JP2014169177A - Substrate processing system and substrate turnover device - Google Patents

Substrate processing system and substrate turnover device Download PDF

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Publication number
JP2014169177A
JP2014169177A JP2013043127A JP2013043127A JP2014169177A JP 2014169177 A JP2014169177 A JP 2014169177A JP 2013043127 A JP2013043127 A JP 2013043127A JP 2013043127 A JP2013043127 A JP 2013043127A JP 2014169177 A JP2014169177 A JP 2014169177A
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substrate
pair
holding arm
suction
arm groups
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JP2013043127A
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JP6064684B2 (en
Inventor
Toru Naruo
徹 成尾
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Mitsuboshi Diamond Industrial Co Ltd
三星ダイヤモンド工業株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/248Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
    • B65G47/252Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them about an axis substantially perpendicular to the conveying direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Abstract

A substrate processing system capable of continuously reversing a substrate is provided.
A plurality of first and second conveying devices arranged with a gap and a rotationally symmetrical arrangement with respect to a rotating shaft 101a, and a unit conveying element 301 when rotating around the rotating shaft 101a And a substrate reversing device 100 having a pair of holding arm groups 102 that have a plurality of holding arms 102 that pass through the gap between the holding arms 102 and that can be moved up and down by lifting means. One holding arm of the pair of holding arm groups 102 The plurality of suction portions 103 provided in 102 are sucked onto the substrate W to be reversed, and then the pair of holding arm groups 102 are rotated 180 degrees around the rotation axis 101a, whereby the substrate W is reversed. The pair of holding arm groups 102 are raised from the delivery position of the substrate W after the substrate W is attracted and until the reversal is completed, and after the reversal, the attracting is released. The was formed with been lowered to the transfer position of the substrate W.
[Selection] Figure 3

Description

  The present invention relates to a substrate processing system that performs processing on both sides of a substrate, and more particularly to a substrate inversion device that inverts a substrate.

  As a method of dividing a brittle material substrate such as a glass substrate (hereinafter also simply referred to as a substrate), a scribe line is formed by rolling while pressing a cutter wheel on one surface of the substrate, and then the substrate is turned upside down. A technique is widely used in which the portion of the other surface directly above the previously formed scribe line is pressed by a break bar to break. In such a case, a mechanism for turning the substrate upside down after forming a scribe line on one side of the substrate is necessary.

  In addition, in the manufacturing process of a liquid crystal panel, a large mother substrate, which is also referred to as a bonded substrate, generally formed by bonding two brittle material substrates is divided by the formation of a scribe line by a cutter wheel. As a technique, sequentially with respect to the front and back surfaces of the mother substrate, that is, sequentially with respect to the surface of each brittle material substrate constituting the mother substrate, the cutter wheel is rolled to form a scribe line, This technique is widely used. Also in this case, it is necessary to reverse the substrate by the reversing mechanism.

  For example, a reversing mechanism for reversing by sandwiching the substrate from above and below is provided. A substrate having a scribe line formed on one side of the substrate is temporarily set to the reversing mechanism from the upstream side and reversed, and the substrate after reversal is disposed on the downstream A substrate cutting system for transferring to an apparatus is already known (see, for example, Patent Document 1).

JP 2010-76957 A

  In the case of the conventional reversing mechanism as disclosed in Patent Document 1, the reversal of the next substrate cannot be started until the previous substrate that has been reversed is carried out of the reversing mechanism. Therefore, there is a problem that continuous cutting processing cannot be performed and work efficiency is low.

  The present invention has been made in view of the above problems, and provides a substrate reversing apparatus that enables substrate processing with high processing efficiency by continuously reversing a substrate, and a substrate processing system including the same. It aims to be realized.

  In order to solve the above-mentioned problems, the invention of claim 1 includes a first transport device and a second transport device, each of which transports a brittle material substrate in a first direction, the first transport device, and the second transport device. A substrate reversing device disposed between the substrate and inverting the brittle material substrate that has been transported by the first transport device and delivering it to the second transport device, and the first transport device and the second transport device. The apparatus transports the one brittle material substrate while supporting the one brittle material substrate downward by a plurality of unit transport elements arranged with a gap in a second direction orthogonal to the first direction. A pair of holding arm groups disposed rotationally symmetrically with respect to a rotation axis extending in the second direction; and a rotation driving means for rotating the pair of holding arm groups around the rotation axis; A pair of holding arm groups is connected to the first transfer device. Each of the pair of holding arm groups, and a raising / lowering means for raising and lowering the substrate delivery position, which is a height position for delivering the brittle material substrate to and from the second transfer device, and the upper part thereof. Has a plurality of holding arms that are spaced apart from each other in the second direction and pass through the gap when rotating around the rotation axis, and each of the plurality of holding arms includes the brittle material A plurality of suction portions that can be sucked to a substrate, and the pair of holding arm groups belonging to one of the pair of holding arm groups in a state where the pair of holding arm groups are arranged at the substrate delivery position. By adsorbing a plurality of adsorbing portions to the inversion target substrate, which is the brittle material substrate to be inverted, and then rotating the pair of holding arm groups 180 degrees around the rotation axis, the inversion pair The substrate is configured to be reversed, and the pair of holding arm groups is configured so that, after the reversal target substrate is sucked by the plurality of suction units, the reversal of the reversal target substrate is completed. The substrate is lifted from the substrate delivery position, and is lowered to the substrate delivery position when releasing the suction of the plurality of suction portions with respect to the substrate to be reversed after the substrate to be reversed is reversed. It is characterized by that.

