first image capturing device 300 of the present embodiment is adjacent to the storage device 200 and the first conveying device 100, respectively; the second conveying device 400 of the present embodiment is adjacent to the first image capturing device 300 and is used for conveying a first electronic component (not shown).
The first translation rail 500 of the present embodiment is disposed above the first conveyor 100, the storage device 200, and the second conveyor 400, and the "above" is not necessarily located right above, but may be broadly understood as an oblique above; the first capture and mounting device 600 of this embodiment is mounted on the first translation rail 500, and can move on the first translation rail 500 to the first capture position at the storage device 200, the second capture position at the second conveying device, the first image recognition position at the first image capturing device 300, and the first mounting position at the first conveying device 100, when located at the first capture position, the first capture and mounting device 600 of this embodiment can capture the first suction nozzle 240, when located at the second capture position, the first capture and mounting device 600 of this embodiment can suck the first electronic component through the first suction nozzle 240, and when located at the first mounting position, the first capture and mounting device 600 of this embodiment mounts the first electronic component onto the first surface of the circuit board; when the first image capturing device 300 of the present embodiment is located at the first image recognition position, the captured image of the first nozzle 240 and the captured image of the first electronic component can be captured, and the control device determines whether the capturing is correct based on the captured image of the first image capturing device 300.
During specific operation, the first grabbing and mounting device of the embodiment moves to the first grabbing position to grab the first suction nozzle 240, the first image acquisition device 300 acquires images of the grabbed first suction nozzles 240, the control device judges whether the grabbed first suction nozzles are correct based on the acquired images, after the grabbed first suction nozzles are recognized to be correct, the first suction nozzle 240 is used for picking up the first electronic element, the first image acquisition device 300 and the control device are used for recognizing whether the grabbed first electronic element is correct, after the correct grabbed first electronic element is judged, the first grabbing and mounting device is used for placing the first electronic element in the first mounting position to perform mounting operation, the whole mounting process does not need manual intervention, the first grabbing and mounting device can be used for grabbing the suction nozzles, mounting of multiple groups of first electronic elements is achieved, and mounting accuracy and efficiency of mounting can be improved.
Referring to fig. 2, in order to improve stability during transportation, the first transportation device 100 of the present embodiment is configured to include a first belt transfer mechanism 110, a support bracket 120, a first slide rail 130, and a second slide rail 140; the support bracket 120 of the present embodiment is mounted on the first tape conveying mechanism 110, and a first sliding portion and a second sliding portion (not shown) are respectively disposed on two sides of the support bracket 120 of the present embodiment, and a limiting component 121 for limiting the circuit board is disposed on a surface of the support bracket 120, and correspondingly, the first sliding rail 130 and the second sliding rail 140 of the present embodiment are respectively disposed on two sides of the support bracket 120 in the first horizontal direction, the first sliding portion is slidably mounted on the first sliding rail 130, and the second sliding portion is slidably mounted on the second sliding rail 140, when the circuit board is conveyed, the support bracket 120 of the present embodiment can be driven by the first tape conveying mechanism 110 to move in the second horizontal direction, and the first sliding rail 130 and the second sliding rail 140 play a role in limiting and fixing two sides of the support bracket 120, so as to improve stability of the circuit board when the circuit board is mounted.
Specifically, the limiting assembly 121 of the present embodiment includes a first limiting plate 1211, a second limiting plate 1212, and a pressing structure 1213; the first limiting plate 1211 and the second limiting plate 1212 of this embodiment are disposed oppositely, the first limiting plate 1211 includes a first stopping wall and a second stopping wall perpendicularly connected to two ends of the first stopping wall, the second limiting plate includes a third stopping wall and a fourth stopping wall perpendicularly connected to two ends of the third stopping wall, the first stopping wall, the two second stopping walls, the third stopping wall and the two fourth stopping walls form a limiting space, the compressing structure 1213 of this embodiment is connected to the first limiting plate 1211 and is configured to drive the first limiting plate 1211 to approach or depart from the second limiting plate 1212, and further adjust the size of the limiting space, so that the limiting assembly 121 can perform good limiting fixation on the circuit board, and is convenient for releasing the limiting on the circuit board.
