TWI568553B - 放置設備的放置頭之動態保持系統 - Google Patents
放置設備的放置頭之動態保持系統 Download PDFInfo
- Publication number
- TWI568553B TWI568553B TW102126092A TW102126092A TWI568553B TW I568553 B TWI568553 B TW I568553B TW 102126092 A TW102126092 A TW 102126092A TW 102126092 A TW102126092 A TW 102126092A TW I568553 B TWI568553 B TW I568553B
- Authority
- TW
- Taiwan
- Prior art keywords
- placement head
- placement
- joint
- head
- deformation
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 59
- 230000014759 maintenance of location Effects 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 230000008859 change Effects 0.000 claims description 14
- 230000033001 locomotion Effects 0.000 claims description 13
- 230000000903 blocking effect Effects 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J17/00—Joints
- B25J17/02—Wrist joints
- B25J17/0208—Compliance devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102012014558.6A DE102012014558B4 (de) | 2012-07-24 | 2012-07-24 | Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201412479A TW201412479A (zh) | 2014-04-01 |
| TWI568553B true TWI568553B (zh) | 2017-02-01 |
Family
ID=49911952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102126092A TWI568553B (zh) | 2012-07-24 | 2013-07-22 | 放置設備的放置頭之動態保持系統 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9364953B2 (enExample) |
| JP (2) | JP2014027270A (enExample) |
| KR (2) | KR102080351B1 (enExample) |
| CN (1) | CN103579046B (enExample) |
| DE (1) | DE102012014558B4 (enExample) |
| MY (1) | MY183739A (enExample) |
| SG (1) | SG196716A1 (enExample) |
| TW (1) | TWI568553B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102425309B1 (ko) * | 2016-10-12 | 2022-07-26 | 삼성전자주식회사 | 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더 |
| WO2018092228A1 (ja) * | 2016-11-17 | 2018-05-24 | 株式会社Ｆｕｊｉ | 作業機 |
| US10050008B1 (en) * | 2017-01-24 | 2018-08-14 | Asm Technology Singapore Pte Ltd | Method and system for automatic bond arm alignment |
| DE102018115144A1 (de) * | 2018-06-23 | 2019-12-24 | Besi Switzerland Ag | Stellantrieb für einen Bondkopf |
| KR102175151B1 (ko) * | 2019-01-04 | 2020-11-06 | 마점래 | 2차 전지 조립용 가변형 코킹장치 |
| CN110369985B (zh) * | 2019-07-05 | 2024-05-17 | 江苏烽禾升科技股份有限公司 | 一种异形笔夹入料机构 |
| DE102020213148A1 (de) * | 2020-10-19 | 2022-04-21 | Mahle International Gmbh | Vorrichtung zur Montage eines Stopfens in einer Hohlwelle |
| KR102874158B1 (ko) | 2020-10-22 | 2025-10-22 | 삼성전자주식회사 | 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법 |
| EP4052868A1 (de) * | 2021-02-15 | 2022-09-07 | Stöger Automation GmbH | Automatisches schraubsystem zum verbinden von bauteilen |
| CN117208572B (zh) * | 2023-11-09 | 2024-02-13 | 四川名人居门窗有限公司 | 一种玻璃吸盘车摆动结构 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614118A (en) * | 1994-10-27 | 1997-03-25 | Weber; Wolfgang | Hot plate welder with pivotably movable carriage unit |
| US5697480A (en) * | 1995-03-22 | 1997-12-16 | Syron Engineering & Manufacturing Corporation | Breakaway mount for robot arm |
| TW201109559A (en) * | 2009-09-07 | 2011-03-16 | Murata Machinery Ltd | Substrate transfer apparatus |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2527967B1 (fr) * | 1982-06-07 | 1985-07-19 | Merlin Gerin | Robot industriel perfectionne pilote par un automate programmable |
| EP0213206B1 (en) * | 1985-01-21 | 1993-09-01 | FUJI MACHINE Mfg. Co., Ltd. | Method of and apparatus for detecting electronic device-holding position and electronic device-mounting apparatus |
| JPH07122830B2 (ja) * | 1989-05-31 | 1995-12-25 | 新技術事業団 | 超精密位置決め装置 |
| TW278212B (enExample) | 1992-05-06 | 1996-06-11 | Sumitomo Electric Industries | |
| JP3099254B2 (ja) | 1994-02-28 | 2000-10-16 | 安藤電気株式会社 | 浮動機構つき吸着ハンドおよび搬送接触機構 |
| JPH08162797A (ja) * | 1994-12-08 | 1996-06-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
| JP3853402B2 (ja) * | 1995-07-13 | 2006-12-06 | 東レエンジニアリング株式会社 | チップボンディング装置 |
| JPH09283990A (ja) * | 1996-04-10 | 1997-10-31 | Toshiba Corp | マウントヘッド及びボンディング装置 |
| JPH10107495A (ja) | 1996-09-26 | 1998-04-24 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