  A second aspect of the present invention is the substrate processing system according to the first aspect, wherein the plurality of suction portions of the reversal target substrate after reversal when the pair of holding arm groups are at the substrate delivery position. The height position of the attracted surface is the same as the transport height position of the second transport device, and the suction is released from the reversal target substrate after reversal, and the reversal target substrate after reversal is the second transport. It is carried out while being supported by the apparatus.

  A third aspect of the present invention is the substrate processing system according to the second aspect, wherein the plurality of suction portions of the plurality of holding arms belonging to one of the pair of holding arm groups, and the pair of holding arms. The plurality of suction portions of the plurality of holding arms belonging to the other of the group are different from each other by 180 degrees, and both end positions are on a common plane parallel to the rotation axis. The transport height position of the first transport device is different from the transport height position of the second transport device by a distance equal to the thickness of the brittle material substrate. Release of suction of the plurality of suction portions to the target substrate, and the plurality of holding arms belonging to the other of the pair of holding arm groups to a new inversion target substrate that has been transported through the first transport device Before adsorption by multiple adsorption parts Substantially simultaneously performing one-holding arm groups in a state disposed in the substrate transfer position, characterized in that.

  Invention of Claim 4 is the substrate processing system in any one of Claim 1 thru | or 3, Comprising: The said rotating shaft equips one end part with a disk-shaped flange part, and the other end part is the said end part. It is a rod-shaped shaft connected to a rotation drive means, and the substrate reversing device has a pair of support means that rotatably support the shaft and includes the elevating means, and the flange portion is the 1 It is slidably fitted to a cylindrical member provided in one of the pair of support means, and a first through hole provided in the flange portion is connected to the suction portion via a first suction pipe. In addition, the second through hole provided in the cylindrical member is connected to the suction means by a second suction pipe.

  The invention of claim 5 is a substrate reversing device for reversing a brittle material substrate transported in a first direction, wherein the substrate reversing device rotates with respect to a rotation axis extending in a second direction orthogonal to the first direction. A pair of holding arm groups arranged symmetrically, a rotation driving means for rotating the pair of holding arm groups around the rotation axis, and the pair of holding arm groups between the outside and the brittleness Elevating means for elevating and lowering between a substrate delivery position, which is a height position for delivering the material substrate, and an upper portion thereof, and each of the pair of holding arm groups is separated from each other in the second direction And a plurality of holding arms that pass through the gap when rotating around the rotation axis, and each of the plurality of holding arms includes a plurality of adsorption portions that can adsorb to the brittle material substrate. And the front of the pair of holding arms In a state of being disposed at the substrate transfer position, the plurality of holding portions of the plurality of holding arms belonging to one of the pair of holding arm groups are adsorbed to the reversal target substrate which is the brittle material substrate to be reversed, and then By rotating the pair of holding arm groups 180 degrees around the rotation axis, the inversion target substrate is inverted, and the pair of holding arm groups are attached to the plurality of suction portions. After the reversal target substrate is sucked and before the reversal of the reversal target substrate is completed, it is raised from the substrate delivery position, and after reversal of the reversal target substrate, the reversal target substrate with respect to the reversal target substrate When releasing the suction of the plurality of suction portions, it is lowered to the substrate transfer position.

  According to the first to fifth aspects of the present invention, the substrate loading operation and the substrate holding operation to be reversed can be performed substantially simultaneously. In addition, the next substrate to be reversed can be transferred, the substrate that has been previously reversed, and the suction and holding of the loaded substrate by the holding arm can be performed substantially simultaneously. That is, it is possible to carry in the substrate to be reversed and to reverse the substrate substantially simultaneously. Thereby, a substrate processing system with excellent reversal processing efficiency is realized.

FIG. 2 is a top view illustrating a configuration of a main part of a substrate processing system 1000. It is a top view which shows the structure of the board | substrate inversion apparatus 100 vicinity. It is a YZ side view which shows the structure of the board | substrate inversion apparatus 100 vicinity. 4 is a ZX side view on the −Y side in the vicinity of the substrate reversing device 100. FIG. It is a ZX side view on the + Y side in the vicinity of the substrate reversing device 100. It is a YZ side view which shows the state in the middle of a pair of holding arm group raising from a board | substrate delivery position. It is a figure which shows the state after raising a pair of holding arm group only the predetermined distance. It is a figure which shows a mode that the board | substrate W is reversed in the board | substrate inversion apparatus 100 sequentially. It is a figure which shows a mode that the board | substrate W is reversed in the board | substrate inversion apparatus 100 sequentially. It is a YZ side view of the vicinity of the substrate reversing apparatus 100 of the substrate processing system 1000 including the transfer apparatus 300 according to a modification.

<System overview>
FIG. 1 is a top view showing a main configuration of a substrate processing system 1000 according to the present embodiment. The substrate processing system 1000 according to the present embodiment mainly includes a substrate reversing device 100, two scribe devices 200 (first scribe device 200A and second scribe device 200B), and two transfer devices 300 (first transfer device). 300A and the second transfer device 300B).

  In general, the substrate processing system 1000 forms a scribe line on one main surface of a brittle material substrate (hereinafter simply referred to as a substrate) W such as a glass substrate by the first scribe device 200A, and then converts the substrate W into the substrate inversion device 100. And the second scribing device 200B forms a scribe line on the other main surface.

