CN114669892A - High-precision plate dividing mold segmentation plate cutting device - Google Patents
High-precision plate dividing mold segmentation plate cutting device Download PDFInfo
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- CN114669892A CN114669892A CN202210596328.9A CN202210596328A CN114669892A CN 114669892 A CN114669892 A CN 114669892A CN 202210596328 A CN202210596328 A CN 202210596328A CN 114669892 A CN114669892 A CN 114669892A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 119
- 230000011218 segmentation Effects 0.000 title claims abstract description 10
- 238000005192 partition Methods 0.000 claims abstract 3
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 7
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The application discloses board device is cut out to high accuracy partition board mould segmentation includes: the equipment main body, the equipment main body includes frame and processing platform, the processing platform sets up the upper end at the frame, the up end rear end position of processing platform is provided with cuts out the board case, the inside of cutting out the board case is provided with cuts out the board device, the up end of processing platform is provided with a plurality of groups conveyor, the last stop device who is used for fixed PCB that is provided with of conveyor, conveyor's rear end extends to the inside of cutting out the board case. The utility model provides a board device is cut out to high accuracy partition mould segmentation uses and need not the manual calibration position of people, and processing is more convenient, can once only divide the board, need not fixed many times, reduces fixed process, divides the fast of board, can make things convenient for operating personnel to take out PCB, practices thrift the unloading time, divides the efficient of board, brings better use prospect.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to a high-precision plate dividing mold segmented plate cutting device.
Background
The Chinese name of the printed circuit board is also called as a printed circuit board, is an important electronic component, is a support body of the electronic component, and is a carrier for electrically interconnecting the electronic component;
in order to facilitate processing, the PCB is usually attached to a large board formed by combining a plurality of PCBs, the large board needs to be cut into PCBs with standard sizes after the mounting process of the electronic components on the large board is completed, and a board cutting device is developed for facilitating cutting of the PCB.
There is certain drawback when current cutting plate device uses, needs the position of the big board of manual adjustment when current cutting plate device cuts out the board, needs calibration repeatedly, and is more troublesome, adopts the fixed big board of fixed knot structure moreover, then adopts cutting equipment to cut apart in proper order, and every cutting all needs to be fixed again, and the efficiency of cutting apart is slow, and it is more troublesome to take out the PCB after fixing moreover, unsatisfied production requirement, for this reason, we provide a high accuracy and divide board mould segmentation cutting plate device.
Disclosure of Invention
The invention aims to provide a high-precision plate dividing mold segmented plate cutting device, which aims to solve the technical problems that a large plate is fixed by a fixing structure when a plate cutting device in the prior art is used for cutting a plate, then cutting equipment is used for sequentially cutting the plate, each cutting needs to be fixed again, the cutting efficiency is low, and the fixed PCB is taken out relatively difficultly.
A high-precision plate dividing mold segmentation plate cutting device comprises:
the PCB processing device comprises an equipment main body, wherein the equipment main body comprises a base and a processing table, the processing table is arranged at the upper end of the base, a board cutting box is arranged at the rear end of the upper end face of the processing table, a board cutting device is arranged inside the board cutting box, a plurality of groups of conveying devices are arranged on the upper end face of the processing table, a limiting device used for fixing a PCB is arranged on each conveying device, and the rear end of each conveying device extends into the board cutting box; and
and the operation table is used for controlling the plate cutting device, the conveying device and the limiting device to operate and is arranged at one end of the base.
Preferably, cut out the board device and include X axle conveyor, laser and cut out board device and two sets of Z axle conveyors, it is two sets of Z axle conveyor is fixed mounting respectively on the inside wall of cutting out the board case, X axle conveyor's both ends are connected with two sets of Z axle conveyors respectively, laser is cut out the board device and is installed on X axle conveyor.
Preferably, the laser board cutting device comprises a mounting seat, a lifting component and a laser board cutting seat, the mounting seat is mounted on the X-axis conveying device, and the laser board cutting seat is connected with the mounting seat through the lifting component.
Preferably, the lower terminal surface of mount pad is provided with laser cutting head, lighting components and the camera device that is used for gathering the PCB image.
Preferably, the conveying device comprises two groups of conveying rails arranged on the upper end face of the processing table, the two groups of conveying rails are arranged in parallel, and a screw rod transmission device is arranged inside each conveying rail.
Preferably, the limiting device comprises a supporting table and a limiting table, fixing seats connected with the lead screw transmission device are arranged at two ends of the lower end face of the supporting table, and the limiting table is installed on the supporting table.
