DE102012014558B4 - Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung - Google Patents

Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung Download PDF

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Publication number
DE102012014558B4
DE102012014558B4 DE102012014558.6A DE102012014558A DE102012014558B4 DE 102012014558 B4 DE102012014558 B4 DE 102012014558B4 DE 102012014558 A DE102012014558 A DE 102012014558A DE 102012014558 B4 DE102012014558 B4 DE 102012014558B4
Authority
DE
Germany
Prior art keywords
placement
placement head
joint
head
deformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102012014558.6A
Other languages
German (de)
English (en)
Other versions
DE102012014558A1 (de
Inventor
Martin Widauer
Dietmar Lackner
Florian Speer
Hannes Kostner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
DATACON TECHNOLOGY GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DATACON TECHNOLOGY GmbH filed Critical DATACON TECHNOLOGY GmbH
Priority to DE102012014558.6A priority Critical patent/DE102012014558B4/de
Priority to SG2013047378A priority patent/SG196716A1/en
Priority to MYPI2013002482A priority patent/MY183739A/en
Priority to JP2013147719A priority patent/JP2014027270A/ja
Priority to CN201310304630.3A priority patent/CN103579046B/zh
Priority to KR1020130086070A priority patent/KR102080351B1/ko
Priority to TW102126092A priority patent/TWI568553B/zh
Priority to US13/949,000 priority patent/US9364953B2/en
Publication of DE102012014558A1 publication Critical patent/DE102012014558A1/de
Application granted granted Critical
Publication of DE102012014558B4 publication Critical patent/DE102012014558B4/de
Priority to US15/051,583 priority patent/US9956692B2/en
Priority to JP2017236312A priority patent/JP6547979B2/ja
Priority to KR1020190138306A priority patent/KR102080447B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J17/00—Joints
    • B25J17/02—Wrist joints
    • B25J17/0208—Compliance devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
DE102012014558.6A 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung Active DE102012014558B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung
SG2013047378A SG196716A1 (en) 2012-07-24 2013-06-19 Kinematic holding system for a placement head of a placement apparatus
MYPI2013002482A MY183739A (en) 2012-07-24 2013-06-28 Kinematic holding system for a placement head of a placement apparatus
JP2013147719A JP2014027270A (ja) 2012-07-24 2013-07-16 装着装置の装着ヘッドのキネマティック保持システム
CN201310304630.3A CN103579046B (zh) 2012-07-24 2013-07-18 放置设备的放置头的运动学保持系统
TW102126092A TWI568553B (zh) 2012-07-24 2013-07-22 放置設備的放置頭之動態保持系統
KR1020130086070A KR102080351B1 (ko) 2012-07-24 2013-07-22 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템
US13/949,000 US9364953B2 (en) 2012-07-24 2013-07-23 Kinematic holding system for a placement head of a placement apparatus
US15/051,583 US9956692B2 (en) 2012-07-24 2016-02-23 Kinematic holding system for a placement head of a placement apparatus
JP2017236312A JP6547979B2 (ja) 2012-07-24 2017-12-08 装着装置の装着ヘッドのキネマティック保持システム
KR1020190138306A KR102080447B1 (ko) 2012-07-24 2019-11-01 배치 장치의 배치 헤드를 위한 기구학적 유지 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012014558.6A DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Publications (2)

Publication Number Publication Date
DE102012014558A1 DE102012014558A1 (de) 2014-01-30
DE102012014558B4 true DE102012014558B4 (de) 2014-02-20

Family

ID=49911952

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012014558.6A Active DE102012014558B4 (de) 2012-07-24 2012-07-24 Kinematisches Haltesystem für einen Bestückkopf einer Bestückvorrichtung

Country Status (8)

Country Link
US (2) US9364953B2 (enExample)
JP (2) JP2014027270A (enExample)
KR (2) KR102080351B1 (enExample)
CN (1) CN103579046B (enExample)
DE (1) DE102012014558B4 (enExample)
MY (1) MY183739A (enExample)
SG (1) SG196716A1 (enExample)
TW (1) TWI568553B (enExample)

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KR102425309B1 (ko) * 2016-10-12 2022-07-26 삼성전자주식회사 본딩 헤드와 스테이지 사이의 평행도 보정 장치 및 이를 포함하는 칩 본더
WO2018092228A1 (ja) * 2016-11-17 2018-05-24 株式会社Ｆｕｊｉ 作業機
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf
KR102175151B1 (ko) * 2019-01-04 2020-11-06 마점래 2차 전지 조립용 가변형 코킹장치
CN110369985B (zh) * 2019-07-05 2024-05-17 江苏烽禾升科技股份有限公司 一种异形笔夹入料机构
DE102020213148A1 (de) * 2020-10-19 2022-04-21 Mahle International Gmbh Vorrichtung zur Montage eines Stopfens in einer Hohlwelle
KR102874158B1 (ko) 2020-10-22 2025-10-22 삼성전자주식회사 반도체 공정 스테이지 구조체, 반도체 칩 픽업 시스템 및 픽업헤드 틸팅 제어 방법
EP4052868A1 (de) * 2021-02-15 2022-09-07 Stöger Automation GmbH Automatisches schraubsystem zum verbinden von bauteilen
CN117208572B (zh) * 2023-11-09 2024-02-13 四川名人居门窗有限公司 一种玻璃吸盘车摆动结构

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Also Published As

Publication number Publication date
TW201412479A (zh) 2014-04-01
KR102080447B1 (ko) 2020-02-21
JP2014027270A (ja) 2014-02-06
US20160167237A1 (en) 2016-06-16
CN103579046A (zh) 2014-02-12
US9956692B2 (en) 2018-05-01
CN103579046B (zh) 2017-12-19
TWI568553B (zh) 2017-02-01
US20140030052A1 (en) 2014-01-30
KR20140015197A (ko) 2014-02-06
SG196716A1 (en) 2014-02-13
US9364953B2 (en) 2016-06-14
JP2018098508A (ja) 2018-06-21
MY183739A (en) 2021-03-10
KR102080351B1 (ko) 2020-02-21
JP6547979B2 (ja) 2019-07-24
DE102012014558A1 (de) 2014-01-30
KR20190126040A (ko) 2019-11-08

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