  In FIG. 1 and the subsequent drawings, the traveling direction of the substrate W in the horizontal plane when the series of processing is sequentially performed in the substrate processing system 1000 is defined as the Y axis positive direction, and the direction orthogonal to the Y axis in the horizontal plane is indicated. A right-handed XYZ coordinate system with the X-axis direction and the vertical direction as the Z-axis direction is attached.

  The substrate reversing device 100 mainly includes a shaft 101 that is a rod-like member extending in the X-axis direction, and a plurality of holding arms 102 extending vertically from the shaft 101. The plurality of holding arms 102 extend in two directions different by 180 degrees, and the holding arms 102 in the same direction are provided to be separated from each other. In the present embodiment, a configuration in which six holding arms 102 are provided in each direction is illustrated. Hereinafter, the plurality of holding arms 102 extending in the same direction may be collectively referred to as a holding arm group as appropriate. It can be said that the substrate reversing apparatus 100 includes two holding arm groups (a pair of holding arm groups) in which the extending directions of the holding arms 102 belonging to each of them are different.

  The holding arm 102 is provided with a suction pad 103. The substrate reversing device 100 reverses the holding arm 102 by 180 degrees with the shaft 101 as the rotation axis in a state where the substrate W transported by the first transport device 300A is sucked and held by the suction pad 103 from below. And the substrate W can be immediately transferred to the transfer device 300B. The detailed configuration of the substrate reversing apparatus 100 will be described later.

  The scribing device 200 includes a table 201 that is movable in the Y-axis direction with the substrate W mounted and fixed on the upper surface, and a bridge that has a longitudinal direction in the X-axis direction above the movement range of the table 201. 202 and at least one (four in FIG. 1) scribing head 203 attached to the bridge 202. In addition, a scribe wheel (not shown) having a disk shape and an outer peripheral portion serving as a cutting edge is attached to a vertically lower portion of the scribe head 203 in a vertical posture and freely rotatable in a plane.

  In the scribing apparatus 200 having such a configuration, the scribing wheel 203 is moved in the positive direction of the Y axis while the substrate W is placed and fixed on the table 201 with the scribing head 203 disposed at an appropriate position of the bridge 202. By pressing and rolling the substrate W, a scribe line along the Y-axis direction can be formed on the substrate W.

  Note that the configuration of the scribing apparatus 200 constituting the substrate processing system 1000 is not limited to this. For example, the scribe line may be formed by moving the scribe head 203 provided with a scribing wheel in the lower portion in the X-axis direction with the substrate W disposed below. Alternatively, an aspect in which a plurality of bridges 202 including the scribe head 203 are arranged may be used.

  The transfer device 300 is a device that transfers the substrate W between the substrate reversing device 100 and the scribe device 200. Specifically, the first transport device 300 </ b> A transports the substrate W on which the scribe line is formed by the first scribing device 200 </ b> A to the reversal start position of the substrate reversing device 100. The second transport device 300B transports the substrate W reversed by the substrate reversing device 100 from the reversal end position of the substrate reversing device 100 toward the second scribe device 200B.

  The transport apparatus 300 includes a plurality of (seven in the present embodiment) unit transport units (unit transport elements) 301 that are arranged in parallel to the Y axis and separated from each other. In the transport apparatus 300, the individual substrates W are transported while being supported downward by all the unit transport units 301. More specifically, each unit transport unit 301 is a belt conveyor that has a longitudinal direction (transport direction) in the Y-axis direction and operates in synchronization with each other.

  Each unit transport unit 301 is disposed so as to be able to pass through the gap between two adjacent unit transport units 301 when the holding arm 102 provided in the substrate reversing device 100 performs the reversing operation by the rotation of the shaft 101. However, the unit transport unit 301 (first unit transport unit 301A) of the first transport device 300A and the unit transport unit 301 (second unit transport unit 301B) of the second transport device 300B are arranged in the vertical direction (height). (Position) is arranged differently. Specifically, the second unit transport unit 301B is arranged at a position higher than the first unit transport unit 301A by a distance equal to the thickness t of the substrate W to be processed in the substrate processing system 1000.

  The substrate processing system 1000 according to the present embodiment further includes two transfer apparatuses 400 (a first transfer apparatus 400A and a second transfer apparatus 400B). The transfer device 400 is responsible for transferring the substrate W between the scribing device 200 and the adjacent transfer device 300. The transfer device 400 includes a suction arm 402 that extends in the X-axis direction and that has a suction pad 401 that can be moved up and down at the tip, and supports the suction arm 402 so as to be movable in the Y-axis direction. And a guide 403.

  More specifically, the first transfer device 400A sucks and holds the substrate W after the scribe line is formed in the first scribe device 200A and transfers the substrate W to the first transfer device 300A. The second transfer device 400B sucks and holds the substrate W transferred by the second transfer device 300B and transfers it to the table 201 of the second scribe device 200B.

  Note that the transfer apparatus 400 is not an essential component in the substrate processing system 1000. The substrate processing system 1000 may be configured such that the scribing apparatus 200 can directly deliver the substrate W to and from the transfer apparatus 300. In such a case, the transfer apparatus 400 is not necessary.

<Detailed configuration of substrate reversing device>
2 and 3 are a top view and a YZ side view showing a configuration in the vicinity of the substrate reversing apparatus 100, which is a main part of the substrate processing system 1000 according to the present embodiment, respectively. 2 and 3 show a state where the substrate W is delivered between the first transfer device 300A and the substrate reversing device 100. FIG.