In addition, the limiting assembly 121 of this embodiment may further include a negative pressure suction structure 1214 disposed on the support bracket 120 and used for sucking the circuit board, the negative pressure suction structure 1214 includes a negative pressure suction piece 12141, a communication pipeline 12142 and a negative pressure suction nozzle 12143 connected in sequence, the negative pressure suction piece 12141 may be a small air pump or other structures, and the negative pressure suction structure 1214 can play a certain role in sucking the bottom surface of the circuit board, thereby further improving the stability of the circuit board in the transportation and mounting processes.
Referring to fig. 3, the first picking and placing apparatus 600 of the present embodiment includes a first moving base 610, a first driving mechanism 620, a second moving base 630, a second driving mechanism 640, a first lifting mechanism 650, and a picking mechanism 660; the first moving base 610 is installed on the first translating rail 500, the first driving mechanism 620 is connected with the first moving base 610 and drives the first moving base 610 to move on the first translating rail 500 along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction; the second moving base 630 is mounted on the first moving base 610, and the second driving mechanism 640 is connected to the second moving base 630 and is configured to drive the second moving base 630 to move in the first horizontal direction; the first elevating mechanism 650 is installed at the second moving base 630, and the catching mechanism 660 is installed in the first elevating mechanism 650.
Above-mentioned first dress device of pasting that snatchs can utilize first actuating mechanism 620 to drive the frame that moves to remove in first horizontal direction, utilizes second actuating mechanism 640 to drive and snatchs mechanism 660 and elevating system and remove in the second horizontal direction, utilizes elevating system to drive and snatchs the mechanism 660 and go up and down for it has higher flexibility ratio to snatch mechanism 660, satisfies and snatchs and paste the dress requirement.
As shown in the attached figure 4, the grabbing mechanism 660 comprises a mounting plate 661 and a plurality of assembling heads 662 connected to the bottom surface of the mounting plate 661, the assembling heads 662 are provided with suction heads 6621 capable of being matched with suction ports of the first suction nozzles 240, the suction heads 6621 are communicated with a negative pressure adsorption assembly (not shown in the figure), the specifications of the assembling heads 662 of the embodiment can be different, and then the assembling heads are matched with the first suction nozzles 240 of different specifications one by one, and the connection and the disconnection are quick and efficient.
Referring to fig. 5, the storage device 200 of the present embodiment includes a storage base 210 and a protection cover 220, the protection cover 220 is preferably hinged to the storage base 210, the storage base 210 is provided with a plurality of accommodating positions for accommodating the first suction nozzles 240, the protection cover 220 is installed on the storage base 210 and is provided with suction nozzle outlets 221 corresponding to the plurality of accommodating positions one to one, and the protection cover 220 is used to protect the first suction nozzles 240 to prevent the first suction nozzles 240 from being polluted by external impurities.
In addition, in this embodiment, the storage device 200 further includes a pushing mechanism 230, the pushing mechanism 230 is connected to the protection cover 220 and used for driving the protection cover 220 and the storage seat 210 to move, the pushing mechanism 230 can be used for adjusting the position of the storage mechanism, so as to facilitate the first pick-and-place device 600 to pick the first suction nozzle 240 and the second pick-and-place device 1200 to pick the second suction nozzle 250, and a storage structure does not need to be separately provided for the second suction nozzle 250, thereby simplifying the storage structure and reducing the cost and the installation space.
In addition to the above functional devices, the electronic component mounting apparatus of this embodiment may further include a first frame (not shown), and a moving wheel (not shown) is disposed at the bottom of the first frame, the first conveyor 100, the second conveyor 400, the storage device 200, the first translation rail 500, the first image capturing device 300, and the first capturing and mounting device 600 of this embodiment are all mounted on the first frame, the structural form of the first frame is not limited, as long as the mounting of the above functional devices can be satisfied, each functional device can be integrated by using the first frame, and the moving wheel is used to facilitate the moving of the whole apparatus.