| JP3421968B2 (ja) | 1999-02-23 | 2003-06-30 | エヌイーシーマシナリー株式会社 | コレット及びそれを用いたマウント装置 |
| US6345728B1 (en) * | 1999-04-28 | 2002-02-12 | Matsushita Electric Industrial Co., Ltd. | Component feeding method and apparatus |
| JP2000332495A (ja) | 1999-05-25 | 2000-11-30 | Sony Corp | 部品装着装置及び部品装着方法 |
| WO2001024597A1 (en) * | 1999-09-28 | 2001-04-05 | Matsushita Electric Industrial Co., Ltd. | Method for generating data for component mounting and apparatus for the same, and method for component mounting and apparatus for the same |
| EP1260126B1 (en) * | 2000-02-17 | 2005-04-27 | Matsushita Electric Industrial Co., Ltd. | Recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel |
| JP2002222820A (ja) * | 2001-01-26 | 2002-08-09 | Sony Corp | 物品組立装置 |
| US6463359B2 (en) * | 2001-02-20 | 2002-10-08 | Infotech Ag | Micro-alignment pick-up head |
| JP4616514B2 (ja) * | 2001-06-07 | 2011-01-19 | 富士機械製造株式会社 | 電気部品装着システムおよびそれにおける位置誤差検出方法 |
| JP4303463B2 (ja) * | 2002-11-29 | 2009-07-29 | パナソニック株式会社 | 基板搬送装置及び部品実装における基板搬送方法 |
| JP4334892B2 (ja) * | 2003-03-20 | 2009-09-30 | パナソニック株式会社 | 部品実装方法 |
| JP4390503B2 (ja) * | 2003-08-27 | 2009-12-24 | パナソニック株式会社 | 部品実装装置及び部品実装方法 |
| EP2089899B1 (de) | 2006-10-31 | 2011-02-23 | Kulicke & Soffa Die Bonding GmbH | Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat und verfahren zum positionieren eines aufnahmewerkzeugs relativ zu einem substrat |
| KR100921398B1 (ko) * | 2007-02-15 | 2009-10-14 | (주)제이티 | 이송툴의 픽커 및 그를 가지는 이송툴 |
| WO2008100111A1 (en) | 2007-02-15 | 2008-08-21 | Jt Corporation | Picker for transfer tool and transfer tool having the same |
| EP2007187A1 (en) | 2007-06-19 | 2008-12-24 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Placement device and assembly device |
| EP2088844A1 (en) | 2008-02-05 | 2009-08-12 | Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO | Placement device, assembly device and method of placing a component |
| US8442661B1 (en) * | 2008-11-25 | 2013-05-14 | Anybots 2.0, Inc. | Remotely controlled self-balancing robot including a stabilized laser pointer |
| JP2011245595A (ja) * | 2010-05-27 | 2011-12-08 | Sharp Corp | 移載ハンドおよび移載方法 |
-
2012
- 2012-07-24 DE DE102012014558.6A patent/DE102012014558B4/de active Active
-
2013
- 2013-06-19 SG SG2013047378A patent/SG196716A1/en unknown
- 2013-06-28 MY MYPI2013002482A patent/MY183739A/en unknown
- 2013-07-16 JP JP2013147719A patent/JP2014027270A/ja not_active Withdrawn
- 2013-07-18 CN CN201310304630.3A patent/CN103579046B/zh active Active
- 2013-07-22 KR KR1020130086070A patent/KR102080351B1/ko active Active
- 2013-07-22 TW TW102126092A patent/TWI568553B/zh active
- 2013-07-23 US US13/949,000 patent/US9364953B2/en active Active
-
2016
- 2016-02-23 US US15/051,583 patent/US9956692B2/en active Active
-
2017
- 2017-12-08 JP JP2017236312A patent/JP6547979B2/ja active Active
-
2019
- 2019-11-01 KR KR1020190138306A patent/KR102080447B1/ko active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5614118A (en) * | 1994-10-27 | 1997-03-25 | Weber; Wolfgang | Hot plate welder with pivotably movable carriage unit |
| US5697480A (en) * | 1995-03-22 | 1997-12-16 | Syron Engineering & Manufacturing Corporation | Breakaway mount for robot arm |
| TW201109559A (en) * | 2009-09-07 | 2011-03-16 | Murata Machinery Ltd | Substrate transfer apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201412479A (zh) | 2014-04-01 |
| KR102080447B1 (ko) | 2020-02-21 |
| JP2014027270A (ja) | 2014-02-06 |
| US20160167237A1 (en) | 2016-06-16 |
| CN103579046A (zh) | 2014-02-12 |
| US9956692B2 (en) | 2018-05-01 |
| CN103579046B (zh) | 2017-12-19 |
| US20140030052A1 (en) | 2014-01-30 |
| DE102012014558B4 (de) | 2014-02-20 |
| KR20140015197A (ko) | 2014-02-06 |
| SG196716A1 (en) | 2014-02-13 |
| US9364953B2 (en) | 2016-06-14 |
| JP2018098508A (ja) | 2018-06-21 |
| MY183739A (en) | 2021-03-10 |
| KR102080351B1 (ko) | 2020-02-21 |
| JP6547979B2 (ja) | 2019-07-24 |
| DE102012014558A1 (de) | 2014-01-30 |
| KR20190126040A (ko) | 2019-11-08 |
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