  Further, FIGS. 4 and 5 are a ZX side view on the −Y side and a ZX side view on the + Y side in the vicinity of the substrate reversing apparatus 100 in the situation shown in FIGS. 2 and 3, respectively. However, in FIG. 4 and FIG. 5, the components provided on the + Y side are omitted, and in FIG. 5, the components provided on the −Y side are omitted.

  As described above, the substrate reversing device 100 includes the shaft 101 that extends in the X-axis direction and is rotatable about the X-axis direction as a rotation axis, and includes a plurality of holding arms 102 each having a plurality of suction pads 103. The holding arm group is configured to extend in two directions different from the shaft 101 by 180 degrees. 2, it can be said that each holding arm group is provided in a comb-like shape with respect to the shaft 101.

  Moreover, the holding arms 102 belonging to one holding arm group (these are also specifically referred to as holding arms 102A) and the plurality of holding arms 102 belonging to the other holding arm group (these are also specifically referred to as holding arms 102B) are provided with each other. The holding arm 102A and the holding arm are arranged so that the direction of the suction pad 103 differs by 180 degrees, and the end position (suction position) of one suction pad 103 and the end position (suction position) of the other suction pad 103 are the same. Even if the posture of 102B changes, it is fixed to the shaft 101 so as to be on a common plane parallel to the shaft 101.

  For example, in the case where the holding arm 102 takes a horizontal posture as illustrated in FIGS. 1 to 5, for example, as can be seen from FIG. 3, the suction pad 103 of the holding arm 102 </ b> A is vertically downward (−Z direction). Whereas the suction pad 103 of the holding arm 102B faces vertically upward (+ Z direction), the former end (lower end) and the latter end (upper end) are on the same plane. It is in the horizontal plane. That is, they are at the same height position. Although the postures of all the holding arms 102 change as the shaft 101 rotates, the orientation of the suction pads 103 provided in the holding arms 102A and the orientation of the suction pads 103 provided in the holding arms 102B are always different by 180 degrees. ing.

  In other words, the holding arm 102A belonging to one holding arm group and the holding arm 102B belonging to the other holding arm group are provided at positions that are rotationally symmetric with respect to the shaft 101 in the YZ plane.

  The substrate reversing device 100 further includes a pair of leg portions 110, a pair of shaft shaft support portions 120, and a rotation driving means 130.

  The pair of leg portions 110 are provided apart from each other in the X-axis direction, and support the shaft 101 extending in the X-axis direction from below through the shaft shaft support portion 120. In this embodiment, for simplification of illustration, a pair of legs 110 are provided independently. However, the pair of legs 110 is provided on a base (not shown). The aspect which consists of may be sufficient.

  The pair of shaft shaft support portions 120 is connected to both end portions of the shaft 101 and is provided at a position above the corresponding leg portion 110 so as to be vertically movable. That is, the shaft shaft support portion 120 can move up and down while supporting the shaft 101. Thereby, in the substrate reversing apparatus 100, the height position of the shaft 101 and the holding arm 102 fixed to the shaft 101 can be changed. The detail of the raising / lowering range of the shaft axial support part 120 is mentioned later. Such a lifting operation can be performed in parallel with the rotation operation of the shaft 101.

  A specific configuration for raising and lowering the shaft support 120 can be realized by a known technique. Preferably, the shaft shaft support 120 is raised and lowered by a linear motor mechanism. For example, a leg (not shown) is provided on the leg portion 110 so as to extend in the Z-axis direction, and a shaft (not shown) is provided on the shaft support portion 120 so that the mover is moved along the stator. 4 and 5, the shaft shaft support 120 can be raised and lowered within a predetermined range in the Z-axis direction, as indicated by an arrow AR.

  In the present embodiment, the pair of shaft shaft support portions 120 are arranged so that they are positioned between the pair of leg portions 110 in the X-axis direction, but the arrangement relationship between them is limited to this. is not.

  The rotation driving unit 130 is a driving unit for rotating the shaft 101. As the rotation driving means 130, for example, a rotary cylinder is suitable.

  More specifically, in the substrate reversing device 100, a disc-shaped flange portion 101a is fixed to one end portion of the shaft 101 (the + X side end portion in the present embodiment). On the other hand, a cylindrical portion 101b that opens in the X-axis direction is fixed to the shaft support portion 120. And the flange part 101a is fitted in the state which the outer peripheral part is slidable with respect to the inner surface of the opening part of the cylindrical part 101b.

  Further, a power transmission portion 101c is fixed to the other end portion of the shaft 101 (in the present embodiment, the −X side end portion). A rotating shaft 130a of the rotation driving means 130 extending in the + X direction is coupled to the power transmission unit 101c while being supported by the shaft shaft supporting unit 120.

  With the above configuration, in the substrate reversing device 100, when the rotation driving unit 130 is operated, the rotation shaft 130a supported by the shaft shaft support 120 and the power transmission unit 101c connected thereto are connected. The shaft 101 supported by the leg portion 110 and the shaft shaft support portion 120 can be rotated. Thereby, the rotation of the holding arm 102 around the shaft 101 is realized. Further, at that time, since the flange portion 101a slides with respect to the tubular portion 101b at the other end portion of the shaft 101, stable rotation operation is possible.

  In addition, although not shown in FIGS. 1 to 3, as shown in FIGS. 4 and 5, the flange portion 101 a is provided with two first ports P <b> 1 that are through-holes. A second port P2, which is also a through hole, is provided on the side surface of the shaped portion 101b. The first suction tube T1 is connected to the first port P1, and the second suction tube T2 is connected to the second port P2. As a result, the first suction tube T1 and the second suction tube T2 are in a spatially communicating state.