Preferably, the upper end of spacing platform is provided with the spacing groove that is used for injecing the big board position, be provided with a plurality of groups spacing district on the spacing groove, be provided with the supporting shoe on the spacing district, be used for perk cutting back PCB's elastic component and two sets of suction nozzles, supporting shoe, elastic component and two sets of suction nozzles are all installed in the upper end of spacing platform.
Preferably, the elastic piece comprises two groups of arc-shaped elastic pieces and a connecting strip, and the two groups of arc-shaped elastic pieces are fixedly connected through the connecting strip.
Preferably, a vacuum pump is arranged inside the support table and is communicated with the plurality of groups of suction nozzles through pipelines.
Preferably, the upper end face of the equipment main body is provided with a gas purifier, two groups of suction hoods are arranged above the two groups of conveying devices on the inner top face of the cutting board box, and the gas purifier is communicated with the suction hoods through a pipeline.
Compared with the prior art, the invention has the beneficial effects that:
the conveying device is recorded in the high-precision plate dividing mold segmented plate cutting device, the material loading position and the cutting position are respectively arranged at two ends of the conveying device, when the high-precision plate dividing mold segmented plate cutting device is used, the conveying device drives the large plate to reciprocate the material loading position and the cutting position, material loading and unloading are carried out on the material loading position, cutting is carried out in the cutting position, manual position calibration is not needed when the high-precision plate dividing mold segmented plate cutting device is used, and the processing is convenient;
secondly, the plate cutting device is recorded in the high-precision plate dividing mold segmentation plate cutting device, the X-axis conveying device and the Z-axis conveying device in the plate cutting device are matched to adjust the laser plate cutting device to a processing position, whether a large plate is misplaced or not is judged through the camera device, then the position of the laser cutting head is adjusted through the lifting assembly to perform laser plate dividing, the plate dividing precision is high, and the plate dividing speed is high;
thirdly, the limiting device is recorded in the high-precision plate dividing mold segmented plate cutting device, and a plurality of groups of limiting areas on a limiting table in the limiting device can directly limit the position of each PCB in a large plate, so that the large plate can be divided at one time without multiple times of fixation, the fixation process is reduced, the plate dividing speed is high, and the plate dividing efficiency is high;
fourthly, the limiting device is recorded in the high-precision plate dividing and cutting device for the mold in the segmentation manner, the position of each PCB can be limited by the vacuum pump in the limiting area on the limiting device in a manner of being matched with the suction nozzle, and after the plate division is completed, one end of each PCB after the plate division is tilted under the elasticity of the elastic piece, so that an operator can conveniently take out the PCB, the blanking time is saved, the plate dividing efficiency is high, and the whole high-precision plate dividing and cutting device for the mold in the segmentation manner is stable in structure, simple and reliable in structure, low in cost, long in service life, convenient to install and maintain, capable of realizing large-scale production and application, convenient to market popularization and practical.
The parts of the device not involved are the same as or can be implemented using prior art.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of the overall structure of a high-precision plate dividing mold section cutting device according to the present invention;
FIG. 2 is a partial structure diagram of the inside of a plate cutting box of the high-precision plate dividing mold section plate cutting device of the invention;
FIG. 3 is a partial structural view of a conveying device in the segmented plate cutting device of the high-precision plate dividing mold according to the invention;
FIG. 4 is a schematic view of a partial structure of a limiting device in the segmented plate cutting device of the high-precision plate dividing mold according to the present invention;
FIG. 5 is a schematic structural diagram of a supporting table in the high-precision plate dividing mold segmented plate cutting device according to the present invention;
FIG. 6 is a schematic structural diagram of an elastic member in a high-precision plate dividing mold segment cutting device according to the present invention.
Reference numerals:
1. a machine base; 2. a processing table; 3. cutting a board box; 4. an operation table; 5. an X-axis conveying device; 6. a laser plate cutting device; 7. a Z-axis conveying device; 8. a mounting seat; 9. a lifting assembly; 10. a laser board cutting seat; 11. a conveying track; 12. a support table; 13. a limiting table; 14. a support block; 15. a suction nozzle; 16. an elastic member; 17. a gas purifier; 18. a suction hood.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Aiming at the problems in the prior art, the invention discloses a high-precision plate dividing mold segmented plate cutting device, which comprises:
the PCB processing device comprises an equipment main body, wherein the equipment main body comprises a base and a processing table, the processing table is arranged at the upper end of the base, a board cutting box is arranged at the rear end of the upper end face of the processing table, a board cutting device is arranged inside the board cutting box, a plurality of groups of conveying devices are arranged on the upper end face of the processing table, a limiting device used for fixing a PCB is arranged on each conveying device, and the rear end of each conveying device extends into the board cutting box; and
and the operation table is used for controlling the plate cutting device, the conveying device and the limiting device to operate and is arranged at one end of the base.