Based on the above structure, the inventor finds that, although the mounting efficiency of the electronic component can be improved, for the circuit board requiring the double-sided mounting of the electronic component, after the mounting of the first surface of the circuit board is completed, the other second surface of the circuit board opposite to the first surface needs to be mounted, if the first surface step is repeated by using the first grabbing and mounting device 600 again to affect the production efficiency to the second surface mounting, but the mounting by using the existing equipment still has the problem of low efficiency, and the like.
Referring to fig. 1, the electronic component mounting apparatus of this embodiment further includes an overturning conveying device 700, a third conveying device 800, a fourth conveying device 900, a second image capturing device 1000, a second translating rail 1100, and a second capturing and mounting device 1200, where the fourth conveying device 900 and the second conveying device 400 of this embodiment have similar or identical structures, and both may be an existing electronic component conveying structure, the second capturing and mounting device 1200 and the first capturing and mounting device 600 have similar structures, and the second image capturing device 1000 and the first image capturing device 300 have the same or similar structures, such as an existing camera, and therefore, the structures of the fourth conveying device 900, the second image capturing device 1000, and the second capturing and mounting device 1200 are not described in detail in this embodiment.
The turnover conveying device 700, the third conveying device 800, the fourth conveying device 900, the second image capturing device 1000, and the second pick-and-place device 1200 of this embodiment are also connected to a control device, that is, the above devices are controlled by the control device of this embodiment, and the connection mode may be a line or wireless signal connection.
The first conveyor 100 of this embodiment has a first feeding end and a first discharging end, the turnover conveyor 700 is configured to receive the circuit board at the first discharging end and turnover-convey the circuit board to the third conveyor 800, and for the circuit board after the first surface mounting is performed on the first conveyor 100, the solder paste can be directly soldered to the first electronic component on the first conveyor 100 by an existing soldering device (not shown in the figure), so as to prevent the electronic component from shifting during the turnover process.
Of course, a conventional soldering device (not shown) having a transfer function may be provided between the first conveyor 100 and the turnover conveyor 700, and the soldering device may receive the circuit board on the first blanking end support plate and solder the electronic component on the first surface, transfer the soldered circuit board to the turnover conveyor 700 of this embodiment to turn over, and then solder the circuit board by the remaining soldering device. Or after the first surface is mounted, the first surface is directly soldered on the first conveyor 100 by a soldering device, and then transferred to the turnover conveyor 700 of the present embodiment.
The second image taking apparatus 1000 of the present embodiment is located between the third conveyance apparatus 800 and the fourth conveyance apparatus 900; in order to simplify the structure, the present embodiment stores a plurality of second suction nozzles 250 in storage, and the fourth conveyance device 900 of the present embodiment is adjacent to the second image pickup device 1000 and is used to convey the second electronic component; the second translation track 1100 is located above the third conveyor 800, the fourth conveyor 900 and the second image capturing device 1000, the second capturing and mounting device 1200 is mounted on the translation track and can move on the second translation track 1100 to a third capturing position, a fourth capturing position, a second image recognition position and a second mounting position, the second capturing and mounting device 1200 is located at the third capturing position, the second capturing and mounting device 1200 can capture the second nozzle 250 and is located at the fourth capturing position, the second capturing and mounting device 1200 can suck the second electronic component through the second nozzle 250 and is located at the second mounting position, and the second capturing and mounting device 1200 mounts the second electronic component onto the second surface of the circuit board.
By adopting the structural design, the turnover conveying device 700 is utilized to convey the circuit board subjected to the first surface mounting to the third conveying device 800 in a turnover manner, then the second grabbing and mounting device 1200 is utilized to sequentially absorb the second suction nozzle 250 and absorb the second electronic element and mount the second electronic element, the circuit board required to be subjected to double-sided mounting can be subjected to double-sided mounting, manual intervention is not needed, the mounting efficiency is improved, and the mounting requirement of the double-sided circuit board is met.
