SG11201701130TA - Mounting device and measurement method - Google Patents

Mounting device and measurement method

Info

Publication number
SG11201701130TA
SG11201701130TA SG11201701130TA SG11201701130TA SG11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA SG 11201701130T A SG11201701130T A SG 11201701130TA
Authority
SG
Singapore
Prior art keywords
measurement method
mounting device
mounting
measurement
Prior art date
Application number
SG11201701130TA
Inventor
Akira Sato
Kohei Seyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201701130TA publication Critical patent/SG11201701130TA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/24—Measuring arrangements characterised by the use of mechanical techniques for measuring angles or tapers; for testing the alignment of axes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
SG11201701130TA 2014-08-13 2014-10-01 Mounting device and measurement method SG11201701130TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014165019 2014-08-13
PCT/JP2014/076313 WO2016024364A1 (en) 2014-08-13 2014-10-01 Mounting device and measurement method

Publications (1)

Publication Number Publication Date
SG11201701130TA true SG11201701130TA (en) 2017-03-30

Family

ID=55304006

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201701130TA SG11201701130TA (en) 2014-08-13 2014-10-01 Mounting device and measurement method

Country Status (7)

Country Link
US (1) US10492351B2 (en)
JP (1) JP6422499B2 (en)
KR (1) KR101972363B1 (en)
CN (1) CN107079619B (en)
SG (1) SG11201701130TA (en)
TW (1) TWI602479B (en)
WO (1) WO2016024364A1 (en)

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* Cited by examiner, † Cited by third party
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KR101972363B1 (en) * 2014-08-13 2019-08-16 가부시키가이샤 신가와 Mounting device and measurement method
JP7033878B2 (en) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment
KR102038355B1 (en) * 2018-04-24 2019-10-30 스테코 주식회사 Inner lead bonding apparatus for preventable misalignmet
DE102018115144A1 (en) * 2018-06-23 2019-12-24 Besi Switzerland Ag Actuator for a bondhead
EP3860329B1 (en) * 2018-09-27 2024-01-10 Fuji Corporation Component supply apparatus
US11121113B2 (en) * 2020-01-16 2021-09-14 Asm Technology Singapore Pte Ltd Bonding apparatus incorporating variable force distribution
CN115668468A (en) * 2020-05-19 2023-01-31 株式会社新川 Bonding apparatus and bonding head adjusting method
US20220412733A1 (en) * 2020-07-30 2022-12-29 Shinkawa Ltd. Mounting apparatus and parallelism detection method in mounting apparatus
CN114981938A (en) * 2020-12-14 2022-08-30 株式会社新川 Apparatus and method for manufacturing semiconductor device
WO2022176183A1 (en) * 2021-02-22 2022-08-25 株式会社新川 Mounting device, and method for detecting degree of parallelism of mounting device
WO2024079975A1 (en) * 2022-10-14 2024-04-18 株式会社新川 Device for manufacturing semiconductor device and method for suctioning member
CN116387209B (en) * 2023-06-06 2023-09-05 北京中科同志科技股份有限公司 Chip packaging system and chip packaging method

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US5454170A (en) * 1994-03-02 1995-10-03 Vlsi Technology Inc. Robot to pedestal alignment head
JP3295529B2 (en) * 1994-05-06 2002-06-24 松下電器産業株式会社 IC component mounting method and device
JP2000091360A (en) * 1998-09-10 2000-03-31 Sanyo Electric Co Ltd Bonding device and flat-surface forming method of bonding head
JP3367435B2 (en) * 1998-11-24 2003-01-14 住友電装株式会社 Electronic component height and tilt detection jig and electronic component height and tilt detection method
JP2000301421A (en) * 1999-04-21 2000-10-31 Sony Corp Device and method for sucking part in electronic part mounting machine
JP4768147B2 (en) * 2001-04-27 2011-09-07 Ｎｅｃ液晶テクノロジー株式会社 Liquid crystal display manufacturing equipment
DE10217028C1 (en) * 2002-04-11 2003-11-20 Nanophotonics Ag Measuring module for wafer production plants
US6870382B2 (en) * 2002-05-03 2005-03-22 Texas Instruments Incorporated System and method for evaluating the planarity and parallelism of an array of probe tips
CH696615A5 (en) * 2003-09-22 2007-08-15 Esec Trading Sa A method for adjustment of the bonding head of a die bonder.
TW200628029A (en) * 2004-12-06 2006-08-01 Matsushita Electric Ind Co Ltd Component mounting apparatus and component mounting method
JP4748118B2 (en) * 2007-06-14 2011-08-17 パナソニック株式会社 Electronic component mounting apparatus and substrate receiving method in electronic component mounting apparatus
US7567885B2 (en) * 2007-08-23 2009-07-28 Sokudo Co., Ltd. Method and system for determining object height
CN101877939A (en) * 2009-04-29 2010-11-03 元港 Circuit board stationary fixture
KR101387295B1 (en) * 2012-05-14 2014-04-18 삼성전기주식회사 Apparatus and Method for Manufacturing Camera Module
KR101332082B1 (en) * 2012-06-18 2013-11-22 삼성전기주식회사 Apparatus for manufacturing camera module
JP2014017328A (en) * 2012-07-06 2014-01-30 Tdk Corp Mounting device and measuring method
JP5999809B2 (en) * 2012-07-20 2016-09-28 富士機械製造株式会社 Component mounter
JP5997990B2 (en) * 2012-09-13 2016-09-28 ヤマハ発動機株式会社 Electronic component mounting apparatus and method of using electronic component mounting apparatus
US9146090B2 (en) * 2013-11-14 2015-09-29 Globalfoundries Inc. Nozzle alignment tool for a fluid dispensing apparatus
KR101972363B1 (en) * 2014-08-13 2019-08-16 가부시키가이샤 신가와 Mounting device and measurement method
US10269758B2 (en) * 2015-12-24 2019-04-23 Intel Corporation Systems and processes for measuring thickness values of semiconductor substrates
KR102425309B1 (en) * 2016-10-12 2022-07-26 삼성전자주식회사 Apparatus for correcting a paralleism between a bonding head and a stage and chip bondder including the same
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment

Also Published As

Publication number Publication date
US20170156244A1 (en) 2017-06-01
JP6422499B2 (en) 2018-11-14
US10492351B2 (en) 2019-11-26
CN107079619B (en) 2020-07-17
KR20170041864A (en) 2017-04-17
JPWO2016024364A1 (en) 2017-06-15
CN107079619A (en) 2017-08-18
KR101972363B1 (en) 2019-08-16
WO2016024364A1 (en) 2016-02-18
TWI602479B (en) 2017-10-11
TW201607389A (en) 2016-02-16

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