The emergency stop button, the computer, the keyboard table and the article placing table are arranged on the operating table, and the observation window is arranged on the outer surface of the board cutting box and can be conveniently checked.
The plate cutting device comprises an X-axis conveying device, a laser plate cutting device and two sets of Z-axis conveying devices, the Z-axis conveying devices are fixedly mounted on the inner side wall of the plate cutting box respectively, two ends of the X-axis conveying devices are connected with the two sets of Z-axis conveying devices respectively, and the laser plate cutting device is mounted on the X-axis conveying devices.
The shaft conveying device drives the X-shaft conveying device to move back and forth, the X-shaft conveying device drives the laser board cutting device to move left and right, and the lifting assembly drives the laser board cutting seat to move up and down, so that the position of the laser cutting head is adjusted, and the boards are cut.
The laser board cutting device comprises a mounting seat, a lifting assembly and a laser board cutting seat, the mounting seat is mounted on the X-axis conveying device, and the laser board cutting seat is connected with the mounting seat through the lifting assembly.
The plate cutting device is recorded in the high-precision plate dividing mold segmented plate cutting device, the X-axis conveying device and the Z-axis conveying device in the plate cutting device are matched to adjust the laser plate cutting device to a machining position, whether a large plate is dislocated or not is judged through the camera device, then the position of the laser cutting head is adjusted through the lifting assembly to perform laser plate dividing, the plate dividing precision is high, and the plate dividing speed is high.
The lower terminal surface of mount pad is provided with laser cutting head, lighting components and is used for gathering the camera device of PCB image.
The camera device is connected with a computer, and the computer software identifies the PCB image so as to judge whether the position of the large board is correct.
The limiting device is recorded in the high-precision plate dividing mold segmented plate cutting device, and the plurality of groups of limiting areas on the limiting table in the limiting device can directly limit the position of each PCB in a large plate, so that the large plate can be divided at one time without multiple times of fixing, the fixing process is reduced, the plate dividing speed is high, and the plate dividing efficiency is high.
The conveying device comprises two groups of conveying rails arranged on the upper end face of the processing table, the two groups of conveying rails are arranged in parallel, and a lead screw transmission device is arranged inside each conveying rail.
The screw transmission device can also be replaced by other existing transmission devices.
The conveying device is recorded in the high-precision plate dividing mold segmented plate cutting device, the material loading position and the cutting position are respectively arranged at two ends of the conveying device, when the high-precision plate dividing mold segmented plate cutting device is used, the conveying device drives a large plate to reciprocate the material loading position and the cutting position, material loading and material unloading are carried out on the material loading position, cutting is carried out in the cutting position, manual position calibration is not needed when the high-precision plate dividing mold segmented plate cutting device is used, and the processing is convenient.
The limiting device comprises a supporting table and a limiting table, fixing seats connected with the lead screw transmission device are arranged at two ends of the lower end face of the supporting table, and the limiting table is installed on the supporting table.
The upper end of spacing platform is provided with the spacing groove that is used for injecing the big board position, be provided with a plurality of groups spacing district on the spacing groove, be provided with the supporting shoe on the spacing district, be used for perk cutting back PCB's elastic component and two sets of suction nozzles, the upper end at spacing platform is all installed to supporting shoe, elastic component and two sets of suction nozzles.
The elastic piece comprises two groups of arc-shaped elastic pieces and connecting strips, and the two groups of arc-shaped elastic pieces are fixedly connected through the connecting strips.
During the use, the suction nozzle adsorbs the PCB, and the PCB extrudees the arc-shaped elastic piece and then is attached to the suction nozzle, and the vacuum pump is closed after the processing, and the arc-shaped elastic piece resets to jack up one end of the PCB, so that the PCB is convenient to take.
The vacuum pump is arranged inside the supporting table and communicated with the plurality of groups of suction nozzles through pipelines.
The limiting device is recorded in the high-precision plate dividing mold segmented plate cutting device, the position of each PCB can be limited by the vacuum pump in the limiting area of the limiting device in cooperation with the suction nozzle, after plate division is completed, one end of each PCB after plate division is tilted under the elasticity of the elastic piece, an operator can conveniently take out the PCB, the blanking time is saved, the plate dividing efficiency is high, and the whole high-precision plate dividing mold segmented plate cutting device is stable in structure, simple and reliable in structure, low in cost, long in service life, convenient to install and maintain, capable of achieving large-scale production and application, convenient to market popularization and practical.