Referring to fig. 6, the embodiment further provides an overturning conveying device 700, specifically, the overturning conveying device 700 includes a first mounting bracket 710, a third driving mechanism 720, a transmission shaft 730, a driving rotating arm 740, a first transmission rod 750, a second transmission rod 760, a first material receiving arm 770, and a second material receiving arm 780; the third driving mechanism 720 of the present embodiment is mounted on the first mounting frame 710; the transmission shaft 730 is connected with the third driving mechanism 720 and driven by the third driving mechanism 720 to rotate; the active rotation arm 740 of the embodiment is connected to the transmission shaft 730 and rotates synchronously, the active rotation arm 740 has a first connection end 741 and a second connection end 742, and a distance between the first connection end 741 and the transmission shaft 730 is equal to a distance between the second connection end 742 and the transmission shaft 730.
In the embodiment, one end of the first transmission rod 750 is hinged to the first connection end 741, and one end of the second transmission rod 760 is hinged to the second connection end 742; the first receiving arm 770 of this embodiment includes a first transmission portion 771 and a first receiving portion 772 integrally connected with each other at an angle, and the first receiving portion 772 and the second receiving portion 782 are approximately U-shaped, so that when the circuit board on the support bracket 120 is received, the first electronic element disturbing the first surface can be avoided as much as possible, the lower end of the first transmission part 771 is in hinged fit with the other end of the first transmission rod 750, the lower end of the second transmission part 781 is in hinged fit with the other end of the second transmission rod 760, the joint of the first transmission part 771 and the first material receiving part 772 is hinged to the first mounting frame 710 through a first pivot, the second material receiving arm 780 comprises the second transmission part 781 and the second material receiving part 782 which are integrally connected and form an angle with each other, the joint of the second transmission part 781 and the second material receiving part 782 is hinged to the first mounting frame 710 through a second pivot, and the first hinge and the second hinge are located above the transmission shaft 730.
When the third driving mechanism 720 of this embodiment drives the transmission shaft 730 to rotate, the first receiving arm 770 and the second receiving arm 780 can rotate between the first state and the second state, as shown in fig. 7, in the first state, the first receiving portion 772 of this embodiment can receive the circuit board at the first receiving end, and the second receiving portion 782 can transfer the circuit board thereon to the third conveying device 800; referring to fig. 8, when the circuit board is in the second state, the first receiving portion 772 and the second receiving portion 782 of this embodiment are close to each other to a limited distance, the first receiving arm 770 transfers the circuit board to the second receiving arm 780, the third driving mechanism 720 is utilized to drive the first receiving arm 770 and the second receiving arm 780 to operate, and only one driving mechanism is needed to sequentially complete receiving, turning and conveying of the circuit board, so that the structure is ingenious, and the cost of the power source is saved.
Referring to fig. 6 again, in this embodiment, a plurality of first limit stops 7721 are disposed at intervals at one end of the first material receiving portion 772 close to the first transmission portion 771, and first limit walls 7722 are disposed at two sides of the plurality of first limit stops 7721; a plurality of second limit stops 7821 are arranged at intervals at one end, close to the second transmission part 781, of the second material receiving part 782, and second limit walls 7822 are arranged on two sides of the plurality of second limit stops 7821; first limit stop 7721 is equipped with the first spacing face that is used for spacing circuit board, second limit stop 7821 is equipped with the second spacing face that is used for spacing circuit board, when being in the second state, a plurality of second limit stop 7821 and a plurality of first limit stop 7721 are crisscross mutually, first spacing face and the downward sloping of second limit face, therefore, when first connect material portion 772 and second connect material portion 782 to be in the second state, first limit stop 7721 and second limit stop 7821 form the unloading inclined plane, be convenient for the circuit board to get into second connect material portion 782 by first connect material portion 772, need not other structure assistance can enough realize the upset of circuit board, and the structure is ingenious.
