JP3367435B2 - Electronic component height and tilt detection jig and electronic component height and tilt detection method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for detecting the height and inclination of an electronic component and a method for detecting the height and inclination of an electronic component. More specifically, an electronic component such as a light emitting diode mounted on a printed circuit board is printed. The present invention relates to a height and inclination detection jig for an electronic component that can detect whether or not it is at an accurate angle or height with respect to a substrate, and a height and inclination detection method for an electronic component.

[0002]

2. Description of the Related Art Generally, it is known that electronic components such as light emitting diodes mounted on a printed circuit board are used for confirmation of ON / OFF of switches and various illuminations. This light emitting diode is attached to the printed circuit board by soldering, etc., but when the light emitting diode is attached to the printed circuit board, the light emitting diode floats or tilts from the printed circuit board and its height and angle change with respect to the printed circuit board. It may end up.

In particular, in the case of a light emitting diode, as shown in FIG. 4, the light emitting diode 2 has an inclination θ of ± 10 ° or more (that is, a horizontal direction) in a direction orthogonal to the printed circuit board 1, or If the height of the printed circuit board rises above a certain level (for example, 6.4 mm or more) and the height of the printed circuit board changes, the amount of light emission decreases, resulting in a defective product. In order to deal with such a situation, there is one that corrects an electronic component so that it is located at an arbitrary position with respect to a printed circuit board (for example, Japanese Patent Laid-Open No. 63-250200, Japanese Utility Model Application Laid-Open No. 1).
-162300). This one has a jig that directly contacts an electronic component erected on a printed circuit board, and pressing the electronic component by the jig prevents the electronic component from tilting more than necessary with respect to the substrate. I try to prevent it.

[0004]

However, in such a conventional technique, it is possible to correct the inclination of the electronic component, but a means for detecting whether or not the floating of the electronic component has occurred is provided. Since there is no such correction, an electronic component having a normal inclination is also corrected, which causes a problem that extra correction work occurs. Further, a driving device for driving the jig is required to correct the inclination of the electronic component, which increases the cost.

Therefore, according to the present invention, the height and inclination of the electronic component and the inclination of the electronic component capable of detecting the height and the inclination of the electronic component with respect to the printed circuit board with a simple and low-cost structure, It is intended to provide a tilt detection method.

[0006]

The invention according to claim 1 is
In order to solve the above problems, a jig for detecting the height and inclination of an electronic component erected on a printed circuit board with respect to the printed circuit board, the jig being formed on the main body and the electronic component being inserted therethrough. Possible slit, and a positioning pin that is provided in the main body, is engageable with a reference position of the printed circuit board, and is arranged at an arbitrary position with respect to the slit, and the width of the slit is The height of the main body is set so that the slit is located at an arbitrary position with respect to the height of the electronic component, while being formed to have a width within an allowable range of the inclination of the electronic component. There is.

In this case, when the positioning pin is engaged with the printed board, the slit is positioned at a position where it can be inserted into the electronic member. Then, when the slit is inserted into the electronic component, the electronic component which is not inserted into the slit is determined to be a tilt defect, and the electronic component whose height of the electronic component is not at an arbitrary position with respect to the slit is determined to be a height defect. can do.

As a result, the height and inclination of the electronic component with respect to the printed circuit board can be detected with a simple and low-cost structure. In order to solve the above-mentioned problems, the invention according to claim 2 is the same as the invention according to claim 1,
When the electronic component is a light emitting diode, the main body is black.

In this case, when the light emitting diode is made to emit light, it is possible to easily detect the brightness or lighting state of the light emitting diode by the light reflected by the black body. In this case, the defective quality of the light emitting diode can be easily detected. In order to solve the above-mentioned problems, the invention according to claim 3 is a method for detecting the height and inclination of an electronic component by the detection jig according to claim 1 or 2, wherein the positioning pin is attached to a printed circuit board. After inserting the electronic component through the slit while aligning, the electronic component that is not inserted into the slit is determined as tilt failure and the height of the electronic component is not at an arbitrary position with respect to the slit. The feature is that it is determined to be defective.

In this case, the height and inclination of the electronic component with respect to the printed circuit board can be detected with a simple and low-cost structure.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing an embodiment of a height and inclination detection jig for an electronic component and a height and inclination detection method for an electronic component according to the present invention. First, the configuration will be described. In FIG. 1, reference numeral 11 is a schematic view of a printed circuit board. On this printed circuit board 11, three light emitting diodes 12, 13, and 14 as electronic parts are erected, and the diodes 12 to 14 are soldered to the printed circuit board 11. And is connected to a driver or the like by the conductor pattern 15. Other electronic components are also mounted on the printed circuit board 11 of the present embodiment, and they are respectively connected by conductor patterns, but they are not shown.