The upper end face of the equipment main body is provided with a gas purifier, two groups of suction hoods are arranged above the two groups of conveying devices on the inner top face of the board cutting box, and the gas purifier is communicated with the suction hoods through a pipeline.
In a specific application scene, the gas purifier can purify and discharge gas generated in the laser board splitting process through the suction hood.
Examples
The embodiment of the invention provides a high-precision plate dividing mold segmented plate cutting device, which comprises the following components in parts by weight as shown in figures 1-5:
the equipment comprises an equipment main body, wherein the equipment main body comprises a machine base 1 and a processing table 2, the processing table 2 is arranged at the upper end of the machine base 1, a board cutting box 3 is arranged at the rear end position of the upper end surface of the processing table 2, a board cutting device is arranged in the board cutting box 3, a plurality of groups of conveying devices are arranged on the upper end surface of the processing table 2, limiting devices for fixing PCBs are arranged on the conveying devices, and the rear ends of the conveying devices extend into the board cutting box 3; and
and the operation table 4 is used for controlling the plate cutting device, the conveying device and the limiting device to operate, and the operation table 4 is arranged at one end of the machine base 1.
The plate cutting device comprises an X-axis conveying device 5, a laser plate cutting device 6 and two sets of Z-axis conveying devices 7, wherein the two sets of Z-axis conveying devices 7 are fixedly installed on the inner side wall of the plate cutting box 3 respectively, two ends of the X-axis conveying device 5 are connected with the two sets of Z-axis conveying devices 7 respectively, and the laser plate cutting device 6 is installed on the X-axis conveying device 5.
The laser board cutting device 6 comprises a mounting seat 8, a lifting component 9 and a laser board cutting seat 10, the mounting seat 8 is mounted on the X-axis conveying device 5, and the laser board cutting seat 10 is connected with the mounting seat 8 through the lifting component 9.
The lower terminal surface of mount pad 8 is provided with laser cutting head, lighting components and the camera device that is used for gathering the PCB image.
The conveying device comprises two groups of conveying rails 11 arranged on the upper end face of the processing table 2, the two groups of conveying rails 11 are arranged in parallel, and a screw rod transmission device is arranged inside each conveying rail 11.
The limiting device comprises a supporting table 12 and a limiting table 13, fixing seats connected with the lead screw transmission device are arranged at two ends of the lower end face of the supporting table 12, and the limiting table 13 is installed on the supporting table 12.
The upper end of the limiting table 13 is provided with a limiting groove used for limiting the position of the large board, the limiting groove is provided with a plurality of groups of limiting areas, the limiting areas are provided with supporting blocks 14, elastic pieces 16 used for raising and cutting the PCB and two groups of suction nozzles 15, and the supporting blocks 14, the elastic pieces 16 and the two groups of suction nozzles 15 are all installed at the upper end of the limiting table 13.
The elastic member 16 includes two sets of arc-shaped elastic pieces and a connecting strip, and the two sets of arc-shaped elastic pieces are fixedly connected through the connecting strip.
The inside of the support table 12 is provided with a vacuum pump which is communicated with a plurality of groups of suction nozzles 15 through pipelines.
The upper end face of the equipment main body is provided with a gas purifier 17, two groups of suction hoods 18 are arranged above the two groups of conveying devices on the inner top face of the plate cutting box 3, and the gas purifier 17 is communicated with the suction hoods 18 through a pipeline.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. The utility model provides a board device is cut out to high accuracy partition board mould segmentation which characterized in that includes:
the equipment comprises an equipment main body, wherein the equipment main body comprises a base (1) and a processing table (2), the processing table (2) is arranged at the upper end of the base (1), a board cutting box (3) is arranged at the rear end of the upper end face of the processing table (2), a board cutting device is arranged inside the board cutting box (3), a plurality of groups of conveying devices are arranged on the upper end face of the processing table (2), limiting devices for fixing PCBs are arranged on the conveying devices, and the rear ends of the conveying devices extend into the board cutting box (3); and
the operation table (4) is used for controlling the plate cutting device, the conveying device and the limiting device to operate, and the operation table (4) is arranged at one end of the machine base (1);
cut out the board device and include X axle conveyor (5), laser cut out board device (6) and two sets of Z axle conveyor (7), it is two sets of Z axle conveyor (7) is fixed mounting respectively on the inside wall of cutting out board case (3), the both ends of X axle conveyor (5) are connected with two sets of Z axle conveyors (7) respectively, laser is cut out board device (6) and is installed on X axle conveyor (5).