Referring to fig. 9, a jacking mechanism 125 is further included, which is disposed on the support bracket 120; the support bracket 120 comprises a first layer frame body 122, a support body 123 and a second layer frame body 124123 which are sequentially connected from top to bottom, a first limit plate 1211 of the embodiment is provided with a sliding block 12111 which penetrates through the first layer frame body 122 and is slidably mounted on a second layer frame body 124123, the sliding block 12111 is fixedly connected with a sliding rack 1251, and the sliding rack 1251 is driven by the movement of the first limit plate 1211 to synchronously move; the jack-up mechanism 125 includes a slide rack 1251, a transmission gear 1252, a rocker 1253, and a slide rod 1254; the transmission gear 1252 is mounted to the support body 123 through a third pivot 1255 and engaged with the transmission gear 1252; the lower end of the rocker 1253 is mounted on the third pivot 1255 and can rotate around the third pivot 1255; the sliding rod 1254 can be slidably mounted on the first-layer frame body 122 along the vertical direction, and the lower end of the sliding rod 1254 is hinged and matched with the upper end of the rocker 1253; the negative pressure suction structure 1214 comprises a negative pressure suction piece 12141, a communication pipeline 12142 and a negative pressure suction nozzle 12143 which are connected in sequence, the negative pressure suction piece 12141 is installed in the support bracket 120, the communication pipeline 12142 is arranged through the sliding rod 1254, and the negative pressure suction nozzle 12143 is installed at the upper end of the sliding rod 1254.
When the first limiting plate 1211 is used for limiting the circuit board, the first limiting plate 1211 moves towards the direction away from the second limiting plate 1212, the sliding rack 1251, the transmission gear 1252 and the rocker 1253 are driven to move, the sliding rod 1254 is made to rise upwards, the adsorption of the negative pressure suction structure 1214 on the circuit board can be relieved through the control device, the first material receiving portion 772 is convenient to receive the circuit board, the jacking mechanism 125 does not need other power, the circuit board can be supported only by the aid of the movement of the first limiting plate 1211, the structure is ingenious, and power source cost is saved.
In the description of the present embodiment, it should be noted that, as those skilled in the art will understand, all or part of the processes in the method according to the above embodiments may be implemented by instructing the control device to perform a computer program, where the program may be stored in a computer-readable storage medium, and the program may include the processes according to the above method embodiments when executed, where the storage medium may be a memory, a magnetic disk, an optical disk, or the like.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected by one skilled in the art without departing from the spirit and scope of the invention, as defined in the appended claims.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An electronic component mounting apparatus, comprising:
a first conveyor (100), the first conveyor (100) being for conveying circuit boards in a first horizontal direction;
a storage device (200), the storage device (200) being adjacent to the first conveyor (100), the storage device (200) having a plurality of first nozzles (240) stored therein;
a first image acquisition device (300), said first image acquisition device (300) being adjacent to said storage device (200) and said first conveyor device (100), respectively;
a second conveying device (400), said second conveying device (400) being adjacent to said first image acquisition device (300) and being adapted to convey a first electronic component;
a first translation track (500), said first translation track (500) being arranged above said first conveyor (100), said storage device (200), said second conveyor (400);
a first grabbing and mounting device (600), wherein the first grabbing and mounting device (600) is mounted on the first translation rail (500), and can move on the first translation rail (500) to a first grabbing position, a second grabbing position, a first image recognition position and a first mounting position, and is located at the first grabbing position, the first grabbing and mounting device (600) can grab the first suction nozzle (240) and is located at the second grabbing position, the first grabbing and mounting device (600) can suck the first electronic component through the first suction nozzle (240) and is located at the first mounting position, and the first grabbing and mounting device (600) mounts the first electronic component to the first surface of the circuit board; and
and a control device, connected to the first conveying device (100), the second conveying device (400), the first image capturing device (300) and the first pick-and-place device (600), respectively, at the first image recognition position, wherein the first image capturing device (300) can capture the captured image of the first suction nozzle (240) and the captured image of the first electronic component, and the control device determines whether the capturing is correct based on the image captured by the first image capturing device (300).