  Further, the other ends of the two first suction tubes T <b> 1 are connected to the suction pad 103 through suction paths provided in the holding arm 102. More specifically, one first suction tube T1 is connected to the suction pad 103 on the holding arm 102A side, and the other first suction tube T1 is connected to the suction pad 103 on the holding arm 102B side. Being done. The other end of the second suction tube T2 is connected to the suction pump 140. With this configuration, in the substrate reversing apparatus 100, the suction pump 140 is operated while the substrate W is placed on the suction pad 103, so that the substrate W can be sucked and fixed by the suction pad 103. ing. FIG. 4 conceptually illustrates a state of connection between the suction tube T1 and a part of the suction pads 103 and a state of connection between the suction tube T2 and the suction pump 140.

  Moreover, the flange portion 101a to which the first suction tube T1 is connected as described above is slidable with respect to the cylindrical body to which the second suction tube T2 is connected when the shaft 101 rotates. Therefore, the suction state is maintained even when the shaft 101 is rotating. Thereby, in the substrate inverting apparatus 100 according to the present embodiment, the substrate W can be sucked and held by the suction pad 103 even when the holding arm 102 is rotating.

<Relationship between transfer device 300 and substrate reversing device>
Next, regarding the arrangement relationship between the conveyance device 300 and the substrate reversing device 100, specifically, the arrangement position of the unit conveyance unit 301 of the first conveyance device 300A and the second conveyance device 300B and the shaft support portion 120 are moved up and down. Furthermore, the relationship between the arrangement positions of the holding arm 102A and the holding arm 102B that change as the shaft 101 rotates will be described.

  As described above, in the substrate processing system 1000 according to the present embodiment, the height position between the unit transport unit 301 of the first transport device 300A and the unit transport unit 301 of the second transport device 300B is the thickness t of the substrate W. The only difference is that. On the other hand, in the substrate reversing device 100, the holding arm 102A and the holding arm 102B are rotationally symmetric with respect to the shaft 101, and the end portions of the suction pads 103 provided in each are positioned on a common plane. It is provided. In addition, the pair of holding arms can be rotated around the shaft 101 by rotating the shaft 101 by the rotation driving means 130, and the pair of holding arms can be moved together with the shaft 101 by raising and lowering the shaft support portion 120. The height position of can be changed.

  The positional relationship of these parts and the range of raising and lowering of the pair of holding arm groups are as follows. The transfer of the substrate W from the other side to the second transfer device 300B and the reversal of the substrate W and the transfer of the substrate W by the first transfer device 300A and the second transfer device 300B during the transfer are efficient. It is determined to be able to do.

  Specifically, first, FIGS. 1 to 5 show a state where the pair of holding arm groups are at the substrate transfer position. As shown in FIGS. 2 and 3, the substrate delivery position is such that the pair of holding arms is in a horizontal posture and the suction pad 103 provided on the holding arm 102 </ b> A located on the −Y side of the shaft 101 at that time. Is defined as a position where the height position of the lower end of the substrate W is higher than the upper surface of the first unit transport unit 301A of the first transport device 300A by the thickness t of the substrate W. When the pair of holding arms are in such a substrate transfer position, if the substrate W is transported to the + Y side end in the first transport device 300A, the height position of the lower end of the suction pad 103 and the upper surface of the substrate W Therefore, the suction of the substrate W by the suction pad 103 becomes possible.

  In addition, at this time, due to the arrangement relationship described above, the height position of the upper surface of the second transfer device 300B is the same as the height position of the upper end of the suction pad 103 provided in the holding arm 102B located on the + Y side of the shaft 101. Therefore, when there is a substrate W whose lower surface, which is a surface to be attracted, is sucked and held by the suction pad 103, the substrate W can be supported by the second transfer device 300B.

  That is, when the pair of holding arm groups are at the substrate transfer position, the transfer of the substrate W from the first transfer device 300A to the substrate reversing device 100 and the transfer of the substrate from the substrate transfer device 100 to the second transfer device 300B are performed. It can be performed almost simultaneously.

  FIG. 6 is a YZ side view showing a state in the middle of when the pair of holding arm groups ascend from the substrate delivery position shown in FIGS. 1 to 5. However, the substrate W is omitted in FIG.

  As shown in FIG. 6, in the present embodiment, the pair of holding arm groups are raised while rotating the holding arms 102 as indicated by an arrow RT. More specifically, while the holding arm 102A and the holding arm 102B are reversed by 180 degrees, the shaft support portion 120 is raised, and the pair of holding arms are raised. Alternatively, the holding arm 102A and the holding arm 102B may be reversed 180 degrees after raising the pair of holding arm groups.

  On the other hand, FIG. 7 shows a state after raising the pair of holding arm groups by a predetermined distance. However, the substrate W is also omitted in FIG.

  Comparing FIG. 7 with FIG. 3 showing a state in which the pair of holding arm groups are in the substrate transfer position, the former has the shaft shaft support 120 at a higher position than the leg 110, and Although the relative arrangement relationship of the holding arm groups is the same, the arrangement positions of the holding arm 102A and the holding arm 102B are interchanged on both sides of the shaft 101 in the Y-axis direction.

  For confirmation, it is clear from the arrangement relationship between the two shown in FIG. 2 that the rotating holding arm 102 does not collide with the unit transport unit 301.