2 and 3, reference numeral 16 is a detection jig, and the detection jig 16 has a main body 17 whose entire front and back surfaces are colored black. The main body 17 includes an upper plate 18 that covers the printed circuit board 11 so as to straddle the printed circuit board 11, and a first contact plate that is provided at one end of the upper plate 18 and can contact one side surface side of the printed circuit board 11. 19 and a second contact plate provided at the other end of the upper plate 18 and having a slit 20 through which the light emitting diodes 12 to 14 can be inserted and which is in contact with the other side surface of the printed circuit board 11.
21 and 21.

A pair of positioning pins (diameter 2.45 cm) 22a and 22b are erected on the upper plate 18.
a and 22b are engageable with engagement holes 23a and 23b formed at the reference position of the printed circuit board 11 and have slits.
It is arranged at an arbitrary position with respect to 20. The arbitrary position is a position where the slits 20 can be inserted into the light emitting diodes 12 to 14 when the pins 22a and 22b are inserted into the engagement holes 23a and 23b.

On the other hand, the width of the slit 20 is equal to the width of the light emitting diode 12
The inclination of the direction from 14 to the direction orthogonal to the printed circuit board 11 is ±
The width (2.7 mm when the width of the light emitting diodes 12 to 14 is 2.0 mm) is set so as to be within the range of inclination within 10 ° (that is, the left-right direction). In addition, the height of the second contact plate 21 (distance from the printed circuit board 11) is set so that the slit 20 is located at an arbitrary position with respect to the height of the light emitting diodes 12 to 14 (5.7 mm). Has been done.

As described above, in order to detect the height and inclination of the light emitting diodes 12 to 14 by the detecting jig 16, the light emitting diodes 12 to 14 are moved while the positioning pins 22a and 22b are engaged with the engaging holes 23a and 23b. After inserting the slit 20, the light emitting diodes 12 to 14 which were not inserted into the slit 20 are determined to have a tilt defect, and the height of the light emitting diodes 12 to 14 which is not at an arbitrary position with respect to the slit 20 is defective. Is determined.

Next, the light emitting diodes 12 to 14 are caused to emit light, and the light reflected by the black body 17 is used.
Defective quality of the light emitting diodes 12 to 14 is judged by detecting the brightness or darkness of the LEDs 12 to 14. As described above, in the present embodiment, the slits 20 are formed to have a width within the allowable range of the inclination of the light emitting diodes 12 to 14, and the position of the slit 20 is relative to the height of the light emitting diodes 12 to 14. Since the detection jig 16 having the black main body 17 in which the height of the second contact plate 21 is set to an arbitrary position is provided, the printed circuit board has a simple and low-cost configuration.
The height and inclination of the light emitting diodes 12 to 14 with respect to 11 can be detected, and in addition, defective quality of the light emitting diodes 12 to 14 can be easily detected.

In the present embodiment, the height of the light emitting diodes 12 to 14 is detected as an electronic component, but the invention is not limited to this, and the height and the inclination on the printed circuit board 11 are within the same allowable range. Any other electronic component can be installed inside.

[0018]

According to the first and third aspects of the present invention, the height and the inclination of the electronic component with respect to the printed circuit board can be detected with a simple and low-cost configuration.
According to the second aspect of the invention, when the light emitting diode is caused to emit light, it is possible to easily detect the brightness or lighting state of the light emitting diode by the light reflected by the black body, so that the light emission of the light emitting diode is dark. In this case or in the case of no lighting, the quality defect of the light emitting diode can be easily detected.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of a height and tilt detection jig for an electronic component and a height and tilt detection method for an electronic component according to the present invention, which is a target printed circuit board on which the detection jig is used. It is a block diagram of.

FIG. 2 is a view showing a detection jig of one embodiment, (a)
Is a perspective view of the detection jig, (b) is a side view of the detection jig, and (c) is a bottom view of the detection jig.

FIG. 3 is a view showing a state in which the detection jig of one embodiment is attached to a printed board.

FIG. 4 is a diagram showing a state in which a light emitting diode is tilted.

[Explanation of symbols]

11 printed circuit board 12-14 Light emitting diodes (electronic parts) 16 Detection jig 17 body 20 slits 22a, 22b Positioning pin

Claims (3)

(57) [Claims] 1. A jig for detecting the height and inclination of an electronic component erected on a printed circuit board with respect to the printed circuit board, the main body and a slit formed in the main body and through which the electronic component can be inserted. And a positioning pin provided on the main body, which is engageable with a reference position of the printed circuit board and arranged at an arbitrary position with respect to the slit, and the width of the slit is set to the width of the electronic component. An electronic component characterized in that the height of the main body is set so that the slit is located at an arbitrary position with respect to the height of the electronic component while being formed to have a width within an allowable range of inclination. Height and tilt detection jig. 2. The jig for detecting height and inclination of an electronic component according to claim 1, wherein when the electronic component is a light emitting diode, the main body is black. 3. A method for detecting the height and inclination of an electronic component by the detection jig according to claim 1, wherein the electronic component is inserted through a slit while the positioning pin is engaged with a printed circuit board. Thereafter, the electronic component which is not inserted into the slit is determined to be a tilt defect, and the electronic component whose height of the electronic component is not at an arbitrary position with respect to the slit is determined to be a height defect. Height and tilt detection method.