2. The electronic component mounting apparatus according to claim 1, wherein the first conveyor (100) includes a first tape transfer mechanism (110), a support bracket (120), a first slide rail (130), and a second slide rail (140);
the support bracket (120) is mounted on the first belt conveying mechanism (110), and the support bracket (120) is provided with a first sliding part, a second sliding part and a limiting assembly (121) for limiting the circuit board;
the first sliding rail (130) and the second sliding rail (140) are respectively located on both sides of the support bracket (120) in the second horizontal direction, the second horizontal direction is perpendicular to the first horizontal direction, the first sliding portion is slidably mounted on the first sliding rail (130), and the second sliding portion is slidably mounted on the second sliding rail (140).
3. The electronic component mounting apparatus according to claim 2, wherein the limiting assembly (121) comprises a first limiting plate (1211), a second limiting plate (1212), and a pressing structure (1213);
the first limiting plate (1211) and the second limiting plate (1212) are arranged oppositely, the first limiting plate (1211) comprises a first stopping wall and a second stopping wall vertically connected to two ends of the first stopping wall, and the second limiting plate (1212) comprises a third stopping wall and a fourth stopping wall vertically connected to two ends of the third stopping wall;
the compressing structure (1213) is connected with the first limiting plate (1211) and is used for driving the first limiting plate (1211) to approach or depart from the second limiting plate (1212).
4. The electronic component mounting apparatus according to claim 3, wherein the position limiting assembly (121) further comprises a negative pressure suction structure (1214) disposed on the support bracket (120) for sucking a circuit board.
5. The electronic component mounting apparatus according to claim 2, wherein the first pick and place device (600) comprises a first moving base (610), a first driving mechanism (620), a second moving base (630), a second driving mechanism (640), a first elevating mechanism (650), and a pick mechanism (660);
the first moving base (610) is mounted on the first translation rail (500), and the first driving mechanism (620) is connected with the first moving base (610) and drives the first moving base (610) to move on the first translation rail (500) along a second horizontal direction;
the second moving base (630) is mounted on the first moving base (610), and the second driving mechanism (640) is connected with the second moving base (630) and is used for driving the second moving base (630) to move in a first horizontal direction;
the first lifting mechanism (650) is installed at the second moving base (630), and the catching mechanism (660) is installed at the first lifting mechanism (650).
6. The electronic component mounting apparatus according to claim 5, wherein said gripping mechanism (660) comprises a mounting plate (661) and a plurality of mounting heads (662) attached to a bottom surface of said mounting plate (661), said mounting heads (662) being provided with suction heads (6621) adapted to suction ports of said first suction nozzles (240), said suction heads (6621) being in communication with a negative pressure suction assembly.
7. The electronic component mounting apparatus according to claim 1, wherein the storage device (200) comprises a storage base (210) and a protective cover (220), the storage base (210) is provided with a plurality of receiving positions for receiving the first suction nozzles (240), and the protective cover (220) is mounted on the storage base (210) and provided with suction nozzle outlets (221) corresponding to the plurality of receiving positions one to one.
8. The electronic component placement machine according to claim 7, wherein the storage device (200) further comprises a pushing mechanism (230), and the pushing mechanism (230) is connected to the protective cover (220) or the storage seat (210) and is configured to move the protective cover (220) and the storage seat (210).
9. The electronic component placement machine according to claim 7, wherein the protective cover (220) is in hinged engagement with the storage receptacle (210).
10. The electronic component mounting apparatus according to any one of claims 1-9, further comprising a first frame, wherein a moving wheel is provided at a bottom of the first frame; the first conveyor (100), the second conveyor (400), the storage device (200), the first translation rail (500), the first image capturing device (300), and the first pick-and-place device (600) are all mounted to the first rack.
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| CN202210954700.9A CN115038327B (en) | 2022-08-10 | 2022-08-10 | Electronic component mounting equipment |
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| CN115038327B (en) | 2024-05-03 |
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