  The ascending distance of the pair of holding arm groups from the substrate delivery position is always located on the + Y side of the upper surface of the unit transport unit 301B of the second transport device 300B and the shaft 101 shown in FIG. It becomes equal to the distance d with the height position of the upper end of the suction pad 103 of the holding arm 102A. Note that the rise of the pair of holding arm groups surely prevents interference between the suction pad 103 of the holding arm 102A and the substrate W to be transferred when the substrate W is transferred in the + Y direction performed in the first transfer device 300A. It is done for the purpose. Therefore, it is sufficient that the ascending distance of the pair of holding arm groups is about several mm. In FIG. 7, the distance d is exaggerated.

  The pair of holding arm groups that have once been raised are lowered to the substrate transfer position while the holding arm 102 is maintained in a horizontal posture. Note that it is not necessary to raise the pair of holding arm groups and then stop them, and the raising and the subsequent lowering may be performed continuously.

<Substrate reversal procedure>
Next, a procedure for reversing the substrate W in the substrate reversing apparatus 100 having the above configuration will be described. 8 and 9 are diagrams sequentially illustrating how the substrate W is reversed in the substrate reversing apparatus 100. FIG. FIG. 8 mainly shows an initial state in which the substrate reversing apparatus 100 starts operating, and FIG. 9 mainly shows a steady state in which the substrate W is continuously reversed.

  For the sake of convenience, as shown in FIG. 8A, the description will be made from a state in which the pair of holding arm groups are raised from the substrate transfer position and are in a horizontal posture. In such a state, first, the substrate W (W1) subjected to the scribing process by the first scribing apparatus 200A is placed on the first unit transport unit 301A of the first transport apparatus 300A. The substrate W1 is transported in the + Y direction by the first unit transport unit 301A as indicated by an arrow AR1.

  Then, until the substrate W1 is transported to the + Y side end of the first unit transport unit 301A, the pair of holding arm groups transfer the substrate as indicated by an arrow AR2 in FIG. 8B. Descends towards position. That is, the transport of the substrate W1 and the lowering of the pair of holding arm groups in the first transport device 300 are performed substantially simultaneously (simultaneously in parallel). This contributes to the efficiency of the substrate reversal process in the substrate processing system 1000.

  When the pair of holding arm groups reach the substrate transfer position, as shown in FIG. 8C, the lower end portion of the suction pad 103 provided in the holding arm 102A comes into contact with the upper surface of the substrate W1. FIG. 8C shows the same situation as FIG. In this way, by operating the suction pump 140 in a state where the suction pad 103 is in contact with the substrate W1, the suction pad 103 sucks and holds the substrate W1.

  At this time, the holding arm 102B is positioned between the unit transport units 301B, and the height position of the upper end of the suction pad 103 is the same as the height position of the unit transport unit 301B.

  When the suction holding is performed, the rotation driving unit 130 is driven to apply rotation to the shaft 101, thereby rotating the pair of holding arms clockwise as indicated by an arrow RT1 in FIG. 8D. And rotate 180 degrees. As a result, the holding arm 102 </ b> A rotates while the substrate W <b> 1 is sucked and held by the suction pad 103. On the other hand, the holding arm 102B passes through the gap of the unit transport unit 301B of the first transport device 300A while rotating. Simultaneously with this rotation, the pair of holding arm groups are raised as indicated by an arrow AR3.

  FIG. 9A shows a state after the pair of holding arm groups are inverted 180 degrees and the pair of holding arm groups are raised. At this time, the substrate W1 is sucked and held from below by the holding arm 102A that is positioned on the + Y side of the shaft 101. That is, it is in a state reversed by 180 degrees from the state in which it is initially arranged in the first transport device 300A. Note that a gap is formed between the holding arm 102 </ b> B and the first unit transport unit 301 </ b> A on the −Y side of the shaft 101.

  Further, until the state shown in FIG. 9A is realized, a scribing process is performed on the first unit transport unit 301A of the first transport device 300A by the first scribing device 200A following the substrate W1. Substrate W (W2) is placed. The substrate W2 is transported in the + Y direction by the first unit transport unit 301A as indicated by an arrow AR4.

  After the substrate W2 is transported to the + Y side end of the first unit transport unit 301A, the pair of holding arms are lowered toward the substrate delivery position as indicated by an arrow AR5 in FIG. 9B. To do. Since the transfer of the substrate W2 and the lowering of the pair of holding arms are performed simultaneously in parallel with the transfer of the substrate W1, the substrate inversion process in the substrate processing system 1000 according to the present embodiment is also performed. It contributes to efficiency improvement.

  When the pair of holding arm groups reach the substrate transfer position, as shown in FIG. 9C, the lower surface of the substrate W1 supported from below by the suction pad 103 is connected to the unit transport unit 301B of the second transport device 300B. Contact. When such a contact state is obtained, the suction holding of the substrate W1 by the suction pad 103 is released. As a result, a state in which the substrate W1 is placed on the unit transport unit 301B is realized. When such placement is realized, the unit transport unit 301B immediately transports the substrate W1 to the + Y side end, as indicated by an arrow AR6. The conveyed substrate W1 is carried out to the second scribe device 200B. That is, the substrate W inverted 180 degrees by the substrate inverting device 100 is subjected to the scribe process by the second scribe device 200B.