2. The high-precision plate dividing die segmented plate cutting device as claimed in claim 1, wherein: laser cuts out board device (6) and includes mount pad (8), lifting unit (9) and laser cuts out board seat (10), install on X axle conveyor (5) mount pad (8), laser cuts out board seat (10) and is connected with mount pad (8) through lifting unit (9).
3. The high-precision plate dividing die segmented plate cutting device as claimed in claim 2, wherein: the lower end face of the mounting seat (8) is provided with a laser cutting head, an illuminating assembly and a camera device for collecting PCB images.
4. The high-precision plate dividing mold segmented plate cutting device as claimed in claim 3, wherein: the conveying device comprises two groups of conveying rails (11) arranged on the upper end face of the machining table (2), the two groups of conveying rails (11) are arranged in parallel, and a screw rod transmission device is arranged inside each conveying rail (11).
5. The high-precision plate dividing mold segmented plate cutting device as claimed in claim 4, wherein: the limiting device comprises a supporting table (12) and a limiting table (13), fixing seats connected with a lead screw transmission device are arranged at two ends of the lower end face of the supporting table (12), and the limiting table (13) is installed on the supporting table (12).
6. The high-precision plate dividing die segmented plate cutting device as claimed in claim 5, wherein: the upper end of spacing platform (13) is provided with the spacing groove that is used for injecing the big board position, be provided with a plurality of groups spacing district on the spacing groove, be provided with supporting shoe (14), elastic component (16) and two sets of suction nozzle (15) that are used for perk cutting back PCB in the spacing district, the upper end at spacing platform (13) is all installed in supporting shoe (14), elastic component (16) and two sets of suction nozzle (15).
7. The high-precision plate dividing mold segmented plate cutting device as claimed in claim 6, wherein: the elastic piece (16) comprises two groups of arc-shaped elastic pieces and connecting strips, and the two groups of arc-shaped elastic pieces are fixedly connected through the connecting strips.
8. The high-precision plate dividing mold segmented plate cutting device as claimed in claim 6, wherein: the vacuum pump is arranged inside the supporting table (12) and communicated with the plurality of groups of suction nozzles (15) through pipelines.
9. The high-precision plate dividing die segmented plate cutting device as claimed in claim 1, wherein: the upper end face of the equipment main body is provided with a gas purifier (17), two groups of suction hoods (18) are arranged above the two groups of conveying devices on the inner top face of the cutting board box (3), and the gas purifier (17) is communicated with the suction hoods (18) through a pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210596328.9A CN114669892A (en) | 2022-05-30 | 2022-05-30 | High-precision plate dividing mold segmentation plate cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210596328.9A CN114669892A (en) | 2022-05-30 | 2022-05-30 | High-precision plate dividing mold segmentation plate cutting device |
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| CN114669892A true CN114669892A (en) | 2022-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210596328.9A Pending CN114669892A (en) | 2022-05-30 | 2022-05-30 | High-precision plate dividing mold segmentation plate cutting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114985904A (en) * | 2022-08-02 | 2022-09-02 | 广上科技(广州)有限公司 | PCB cutting equipment |
| CN115038327A (en) * | 2022-08-10 | 2022-09-09 | 广上科技(广州)有限公司 | Electronic component pastes dress equipment |
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| CN212496237U (en) * | 2020-07-02 | 2021-02-09 | 阮凤仪 | PCB board equipment weldment clamping device |
| CN113500290A (en) * | 2021-09-13 | 2021-10-15 | 深圳双十科技有限公司 | Laser cutting machine |
| CN114248300A (en) * | 2021-12-23 | 2022-03-29 | 韩松精密配件(昆山)有限公司 | Full-automatic PCB board divides board equipment |
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2022
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| CN212496237U (en) * | 2020-07-02 | 2021-02-09 | 阮凤仪 | PCB board equipment weldment clamping device |
| CN113500290A (en) * | 2021-09-13 | 2021-10-15 | 深圳双十科技有限公司 | Laser cutting machine |
| CN114248300A (en) * | 2021-12-23 | 2022-03-29 | 韩松精密配件(昆山)有限公司 | Full-automatic PCB board divides board equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114985904A (en) * | 2022-08-02 | 2022-09-02 | 广上科技(广州)有限公司 | PCB cutting equipment |
| CN114985904B (en) * | 2022-08-02 | 2022-11-15 | 广上科技(广州)有限公司 | PCB cutting equipment |
| CN115038327A (en) * | 2022-08-10 | 2022-09-09 | 广上科技(广州)有限公司 | Electronic component pastes dress equipment |
| CN115038327B (en) * | 2022-08-10 | 2024-05-03 | 广上科技(广州)股份有限公司 | Electronic component mounting equipment |
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Application publication date: 20220628 |