JPWO2019244136A5 - - Google Patents

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Publication number
JPWO2019244136A5
JPWO2019244136A5 JP2021520478A JP2021520478A JPWO2019244136A5 JP WO2019244136 A5 JPWO2019244136 A5 JP WO2019244136A5 JP 2021520478 A JP2021520478 A JP 2021520478A JP 2021520478 A JP2021520478 A JP 2021520478A JP WO2019244136 A5 JPWO2019244136 A5 JP WO2019244136A5
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JP
Japan
Prior art keywords
moving axis
axis
moving
head
contact surface
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JP2021520478A
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English (en)
Japanese (ja)
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JP2021529441A (ja
JP7333391B2 (ja
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Priority claimed from DE102018115144.6A external-priority patent/DE102018115144A1/de
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Publication of JPWO2019244136A5 publication Critical patent/JPWO2019244136A5/ja
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Publication of JP7333391B2 publication Critical patent/JP7333391B2/ja
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JP2021520478A 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ Active JP7333391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018115144.6A DE102018115144A1 (de) 2018-06-23 2018-06-23 Stellantrieb für einen Bondkopf
DE102018115144.6 2018-06-23
PCT/IB2019/055284 WO2019244136A2 (de) 2018-06-23 2019-06-23 Stellantrieb für einen bondkopf

Publications (3)

Publication Number Publication Date
JP2021529441A JP2021529441A (ja) 2021-10-28
JPWO2019244136A5 true JPWO2019244136A5 (enExample) 2022-07-19
JP7333391B2 JP7333391B2 (ja) 2023-08-24

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ID=67766204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021520478A Active JP7333391B2 (ja) 2018-06-23 2019-06-23 接合ヘッドのためのアクチュエータ

Country Status (8)

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US (1) US12230599B2 (enExample)
JP (1) JP7333391B2 (enExample)
KR (1) KR102800366B1 (enExample)
CN (1) CN113169091B (enExample)
DE (1) DE102018115144A1 (enExample)
MY (1) MY204833A (enExample)
SG (1) SG11202012866TA (enExample)
WO (1) WO2019244136A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114005778B (zh) * 2021-12-24 2022-03-22 湖北三维半导体集成创新中心有限责任公司 键合系统和键合补偿方法
CN114005777B (zh) * 2021-12-24 2022-03-29 湖北三维半导体集成创新中心有限责任公司 键合装置和键合方法
CN113990790B (zh) * 2021-12-24 2022-03-18 湖北三维半导体集成创新中心有限责任公司 键合系统和键合方法
CN116417389B (zh) * 2023-06-08 2023-08-15 上海果纳半导体技术有限公司 晶圆盒搬运装置及方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1022306A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd ダイボンディング装置
JPH10107495A (ja) * 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3303705B2 (ja) * 1997-01-22 2002-07-22 松下電器産業株式会社 バンプ付電子部品の熱圧着装置
JP2000101294A (ja) * 1998-09-18 2000-04-07 Sony Corp 部品装着装置
US6146912A (en) * 1999-05-11 2000-11-14 Trw Inc. Method for parallel alignment of a chip to substrate
JP2000340585A (ja) * 1999-05-31 2000-12-08 Sony Corp 平面平行度調整装置を備えた加工装置
JP2002280397A (ja) * 2001-03-19 2002-09-27 Furukawa Electric Co Ltd:The 面合わせ機構および面合わせ方法
JP2003040585A (ja) 2001-07-30 2003-02-13 Toyota Industries Corp オーダーピッカ
WO2004107432A1 (ja) * 2003-05-29 2004-12-09 Fujitsu Limited 電子部品の実装方法、取外し方法及びその装置
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
DE502006008968D1 (de) * 2006-10-31 2011-04-07 Kulicke & Soffa Die Bonding Gmbh Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat zeugs relativ zu einem substrat
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法
JP5065969B2 (ja) * 2008-03-31 2012-11-07 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR101233221B1 (ko) * 2008-12-17 2013-02-15 세메스 주식회사 다이 본더용 피커 헤드
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
US8387851B1 (en) 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
DE102012014558B4 (de) * 2012-07-24 2014-02-20 Datacon Technology Gmbh Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
SG11201701130TA (en) * 2014-08-13 2017-03-30 Shinkawa Kk Mounting device and measurement method
US10096568B2 (en) * 2014-09-18 2018-10-09 Asm Technology Singapore Pte Ltd Die bonding tool and system
CN104966687B (zh) * 2015-06-30 2017-08-25 北京中电科电子装备有限公司 一种键合头装置
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018146880A1 (ja) * 2017-02-09 2018-08-16 ボンドテック株式会社 部品実装システム、樹脂成形装置、部品実装方法および樹脂成形方法

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