SG196716A1 - Kinematic holding system for a placement head of a placement apparatus - Google Patents

Kinematic holding system for a placement head of a placement apparatus

Info

Publication number
SG196716A1
SG196716A1 SG2013047378A SG2013047378A SG196716A1 SG 196716 A1 SG196716 A1 SG 196716A1 SG 2013047378 A SG2013047378 A SG 2013047378A SG 2013047378 A SG2013047378 A SG 2013047378A SG 196716 A1 SG196716 A1 SG 196716A1
Authority
SG
Singapore
Prior art keywords
placement
holding system
head
kinematic holding
kinematic
Prior art date
Application number
SG2013047378A
Other languages
English (en)
Inventor
Hannes Kostner
Dietmar Lackner
Florian Speer
Martin Widauer
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Publication of SG196716A1 publication Critical patent/SG196716A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
SG2013047378A 2012-07-24 2013-06-19 Kinematic holding system for a placement head of a placement apparatus SG196716A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Publications (1)

Publication Number Publication Date
SG196716A1 true SG196716A1 (en) 2014-02-13

Family

ID=49911952

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013047378A SG196716A1 (en) 2012-07-24 2013-06-19 Kinematic holding system for a placement head of a placement apparatus

Country Status (8)

Country Link
US (2) US9364953B2 (enExample)
JP (2) JP2014027270A (enExample)
KR (2) KR102080351B1 (enExample)
CN (1) CN103579046B (enExample)
DE (1) DE102012014558B4 (enExample)
MY (1) MY183739A (enExample)
SG (1) SG196716A1 (enExample)
TW (1) TWI568553B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018092228A1 (ja) * 2016-11-17 2018-05-24 株式会社Ｆｕｊｉ 作業機
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148A1 (de) * 2020-10-19 2022-04-21 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2527967B1 (fr) * 1982-06-07 1985-07-19 Merlin Gerin Robot industriel perfectionne pilote par un automate programmable
EP0213206B1 (en) * 1985-01-21 1993-09-01 FUJI MACHINE Mfg. Co., Ltd. Method of and apparatus for detecting electronic device-holding position and electronic device-mounting apparatus
JPH07122830B2 (ja) * 1989-05-31 1995-12-25 新技術事業団 超精密位置決め装置
TW278212B (enExample) 1992-05-06 1996-06-11 Sumitomo Electric Industries
JP3099254B2 (ja) 1994-02-28 2000-10-16 安藤電気株式会社 浮動機構つき吸着ハンドおよび搬送接触機構
US5614118A (en) 1994-10-27 1997-03-25 Weber; Wolfgang Hot plate welder with pivotably movable carriage unit
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
US5697480A (en) * 1995-03-22 1997-12-16 Syron Engineering & Manufacturing Corporation Breakaway mount for robot arm
JP3853402B2 (ja) * 1995-07-13 2006-12-06 東レエンジニアリング株式会社 チップボンディング装置
JPH09283990A (ja) * 1996-04-10 1997-10-31 Toshiba Corp マウントヘッド及びボンディング装置
JPH10107495A (ja) 1996-09-26 1998-04-24 Matsushita Electric Ind Co Ltd 部品装着装置
JP3421968B2 (ja) 1999-02-23 2003-06-30 エヌイーシーマシナリー株式会社 コレット及びそれを用いたマウント装置
US6345728B1 (en) * 1999-04-28 2002-02-12 Matsushita Electric Industrial Co., Ltd. Component feeding method and apparatus
JP2000332495A (ja) 1999-05-25 2000-11-30 Sony Corp 部品装着装置及び部品装着方法
WO2001024597A1 (en) * 1999-09-28 2001-04-05 Matsushita Electric Industrial Co., Ltd. Method for generating data for component mounting and apparatus for the same, and method for component mounting and apparatus for the same
EP1260126B1 (en) * 2000-02-17 2005-04-27 Matsushita Electric Industrial Co., Ltd. Recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel
JP2002222820A (ja) * 2001-01-26 2002-08-09 Sony Corp 物品組立装置
US6463359B2 (en) * 2001-02-20 2002-10-08 Infotech Ag Micro-alignment pick-up head
JP4616514B2 (ja) * 2001-06-07 2011-01-19 富士機械製造株式会社 電気部品装着システムおよびそれにおける位置誤差検出方法
JP4303463B2 (ja) * 2002-11-29 2009-07-29 パナソニック株式会社 基板搬送装置及び部品実装における基板搬送方法
JP4334892B2 (ja) * 2003-03-20 2009-09-30 パナソニック株式会社 部品実装方法
JP4390503B2 (ja) * 2003-08-27 2009-12-24 パナソニック株式会社 部品実装装置及び部品実装方法
EP2089899B1 (de) 2006-10-31 2011-02-23 Kulicke & Soffa Die Bonding GmbH Vorrichtung zum positionieren und/oder anpressen eines flächigen bauteils relativ zu einem substrat und verfahren zum positionieren eines aufnahmewerkzeugs relativ zu einem substrat
KR100921398B1 (ko) * 2007-02-15 2009-10-14 (주)제이티 이송툴의 픽커 및 그를 가지는 이송툴
WO2008100111A1 (en) 2007-02-15 2008-08-21 Jt Corporation Picker for transfer tool and transfer tool having the same
EP2007187A1 (en) 2007-06-19 2008-12-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Placement device and assembly device
EP2088844A1 (en) 2008-02-05 2009-08-12 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Placement device, assembly device and method of placing a component
US8442661B1 (en) * 2008-11-25 2013-05-14 Anybots 2.0, Inc. Remotely controlled self-balancing robot including a stabilized laser pointer
JP5403247B2 (ja) * 2009-09-07 2014-01-29 村田機械株式会社 基板移載装置
JP2011245595A (ja) * 2010-05-27 2011-12-08 Sharp Corp 移載ハンドおよび移載方法

Also Published As

Publication number Publication date
TW201412479A (zh) 2014-04-01
KR102080447B1 (ko) 2020-02-21
JP2014027270A (ja) 2014-02-06
US20160167237A1 (en) 2016-06-16
CN103579046A (zh) 2014-02-12
US9956692B2 (en) 2018-05-01
CN103579046B (zh) 2017-12-19
TWI568553B (zh) 2017-02-01
US20140030052A1 (en) 2014-01-30
DE102012014558B4 (de) 2014-02-20
KR20140015197A (ko) 2014-02-06
US9364953B2 (en) 2016-06-14
JP2018098508A (ja) 2018-06-21
MY183739A (en) 2021-03-10
KR102080351B1 (ko) 2020-02-21
JP6547979B2 (ja) 2019-07-24
DE102012014558A1 (de) 2014-01-30
KR20190126040A (ko) 2019-11-08

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