  On the other hand, on the −Y side of the shaft 101, a state in which the lower end portion of the suction pad 103 provided in the holding arm 102B is in contact with the upper surface of the substrate W2 is realized. When the suction holding of the substrate W1 is released and the transport to the + Y side is performed, when the suction pump 140 is operated again, the substrate W2 is sucked and held by the suction pad 103.

  Since the suction holding can be performed immediately after the release of the suction by the holding arm 102A and the subsequent transport of the substrate W by the second transport device 300B, the substrate reversing device 100 has the substrate after the reversing process. The transfer of W to the second transfer device 300B and the suction holding of the substrate W to be reversed next can be performed substantially simultaneously (without time lag) as a series of continuous operations. I can say that.

  When such suction holding is performed, the rotation driving means 130 is driven again to rotate the shaft 101, so that a pair of holding arms are clocked as indicated by an arrow RT2 in FIG. 9D. Turn around and reverse 180 degrees. Then, the holding arm 102B is rotated while holding the substrate W2. At the same time, as shown by an arrow AR7, the pair of holding arm groups are raised.

  Thereafter, when the pair of holding arm groups are raised, a state similar to that shown in FIG. 9A is realized except that the holding arm 102A and the holding arm 102B are switched. Therefore, if the procedures shown in FIGS. 9A to 9D are repeated thereafter, the substrates W loaded from the first scribe device 200A are reversed one after another and used for the scribe processing by the second scribe device 200B. Can be done.

  As described above, according to the substrate processing system according to the present embodiment, the substrate carry-in operation to be reversed and the substrate holding operation can be performed substantially simultaneously. In addition, the next substrate to be reversed can be transferred, the substrate that has been previously reversed, and the suction and holding of the loaded substrate by the holding arm can be performed substantially simultaneously. If it sees roughly, the substrate processing system concerning this embodiment will perform reversal of a substrate and carrying in of the substrate which is going to be reversed next substantially simultaneously. Thereby, a substrate processing system with excellent reversal processing efficiency is realized.

<Modification>
In the above-described embodiment, the unit transport unit 301 of the transport apparatus 300 is configured as a belt conveyor, but the configuration of the unit transport unit 301 is not limited to this. FIG. 10 is a YZ side view of the vicinity of the substrate reversing apparatus 100 of the substrate processing system 1000 including the transfer apparatus 300 according to a modification.

  In the substrate processing system 1000 illustrated in FIG. 10, the unit transport unit 301 includes a plurality of rollers 302 that are separated from each other in the Y-axis direction. The roller 302 may be rotationally driven by a driving unit (not shown), or may be a driven roller that rolls by moving while the substrate W is in contact therewith. In the former case, the substrate W can be transported to a desired position by rotating the roller 302 by the driving means while the substrate W is placed. In the latter case, for example, when the substrate W is moved while being held by the transfer device 400 or the like, the roller 302 in contact with the back surface of the substrate W is rotated, thereby assisting the conveyance of the substrate W.

  In the above-described embodiment, each holding arm 102 is provided so as to extend directly from the shaft 101. Instead, a frame that rotates integrally with the shaft around the shaft 101 is provided. And a holding arm 102 may be provided on the frame.

  In the above-described embodiment, each holding arm 102 has a uniform width and thickness in the longitudinal direction and a rectangular cross-section perpendicular to the longitudinal direction. It is not limited to. For example, you may have the shape where thickness becomes small, so that it goes to a longitudinal direction front-end | tip part.

DESCRIPTION OF SYMBOLS 100 Substrate reversing device 101 Shaft 101a Flange part 101b Tubular part 101c Power transmission part 102 Holding arm 103 Suction pad 110 Leg part 120 Shaft support part 130 Rotation drive means 130a Rotating shaft 140 Suction pump 200 Scribe apparatus 201 Table 202 Bridge 203 Scribe head DESCRIPTION OF SYMBOLS 300 Conveyance apparatus 301 Unit conveyance part 302 Roller 400 Transfer apparatus 401 Suction pad 402 Suction arm 403 Guide 1000 Substrate processing system W (W1, W2) Substrate

Claims (5)

  1. A first transport device and a second transport device for transporting each brittle material substrate in a first direction;
    A substrate reversing device disposed between the first transporting device and the second transporting device, inverting the brittle material substrate transported by the first transporting device and delivering it to the second transporting device;
    With
    The first transport device and the second transport device support one brittle material substrate downward by a plurality of unit transport elements arranged with a gap in a second direction orthogonal to the first direction. While carrying
    The substrate reversing device is
    A pair of holding arms arranged in rotational symmetry with respect to a rotation axis extending in the second direction;
    Rotation driving means for rotating the pair of holding arm groups around the rotation axis;
    Lifting means for raising and lowering the pair of holding arm groups between a substrate transfer position, which is a height position for transferring the brittle material substrate between the first transfer device and the second transfer device, and above the position. When,
    With
    Each of the pair of holding arm groups includes a plurality of holding arms that are spaced apart from each other in the second direction and pass through the gap when rotating around the rotation axis.
    Each of the plurality of holding arms includes a plurality of adsorption portions that can be adsorbed to the brittle material substrate,
    The brittle material substrate in which the plurality of suction portions of the plurality of holding arms belonging to one of the pair of holding arm groups are to be reversed in a state where the pair of holding arm groups are arranged at the substrate transfer position. By adsorbing to the substrate to be inverted, and then rotating the pair of holding arm groups 180 degrees around the rotation axis, the substrate to be inverted is inverted,
    The pair of holding arm groups are lifted from the substrate delivery position after the reversal target substrate is attracted to the plurality of suction portions and until the reversal target substrate is completely reversed. When the suction of the plurality of suction portions to the inversion target substrate is released after the inversion target substrate is inverted, the substrate is lowered to the substrate delivery position.
    A substrate processing system.
  2. The substrate processing system according to claim 1,
    The height position of the surface to be attracted by the plurality of suction portions of the substrate to be reversed after reversing when the pair of holding arm groups is at the substrate delivery position is the transport height position of the second transport device. It is the same, and the release of the suction to the substrate to be reversed after being reversed is performed while the substrate to be reversed after being reversed is supported by the second transfer device.
    A substrate processing system.
  3. The substrate processing system according to claim 2,
    The plurality of suction portions of the plurality of holding arms belonging to one of the pair of holding arm groups and the plurality of suction portions of the plurality of holding arms belonging to the other of the pair of holding arm groups are mutually Are arranged so that their orientations are different by 180 degrees and their end positions are on a common plane parallel to the rotation axis,
    The transport height position of the first transport device and the transport height position of the second transport device are different by a distance equal to the thickness of the brittle material substrate,
    Release of suction of the plurality of suction portions with respect to the substrate to be reversed after reversal, and the plurality of members belonging to the other of the pair of holding arm groups to a new substrate to be reversed that has been transported through the first transport device Suction by the plurality of suction portions of the holding arm is performed substantially simultaneously with the pair of holding arm groups disposed at the substrate delivery position.
    A substrate processing system.
  4. A substrate processing system according to any one of claims 1 to 3,
    The rotation shaft is a rod-shaped shaft having a disc-shaped flange portion at one end and the other end connected to the rotation driving means,
    The substrate reversing device has a pair of support means that rotatably support the shaft and includes the lifting means,
    The flange portion is slidably fitted to a cylindrical member provided in one of the pair of support means,
    A first through hole provided in the flange portion is connected to the suction portion via a first suction pipe, and a second through hole provided in the cylindrical member is sucked by the second suction pipe. Connected to the means,
    A substrate processing system.
  5. A substrate reversing device for reversing a brittle material substrate conveyed in a first direction,
    A pair of holding arms arranged in rotational symmetry with respect to a rotation axis extending in a second direction orthogonal to the first direction;
    Rotation driving means for rotating the pair of holding arm groups around the rotation axis;
    Elevating means for elevating the pair of holding arm groups between a substrate delivery position, which is a height position for delivering the brittle material substrate to the outside, and the upper part thereof;
    With
    Each of the pair of holding arm groups includes a plurality of holding arms that are spaced apart from each other in the second direction and pass through the gap when rotating around the rotation axis.
    Each of the plurality of holding arms includes a plurality of adsorption portions that can be adsorbed to the brittle material substrate,
    The brittle material substrate in which the plurality of suction portions of the plurality of holding arms belonging to one of the pair of holding arm groups are to be reversed in a state where the pair of holding arm groups are arranged at the substrate transfer position. By adsorbing to the substrate to be inverted, and then rotating the pair of holding arm groups 180 degrees around the rotation axis, the substrate to be inverted is inverted,
    The pair of holding arm groups are lifted from the substrate delivery position after the reversal target substrate is attracted to the plurality of suction portions and until the reversal target substrate is completely reversed. When the suction of the plurality of suction portions to the inversion target substrate is released after the inversion target substrate is inverted, the substrate is lowered to the substrate delivery position.
    A substrate reversing device.
JP2013043127A 2013-03-05 2013-03-05 Substrate processing system and substrate inversion apparatus Active JP6064684B2 (en)

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JP2013043127A JP6064684B2 (en) 2013-03-05 2013-03-05 Substrate processing system and substrate inversion apparatus
KR1020130149898A KR101830598B1 (en) 2013-03-05 2013-12-04 Substrate processing system and substrate inverting apparatus
TW103102243A TWI571954B (en) 2013-03-05 2014-01-22 Substrate processing system and substrate reversing device
CN201410055154.0A CN104030558B (en) 2013-03-05 2014-02-18 Base plate processing system and substrate inversion set

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CN104828602A (en) * 2015-03-27 2015-08-12 广东韦达尔科技有限公司 Side-turning mechanism for laminator
EP3696119A1 (en) 2019-02-18 2020-08-19 Steelco S.p.A. Apparatus for upending box-like containing bodies, and corresponding method

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CN107429386B (en) * 2015-04-15 2019-09-27 株式会社爱发科 The keeping method of substrate holding mechanism, film formation device and substrate
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CN108218215A (en) * 2016-12-14 2018-06-29 塔工程有限公司 Cutter for substrate
CN108820885A (en) * 2018-07-09 2018-11-16 武汉轻工大学 Negative pressure turnover device and method for ceramic substrate group automated production
KR200491700Y1 (en) * 2018-07-16 2020-06-02 주식회사 야스 Substrate flip equipment and management system for reducing tac time
CN110526003A (en) * 2019-08-26 2019-12-03 许昌裕同印刷包装有限公司 A kind of the cardboard turning device and its application method of efficient stable

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EP3696119A1 (en) 2019-02-18 2020-08-19 Steelco S.p.A. Apparatus for upending box-like containing bodies, and corresponding method

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KR20140110711A (en) 2014-09-17
KR101830598B1 (en) 2018-02-22
CN104030558B (en) 2018-09-28
CN104030558A (en) 2014-09-10
TW201436087A (en) 2014-09-16
JP6064684B2 (en) 2017-01-25

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